WO2009082786A3 - Echangeur de chaleur - Google Patents
Echangeur de chaleur Download PDFInfo
- Publication number
- WO2009082786A3 WO2009082786A3 PCT/BE2008/000105 BE2008000105W WO2009082786A3 WO 2009082786 A3 WO2009082786 A3 WO 2009082786A3 BE 2008000105 W BE2008000105 W BE 2008000105W WO 2009082786 A3 WO2009082786 A3 WO 2009082786A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- base plate
- metal alloy
- heat exchanger
- cooling fins
- accumulator blocks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
- A61F2007/0054—Heating or cooling appliances for medical or therapeutic treatment of the human body with a closed fluid circuit, e.g. hot water
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- Vascular Medicine (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Animal Behavior & Ethology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Heart & Thoracic Surgery (AREA)
- Biomedical Technology (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
L'invention concerne un échangeur de chaleur composé d'une plaque de base (2), de plusieurs ailettes de refroidissement (3) et de blocs accumulateurs (6), les ailettes de refroidissement (3) étant fixées à la plaque de base (2) et les blocs accumulateurs (6) étant pressés dans la plaque de base ou placés à l'intérieur de celle-ci. L'échangeur est caractérisé en ce que la plaque de base (2) et les ailettes de refroidissement (3) sont composées d'un premier alliage métallique et en ce que les blocs accumulateurs (6) sont composés d'un second alliage métallique, ledit second alliage métallique assurant une meilleure conduction thermique que le premier alliage métallique.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08865962A EP2232188A2 (fr) | 2007-12-31 | 2008-12-29 | Echangeur de chaleur |
| US12/811,148 US20100276114A1 (en) | 2007-12-31 | 2008-12-29 | Heat exchanger |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE2007/0623 | 2007-12-31 | ||
| BE2007/0623A BE1017916A3 (nl) | 2007-12-31 | 2007-12-31 | Warmtewisselaar. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2009082786A2 WO2009082786A2 (fr) | 2009-07-09 |
| WO2009082786A3 true WO2009082786A3 (fr) | 2009-10-15 |
Family
ID=39686601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/BE2008/000105 Ceased WO2009082786A2 (fr) | 2007-12-31 | 2008-12-29 | Echangeur de chaleur |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100276114A1 (fr) |
| EP (1) | EP2232188A2 (fr) |
| BE (1) | BE1017916A3 (fr) |
| WO (1) | WO2009082786A2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103379803A (zh) * | 2012-04-28 | 2013-10-30 | 昆山广禾电子科技有限公司 | 结构改进的散热片模组 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110972443B (zh) * | 2018-09-30 | 2023-09-15 | 泰科电子(上海)有限公司 | 散热装置和壳体组件 |
| CN110972444B (zh) * | 2018-09-30 | 2022-09-06 | 泰科电子(上海)有限公司 | 散热装置和壳体组件 |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH291669A (de) * | 1950-07-29 | 1953-06-30 | Weidmann Rudolf | Kühlvorrichtung für medizinische Zwecke. |
| US3216496A (en) * | 1961-02-01 | 1965-11-09 | Astro Dynamics Inc | Heat sink for electronic devices |
| GB1296578A (fr) * | 1969-11-28 | 1972-11-15 | ||
| EP0890986A2 (fr) * | 1997-06-30 | 1999-01-13 | Nec Corporation | Dispositif de refroidissement pour module à multi-puce et procédé de fabriction |
