WO2009098421A1 - Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu - Google Patents
Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu Download PDFInfo
- Publication number
- WO2009098421A1 WO2009098421A1 PCT/FR2009/050111 FR2009050111W WO2009098421A1 WO 2009098421 A1 WO2009098421 A1 WO 2009098421A1 FR 2009050111 W FR2009050111 W FR 2009050111W WO 2009098421 A1 WO2009098421 A1 WO 2009098421A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- zone
- roughness
- smooth
- substrate
- element according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
Definitions
- the invention relates to the technical field of deposition of thin layers to produce heating elements on insulating substrate.
- the invention finds an advantageous application in the field of defogging or deicing surfaces, in sectors such as for example reflective surfaces in the automotive sector or the leading edge of wings in the aeronautical sector.
- a heating element consists of a zone characterized by a low electrical resistance called cold zone and a much higher electrical resistance zone to constitute the heating portion as such.
- two cold zones are associated with the heating zone by a series connection, so that the electrical intensity that passes through each of the zones is the same.
- the cold zones have the function of connecting the electrical inputs from an external source and distributing the current, homogeneously, across the heating portion.
- the passage of the current thus produces a significant heating in the zone of high electrical resistance called hot zone.
- the cold zones have the lowest possible electrical resistance, the result is a minimal thermal power output at the electrical connections.
- the value of the electrical resistance being equal to the product of the resistivity by the length of the conductor divided by its section, it is possible to modify the values of the resistance by varying the value of any of the aforementioned parameters: resistivity, length, section.
- thin film heating elements using for example the vacuum deposition technique, it is possible to use at least two different resistivity materials, each being deposited through specific masks to constitute successively a hot) heating part in the form of a track and one or more collectors or drains.
- the two materials are selected according to their intrinsic resistivities, while their sections are determined according to the conductance values necessary for the cold areas and the resistance value needed for the heating part.
- the heating coating does not make it possible to have a sufficiently high electrical resistance by adjusting the thickness of said coating, it becomes necessary to adjust the length of the resistance deposited in the form of tracks, in order therefore to increase the length traveled by the current.
- a second material highly conductive, is deposited at the ends of the resistors to act as a drain.
- a second material highly conductive, is deposited at the ends of the resistors to act as a drain.
- the electrical connections can be taken on either side of the resistive coating by means of a conductive coating made in the form of known strips. under the name of drains.
- a conductive coating made in the form of known strips. under the name of drains.
- FIG. 1 shows a heating element made in two steps.
- the heating element is constituted by a substrate (C) made of an electrical insulating material such as a ceramic, a glass or a plastics material.
- a coating is deposited ( B) weakly conductive.
- a mask is positioned on the coating (B), so as, for example, not to cover its ends to allow the deposition of a second coating with high conductivity, to achieve the drains (A) for the connection of a power source such as a generator (G).
- the problem to be solved by the invention is to achieve, in a single deposition step and with a single material, heating elements in thin layers.
- a method of manufacturing a heating element by deposition of thin layers on an insulating substrate according to which: the state of the surface of the substrate is modified to obtain at least one smooth zone of low roughness Ra and at least one zone of higher roughness Rax; a material that is highly conductive to electricity is applied to the different zones; connecting the smooth zone (s) to a power source.
- the heating element can be obtained in a single deposition step to achieve, at the same time, the electrical resistance and the drains formed in this case by the smooth areas with low roughness.
- the highly conductive material is used, for the heating part, and not only for the cold parts or drains.
- the layer of highly conductive material is deposited on the entire substrate, so as to cover all the smooth and rough areas; or the layer of the highly conductive material is deposited so as to form a track covering part of the smooth zones and part of the rough zone.
- the higher roughness zone is made between two smooth zones.
- the invention also relates to a heating element by deposition of thin layers on an insulating substrate having at least one heating element by Joule effect and at least one electrical connection part constituted by at least one zone of higher roughness Rax and at least one zone. low roughness smooth Ra, said zones being covered with a thin layer of a highly conductive material, a power source being connected at the level of the smooth zone (s).
- highly conductive materials that may be used, mention may be made, by way of non-limiting indication, of aluminum, copper, silver, gold, and more generally any material having an intrinsic electrical conductivity greater than 3OxIO. 6 mM -1 at room temperature.
- the roughness Ra of the zone (s) smooth (s) and less than 0.5 microns is less than 0.5 microns.
