WO2009104886A3 - 레이저 가공장치 - Google Patents

레이저 가공장치 Download PDF

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Publication number
WO2009104886A3
WO2009104886A3 PCT/KR2009/000743 KR2009000743W WO2009104886A3 WO 2009104886 A3 WO2009104886 A3 WO 2009104886A3 KR 2009000743 W KR2009000743 W KR 2009000743W WO 2009104886 A3 WO2009104886 A3 WO 2009104886A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
laser beam
processing device
processing
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/000743
Other languages
English (en)
French (fr)
Other versions
WO2009104886A2 (ko
Inventor
엄승환
김현중
조운기
이광재
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kornic Systems Corp
Original Assignee
Kornic Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kornic Systems Corp filed Critical Kornic Systems Corp
Priority to CN2009801130955A priority Critical patent/CN102007568B/zh
Priority to JP2010546700A priority patent/JP5220133B2/ja
Publication of WO2009104886A2 publication Critical patent/WO2009104886A2/ko
Publication of WO2009104886A3 publication Critical patent/WO2009104886A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

본 발명의 레이저 가공장치에 관한 것으로서, 보다 상세하게는 기판으로부터 박막을 분리하는 레이저 리프트 오프 공정에 사용되는 레이저 가공장치에 관한 것이다. 본 발명에 따른 레이저 가공장치는 레이저 빔을 방출하는 레이저 빔 광원과, 레이저 빔 광원에서 방출된 레이저 빔의 형상 및 에너지분포를 가공하는 광학계와, 광학계에 의해 가공된 레이저 빔이 조사되며, 조사된 레이저 빔에 의해 가공되는 가공대상물이 배치되는 스테이지와, 광학계에 의해 가공된 레이저 빔이 통과하도록 레이저 빔의 진행경로 상에 배치되며, 가공대상물의 가공시 발생되는 부산물을 흡입하기 위한 석션 유닛을 포함한다.
PCT/KR2009/000743 2008-02-18 2009-02-17 레이저 가공장치 Ceased WO2009104886A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009801130955A CN102007568B (zh) 2008-02-18 2009-02-17 激光工艺装置
JP2010546700A JP5220133B2 (ja) 2008-02-18 2009-02-17 レーザー加工装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0014564 2008-02-18
KR1020080014564A KR100953686B1 (ko) 2008-02-18 2008-02-18 레이저 가공장치

Publications (2)

Publication Number Publication Date
WO2009104886A2 WO2009104886A2 (ko) 2009-08-27
WO2009104886A3 true WO2009104886A3 (ko) 2009-10-22

Family

ID=40986034

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/000743 Ceased WO2009104886A2 (ko) 2008-02-18 2009-02-17 레이저 가공장치

Country Status (5)

Country Link
JP (1) JP5220133B2 (ko)
KR (1) KR100953686B1 (ko)
CN (1) CN102007568B (ko)
TW (1) TWI372671B (ko)
WO (1) WO2009104886A2 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012178534A (ja) * 2011-02-02 2012-09-13 Gigaphoton Inc 光学システムおよびそれを用いた極端紫外光生成システム
JP5788716B2 (ja) * 2011-06-02 2015-10-07 株式会社ディスコ 粉塵排出装置
WO2014062034A1 (ko) * 2012-10-18 2014-04-24 디앤에이 주식회사 레이저 리프트 오프 장치
JP6004933B2 (ja) * 2012-12-21 2016-10-12 株式会社ディスコ レーザー加工装置
JP6008210B2 (ja) * 2014-04-08 2016-10-19 ウシオ電機株式会社 レーザリフトオフ装置
CN111496379B (zh) * 2014-08-19 2022-08-26 亮锐控股有限公司 用于减少在管芯级激光剥离期间所受机械损伤的蓝宝石收集器
EP3295479B1 (en) 2015-05-13 2018-09-26 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
JP6999264B2 (ja) 2016-08-04 2022-01-18 株式会社日本製鋼所 レーザ剥離装置、レーザ剥離方法、及び有機ｅｌディスプレイの製造方法
KR102092712B1 (ko) 2017-02-24 2020-03-24 에이피시스템 주식회사 레이저 처리 장치 및 방법
ES2636715B2 (es) * 2017-06-07 2018-02-12 Sitexco Girona, S.L. Máquina de limpieza de rodillos anilox por láser y procedimiento para autoajuste del punto focal láser al diámetro del rodillo anilox.
KR20200050967A (ko) 2017-09-12 2020-05-12 에베 그룹 에. 탈너 게엠베하 일시적으로 접합된 기판 스택을 분리하는 방법 및 장치
KR102379215B1 (ko) 2017-10-31 2022-03-28 삼성디스플레이 주식회사 레이저 장치
JP7069441B1 (ja) * 2021-08-31 2022-05-17 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
JP7845321B2 (ja) * 2023-09-14 2026-04-14 トヨタ自動車株式会社 レーザ加工機

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06269975A (ja) * 1993-03-24 1994-09-27 Toshiba Corp 水中レーザー加工装置
JPH1099978A (ja) * 1996-09-27 1998-04-21 Hitachi Ltd レーザー加工装置
JP2001150176A (ja) * 1999-11-22 2001-06-05 Matsushita Electronics Industry Corp レーザマーキング集塵装置
KR20050078411A (ko) * 2004-01-29 2005-08-05 삼성에스디아이 주식회사 레이저 패터닝 시스템에서의 레이저 모니터링 시스템

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09174262A (ja) * 1995-12-27 1997-07-08 Hitachi Ltd レーザマーカ
JP4555743B2 (ja) * 2005-07-21 2010-10-06 本田技研工業株式会社 レーザ加工ヘッド

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06269975A (ja) * 1993-03-24 1994-09-27 Toshiba Corp 水中レーザー加工装置
JPH1099978A (ja) * 1996-09-27 1998-04-21 Hitachi Ltd レーザー加工装置
JP2001150176A (ja) * 1999-11-22 2001-06-05 Matsushita Electronics Industry Corp レーザマーキング集塵装置
KR20050078411A (ko) * 2004-01-29 2005-08-05 삼성에스디아이 주식회사 레이저 패터닝 시스템에서의 레이저 모니터링 시스템

Also Published As

Publication number Publication date
KR100953686B1 (ko) 2010-04-19
KR20090089161A (ko) 2009-08-21
TW200940229A (en) 2009-10-01
CN102007568B (zh) 2013-07-10
JP2011512256A (ja) 2011-04-21
JP5220133B2 (ja) 2013-06-26
TWI372671B (en) 2012-09-21
WO2009104886A2 (ko) 2009-08-27
CN102007568A (zh) 2011-04-06

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