WO2009082062A1 - Procédé d'injection de métal d'apport fondu dans des cavités d'un masque et appareil pour le mettre en œuvre - Google Patents

Procédé d'injection de métal d'apport fondu dans des cavités d'un masque et appareil pour le mettre en œuvre Download PDF

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Publication number
WO2009082062A1
WO2009082062A1 PCT/KR2008/002040 KR2008002040W WO2009082062A1 WO 2009082062 A1 WO2009082062 A1 WO 2009082062A1 KR 2008002040 W KR2008002040 W KR 2008002040W WO 2009082062 A1 WO2009082062 A1 WO 2009082062A1
Authority
WO
WIPO (PCT)
Prior art keywords
nozzle
pressure
template
molten solder
cavities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2008/002040
Other languages
English (en)
Inventor
Ki-Don Kim
Jun-Ho Jeong
Dae-Guen Choi
Jun-Hyuk Choi
Ji-Hye Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Institute of Machinery and Materials KIMM
Secron Co Ltd
Original Assignee
Korea Institute of Machinery and Materials KIMM
Secron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Institute of Machinery and Materials KIMM, Secron Co Ltd filed Critical Korea Institute of Machinery and Materials KIMM
Publication of WO2009082062A1 publication Critical patent/WO2009082062A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates

Definitions

  • the present invention relates to a method of injecting a molten solder into cavities of a template and an apparatus for performing the same. More particularly, the present invention relates to a method of injecting a molten solder into cavities, which are formed at a surface portion of a template, to form solder bumps using microelectronic packaging technology and an apparatus for performing the same.
  • Background Art
  • solder bumping technologies used in volume production. For example, these include electroplating, solder paste printing, evaporation, the direct attachment of preformed solder spheres, and the like.
  • C4NP controlled collapse chip connection new process
  • spherical solder bumps are formed in cavities of a template and then transferred onto bump pads of a semiconductor wafer at a reflow temperature of the solder bumps.
  • the bump pads are connected with metal wires of chips formed on the semiconductor substrate, and under-bump metallurgy (UBM) pads are disposed on the bump pads.
  • UBM pads may be provided to improve adhesive strength between the solder bumps and the bump pads.
  • the semiconductor chips of the wafer, onto which the solder bumps are transferred, may be individualized by a dicing process.
  • Each of the semiconductor chips may be attached to a substrate, for example, a printed circuit board (PCB), by a solder reflow process and an underfill process to thereby manufacture a flip-chip device.
  • PCB printed circuit board
  • a molten solder may be injected into the cavities of the template to form the solder bumps.
  • An example of an apparatus for injecting a molten solder is disclosed in U.S. Patent No. 6,231,333.
  • an injection head for injecting a molten solder has a flat lower surface and is slidably disposed on a mold plate having a plurality of cells.
  • the injection head has an injection slot for injecting the molten solder into the cells, a vacuum slot for providing a vacuum pressure and a recess connecting the injection slot with the vacuum slot.
  • the molten solder is sequentially injected into the cells by the vacuum pressure during a sliding movement of the injection head.
  • Example embodiments of the present invention provide a method of injecting a molten solder into cavities of a template, which enables easy pressure control.
  • example embodiments of the present invention provide an apparatus having an improved nozzle to inject a molten solder into cavities of a template, which enables easy pressure control during a solder injecting process.
  • a template having a surface portion, on which a plurality of cavities is formed may be placed in an airtight space.
  • a nozzle for providing the molten solder may be brought into contact with the surface portion of the template.
  • a differential pressure between the airtight space and the interior of the nozzle may be adjusted in such a way that the molten solder may be sequentially injected into the cavities by a relative movement between the nozzle and the template.
  • the nozzle may be maintained at a temperature equal to or higher than the melting point of the solder, and the template may be maintained at a temperature lower than the melting point of the solder.
  • a temperature difference between the nozzle and the template may be in a range of about 3 0 C to about 1O 0 C.
