WO2009096321A1 - Coupleur optique pouvant connecter un guide d'onde à fil mince et un guide d'onde à moulure avec une faible perte - Google Patents

Coupleur optique pouvant connecter un guide d'onde à fil mince et un guide d'onde à moulure avec une faible perte Download PDF

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Publication number
WO2009096321A1
WO2009096321A1 PCT/JP2009/051016 JP2009051016W WO2009096321A1 WO 2009096321 A1 WO2009096321 A1 WO 2009096321A1 JP 2009051016 W JP2009051016 W JP 2009051016W WO 2009096321 A1 WO2009096321 A1 WO 2009096321A1
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WIPO (PCT)
Prior art keywords
core
ridge
thin wire
waveguide
optical coupler
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PCT/JP2009/051016
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English (en)
Japanese (ja)
Inventor
Masatoshi Tokushima
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NEC Corp
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NEC Corp
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Priority to JP2009551490A priority Critical patent/JP5370678B2/ja
Publication of WO2009096321A1 publication Critical patent/WO2009096321A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1228Tapered waveguides, e.g. integrated spot-size transformers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035Materials
    • G02B2006/12038Glass (SiO2 based materials)
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035Materials
    • G02B2006/12061Silicon
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083Constructional arrangements
    • G02B2006/12097Ridge, rib or the like