- the substrate has a smooth zone of low roughness Ra disposed next to an area of higher roughness Rax. In another embodiment, the substrate has two smooth zones of low roughness Ra disposed on either side of a higher roughness zone Rax.
- either the thin layer of highly conductive material is deposited on the entire surface of the substrate so as to cover the different areas; either the thin layer of highly conductive material is deposited in the form of a track covering the different areas.
- R1 resistance in ohm of the smooth zone of low roughness (Ra);
- R2 resistance in ohm of the zone of higher roughness (Rax);
- ⁇ l developed length of the smooth zone divided by its length palpated by means of a rugosimeter;
- ⁇ 2 developed length of the zone of higher roughness divided by its length palpated by means of a rugosimeter.
- FIG. 1 is a schematic view of a heating element, according to the prior art
- FIG. 2 is a top view corresponding to Figure 1;
- FIG. 3 is a schematic sectional view similar to Figure 1 showing the heating element obtained according to the invention;
- FIG. 4 is a plan view corresponding to FIG. 3;
- FIGS. 5 and 6 are schematic plan views of other embodiments of the heating element in which the highly conductive coating is deposited in the form of a track;
- FIG. 7 is a schematic perspective view of an element with a smooth zone and a rough zone
- Figure 8 is a view corresponding to Figure 7 after coating deposit on the outside of the cylindrical zone.
- FIGS. 3 and 4 show a first embodiment of heating elements obtained according to the characteristics of the invention on an electrical insulating substrate (1) of any type known and appropriate.
- the surface state of the substrate (1) is modified so as to obtain smooth zones (Ia) and (Ib) with a low roughness Ra, typically less than 0.5 ⁇ m, and a zone (Ic) of higher roughness Rax, necessarily greater than 0.5 microns.
- a coating (2) made of a material with high electrical conductivity.
- the conductivity of the highly conductive material is greater than 10 6 S / m 2 at room temperature.
- the adjustment of the electrical resistance is mainly done by modifying the roughness of the area (Ic) of the substrate. It is also possible to combine the characteristics of the roughness and to modify the thickness of the coating in order to adjust the value of the resistance.
- the coating (2) may be deposited in the form of tracks, for example by positioning a mask, prior to deposition of said coating or by selective removal of the coating.
- FIG. 5 shows a substrate (1) having a central zone of roughness Rax higher (Ic) and two lateral zones (la) and (Ib) of low roughness (Ra).
- the substrate has two smooth zones (la) and (Ib) of low roughness Ra disposed on either side of a higher roughness zone Rax.
- the substrate may have a single smooth zone of low roughness Ra disposed next to a zone of higher roughness Rax.
- the tracks (2d) constituted by the coating (2) with high electrical conductivity may have different embodiments. Referring to Figures 5 and 6.
- the substrate has a zone (Ib) of low roughness and a zone (Ic) of high roughness.
- the coating (2) is deposited on the outside of the cylindrical zone in (2c) (high roughness zone) and (2b) (low roughness zone) where is connected the electric generator (3).
- This modification of the surface condition may be provided upstream, during the manufacture of the substrate, for example in the context of a polymer substrate by virtue of a relief that presents the surface of an injection mold.
- this modification of the surface state can be obtained directly on the substrate before deposition, using the known sand blasting technique or any other means adapted to the modification of the roughness of the substrate in question.
- a first insulating coating may be applied before the deposition of the heating element.
- a substrate of low roughness Ra that is subjected to a treatment to obtain, for example, a higher roughness zone Rax between two smooth zones of roughness Ra
- a higher roughness substrate Rax than is subjected to a treatment to obtain, for example, two areas of low roughness Ra on either side of a higher roughness zone Rax.
- Example 1 copper deposits were made on polycarbonate substrates using the vacuum deposition technique.
- the length of the resistors is 98 mm, their widths are respectively 5, 12 and 24 mm.
- the roughness profiles made it possible to calculate the developed length for each surface state.
- the electrical resistors have been characterized by imposing an electric current and measuring the voltage across the resistor. All substrates are coated simultaneously in the vacuum deposition equipment. Moreover, the substrates are positioned identically with respect to the deposition source. On glass control substrates having a Ra roughness of less than 0.0 l ⁇ m, the thickness of the copper deposits was measured at 1.15 ⁇ m.
- the rough specimens are prepared according to the principle of Figures 3 and 4.
- ⁇ represents the developed length divided by the length probed using a roughness meter.