  • the airtight space may be maintained at a pressure lower than atmospheric pressure, and the interior of the nozzle may be maintained at a pressure higher than the pressure in the airtight space while injecting the molten solder into the cavities.
  • an inert gas may be supplied into the interior of the nozzle to evenly maintain the differential pressure while injecting the molten solder into the cavities.
  • the interior of the nozzle may be maintained at a pressure equal to or lower than that in the airtight space to prevent leakage of the molten solder from the nozzle before injecting the molten solder into the cavities.
  • a template having a surface portion, on which a plurality of cavities is formed may be placed in a first space, and a nozzle for injecting the molten solder into the cavities may be placed in a second space.
  • a pressure in the first space may be adjusted to become equal to a pressure in the second space, and the template may then be transferred from the first space into the second space.
  • the nozzle may be brought into contact with the surface portion of the template.
  • the molten solder may be sequentially injected into the cavities by producing a relative movement between the nozzle and the template and adjusting a differential pressure between the second space and the interior of the nozzle.
  • the second space may be maintained at a pressure lower than atmospheric pressure.
  • an inert gas may be supplied into the nozzle to evenly maintain the differential pressure.
  • the interior of the nozzle may be maintained at a pressure equal to or lower than that in the second space to prevent leakage of the molten solder from the nozzle before injecting the molten solder into the cavities.
  • an apparatus for injecting a molten solder may include a chamber receiving a template having a surface portion on which a plurality of cavities is formed, a nozzle disposed in the chamber to provide the molten solder, a driving section bringing the nozzle into contact with the surface portion of the template and producing a relative movement between the template and the nozzle, and a pressure-adjusting section adjusting a differential pressure between the interior of the nozzle and the interior of the chamber to sequentially inject the molten solder into the cavities during the relative movement.
  • the nozzle may include a housing receiving the molten solder and having a slit to inject the molten solder into the cavities and a heater connected to the housing to melt the solder in the housing.
  • the housing may be maintained at a temperature equal to or higher than the melting point of the solder.
  • the apparatus may further include a chuck supporting the template and a heater connected to the chuck to maintain the template at a temperature lower than the melting point of the solder.
  • the apparatus may further include a chuck supporting the template, a first heater connected to the nozzle to maintain the nozzle at a temperature higher than the melting point of the solder and a second heater connected to the chuck to maintain the template at a temperature lower than the melting point of the solder.
  • a temperature difference between the nozzle and the template may be in a range of about 3 0 C to about 1O 0 C.
  • the driving section may move one of the nozzle and the chuck in a vertical direction and may move another one of the nozzle and the chuck in a horizontal direction.
  • the driving section may move the nozzle or the chuck in vertical and horizontal directions.
  • the pressure-adjusting section may maintain the interior of the chamber at a pressure lower than atmospheric pressure and may maintain the interior of the nozzle at a pressure higher than a pressure in the chamber while injecting the molten solder into the cavities.
  • the pressure-adjusting section may supply an inert gas into the nozzle to evenly maintain the differential pressure while injecting the molten solder into the cavities.
  • the pressure-adjusting section may maintain the interior of the nozzle at a pressure equal to or lower than a pressure in the chamber to prevent leakage of the molten solder from the nozzle before injecting the molten solder into the cavities.
  • an apparatus for injecting a molten solder may include a load-lock chamber, a process chamber, a transfer module transferring a template between the load-lock chamber and the process chamber, the template having a surface portion on which a plurality of cavities is formed, a nozzle disposed in the process chamber to provide the molten solder, a driving section bringing the nozzle into contact with the surface portion of the template and producing a relative movement between the nozzle and the template, and a pressure-adjusting section adjusting a pressure in the load-lock chamber to become equal to a pressure in the process chamber while transferring the template between the load-lock chamber and the process chamber, and adjusting a differential pressure between the interior of the nozzle and the interior of the process chamber to sequentially inject the molten solder into the cavities during the relative movement.