Definitions

  • Optical coupler that can connect thin wire waveguide and ridge waveguide with low loss
  • the present invention relates to an optical coupler of an optical waveguide for connecting two optical waveguides, and more particularly to an optical coupler applicable to an integrated optical circuit.
  • a silicon on insulator (SOI) substrate is a laminated substrate that can be used as a substrate for optical integrated circuits.
  • the S O I substrate has a buried oxide film of a thin film of silicon dioxide formed on a silicon substrate and a silicon active layer of a thin film of silicon formed thereon.
  • a thin wire waveguide and a ridge waveguide also referred to as a rib optical waveguide
  • the thin wire waveguide using the S O I substrate is formed by processing the silicon active layer on the top layer of the S O I substrate into a thin wire shape.
  • the thin wire waveguide has a core made of silicon, a buried oxide film under the core, and a clad made of air next to or above the core.
  • the core on the side and top of the core may be made of silicon dioxide instead of air.
  • the core is formed by embedding in silicon dioxide.
  • guided light propagates while being confined in the core.
  • a ridge waveguide using an s O I substrate is formed by forming thin line-like protrusions on the silicon active layer on the top layer of the S O I substrate.
  • the ridge waveguide has a ridge-like core consisting of a thin film portion made of silicon and a projection made of silicon formed on the thin film portion, a buried oxide film under the core, and a core on the core. And a ridge core constituted by air.
  • guided light is confined near the core.
  • the top of the ridge core may also be embedded with silicon dioxide. The guided light of the ridge waveguide is confined and propagated in the vicinity of the protrusion in the thin film of the core.
  • the ridge waveguide is less susceptible to sidewall roughness than a thin wire waveguide. For this reason, When manufacturing straight optical waveguides with the same number of guided modes with the same processing accuracy using the same material system, the ridge waveguide has lower propagation loss than the thin wire waveguide. On the other hand, since thin wire waveguides have higher confinement of light than ridge waveguides, thin wire waveguides are better suited to ridge guiding when manufacturing curved optical waveguides with the same processing accuracy and the same processing accuracy using the same material system. The loss is lower than that of the waveguide.
  • the thin wire waveguide, the ridge waveguide, and both optical waveguides should have low loss on one SOI substrate.
  • An optical coupler to connect is desired.
  • the SOI substrate is used.
  • an optical coupler for connecting the thin wire waveguide and the ridge waveguide with low loss is required.
  • An optical coupler for connecting a ridge waveguide and a thin wire waveguide is disclosed, for example, in Japanese Patent Application Laid-Open No. 2007-093743, which is a related art of the present invention.
  • the optical coupler disclosed in this related art has a ridge core consisting of a thin film portion and a projection on the thin film portion.
  • the ridge core has a shape in which the width of the protrusion and the thickness of the thin film portion simultaneously decrease from one end where the ridge waveguide is connected to the other end where the thin wire waveguide is connected.
  • the height of the protrusion of the ridge core is constant from the one end to the other end.
  • the confinement of light in the thin wire waveguide connected to the other end may be stronger than the ridge waveguide connected to the one end.
  • the height of the ridge core protrusion and the height of the thin waveguide are different depending on the design conditions of the thin waveguide device. You may want to
  • an object of the present invention is to provide an optical coupler capable of connecting a thin wire waveguide and a ridge waveguide to low loss while satisfying these single mode conditions.
  • Another object of the present invention is to provide an optical coupler which makes it possible to set the height of the core of the thin wire waveguide and the height of the protrusion of the core of the ridge waveguide at different heights which are optimum for each. To provide.
  • Yet another object of the present invention is to provide a densified optical integrated circuit.
  • an optical coupler formed on a silicon substrate and connecting the ridge waveguide and the thin wire waveguide, the ridge core having one end connected to the core of the ridge waveguide, A tapered shape in which the height decreases from one end to the other end, and further having a thin wire core connected to the other end of the ridge core and connected to the core of the thin wire waveguide at the other end,
  • An optical coupler is obtained which is characterized in that it has a tapered shape whose height decreases from one end to the other.
  • At least one of the ridge core and the thin wire core may have a tapered shape whose width decreases from one end to the other end.
  • the ridge core includes a thin film portion extending between one end and the other end, and a projection formed on the thin film portion and extending between the one end and the other end, and the thin film portion has a height of zero at the other end. Even if it has a tapered shape, its height decreases from one end to the other so as to converge.