| US6085833A (en) * | 1996-06-06 | 2000-07-11 | Furukawa Electric Co., Ltd. | Heat sink |
| US20020139518A1 (en) * | 2001-02-23 | 2002-10-03 | Dongyun Lee | Fan holder |
| US20030024693A1 (en) * | 2001-07-31 | 2003-02-06 | Petty Eric Hayes | Counter flow two pass active heat sink with heat spreader |
| WO2003052340A1 (fr) * | 2001-12-13 | 2003-06-26 | Graftech Inc. | Composant de dissipation thermique mettant en oeuvre des pieces rapportees hautement conductrices |
| US20040011508A1 (en) * | 2002-07-16 | 2004-01-22 | Li-Kuang Tan | Heat sink |
| US20040070070A1 (en) * | 2002-10-11 | 2004-04-15 | Chien-Min Sung | Carbonaceous composite heat spreader and associated methods |
| US20050006054A1 (en) * | 2002-01-16 | 2005-01-13 | Ryuuji Miyazaki | Heat sink having high efficiency cooling capacity and semiconductor device comprising it |
| EP1498947A2 (fr) * | 2003-07-15 | 2005-01-19 | Behr-Hella Thermocontrol GmbH | Circuit électronique avec un dispositf semi-conducteur à haute prestation et un dispositif de protection pour protéger le dispositif semi-conducteur à haute prestation contre la surchauffe |
| US20050013119A1 (en) * | 2003-07-17 | 2005-01-20 | Sanjay Misra | Thermal diffusion apparatus |
| US20050141193A1 (en) * | 2003-12-26 | 2005-06-30 | Nidec Corporation | Heat Sink Fan and Method for Manufacturing Heat Sink That Is Used For the Heat Sink Fan |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4026299A (en) * | 1975-09-26 | 1977-05-31 | Vari-Temp Manufacturing Co. | Cooling and heating apparatus |
| US4962761A (en) * | 1987-02-24 | 1990-10-16 | Golden Theodore A | Thermal bandage |
| US5174285A (en) * | 1990-01-08 | 1992-12-29 | Lake Shore Medical Development Partners Ltd. | Localized heat transfer device |
| US5097829A (en) * | 1990-03-19 | 1992-03-24 | Tony Quisenberry | Temperature controlled cooling system |
| US5895418A (en) * | 1994-09-30 | 1999-04-20 | Saringer Research Inc. | Device for producing cold therapy |
| US6182453B1 (en) * | 1996-04-08 | 2001-02-06 | Worldwide Water, Inc. | Portable, potable water recovery and dispensing apparatus |
| BE1010730A7 (nl) * | 1996-11-04 | 1998-12-01 | Pira Luc Louis Marie Francis | Cryoprobe op basis van peltier module. |
| US9119705B2 (en) * | 1998-06-08 | 2015-09-01 | Thermotek, Inc. | Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis |
| US6644395B1 (en) * | 1999-11-17 | 2003-11-11 | Parker-Hannifin Corporation | Thermal interface material having a zone-coated release linear |
| US6651732B2 (en) * | 2001-08-31 | 2003-11-25 | Cool Shield, Inc. | Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit |
| US6807345B2 (en) * | 2002-05-28 | 2004-10-19 | Agilent Technologies, Inc. | Systems and methods for removing heat from opto-electronic components |
| US6771502B2 (en) * | 2002-06-28 | 2004-08-03 | Advanced Energy Technology Inc. | Heat sink made from longer and shorter graphite sheets |
| US6755026B2 (en) * | 2002-10-24 | 2004-06-29 | Tech Medical Devices Inc. | Thermoelectric system to directly regulate the temperature of intravenous solutions and bodily fluids |
| US6770085B1 (en) * | 2003-04-11 | 2004-08-03 | Ryan R Munson | Heat absorbing pad |
| US8491644B1 (en) * | 2005-02-22 | 2013-07-23 | Medivance Incorporated | Portable, refrigerant-based apparatus and method for rapid systemic patient cooling |