  • the pressure-adjusting section may maintain the interior of the process chamber at a pressure lower than atmospheric pressure.
  • the pressure-adjusting section may supply an inert gas into the nozzle to evenly maintain the differential pressure.
  • the pressure-adjusting section may maintain the interior of the nozzle at a pressure equal to or lower than the pressure in the process chamber to prevent leakage of the molten solder from the nozzle before injecting the molten solder into the cavities.
  • a pressure control may be easily performed while injecting a molten solder into cavities of a template using a nozzle.
  • the nozzle has a simple structure in comparison with a conventional injection head.
  • manufacturing costs of an apparatus for injecting the molten solder may be reduced.
  • a contact area between the nozzle and the template is relatively small, leakage of the molten solder may be reduced between the nozzle and the template.
  • F IG. 1 is a schematic view illustrating an apparatus for injecting a molten solder according to an example embodiment of the present invention
  • F IG. 2 is a perspective view illustrating a nozzle shown in F IG. 1 ;
  • F IG. 3 is a schematic view illustrating a process controller shown in F IG. 1;
  • F IG. 4 is a perspective view illustrating another example of the nozzle shown in
  • FIG. 2
  • F IG. 5 is a perspective view illustrating still another example of the nozzle shown in
  • F IGS. 6 and 7 are cross-sectional views illustrating a method of injecting a molten solder into cavities of a template.
  • F IG. 8 is a schematic view illustrating an apparatus for injecting a molten solder according to another example embodiment of the present invention. Best Mode for Carrying Out the Invention
  • first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first thin film could be termed a second thin film, and, similarly, a second thin film could be termed a first thin film without departing from the teachings of the disclosure.
  • relative terms such as “lower” or “bottom” and “upper” or “top” may be used herein to describe one element's relationship to other elements as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. The exemplary term “lower,” can therefore, encompass both an orientation of “lower” and “upper” depending on the particular orientation of the figure.
  • Example embodiments of the present invention are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments of the present invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the present invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region illustrated or described as flat may, typically, have rough and/or nonlinear features. Moreover, sharp angles that are illustrated may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present invention.
  • F IG. 1 is a schematic view illustrating an apparatus for injecting a molten solder according to an example embodiment of the present invention.
  • an apparatus 100 for injecting a molten solder 10 may include a process chamber 102, in which a solder injecting process is performed.
  • the process chamber 102 may provide an airtight space, and a chuck 104 may be disposed in the process chamber 102 to support a template 20 on which a plurality of cavities (22; see F IG. 5) is formed at a surface portion thereof.
  • a nozzle 110 may be disposed in the process chamber 102 to provide the molten solder 10.
  • the nozzle 110 may extend upwardly through an upper portion of the process chamber 102.
  • the nozzle 110 may include a housing to receive a solder material therein, and a slit may be formed through a lower portion of the housing to inject the molten solder 10 into the cavities 22 of the template 20. As shown in F IG. 1, the nozzle 110 has a simple structure in comparison with a conventional injection head, and thus manufacturing costs of the nozzle 110 may be reduced.
  • the molten solder 10 may include tin (Sn), silver (Ag), copper (Cu), bismuth (Bi), indium (In), and the like. These materials may be used alone or in a combination thereof.
  • F IG. 2 is a perspective view illustrating the nozzle shown in F IG. 1.
  • the nozzle 110 may have a flat lower surface, which may extend longitudinally in a horizontal direction.
  • the template 20 may have a flat upper surface, at which the cavities 22 may be formed. Further, the template 20 may have an injection region 20a, which has a shape similar to a semiconductor wafer, and a peripheral region 20b surrounding the injection region 20a. The cavities 22 may be disposed in the injection region 20a. [61] Referring again to F IG. 1, the nozzle 110 may be connected with a first heater 112.
  • the first heater 112 may be provided to heat the nozzle 110 to a temperature higher than the melting point of the solder. That is, the solder may be melted in the nozzle 110 by the first heater 112.