  • the protrusions of the ridge core and the thin wire core may have the same cross section connected to each other.
  • the length from one end of the ridge core to the other end of the thin wire core is the difference between the sum of the thickness of the thin film portion at one end of the ridge core and the height of the projection and the height of the thin wire core at the other end of the thin wire core. 10 times or more may be sufficient.
  • the present optical coupler may be formed on the same silicon substrate as at least one of the ridge waveguide and the thin wire waveguide.
  • the layer cladding may be constituted by a buried oxide film formed on a silicon substrate.
  • a ridge waveguide, a thin wire waveguide, and an optical coupler are provided, and the ridge waveguide, the thin wire waveguide, and the optical coupler are formed on a silicon substrate common to them.
  • An integrated optical circuit is obtained.
  • FIG. 1 is a perspective view showing an optical coupler according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along line 2-2 of the optical coupler shown in FIG. 3A to 3F are process diagrams for explaining a method of manufacturing the optical coupler shown in FIG.
  • FIG. 4 is a perspective view showing an optical coupler according to a second embodiment of the present invention
  • FIG. 5 is a cross-sectional view taken along line 5-5 of the optical coupler shown in FIG. is there.
  • the optical coupler according to the present invention has a ridge core connected at one end to the core of the ridge waveguide.
  • the ridge core has a tapered shape whose height decreases from one end to the other.
  • the optical coupler further includes a thin wire core having one end connected to the other end of the ridge core and the other end connected to the core of the thin wire waveguide.
  • the thin line core has a tapered shape whose height decreases from one end to the other end.
  • the height of the core of the thin wire waveguide can be reduced while maintaining the height of the protruding portion of the core of the ridge waveguide from the surface of the thin film portion large.
  • the light confinement effect can be achieved while satisfying the single mode condition in the ridge waveguide, and the single mode condition can be satisfied in the thin wire waveguide.
  • the optical coupler according to the present invention can connect the thin wire waveguide and the ridge waveguide with low loss.
  • the ridge waveguide and the thin wire waveguide may be structurally combined with each other. It enables mixed mounting on the same substrate without restriction of This increases the degree of freedom in the design of the optical integrated circuit.
  • the optical coupler according to the present invention makes it possible to connect the other of the ridge waveguide and the thin wire waveguide from the outside to an optical circuit including one of the ridge waveguide and the thin wire waveguide.
  • the height of the optical coupler according to the present invention is adjusted by the tapered thin wire core, it is possible to design a structure in which the height of the core of the thin wire waveguide can be increased. This improves manufacturing yield and productivity.
  • the present optical coupler for connecting the ridge waveguide 30 and the thin wire waveguide 20 is formed by the lower lower layer cladding 10 formed of the silicon dioxide film of the SOI substrate, and the lower layer cladding. And a core formed of a silicon film of an SOI substrate. The upper clad is not shown.
  • the core 31 of the ridge waveguide 30 comprises a thin film portion 31a and a projection 31b formed on the thin film portion 31a.
  • the optical coupler has a ridge core 32 whose one end in the rear in the figure is connected to the core 31 of the ridge waveguide 30.
  • the ridge core 32 has a tapered shape in which the height (thickness) decreases from one end toward the other end in the figure.
  • the ridge core 32 comprises a tapered thin film portion 32a whose height (thickness) is tapered, and a projection 32b formed on the tapered thin film portion 32a.
  • the protrusion 32 b has a straight shape inclined along the upper surface of the tapered thin film portion 32 a or a tapered shape whose height decreases. In the present example, the protrusion 32 b has an inclined straight shape.
  • a thin wire core 2 2 has one end on the rear side connected to the other end of the ridge core 32 in the drawing and the other end on the front side to the core 21 of the thin wire waveguide 20.
  • the thin wire core 22 has a tapered shape in which the height (thickness) decreases from one end to the other end.
  • the thickness of the tapered thin film portion 32 a mainly decreases as it approaches the thin wire core 22.
  • the thickness of the tapered thin film portion 3 2 a is zero at the boundary to the thin wire core 22. Therefore, the height of the protrusion 32 b is equal to the height of the wire core 22 at the boundary with the wire core 22.
  • the present optical coupler has a thin wire core 22 having a tapered shape with a decreasing height, which is not included in the related art mentioned in the background section of this specification.
  • the optical coupler can set the height of the core 21 of the thin wire waveguide 20 smaller than the height of the protrusion 32 b of the ridge core 32.
