WO2009121426A3 - Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung - Google Patents

Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung Download PDF

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Publication number
WO2009121426A3
WO2009121426A3 PCT/EP2008/065390 EP2008065390W WO2009121426A3 WO 2009121426 A3 WO2009121426 A3 WO 2009121426A3 EP 2008065390 W EP2008065390 W EP 2008065390W WO 2009121426 A3 WO2009121426 A3 WO 2009121426A3
Authority
WO
WIPO (PCT)
Prior art keywords
encoder sensor
distance encoder
force
form fit
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/065390
Other languages
English (en)
French (fr)
Other versions
WO2009121426A2 (de
Inventor
Thorsten Uelzen
Boris Adam
Martin Griebel
Timo Nachtrab
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2009121426A2 publication Critical patent/WO2009121426A2/de
Publication of WO2009121426A3 publication Critical patent/WO2009121426A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)

Abstract

Wegbausensor für die Verwendung im Automobil mit einem Sensormodul, einem Gehäuse, wenigstens einem elektrischen Anschluss des Sensormoduls (Kontaktelement), dadurch gekennzeichnet, dass das wenigstens eine Kontaktelement des Sensormoduls eine jeweilige elektrische Verbindung zu einem jeweiligen Kontaktelement des Gehäuses kraft- oder formschlüssig herstellt, das Sensormodul in das Gehäuse ein- oder angelegt ist und das Sensormodul im oder am Gehäuse kraft- oder formschlüssig fixiert ist.
PCT/EP2008/065390 2008-03-31 2008-11-12 Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung Ceased WO2009121426A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008000889.3 2008-03-31
DE102008000889.3A DE102008000889B4 (de) 2008-03-31 2008-03-31 Wegbausensor und Verfahren zur Herstellung eines Wegbausensors mittels Einlegen und kraft-/formschlüssiger Verbindung

Publications (2)

Publication Number Publication Date
WO2009121426A2 WO2009121426A2 (de) 2009-10-08
WO2009121426A3 true WO2009121426A3 (de) 2010-04-08

Family

ID=41050382

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/065390 Ceased WO2009121426A2 (de) 2008-03-31 2008-11-12 Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung

Country Status (2)

Country Link
DE (1) DE102008000889B4 (de)
WO (1) WO2009121426A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011079446A1 (de) 2011-07-20 2013-02-07 Robert Bosch Gmbh Sensoreinrichtung, insbesondere für die Verwendung in einem Kraftfahrzeug
DE102014219030B4 (de) 2014-09-22 2016-07-07 Robert Bosch Gmbh Steckermodul
DE102014225861A1 (de) * 2014-12-15 2016-06-16 Robert Bosch Gmbh Sensoreinrichtung, insbesondere für die Verwendung in einem Kraftfahrzeug
US10690524B2 (en) 2017-10-19 2020-06-23 Veoneer Us, Inc. Lock clip for electrical sensor connection
EP4317967A3 (de) * 2022-08-04 2024-04-03 Carrier Corporation Gasdetektor mit abnehmbarer sensoranordnung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6435882B1 (en) * 2001-07-27 2002-08-20 Agilent Technologies, Inc. Socketable flexible circuit based electronic device module and a socket for the same
US20030107491A1 (en) * 2001-12-10 2003-06-12 Keiji Sasaki Pressure sensor
EP1584911A1 (de) * 2004-03-30 2005-10-12 Nagano Keiki Co., Ltd. Drucksensorgehäuse und Herstellungsverfahren

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3706168A1 (de) 1987-02-26 1988-09-08 Bosch Gmbh Robert Messaufnehmer
AT403962B (de) 1996-10-30 1998-07-27 Avl Verbrennungskraft Messtech Vorrichtung zur durchführung von elektrochemischen und/oder optischen messvorgängen in flüssigkeiten
DE19964218C2 (de) 1999-10-08 2003-04-10 Hahn Schickard Ges Elektromechanisches Bauelement mit einem Polymerkörper und Verfahren zur Herstellung desselben
DE20106750U1 (de) 2001-04-19 2002-08-29 Robert Bosch Gmbh, 70469 Stuttgart Kleinbauender Kupplungsstecker, insbesondere für eine planare Breitband-Lamda-Sonde mit einer Sicherung für das Deckelelement
DE20304461U1 (de) 2002-04-09 2003-06-12 MBS Sulzbach Messwandler GmbH, 74429 Sulzbach-Laufen Elektronischer Messwertumformer mit integriertem Stromwandler
DE102004021931A1 (de) 2004-03-16 2005-10-06 Robert Bosch Gmbh Gehäuse für eine elektronische Schaltung
DE102004027094A1 (de) 2004-06-02 2005-12-29 Infineon Technologies Ag Halbleitermodul mit einem Halbleiter-Sensorchip und einem Kunststoffgehäuse sowie Verfahren zu dessen Herstellung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6435882B1 (en) * 2001-07-27 2002-08-20 Agilent Technologies, Inc. Socketable flexible circuit based electronic device module and a socket for the same
US20030107491A1 (en) * 2001-12-10 2003-06-12 Keiji Sasaki Pressure sensor
EP1584911A1 (de) * 2004-03-30 2005-10-12 Nagano Keiki Co., Ltd. Drucksensorgehäuse und Herstellungsverfahren

Also Published As

Publication number Publication date
DE102008000889A1 (de) 2009-10-15
DE102008000889B4 (de) 2022-10-27
WO2009121426A2 (de) 2009-10-08

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