  • the first heater 112 may be contained within the nozzle 110 and may include an electrical resistance heating wire.
  • the apparatus 100 may include a driving section to produce between the nozzle 110 and the template 20 supported by the chuck 104.
  • the driving section may move the nozzle 110 to bring the lower portion of the nozzle 110 into close contact with the surface portion of the template 20, and may further produce a relative sliding movement between the nozzle 110 and the template 20 in such a way that the molten solder 10 may be sequentially injected into the cavities 22 from the nozzle 110 which is in close contact with the template 20.
  • the driving section may include a first driving section 120 moving the nozzle 110 in a vertical direction and a second driving section 122 moving the chuck 104 in a horizontal direction.
  • the driving section may move the chuck 104 or the nozzle 110 in vertical and horizontal directions.
  • the driving section may include a first driving section moving the chuck 104 in a vertical direction and a second driving section moving the nozzle 110 in a horizontal direction.
  • Each of the first and second driving sections 120 and 122 may include a hydraulic or pneumatic cylinder.
  • each of the first and second driving sections 120 and 122 may include a one-axis actuator including a motor, a linear motion guide, etc.
  • the configuration of the driving section may vary and the scope of the present invention may not be limited by the configuration of the driving section.
  • the chuck 104 may be connected with a second heater 114.
  • the second heater 114 may be provided to adjust the temperature of the template 20.
  • the second heater 114 may adjust the temperature of the template 20 to a temperature lower than the melting point of the solder.
  • the second heater 114 may adjust the temperature of the template 20 to a temperature approximately 3 0 C to approximately 1O 0 C lower than that of the nozzle 110.
  • the temperature of the template 20 is excessively low, the temperature of the nozzle 110, which is in contact with the template 20, may become lower so that the solder may be solidified in the nozzle 110.
  • the temperature of the template 20 is higher than the melting point of the solder, the molten solder 10 injected into the cavities 22 may not be solidified.
  • the apparatus 100 may include a process controller 130 to control a solder injecting process.
  • F IG. 3 is a schematic view illustrating the process controller shown in F IG. 1.
  • the process controller 130 may include a temperature-adjusting section 140 and a pressure-adjusting section 150.
  • the temperature-adjusting section 140 may include a first temperature sensor 142 connected to the nozzle 110, a second temperature sensor 144 connected to the chuck 104 and a temperature controller 146 connected with the first and second temperature sensors 142 and 144.
  • the temperature controller 146 may produce control signals to control the temperatures of the nozzle 110 and the chuck 104 on the basis of temperature signals from the first and second temperature sensors 142 and 144. That is, the first heater 112 and the second heater 114 may be controlled by the control signals from the temperature controller 146.
  • the pressure-adjusting section 150 may include a first pressure sensor 152 measuring a pressure in the process chamber 102, a second pressure sensor 154 measuring a pressure in the nozzle 110, a pressure controller 156 producing control signals in accordance with a differential pressure between the pressure in the process chamber 102 and the pressure in the nozzle 110, a gas supply 160 connected with the pressure controller 156 and supplying an inert gas into the process chamber 102 and the nozzle 110, and a vacuum system 170 evacuating the process chamber 102 and the nozzle 110.
  • a differential pressure sensor may be used in substitution for the first and second pressure sensors 152 and 154.
  • the gas supply 160 may include a gas tank 162 storing the inert gas, which may be connected to the process chamber 102 and the nozzle 110 by gas supply lines.
  • On-off valves 164 and mass flow controllers 166 may be disposed in each of the gas supply lines. Flow rates of the inert gas supplied into the process chamber 102 and the nozzle 110 may be controlled by the on-off valves 164 and the mass flow controllers 166.
  • Examples of the inert gas may include nitrogen (N2), argon (Ar), helium (He), and the like. Thus, contamination of the molten solder 10 in the nozzle 110 and the solders injected into the cavities 22 may be prevented.