  • the length of the tapered core of the present optical coupler that is, the sum of the lengths of the ridge core 32 and the thin wire end 22 is determined by the thin film portion 31 a of the core 31 of the ridge waveguide 30.
  • the difference between the sum of the thickness and the height of the projecting portion 31 b and the height of the core 21 of the thin wire waveguide 20 is preferably 10 or more.
  • the ridge waveguide 30 and the thin wire waveguide 20 are adiabatically coupled, and the transmission loss of the optical coupler can be suppressed to less than 10 20 dB. Examples of specific dimensions of the present optical coupler are as follows.
  • the thickness of the thickest portion of the tapered thin film portion 32 a of the ridge core 32 is 0.5 ⁇ m
  • the height of the protruding portion 32 b of the ridge core 32 is 1.0 A m
  • the protruding portion of the ridge core 32 The height of 3 2 3 is 1.0 ⁇ ⁇
  • the width of protrusion 3 2 b of ridge core 3 2 is 0.5 m.
  • the height of the lowest portion of the thin wire core 22 is 0.1 ⁇ m, and the width of the thin wire core 22 is 0.5 ⁇ m.
  • the length of the tapered core of the present optical coupler that is, the sum of the lengths of the ridge core 32 and the thin wire core 22 is about 50 ⁇ .
  • the transmission loss of this optical coupler is less than or equal to 1 3 0 d B.
  • an SOI substrate is prepared.
  • the SOI substrate has a silicon dioxide layer 100 which is a buried oxide film processed into a silicon film, and a silicon layer 200 present on the silicon dioxide layer 100. Further, a thick film photoresist is applied on the SOI substrate, and a resist 61 having a shape as illustrated is formed by lithography to cover the back of the SOI substrate in the drawing.
  • the silicon layer 20 on which the resist 61 is formed is wet-etched using an etching solution such as a mixed solution of hydrofluoric acid and nitric acid.
  • This etching solution is capable of isotropically etching both the resist 61 and the silicon layer 200 simultaneously.
  • the resist 61 one that gradually dissolves during etching is used, and it is preferable to make the thickness equal to or greater than the desired total length of the thin wire core 22 and the ridge core 32 (FIG. 1). This allows the resist to gradually recede during etching, creating a long and gentle taper.
  • the resist 61 recedes to become a resist 62 having a shape shown in FIG. 3B.
  • the silicon layer 200 is also etched, as shown in FIG. 3B, as shown in FIG. 3B, a thin portion 210, a thick portion 220 and a ridged portion 230 formed in front of the portion 220.
  • a resist 71 of the same width as the desired width of the thin wire waveguide 20, 22 (Fig. 1) or the projection 30b, 32b (Fig. 1) of the core is used. Form 0, and 2 2 0 longitudinally.
  • the silicon layer is etched to the same thickness as the portion 210. That is, a silicon layer is formed on a thin portion 21 1 formed on a silicon dioxide layer 100, a thick portion 2 23 formed on a silicon dioxide layer 100, and a portion 2 23 A thin portion 2 2 1, a bowl-shaped portion 2 3 4 formed in front of the portion 2 2 3, and a portion 2 3 formed between the 2 1 4 and 2 1 2 on the slope 2 3 1 1 and contains.
  • the structure shown in FIG. 3D is similar to the structure of the optical coupler disclosed in the related art, although the manufacturing method is different.
  • the portions 2 2 1 and 2 3 1 are the protrusions 3 O b of the core. And continue until the desired height of 32 b (Fig. 1) is reached.
  • the SOI substrate becomes as shown in FIG. 3E. Since this dry etching is selective etching, only the silicon layer not covered with the resist 71 is etched, while the silicon dioxide layer 100 is not etched. For this reason, only the reduction of the height of the part 223 of the silicon layer in FIG. 3D and the retraction of the part 234 occur. As a result, the silicon layer becomes as shown in FIG. 3E.
  • the silicon layer is formed on a portion 21 1 formed on the silicon dioxide layer 100, a portion 2 24 formed on the silicon dioxide layer 100, and a portion 2 24 A portion 22 2, a bowl-shaped portion 2 3 5 formed in front of the portion 2 2 4, a portion 2 3 3 formed in front of the portion 2 2 2 on the slope of the portion 2 3 5, And a portion 2 3 2 formed between the portions 2 1 1 and 2 3 3 on the silicon layer 100.
  • the part 2 24 is thinner than the part 2 2 3 (FIG. 3D).
  • Part 2 2 2 is taller than Part 2 2 1 ( Figure 3D).
  • Part 2 3 5 is more retracted than part 2 3 4 ( Figure 3D). Both the portion 2 3 2 and the combination of portions 2 3 5 and 2 3 3 are tapered.
  • the cross-sectional shape of the portion 22 32 and the portion 23 3 are continuous with each other.
  • the resist 71 is removed.
  • the optical coupler having the structure shown in FIG. 1 was manufactured. Then, if necessary, form the upper ridge core.
  • the present embodiment differs from the first embodiment in that the ridge core protrusion and the thin wire core have a tapered shape in which the width also changes in addition to the height. Therefore, detailed description of the same or similar configuration as that of the first embodiment is omitted.
  • the present optical coupler for connecting the ridge waveguide 30 and the thin wire waveguide 20 is formed by the lower lower layer cladding 10 composed of silicon dioxide film of the SOI substrate, and the lower layer cladding 1 And a core formed of a silicon film of the S ⁇ I substrate.
