WO2009083565A3 - Dispositif micromecanique ou nanomecanique a couche d'interface anti-collage - Google Patents

Dispositif micromecanique ou nanomecanique a couche d'interface anti-collage Download PDF

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Publication number
WO2009083565A3
WO2009083565A3 PCT/EP2008/068283 EP2008068283W WO2009083565A3 WO 2009083565 A3 WO2009083565 A3 WO 2009083565A3 EP 2008068283 W EP2008068283 W EP 2008068283W WO 2009083565 A3 WO2009083565 A3 WO 2009083565A3
Authority
WO
WIPO (PCT)
Prior art keywords
walls
cavity
micromechanical
mobile
interface layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/068283
Other languages
English (en)
Other versions
WO2009083565A2 (fr
Inventor
Stéphane CAPLET
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of WO2009083565A2 publication Critical patent/WO2009083565A2/fr
Publication of WO2009083565A3 publication Critical patent/WO2009083565A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0005—Anti-stiction coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
    • B81C2201/112—Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)

Abstract

Dispositif micromécanique et/ou nanomécanique (100) comportant un premier élément (108) à base de semi-conducteur, mobile par rapport à un second élément (106) du dispositif à base de semi-conducteur, le premier élément mobile étant susceptible de se déplacer en regard d'une cavité formée dans le dispositif, des parois du premier élément mobile disposées en regard d'une paroi du second élément et d'une paroi de la cavité à base de matériau semi-conducteur étant susceptibles d'entrer en contact avec lesdites parois du second élément et de la cavité, et lesdites parois du premier élément mobile, du second élément et de la cavité étant recouvertes au moins partiellement par un matériau anti-collage conducteur (118) de telle sorte que le matériau anti-collage conducteur recouvrant lesdites parois du second élément et de la cavité soit disposé au moins partiellement en regard du matériau anti-collage conducteur recouvrant lesdites parois du premier élément mobile.
PCT/EP2008/068283 2007-12-27 2008-12-24 Dispositif micromecanique ou nanomecanique a couche d'interface anti-collage Ceased WO2009083565A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0760398A FR2925887B1 (fr) 2007-12-27 2007-12-27 Dispositif micromecanique ou nanomecanique a couche d'interface anti-collage
FR0760398 2007-12-27

Publications (2)

Publication Number Publication Date
WO2009083565A2 WO2009083565A2 (fr) 2009-07-09
WO2009083565A3 true WO2009083565A3 (fr) 2009-09-11

Family

ID=39758856

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/068283 Ceased WO2009083565A2 (fr) 2007-12-27 2008-12-24 Dispositif micromecanique ou nanomecanique a couche d'interface anti-collage

Country Status (2)

Country Link
FR (1) FR2925887B1 (fr)
WO (1) WO2009083565A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120062570A1 (en) * 2010-09-10 2012-03-15 Qualcomm Mems Technologies, Inc. Process of forming an air gap in a microelectromechanical system device using a liner material
US8470628B2 (en) * 2011-06-20 2013-06-25 International Business Machines Corporation Methods to fabricate silicide micromechanical device
US20130032904A1 (en) * 2011-08-04 2013-02-07 Robert Bosch Gmbh Coated Capacitive Sensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19817310A1 (de) * 1997-06-06 1998-12-10 Bosch Gmbh Robert Verfahren zur Herstellung von mikromechanischen Bauelementen und mikromechanisches Bauelement
US20020171150A1 (en) * 2000-11-09 2002-11-21 Joachim Rudhard Method for producing a micromechanical structure and a micromechanical structure
FR2862298A1 (fr) * 2003-11-17 2005-05-20 Bosch Gmbh Robert Procede de production des proprietes adhesives des mems et dispositifs a revetement anti-adhesifs

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19817310A1 (de) * 1997-06-06 1998-12-10 Bosch Gmbh Robert Verfahren zur Herstellung von mikromechanischen Bauelementen und mikromechanisches Bauelement
US20020171150A1 (en) * 2000-11-09 2002-11-21 Joachim Rudhard Method for producing a micromechanical structure and a micromechanical structure
FR2862298A1 (fr) * 2003-11-17 2005-05-20 Bosch Gmbh Robert Procede de production des proprietes adhesives des mems et dispositifs a revetement anti-adhesifs

Also Published As

Publication number Publication date
FR2925887A1 (fr) 2009-07-03
WO2009083565A2 (fr) 2009-07-09
FR2925887B1 (fr) 2010-06-11

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