  • the vacuum system 170 may include a vacuum pump 172 and a buffer tank 174.
  • the vacuum pump 172 may be connected to the buffer tank 174 by a first vacuum line
  • the buffer tank 174 may be connected to the process chamber 102 and the nozzle 110 by second vacuum lines.
  • On-off valves 176 and mass flow controllers 178 (or pressure control valves) may be disposed in the second vacuum lines.
  • the on-off valves 164 and 176 and the mass flow controllers 166 and 178 of the vacuum system 170 of the gas supply 160 and the vacuum system 170 may be connected to the pressure controller 156 and may be controlled by the control signals from the pressure controller 156.
  • the interior of the process chamber 102 may be maintained at a pressure equal to or lower than atmospheric pressure.
  • the pressure in the process chamber 102 may be adjusted to within a range of about 760 Torr to about 50 mTorr.
  • the pressure in the nozzle 110 may be adjusted to a pressure higher than the pressure in the process chamber 102 to inject the molten solder 10 into the cavities 22. That is, the molten solder 10 in the nozzle 110 may be injected into the cavities 22 by the differential pressure between the process chamber 102 and the nozzle 110.
  • the pressure in the nozzle 110 may be maintained at a pressure equal to or lower than the pressure in the process chamber 102 to prevent leakage of the molten solder 10 through the slit of the nozzle 110 before and after injecting the molten solder 10 into the cavities 22.
  • the pressure in the nozzle 110 may be maintained at a pressure lower than the atmospheric pressure, and the pressure in the process chamber 102 may be adjusted to a pressure lower than the pressure in the nozzle 110 to inject the molten solder 10 into the cavities 22. Meanwhile, the pressure in the process chamber 102 may be maintained at a pressure equal to or higher than the pressure in the nozzle 110 to prevent leakage of the molten solder 10 through the slit of the nozzle 110 before and after injecting the molten solder 10 into the cavities 22.
  • the molten solder 10 in the nozzle 110 may be sequentially injected into the cavities 22 by the differential pressure between the process chamber 102 and the nozzle 110 and the relative sliding movement between the template 20 and the nozzle 110.
  • the length of the lower surface of the nozzle 110 may be longer than the diameter of the injection region 20a.
  • the scope of the present invention may not be limited by the length of the lower surface of the nozzle 110.
  • the apparatus 100 may include a plurality of nozzles, and each of the nozzles may have an extension length shorter than the diameter of the injection region 20a.
  • F IG. 4 is a perspective view illustrating another example of the nozzle shown in
  • FIG. 2, and F IG. 5 is a perspective view illustrating still another example of the nozzle shown in F IG. 2.
  • the length of a lower surface of a nozzle 11OA may be shorter than the diameter of the injection region 20a.
  • the nozzle 110 or the chuck 104 may move in a zigzag pattern to sequentially inject the molten solder 10 into the cavities 22.
  • a cooling member 11OC which is formed of an insulating material, may be connected to a lower portion of a nozzle 11OB.
  • a lower surface of the cooling member HOC makes contact with the surface portion of the template 20 together with a lower surface of the nozzle HOB.
  • the cooling member HOC may be provided to solidify the solders 10a injected into the cavities 22. That is, the cooling member HOC may be maintained at a temperature lower than that of the nozzle HOB, and thus the solders 10a injected into the cavities 22 may be solidified with ease.
  • the process chamber 102 may have a gate door 106 to carry the template 20 in and out.
  • the template 20 carried into the process chamber 102 through the gate door 106 may be supported by the chuck 104.
  • the apparatus 100 may further include a lifting unit to load and unload the template 20 onto and from the chuck 102.
  • the lifting unit may include a plurality of lift pins movable vertically through the chuck 102 and a driving section for vertically moving the lift pins.
  • the configuration of the lifting unit may vary, and the scope of the present invention may not be limited by the configuration of the lifting unit.