- the rough surfaces have been indexed 1 and the smooth surfaces have been indexed 2.
- the value of the electrical resistance R 1 is expressed as follows:
- Example 2 In Example 2, the same deposits as in Example 1 were carried out on polysulfone by vacuum deposition technique.
- the rough specimens are prepared according to the principle of Figures 3, 4 and 5.
- the length of the resistors is 45 mm, their widths are 12 and 23 mm.
- heating resistors have been developed on polycarbonate parts.
- a mask was positioned on the specimens before deposition so as to obtain tracks.
- the surface condition of the substrate has not been modified, the Ra is 0.02 ⁇ m.
- the surface condition has been modified on the entire surface of the substrate, the Ra is 4.92 ⁇ m.
- the surface condition of the substrate was not modified at the turns and at the electrical contacts, the Ra being in these areas of 0.02 microns.
- the piece 3 is made according to the principle of Figures 3, 4 and 5.
- the surface of the part has a roughness of 0.02 microns.
- a first deposit of 0.1 micron resistive NiCr alloy was developed through the first mask. After this first deposition, a second mask was applied to the part which then underwent a 0.5 ⁇ m deposition of copper on the end zones as defined in FIG.
- the resistors were powered under 12V to measure Joule heating.
- the ambient temperature is 20 ° C. during the heating measurements.
- Part 1 is non-compliant, the surface condition too smooth leads to a very low resistance so that when the resistance is supplied under 12V, excessive heating resulting from the high amperage produces the deterioration of the substrate by heating above 150 0 C its glass transition temperature.
- Part 2 is non-compliant, heating at the electrical contacts, where the current lines are very dense, produces the destruction of the deposit and the substrate at these contacts.
- the part 3 is compliant, its resistance value limits the passage of current, so that the temperature rises to a value allowing an application such as defrosting or demisting, without leading to the destruction of the support.
- the smooth surfaces allow a low resistance avoiding local overheating.
- the piece 4 is non-compliant despite the fact that it can be used as a heating element. Indeed, the structure was obtained by using 2 materials of very different conductivity and by depositing in 2 steps with the interposition of a mask between these 2 steps, which corresponds to the state of the art with the disadvantages resulting therefrom. that we wanted to delete.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Formation Of Insulating Films (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
Claims
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BRPI0907493A BRPI0907493B8 (pt) | 2008-02-06 | 2009-01-26 | Processo de fabricação de um elemento aquecedor por depósito de camadas finas sobre um substrato isolante e o elemento obtido |
| CA2712381A CA2712381C (fr) | 2008-02-06 | 2009-01-26 | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant, et l'element obtenu |
| KR1020107016331A KR101496496B1 (ko) | 2008-02-06 | 2009-01-26 | 절연 기판에 박층을 피착하여 가열 소자를 형성하는 방법과 가열 소자 |
| AT09708987T ATE515390T1 (de) | 2008-02-06 | 2009-01-26 | Verfahren zur herstellung eines erwärmungselements durch ablagerung dünner schichten auf einem isolationssubstrat, daraus resultierendes element und benutzung des letzten |
| JP2010545528A JP5449197B2 (ja) | 2008-02-06 | 2009-01-26 | 絶縁基板上に薄層を堆積させることにより加熱素子を製造する方法、及びそれにより得られた素子 |
| EP09708987A EP2240318B1 (fr) | 2008-02-06 | 2009-01-26 | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant, l'element obtenu et son utilisation |
| AU2009211229A AU2009211229B2 (en) | 2008-02-06 | 2009-01-26 | Method for making a heating element by depositing thin layers onto an insulating substrate, and resulting element |