  • the upper clad is not shown.
  • the core 3 1 of the ridge waveguide 30 is a thin film portion 3 1 a and a protrusion 3 formed on the thin film portion 3 1 a It consists of 1 b.
  • the optical coupler has a ridge core 37 whose one end in the rear in the figure is connected to the core 31 of the ridge waveguide 30.
  • the ridge core 37 has a tapered shape in which the height (thickness) decreases from one end toward the other end in the figure.
  • the ridge core 37 has a thin film portion 3 7 a having a tapered height (thickness), a height (thickness) formed on the thin film portion 3 7 a, and a projecting portion 3 7 b having a tapered width. It consists of
  • the protrusion 37 b may have a straight shape having a constant height (thickness) along the upper surface of the thin film portion 3 7 a.
  • the protrusion 37 b has a tapered shape with a constant height and a reduced width.
  • the ridge waveguide 30 may have a taper structure in which the width increases or decreases from the rear in the figure toward the end connected to the ridge core 3 7 in the front in the figure. In this example, the width is decreasing.
  • a thin wire core 2 7 is connected to the other end of the ridge core 37 at the rear end in the drawing and to the core 21 of the thin wire waveguide 20 at the other end in the drawing.
  • the thin wire core 27 has a tapered shape in which the height (thickness) and the width decrease from one end to the other end.
  • the thin wire waveguide 20 may also have a tapered structure in which the width increases or decreases from the end connected to the thin wire core 27 in the rear to the front in the drawing. In the present example, the width is reduced.
  • the height and width of at least the narrow if fountain core 27 among the ridge core 37 and the narrow and wedge cores 27 may be tapered.
  • the ridge core 37 may have a tapered shape in which only the height decreases.
  • the cross-sections in which the thin wire core 27 and the protrusion 3 7 b of the ridge core 37 are connected to each other have the same shape.
  • the thickness force S of the thin film portion 3 7a mainly decreases as it approaches the thin wire core 27.
  • the thickness of the thin film portion 3 7 a is zero at the boundary to the thin wire core 27. Therefore, at the boundary with respect to the thin wire core 27, the height of the protrusion 3 7 b is equal to the height of the thin wire core 27.
  • the structure having the thin wire core 27 having a tapered shape in which the height and width are reduced provides the core of the thin wire waveguide 20
  • the height and width of 2 1 can be smaller than the width if the height of the protrusion 3 7 b of the ridge core 3 7.
  • the length of the tapered core of the present optical coupler that is, the sum of the lengths of the ridge core 37 and the thin wire core 27 is determined by the thin film portion 31a of the core 31 of the ridge waveguide 30.
  • the difference between the sum of the thickness and the height of the protrusion 31 b and the height of the core 21 of the fine spring waveguide 20 is preferably 10 or more.
  • the ridge waveguide 30 and the thin wire waveguide 20 are adiabatically coupled, and the transmission loss of the optical coupler can be suppressed to less than 10 20 dB.
  • the reduction effect in the width direction makes It is possible to make a single mode of the thin wire waveguide.
  • the thickness of the thickest portion of the thin film portion 3 7 a of the ridge core 3 7 is 0.5 ⁇ m
  • the height of the protrusions 3 7 b of the ridge core 3 7 is 1.0 m
  • the protrusions 3 7 of the ridge core 3 7 The height of b is 1.0 ⁇
  • the width of the widest part of the protrusion 3 b of the ridge core 3 7 is 0.5 ⁇ m.
  • the thinnest portion of the thin wire core 27 is the lowest, the height of the portion is 0.2 ⁇ m, and the width of the narrowest portion of the thin wire core 27 is 0.
  • the length of the tapered core of the present optical coupler that is, the sum of the lengths of the ridge core 37 and the thin wire core 27 is 5 0 ⁇ .
  • the transmission loss of this optical coupler is less than 1 2 5 d B.
  • the width of the thin wire core 27 is reduced in accordance with the width of the protrusion 37 b of the ridge core 37 so that the thin wire waveguide 20 is single-mode-thinned.
  • the decrease in the height of the thin wire core 27 is smaller than in the first embodiment.
  • the width of ridge ridge projections and the width of thin wire core can be adjusted to any position and width by patterning technology.
  • the manufacturing method of the present optical coupler changes the width according to the desired taper shape so that the width of the ridge core protrusion and the thin wire core changes. Is different from the manufacturing method of the first embodiment in that the resist is used instead of the resist 71 in the manufacturing method of the first embodiment. Therefore, the description of the manufacturing method is omitted.
  • the present invention can be variously modified within the technical scope described in the claims, without being limited to the embodiments described above.
  • the present invention can be applied to a high-performance optical integrated circuit in which an optical circuit including a ridge waveguide and an optical circuit including a thin wire waveguide are mixedly mounted.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