  • a template 20 having a surface portion on which a plurality of cavities 22 is formed may be carried into a process chamber 102 through a gate door 106.
  • the template 20 may be loaded on a chuck 104 in the process chamber 102 by a lifting unit.
  • the template 20 may be carried into the process chamber by an external transfer module (not shown).
  • the interior of the process chamber 102 may be adjusted to a pressure lower than atmospheric pressure.
  • a gas supply 160 may supply an inert gas into the process chamber 102 and a vacuum system may evacuate the process chamber 102 so that contaminants may be removed from the process chamber 102.
  • the nozzle 110 may be heated to a temperature higher than the melting point of a solder material by a first heater 112 so that the solder material may be melted in the nozzle 110.
  • the interior of the nozzle 110 may be maintained at a pressure lower than that in the process chamber 102 to prevent leakage of the molten solder 10 through a slit of the nozzle 110.
  • a differential pressure between the process chamber 102 and the nozzle 110 may be evenly maintained while adjusting the pressure in the process chamber 102.
  • the template 20 may be heated to a temperature lower than the melting point of the solder.
  • a temperature difference between the nozzle 110 and the template 20 may be maintained in a range of about 3 0 C to about 1O 0 C.
  • the temperature difference may be maintained to about 5 0 C.
  • a second driving section 122 may move the template 20, which is supported by the chuck 104, to under the nozzle 110.
  • a first driving section 120 may downwardly move the nozzle 100 to bring the nozzle 110 into close contact with a peripheral region 20b of the template 20.
  • leakage of the molten solder 10 may be prevented or reduced because the contact area between the nozzle 110 and the template 20 is relatively small in comparison with a conventional injection head.
  • a seal between the nozzle 110 and the template 20 may be accomplished by line contact between a lower portion of the nozzle 110 and the template 20.
  • the differential pressure between the process chamber 102 and the nozzle 110 may be adjusted in such a way that the pressure in the nozzle 110 may become higher than the pressure in the process chamber 102.
  • the differential pressure may be adjusted to inject the molten solder 10 into the cavities 22.
  • the differential pressure may be adjusted by supplying the inert gas into the nozzle 110.
  • the second driving section 122 may move the chuck 104 in a horizontal direction to produce a relative sliding movement between the nozzle 110 and the template 20.
  • the molten solder 10 may be sequentially injected into the cavities 22 of the template 20 as shown in F IGS. 6 and 7.
  • the pressure in the nozzle 110 may be evenly maintained while injecting the molten solder 10 into the cavities 22.
  • the flow rate of the inert gas may be adjusted such that the pressure in the nozzle 110 may be substantially evenly maintained.
  • the pressure in the nozzle 110 may be nonlinearly maintained to within a predetermined range. In such a case, the inert gas may be discretely supplied into the nozzle 110.
  • the pressure in the process chamber 102 may be linearly or nonlinearly to within a predetermined range by the vacuum system 170. That is, the differential pressure between the process chamber 102 and the nozzle 110 may be maintained almost evenly in a predetermined range by the gas supply 160 and the vacuum system 170. Particularly, because the volume of the process chamber 102 is relatively small in comparison with a recess of the conventional injection head, the differential pressure may be adjusted with ease, thereby improving the solder-injecting process.
  • solders 10a injected into the cavities 22 may be solidified by the temperature difference between the nozzle 110 and the template 20.
  • the nozzle 110 may be adjusted to become lower than the pressure in the process chamber 102 to prevent leakage of the molten solder 10 through the slit of the nozzle 110.
  • the first driving section 120 may move upwardly the nozzle 110, and the second driving section 122 may then move the chuck 104 to a place adjacent to the gate door 106.
  • the template 20 may be unloaded from the chuck 104 by the lifting unit, and may be carried out of the process chamber 102 by the transfer module.
  • F IG. 8 is a schematic view illustrating an apparatus for injecting a molten solder according to another example embodiment of the present invention.