| US12/865,771 US8395091B2 (en) | 2008-02-06 | 2009-01-26 | Method for fabricating a heating element by depositing thin layers on an insulating substrate and the element thus obtained |
| MX2010008519A MX2010008519A (es) | 2008-02-06 | 2009-01-26 | Metodo para la fabricacion de un elemento de calefaccion mediante el deposito de capas delgadas sobre sustrato, y el elemento resultante de aislamiento. |
| CN200980104511.5A CN101939164B (zh) | 2008-02-06 | 2009-01-26 | 在绝缘基底上沉积薄膜来制造加热元件的方法以及由此获得的元件 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0850747A FR2927218B1 (fr) | 2008-02-06 | 2008-02-06 | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu |
| FR0850747 | 2008-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009098421A1 true WO2009098421A1 (fr) | 2009-08-13 |
Family
ID=39745133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FR2009/050111 Ceased WO2009098421A1 (fr) | 2008-02-06 | 2009-01-26 | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US8395091B2 (fr) |
| EP (1) | EP2240318B1 (fr) |
| JP (1) | JP5449197B2 (fr) |
| KR (1) | KR101496496B1 (fr) |
| CN (1) | CN101939164B (fr) |
| AT (1) | ATE515390T1 (fr) |
| BR (1) | BRPI0907493B8 (fr) |
| CA (1) | CA2712381C (fr) |
| ES (1) | ES2367840T3 (fr) |
| FR (1) | FR2927218B1 (fr) |
| MX (1) | MX2010008519A (fr) |
| MY (1) | MY161997A (fr) |
| TW (1) | TWI500800B (fr) |
| WO (1) | WO2009098421A1 (fr) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2578927C (fr) | 2007-02-19 | 2011-09-27 | Ray Arbesman | Articles autocollants predecoupes pour le soutien corporel et systeme de soutien |
| FR2914488B1 (fr) * | 2007-03-30 | 2010-08-27 | Soitec Silicon On Insulator | Substrat chauffage dope |
| CA2711131A1 (fr) * | 2007-12-29 | 2009-07-09 | Saint-Gobain Ceramics & Plastics, Inc. | Elements chauffants en ceramique ayant une structure a face ouverte et procedes de fabrication de ceux-ci |
| FR2927218B1 (fr) * | 2008-02-06 | 2010-03-05 | Hydromecanique & Frottement | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu |
| EP2955976A1 (fr) * | 2014-06-12 | 2015-12-16 | AGC Glass Europe | Vitrage chauffant |
| EP2977202A1 (fr) * | 2014-07-25 | 2016-01-27 | AGC Glass Europe | Vitrage chauffant |
| DE102015119763A1 (de) * | 2015-11-16 | 2017-05-18 | Heraeus Quarzglas Gmbh & Co. Kg | Infrarotstrahler |
| JP7523555B2 (ja) | 2020-02-12 | 2024-07-26 | サン-ゴバン グラス フランス | 統合された温度センサを有する乗り物ペイン |
| CN114554684A (zh) * | 2020-11-19 | 2022-05-27 | 广州方邦电子股份有限公司 | 一种复合金属箔及线路板 |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2111742A (en) * | 1933-09-09 | 1938-03-22 | Rca Corp | Resistance compound |
| GB499816A (en) * | 1937-07-26 | 1939-01-26 | Allen West & Co Ltd | Improvements in or relating to electric circuit interrupters |
| US2419537A (en) * | 1944-09-09 | 1947-04-29 | Bell Telephone Labor Inc | Resistor |
| US3095340A (en) * | 1961-08-21 | 1963-06-25 | David P Triller | Precision resistor making by resistance value control for etching |
| US3458847A (en) * | 1967-09-21 | 1969-07-29 | Fairchild Camera Instr Co | Thin-film resistors |
| US3594225A (en) * | 1967-09-21 | 1971-07-20 | Fairchild Camera Instr Co | Thin-film resistors |
| US3772075A (en) * | 1969-07-01 | 1973-11-13 | Ppg Industries Inc | Applying electroconductive heating circuits to glass |
| GB2128813A (en) * | 1982-09-30 | 1984-05-02 | Dale Electronics | Thin film resistor |
| US5643483A (en) * | 1994-04-11 | 1997-07-01 | Shin-Etsu Chemical Co., Ltd. | Ceramic heater made of fused silica glass having roughened surface |
| WO2005107348A1 (fr) * | 2004-04-29 | 2005-11-10 | Siemens Aktiengesellschaft | Procede pour produire des connexions transversales dans des ensembles cartes a circuits imprimes |
