WO2009127573A3 - Klassifizierungseinrichtung und -verfahren für die klassifizierung von oberflächendefekten insbesondere auf waferoberflächen - Google Patents

Klassifizierungseinrichtung und -verfahren für die klassifizierung von oberflächendefekten insbesondere auf waferoberflächen Download PDF

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Publication number
WO2009127573A3
WO2009127573A3 PCT/EP2009/054215 EP2009054215W WO2009127573A3 WO 2009127573 A3 WO2009127573 A3 WO 2009127573A3 EP 2009054215 W EP2009054215 W EP 2009054215W WO 2009127573 A3 WO2009127573 A3 WO 2009127573A3
Authority
WO
WIPO (PCT)
Prior art keywords
defect
classification
stored
determined
category
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/054215
Other languages
English (en)
French (fr)
Other versions
WO2009127573A2 (de
Inventor
Dirk Bugner
Sergei Sitov
Mladen Nikolov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zegema GmbH
Original Assignee
Nanophotonics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanophotonics GmbH filed Critical Nanophotonics GmbH
Publication of WO2009127573A2 publication Critical patent/WO2009127573A2/de
Publication of WO2009127573A3 publication Critical patent/WO2009127573A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Die Erfindung betrifft eine Klassifizierungseinrichtung, ein Klassifizierungsverfahren sowie ein Computerprogrammprodukt für die Klassifizierung von Oberflächendefekten auf Objektoberflächen, insbesondere auf Waferoberflächen. Nach dem erfindungsgemäßen Verfahren wird der Oberflächendefekt einer vordefinierten Defektklasse zugeordnet, für die wenigstens eine Eigenschaftsinformation aus der Gruppe zwingender Konditionen und Eigenschaftswertverteilungen hinterlegt ist. Dabei werden Werte bestimmter Defekteigenschaften des Oberflächendefektes ermittelt, die ermittelten Defekteigenschaftswerte auf Erfüllung der zwingenden Konditionen überprüft, wenn wenigstens eine zwingende Kondition hinterlegt ist, die Zugehörigkeit zu der Defektklasse bejaht, wenn die zwingenden Konditionen erfüllt sind und keine Eigenschaftswertverteilung für die Defektklasse hinterlegt ist und ein Wahrscheinlichkeitswert für die Zugehörigkeit des Oberflächendefektes zu der Defektklasse durch Vergleich der Eigenschaftswertverteilungen mit den ermittelten Defekteigenschaftswerte bestimmt, wenn wenigstens eine Eigenschaftswertverteilung für die Defektklasse hinterlegt ist.
PCT/EP2009/054215 2008-04-14 2009-04-08 Klassifizierungseinrichtung und -verfahren für die klassifizierung von oberflächendefekten insbesondere auf waferoberflächen Ceased WO2009127573A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008001173.8 2008-04-14
DE200810001173 DE102008001173B9 (de) 2008-04-14 2008-04-14 Klassifizierungseinrichtung und -verfahren für die Klassifizierung von Oberflächendefekten, insbesondere aus Waferoberflächen

Publications (2)

Publication Number Publication Date
WO2009127573A2 WO2009127573A2 (de) 2009-10-22
WO2009127573A3 true WO2009127573A3 (de) 2010-04-01

Family

ID=41078890

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/054215 Ceased WO2009127573A2 (de) 2008-04-14 2009-04-08 Klassifizierungseinrichtung und -verfahren für die klassifizierung von oberflächendefekten insbesondere auf waferoberflächen

Country Status (2)

Country Link
DE (1) DE102008001173B9 (de)
WO (1) WO2009127573A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2977939B1 (fr) 2011-07-11 2013-08-09 Edixia Procede d'acquisition de plusieurs images d'un meme objet a l'aide d'une seule camera lineaire

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1061571A2 (de) * 1999-06-15 2000-12-20 Applied Materials, Inc. Adaptatives Verfahren und Vorrichtung zur automatischen Klassifizierung von Oberflächendefekten
US20040218806A1 (en) * 2003-02-25 2004-11-04 Hitachi High-Technologies Corporation Method of classifying defects
US20070201739A1 (en) * 2006-02-27 2007-08-30 Ryo Nakagaki Method and apparatus for reviewing defects

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6466895B1 (en) * 1999-07-16 2002-10-15 Applied Materials, Inc. Defect reference system automatic pattern classification
DE10131665B4 (de) * 2001-06-29 2005-09-22 Infineon Technologies Ag Verfahren und Vorrichtung zur Inspektion des Randbereichs eines Halbleiterwafers
US6947588B2 (en) * 2003-07-14 2005-09-20 August Technology Corp. Edge normal process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1061571A2 (de) * 1999-06-15 2000-12-20 Applied Materials, Inc. Adaptatives Verfahren und Vorrichtung zur automatischen Klassifizierung von Oberflächendefekten
US20040218806A1 (en) * 2003-02-25 2004-11-04 Hitachi High-Technologies Corporation Method of classifying defects
US20070201739A1 (en) * 2006-02-27 2007-08-30 Ryo Nakagaki Method and apparatus for reviewing defects

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
LURIA M ET AL: "Automatic Defect Classification Using Fuzzy Logic", 19931018; 19931018 - 19931019, 18 October 1993 (1993-10-18), pages 191 - 193, XP010285370 *
MITAL D P ET AL: "Computer based wafer inspection system", PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON INDUSTRIAL ELECTRONICS, CONTROL AND INSTRUMENTATION (IECON). KOBE, OCT. 28 - NOV. 1, 1991; [PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON INDUSTRIAL ELECTRONICS, CONTROL AND INSTRUMENTATION (IECON)], NE, vol. CONF. 17, 28 October 1991 (1991-10-28), pages 2497 - 2503, XP010041813, ISBN: 978-0-87942-688-0 *
PAUL B CHOU ET AL: "Automatic defect classification for semiconductor manufacturing", MACHINE VISION AND APPLICATIONS, SPRINGER, BERLIN, DE, vol. 9, no. 4, 1 January 1997 (1997-01-01), pages 201 - 214, XP007910519, ISSN: 1432-1769 *

Also Published As

Publication number Publication date
WO2009127573A2 (de) 2009-10-22
DE102008001173B9 (de) 2010-06-02
DE102008001173B3 (de) 2009-10-22

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