| TWM275458U (en) * | 2005-04-01 | 2005-09-11 | Foxconn Tech Co Ltd | Heat dissipation device |
| JP4809095B2 (ja) * | 2006-03-28 | 2011-11-02 | 富士通株式会社 | ヒートシンク |
| CN101106888B (zh) * | 2006-07-14 | 2012-06-13 | 富准精密工业(深圳)有限公司 | 散热模组 |
| US20080097562A1 (en) * | 2006-10-19 | 2008-04-24 | Dyamed Biotech Pte Ltd | System For Chemohyperthermia Treatment |
| US8235094B2 (en) * | 2007-07-31 | 2012-08-07 | Adc Telecommunications, Inc. | Apparatus for transferring heat in a fin of a heat sink |
| US7606030B2 (en) * | 2007-12-12 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US8475508B2 (en) * | 2008-05-15 | 2013-07-02 | Ryan R Munson | Therapeutic cooling system |
| CN102065666A (zh) * | 2009-11-12 | 2011-05-18 | 富准精密工业(深圳)有限公司 | 散热装置 |
| CN102956582A (zh) * | 2011-08-29 | 2013-03-06 | 富准精密工业(深圳)有限公司 | 散热装置 |
-
2007
- 2007-12-31 BE BE2007/0623A patent/BE1017916A3/nl not_active IP Right Cessation
-
2008
- 2008-12-29 US US12/811,148 patent/US20100276114A1/en not_active Abandoned
- 2008-12-29 WO PCT/BE2008/000105 patent/WO2009082786A2/fr not_active Ceased
- 2008-12-29 EP EP08865962A patent/EP2232188A2/fr not_active Withdrawn
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH291669A (de) * | 1950-07-29 | 1953-06-30 | Weidmann Rudolf | Kühlvorrichtung für medizinische Zwecke. |
| US3216496A (en) * | 1961-02-01 | 1965-11-09 | Astro Dynamics Inc | Heat sink for electronic devices |
| GB1296578A (fr) * | 1969-11-28 | 1972-11-15 | ||
| US6085833A (en) * | 1996-06-06 | 2000-07-11 | Furukawa Electric Co., Ltd. | Heat sink |
| EP0890986A2 (fr) * | 1997-06-30 | 1999-01-13 | Nec Corporation | Dispositif de refroidissement pour module à multi-puce et procédé de fabriction |
| US20020139518A1 (en) * | 2001-02-23 | 2002-10-03 | Dongyun Lee | Fan holder |
| US20030024693A1 (en) * | 2001-07-31 | 2003-02-06 | Petty Eric Hayes | Counter flow two pass active heat sink with heat spreader |
| WO2003052340A1 (fr) * | 2001-12-13 | 2003-06-26 | Graftech Inc. | Composant de dissipation thermique mettant en oeuvre des pieces rapportees hautement conductrices |
| US20050006054A1 (en) * | 2002-01-16 | 2005-01-13 | Ryuuji Miyazaki | Heat sink having high efficiency cooling capacity and semiconductor device comprising it |
| US20040011508A1 (en) * | 2002-07-16 | 2004-01-22 | Li-Kuang Tan | Heat sink |
| US20040070070A1 (en) * | 2002-10-11 | 2004-04-15 | Chien-Min Sung | Carbonaceous composite heat spreader and associated methods |
| EP1498947A2 (fr) * | 2003-07-15 | 2005-01-19 | Behr-Hella Thermocontrol GmbH | Circuit électronique avec un dispositf semi-conducteur à haute prestation et un dispositif de protection pour protéger le dispositif semi-conducteur à haute prestation contre la surchauffe |
| US20050013119A1 (en) * | 2003-07-17 | 2005-01-20 | Sanjay Misra | Thermal diffusion apparatus |
| US20050141193A1 (en) * | 2003-12-26 | 2005-06-30 | Nidec Corporation | Heat Sink Fan and Method for Manufacturing Heat Sink That Is Used For the Heat Sink Fan |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103379803A (zh) * | 2012-04-28 | 2013-10-30 | 昆山广禾电子科技有限公司 | 结构改进的散热片模组 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2232188A2 (fr) | 2010-09-29 |
| US20100276114A1 (en) | 2010-11-04 |
| WO2009082786A2 (fr) | 2009-07-09 |
| BE1017916A3 (nl) | 2009-11-03 |
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