  • an apparatus 200 for injecting a molten solder may include a load- lock chamber 201 providing a first space and a process chamber 202 providing a second space.
  • the process chamber 202 may be connected with the load-lock chamber 201, and a gate door 206 may be disposed between the load-lock chamber 201 and the process chamber 202.
  • a container 203 may be disposed in the load- lock chamber 201 to receive a plurality of templates 20, and further a transfer module 208 may be disposed in the load-lock chamber 201 to transfer the templates 20 between the load-lock chamber 201 and the process chamber 202.
  • Each of the templates 20 may have a surface portion on which a plurality of cavities is formed.
  • the container 203 may be disposed outside the load-lock chamber 201.
  • a chuck 204 for supporting the template 20 and a nozzle 210 for providing the molten solder 10 may be disposed in the process chamber 202.
  • the nozzle 210 and the chuck 204 may be connected with first and second heaters 212 and 214, respectively.
  • a process controller 230 may be connected to the load-lock chamber 201, the process chamber 202, the nozzle 210 and the chuck 204, and may control the temperature of the nozzle 210, the temperature of the chuck 204, a pressure in the nozzle 210, a pressure in the load- lock chamber 201 and a pressure in the process chamber 202.
  • the process controller 230 may include a gas supply for supplying an inert gas into the load- lock chamber 201, the process chamber 202 and the nozzle 210, and a vacuum system for evacuating the load-lock chamber 201, the process chamber 202 and the nozzle 210.
  • the process controller 230 may control the pressure in the load-lock chamber 201 in such a way as to become equal to that in the process chamber 202 while transferring the template 20 between the container 203 in the load-lock chamber 201 and the chuck 204 in the process chamber 202.
  • the pressure in the process chamber 202 may vary, and thus a differential pressure between the process chamber 202 and the nozzle 210 may vary.
  • the process controller 230 may control the pressure in the load- lock chamber 201 in such a way as to prevent the variation of the process chamber 202.
  • leakage the molten solder 10 through a slit of the nozzle 210 may be prevented.
  • the pressure in the load- lock chamber 201 and the pressure in the process chamber 202 may be always evenly maintained, and the pressure in the nozzle 210 may be adjusted in such a way as to become higher than that in the process chamber 202 to inject the molten solder 10 into the cavities of the template 20. That is, the molten solder 10 may be injected into the cavities of the template 20 by only adjusting the pressure in the nozzle 210.
  • the interior of the nozzle 210 may be maintained at a first pressure lower than that in the process chamber 202 while transferring the template 20 and may be maintained at a second pressure higher than that in the process chamber 202 while injecting the molten solder 10 into the cavities.
  • Reference numerals 220 and 222 denote a first driving section and a second driving section, respectively. Further detailed descriptions of the first and second driving sections 220 and 222 will be omitted because these elements are similar to those already described with reference to F IGS. 1 to 7. Industrial Applicability
  • a structure of a solder injection nozzle is simple in comparison with a conventional injection head, thereby reducing manufacturing costs of the nozzle. Further, because the volume of a process chamber is relatively large, a pressure in the process chamber may be adjusted with ease while injecting a molten solder into cavities of a template in the process chamber, thereby improving a solder-injecting process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé d'injection de métal d'apport fondu dans des cavités d'un masque et un appareil destiné à le mettre en œuvre, une buse étant disposée de façon à amener le métal d'apport fondu dans une chambre de processus et à établir un contact avec une partie de la surface du masque. La pression dans la chambre de processus est réglée de façon à être inférieure à celle régnant dans la buse. Une section d'entraînement crée un mouvement de translation relative entre la buse and le masque. Le métal d'apport fondu peut ainsi être injecté de façon séquentielle dans les cavités sous l'effet de la pression différentielle entre la chambre de processus et la buse et du mouvement de translation relative.