| US20060163563A1 (en) * | 2005-01-24 | 2006-07-27 | Kurt Ulmer | Method to form a thin film resistor |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2624823A (en) * | 1949-06-23 | 1953-01-06 | Pittsburgh Plate Glass Co | Electroconductive article |
| JPS5543751A (en) * | 1978-09-21 | 1980-03-27 | Tokyo Shibaura Electric Co | Plane heating element |
| US4725710A (en) * | 1985-11-07 | 1988-02-16 | Ford Motor Company | Electrically heatable vision unit |
| US4911353A (en) * | 1986-03-31 | 1990-03-27 | David Deakin | Solar collector having absorber plate formed by spraying molten metal |
| US5332888A (en) * | 1986-08-20 | 1994-07-26 | Libbey-Owens-Ford Co. | Sputtered multi-layer color compatible solar control coating |
| DE3937346A1 (de) * | 1989-11-09 | 1991-05-16 | Ver Glaswerke Gmbh | Elektrisch beheizbare autoglasscheibe aus verbundglas |
| JPH03292791A (ja) * | 1990-04-11 | 1991-12-24 | Toshiba Corp | 配線基板 |
| JPH07226301A (ja) | 1994-02-10 | 1995-08-22 | Tama Electric Co Ltd | 抵抗器 |
| JPH08124707A (ja) | 1994-10-24 | 1996-05-17 | Tama Electric Co Ltd | 薄膜チップ抵抗器 |
| JPH10261478A (ja) * | 1997-03-18 | 1998-09-29 | Sun Tec Corp Kk | 導電性加熱板 |
| AU7291398A (en) * | 1997-05-06 | 1998-11-27 | Thermoceramix, L.L.C. | Deposited resistive coatings |
| US6262401B1 (en) * | 1998-12-30 | 2001-07-17 | Aos Holding Company | Gold-plated water heater element and method of making same |
| US6967313B1 (en) * | 1999-05-07 | 2005-11-22 | Ibiden Company, Ltd. | Hot plate and method of producing the same |
| US6835916B2 (en) * | 1999-08-09 | 2004-12-28 | Ibiden, Co., Ltd | Ceramic heater |
| JP2001118664A (ja) * | 1999-08-09 | 2001-04-27 | Ibiden Co Ltd | セラミックヒータ |
| US6222166B1 (en) * | 1999-08-09 | 2001-04-24 | Watlow Electric Manufacturing Co. | Aluminum substrate thick film heater |
| EP1137321A1 (fr) * | 1999-11-30 | 2001-09-26 | Ibiden Co., Ltd. | Appareil chauffant en ceramique |
| US6674053B2 (en) * | 2001-06-14 | 2004-01-06 | Trebor International | Electrical, thin film termination |
| US6580061B2 (en) * | 2000-02-01 | 2003-06-17 | Trebor International Inc | Durable, non-reactive, resistive-film heater |
| US7081602B1 (en) * | 2000-02-01 | 2006-07-25 | Trebor International, Inc. | Fail-safe, resistive-film, immersion heater |
| US6663914B2 (en) * | 2000-02-01 | 2003-12-16 | Trebor International | Method for adhering a resistive coating to a substrate |
| US6204480B1 (en) | 2000-02-01 | 2001-03-20 | Southwall Technologies, Inc. | Vacuum deposition of bus bars onto conductive transparent films |
| US6433319B1 (en) * | 2000-12-15 | 2002-08-13 | Brian A. Bullock | Electrical, thin film termination |
| WO2001080601A1 (fr) * | 2000-04-14 | 2001-10-25 | Ibiden Co., Ltd. | Dispositif de chauffage en ceramique |
| EP1251551A1 (fr) * | 2000-08-30 | 2002-10-23 | Ibiden Co., Ltd. | Dispositif ceramique chauffant permettant la production de semi-conducteurs et equipement d'inspection |
| WO2002043441A1 (fr) * | 2000-11-24 | 2002-05-30 | Ibiden Co., Ltd. | Element chauffant en ceramique et procede de production |
| JP2002299013A (ja) * | 2001-01-29 | 2002-10-11 | Murata Mfg Co Ltd | 電極膜付き摺動物品、電極膜付き窓ガラスおよび導電性ペースト |
| JP2003057984A (ja) * | 2001-08-09 | 2003-02-28 | Minolta Co Ltd | 加熱定着ローラ |
| US6870134B2 (en) | 2002-02-01 | 2005-03-22 | Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique S.A. (C.R.V.C.) | Heatable vehicle windshield with bus bars including braided and printed portions |
| JP2003272545A (ja) * | 2002-03-18 | 2003-09-26 | Canon Inc | スペーサおよびこれを用いた画像形成装置 |
| US6825681B2 (en) * | 2002-07-19 | 2004-11-30 | Delta Design, Inc. | Thermal control of a DUT using a thermal control substrate |
| US6855647B2 (en) * | 2003-04-02 | 2005-02-15 | Hewlett-Packard Development Company, L.P. | Custom electrodes for molecular memory and logic devices |
| TWI353631B (en) * | 2004-06-28 | 2011-12-01 | Kyocera Corp | Wafer heating device and semiconductor equipment |