La présente invention concerne un coupleur optique qui comprend un cœur de moulure (32) dont une extrémité est raccordée au cœur (31) d'un guide d'onde à moulure (30). Le cœur de moulure (32) comprend une partie couche mince (32a) et une partie saillante en forme de moulure (32b) formée sur la partie couche mince (32a). La hauteur de la partie couche mince (32a) est réduite d'une extrémité à l'autre extrémité. Le coupleur optique comprend en outre un cœur de fil mince (22) dont une extrémité est raccordée à l'autre extrémité du cœur de moulure (32) et dont l'autre extrémité est raccordée au cœur (21) d'un guide d'onde à fil mince (20). La hauteur du cœur à fil mince (22) est réduite d'une extrémité à l'autre extrémité.
PCT/JP2009/051016 2008-01-31 2009-01-16 Coupleur optique pouvant connecter un guide d'onde à fil mince et un guide d'onde à moulure avec une faible perte Ceased WO2009096321A1 (fr)

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JP2009551490A JP5370678B2 (ja) 2008-01-31 2009-01-16 細線導波路とリッジ導波路とを低損失に接続することができる光結合器

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JP2008021720 2008-01-31
JP2008-021720 2008-01-31

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
WO2015114060A1 (fr) * 2014-01-31 2015-08-06 Universite De Franche-Comte Méthode de fabrication d'un guide d'onde optique à structure " ridge " à faibles pertes de couplage entre le guide d'onde optique à structure " ridge " et une fibre optique, et guide d'onde optique à structure " ridge " fabriqué par cette méthode
WO2024057980A1 (fr) * 2022-09-16 2024-03-21 京セラ株式会社 Circuit intégré optique et émetteur-récepteur optique
JP2024043453A (ja) * 2022-09-16 2024-03-29 京セラ株式会社 光集積回路及び光トランシーバ

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JP2003035833A (ja) * 2001-05-14 2003-02-07 Nippon Telegr & Teleph Corp <Ntt> 石英系光導波回路及びその作製方法
JP2007093743A (ja) * 2005-09-27 2007-04-12 Hitachi Cable Ltd スポットサイズ変換導波路及びその製造方法

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WO2015114060A1 (fr) * 2014-01-31 2015-08-06 Universite De Franche-Comte Méthode de fabrication d'un guide d'onde optique à structure " ridge " à faibles pertes de couplage entre le guide d'onde optique à structure " ridge " et une fibre optique, et guide d'onde optique à structure " ridge " fabriqué par cette méthode
FR3017216A1 (fr) * 2014-01-31 2015-08-07 Univ Franche Comte Methode de fabrication d'un guide d'onde optique a structure "ridge" a faibles pertes de couplage entre le guide d'onde optique a structure "ridge" et une fibre optique, et guide d'onde optique a structure "ridge" fabrique par cette methode
US9841565B2 (en) 2014-01-31 2017-12-12 Centre National Pour La Recherche Scientifique Method for producing a ridge optical waveguide having low coupling losses between the ridge optical waveguide and an optical fibre, and a ridge optical waveguide made using this method
WO2024057980A1 (fr) * 2022-09-16 2024-03-21 京セラ株式会社 Circuit intégré optique et émetteur-récepteur optique
JP2024043453A (ja) * 2022-09-16 2024-03-29 京セラ株式会社 光集積回路及び光トランシーバ
JP7830306B2 (ja) 2022-09-16 2026-03-16 京セラ株式会社 光集積回路及び光トランシーバ

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