PCT/KR2008/002040 2007-12-21 2008-04-11 Procédé d'injection de métal d'apport fondu dans des cavités d'un masque et appareil pour le mettre en œuvre Ceased WO2009082062A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070135567A KR100923249B1 (ko) 2007-12-21 2007-12-21 템플릿의 캐버티들에 용융된 솔더를 주입하는 방법 및 이를수행하기 위한 장치
KR10-2007-0135567 2007-12-21

Publications (1)

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WO2009082062A1 true WO2009082062A1 (fr) 2009-07-02

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PCT/KR2008/002040 Ceased WO2009082062A1 (fr) 2007-12-21 2008-04-11 Procédé d'injection de métal d'apport fondu dans des cavités d'un masque et appareil pour le mettre en œuvre

Country Status (3)

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KR (1) KR100923249B1 (fr)
TW (1) TWI384599B (fr)
WO (1) WO2009082062A1 (fr)

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CN103140055A (zh) * 2011-11-28 2013-06-05 联发科技（新加坡）私人有限公司 先进方形扁平无引脚封装的表面贴装技术工艺及其模板
EP2770528A4 (fr) * 2011-10-18 2015-05-20 Senju Metal Industry Co Procédé et dispositif de formation de bossages de soudure
CN105108262A (zh) * 2015-10-08 2015-12-02 天津电气科学研究院有限公司 一种线路板直插器件自动焊接机
CN107427857A (zh) * 2015-01-13 2017-12-01 千住金属工业株式会社 流体排出装置、流体排出方法及流体涂覆装置

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KR20110026151A (ko) * 2009-09-07 2011-03-15 세크론 주식회사 솔더 범프 형성 장치
KR101135562B1 (ko) * 2009-12-03 2012-04-17 세크론 주식회사 템플릿의 캐버티들에 용융된 솔더를 주입하기 위한 노즐 조립체 및 이를 포함하는 솔더 주입 장치
TWI460776B (zh) * 2012-06-27 2014-11-11 D Tek Technology Co Ltd 應用於晶圓的銅柱焊料的製造方法及其設備

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EP2770528A4 (fr) * 2011-10-18 2015-05-20 Senju Metal Industry Co Procédé et dispositif de formation de bossages de soudure
US9511438B2 (en) 2011-10-18 2016-12-06 Senju Metal Industry Co., Ltd. Solder bump forming method and apparatus
CN104137242B (zh) * 2011-10-18 2017-08-25 千住金属工业株式会社 焊锡焊盘形成方法以及装置
CN103140055A (zh) * 2011-11-28 2013-06-05 联发科技（新加坡）私人有限公司 先进方形扁平无引脚封装的表面贴装技术工艺及其模板
CN107427857A (zh) * 2015-01-13 2017-12-01 千住金属工业株式会社 流体排出装置、流体排出方法及流体涂覆装置
US20180021803A1 (en) * 2015-01-13 2018-01-25 Senju Metal Industry Co., Ltd. Fluid discharge device, fluid discharge method, and fluid application device
EP3246097A4 (fr) * 2015-01-13 2018-07-18 Senju Metal Industry Co., Ltd Dispositif d'évacuation de fluide, procédé d'évacuation de fluide, et dispositif d'application de fluide
US10632492B2 (en) 2015-01-13 2020-04-28 Senju Metal Industry Co., Ltd. Fluid discharge device, fluid discharge method, and fluid application device
EP4234103A3 (fr) * 2015-01-13 2023-09-13 Senju Metal Industry Co., Ltd. Dispositif d'évacuation de fluide, procédé d'évacuation de fluide et dispositif d'application de fluide
CN105108262A (zh) * 2015-10-08 2015-12-02 天津电气科学研究院有限公司 一种线路板直插器件自动焊接机
CN105108262B (zh) * 2015-10-08 2017-03-29 天津电气科学研究院有限公司 一种线路板直插器件自动焊接机

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KR20090067791A (ko) 2009-06-25
KR100923249B1 (ko) 2009-10-27
TWI384599B (zh) 2013-02-01
TW200929483A (en) 2009-07-01

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