| US20060250078A1 (en) * | 2005-05-09 | 2006-11-09 | City University Of Hong Kong | Organic electroluminescent devices incorporating UV-illuminated fluorocarbon layers |
| US20070220754A1 (en) * | 2006-03-01 | 2007-09-27 | Jennifer Barbaro | Counter apparatus and method for consumables |
| JP2007273182A (ja) * | 2006-03-30 | 2007-10-18 | Sony Corp | 集電体、負極及び電池 |
| FR2907470B1 (fr) * | 2006-10-20 | 2009-04-17 | Hef Soc Par Actions Simplifiee | Piece en contact glissant, en regime lubrifie, revetue d'une couche mince. |
| FR2913429B1 (fr) * | 2007-03-05 | 2009-04-17 | H E F Soc Par Actions Simplifi | Procede d'assemblage d'au moins deux plaques et utilisation du procede pour la realisation d'un ensemble de pulverisation ionique. |
| FR2927218B1 (fr) * | 2008-02-06 | 2010-03-05 | Hydromecanique & Frottement | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu |
-
2008
- 2008-02-06 FR FR0850747A patent/FR2927218B1/fr not_active Expired - Fee Related
-
2009
- 2009-01-26 US US12/865,771 patent/US8395091B2/en active Active
- 2009-01-26 KR KR1020107016331A patent/KR101496496B1/ko active Active
- 2009-01-26 CA CA2712381A patent/CA2712381C/fr active Active
- 2009-01-26 JP JP2010545528A patent/JP5449197B2/ja active Active
- 2009-01-26 EP EP09708987A patent/EP2240318B1/fr active Active
- 2009-01-26 ES ES09708987T patent/ES2367840T3/es active Active
- 2009-01-26 AT AT09708987T patent/ATE515390T1/de not_active IP Right Cessation
- 2009-01-26 BR BRPI0907493A patent/BRPI0907493B8/pt active IP Right Grant
- 2009-01-26 MX MX2010008519A patent/MX2010008519A/es active IP Right Grant
- 2009-01-26 WO PCT/FR2009/050111 patent/WO2009098421A1/fr not_active Ceased
- 2009-01-26 CN CN200980104511.5A patent/CN101939164B/zh active Active
- 2009-01-26 MY MYPI2010003295A patent/MY161997A/en unknown
- 2009-02-04 TW TW098103533A patent/TWI500800B/zh active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2111742A (en) * | 1933-09-09 | 1938-03-22 | Rca Corp | Resistance compound |
| GB499816A (en) * | 1937-07-26 | 1939-01-26 | Allen West & Co Ltd | Improvements in or relating to electric circuit interrupters |
| US2419537A (en) * | 1944-09-09 | 1947-04-29 | Bell Telephone Labor Inc | Resistor |
| US3095340A (en) * | 1961-08-21 | 1963-06-25 | David P Triller | Precision resistor making by resistance value control for etching |
| US3458847A (en) * | 1967-09-21 | 1969-07-29 | Fairchild Camera Instr Co | Thin-film resistors |
| US3594225A (en) * | 1967-09-21 | 1971-07-20 | Fairchild Camera Instr Co | Thin-film resistors |
| US3772075A (en) * | 1969-07-01 | 1973-11-13 | Ppg Industries Inc | Applying electroconductive heating circuits to glass |
| GB2128813A (en) * | 1982-09-30 | 1984-05-02 | Dale Electronics | Thin film resistor |
| US5643483A (en) * | 1994-04-11 | 1997-07-01 | Shin-Etsu Chemical Co., Ltd. | Ceramic heater made of fused silica glass having roughened surface |
| WO2005107348A1 (fr) * | 2004-04-29 | 2005-11-10 | Siemens Aktiengesellschaft | Procede pour produire des connexions transversales dans des ensembles cartes a circuits imprimes |
| US20060163563A1 (en) * | 2005-01-24 | 2006-07-27 | Kurt Ulmer | Method to form a thin film resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100111279A (ko) | 2010-10-14 |
| JP2011512008A (ja) | 2011-04-14 |
| JP5449197B2 (ja) | 2014-03-19 |
| BRPI0907493B1 (pt) | 2018-10-16 |
| BRPI0907493A2 (pt) | 2015-07-14 |
| EP2240318B1 (fr) | 2011-07-06 |
| CN101939164A (zh) | 2011-01-05 |
| MY161997A (en) | 2017-05-31 |
| MX2010008519A (es) | 2011-05-25 |
| ATE515390T1 (de) | 2011-07-15 |
| BRPI0907493B8 (pt) | 2023-01-10 |
| CA2712381A1 (fr) | 2009-08-13 |
| CA2712381C (fr) | 2015-12-15 |
| US20100308030A1 (en) | 2010-12-09 |
| US8395091B2 (en) | 2013-03-12 |
| TW200936796A (en) | 2009-09-01 |
| BRPI0907493A8 (pt) | 2018-09-18 |
| KR101496496B1 (ko) | 2015-02-26 |
| FR2927218B1 (fr) | 2010-03-05 |
| AU2009211229A1 (en) | 2009-08-13 |
| CN101939164B (zh) | 2013-09-11 |
| ES2367840T3 (es) | 2011-11-10 |
| EP2240318A1 (fr) | 2010-10-20 |
| FR2927218A1 (fr) | 2009-08-07 |
| TWI500800B (zh) | 2015-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2240318B1 (fr) | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant, l'element obtenu et son utilisation | |
| EP1478291B1 (fr) | Element de panneau avec une couche chauffante | |
| EP3347945B1 (fr) | Radome équipé d'un système résistif chauffant structure en bandes de nano-éléments metalliques | |
| FR2690003A1 (fr) | Résistance pastille à couche métallique. | |
| EP0394089A2 (fr) | Vitrage automobile chauffable électriquement | |
| FR2503457A1 (fr) | Systeme de cellules solaires connectees en serie sur un substrat unique | |
| FR3032084A1 (fr) | Dispositif chauffant, en particulier semi-transparent | |
| FR3073319A1 (fr) | Puce a memoire non volatile embarquee a materiau a changement de phase | |
| FR2537329A1 (fr) | Resistance a couche de haute resistivite et son procede de fabrication | |
| EP0126110B1 (fr) | Fluxmetre thermique a thermocouples | |
| EP2321178A1 (fr) | Procede de fabrication d'un element de degivrage de nacelle | |
| WO2006003282A1 (fr) | Element chauffant, son procede de fabrication, article dote d'un tel element et son procede de fabrication | |
| EP0533575A1 (fr) | Feuillards métalliques supportés sur plastique obtenu par métallisation-placage | |
| FR2606213A1 (fr) | Nouveau materiau composite de preference flexible, dispositif de mesure formant un fluxmetre et un capteur de temperature combines comprenant un tel materiau composite et procede de preparation d'un tel materiau | |
| EP2497118B1 (fr) | Conducteur de cellule photovoltaïque en deux parties serigraphiees haute et basse temperature | |
| FR2529374A1 (fr) | Element de circuit resistif et son procede de fabrication | |
| WO2021239737A1 (fr) | Cellule et chaîne photovoltaïques et procédés associés | |
| WO2004066680A1 (fr) | Element en plaque avec un chauffage en couche | |
| FR3085078A1 (fr) | Procede de fabrication d'une matrice de pixels d'un capteur de motif thermique et capteur associe | |
| FR2721788A1 (fr) | Film chauffant. | |
| WO2018051018A1 (fr) | Réseau percolant de nanofils pour chauffage grande surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 200980104511.5 Country of ref document: CN |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09708987 Country of ref document: EP Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 5020/DELNP/2010 Country of ref document: IN Ref document number: 2009708987 Country of ref document: EP |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2712381 Country of ref document: CA |
|
| ENP | Entry into the national phase |
Ref document number: 20107016331 Country of ref document: KR Kind code of ref document: A |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2009211229 Country of ref document: AU |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 12865771 Country of ref document: US |
|
| WWE | Wipo information: entry into national phase |
Ref document number: MX/A/2010/008519 Country of ref document: MX |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2010545528 Country of ref document: JP |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWE | Wipo information: entry into national phase |
Ref document number: PI 2010003295 Country of ref document: MY |
|
| ENP | Entry into the national phase |
Ref document number: 2009211229 Country of ref document: AU Date of ref document: 20090126 Kind code of ref document: A |
|
| ENP | Entry into the national phase |
Ref document number: PI0907493 Country of ref document: BR Kind code of ref document: A2 Effective date: 20100730 |


