WO2009138637A1 - Station et procede de mesure de la contamination d'une enceinte de transport de substrats semi-conducteurs - Google Patents
Station et procede de mesure de la contamination d'une enceinte de transport de substrats semi-conducteurs Download PDFInfo
- Publication number
- WO2009138637A1 WO2009138637A1 PCT/FR2009/050713 FR2009050713W WO2009138637A1 WO 2009138637 A1 WO2009138637 A1 WO 2009138637A1 FR 2009050713 W FR2009050713 W FR 2009050713W WO 2009138637 A1 WO2009138637 A1 WO 2009138637A1
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- WO
- WIPO (PCT)
- Prior art keywords
- measuring
- gas
- envelope
- jet
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
Definitions
- the present invention relates to a station for measuring the particle contamination of a transport chamber for conveying and atmospheric storage of semiconductor substrates such as semiconductor wafers ("wafers" in English) or photomasqoes.
- the invention also relates to a corresponding measurement method.
- the transport and storage enclosures determine a confined space under atmospheric pressure separated from. the environment of use and transport: of the substrate, for the transport and storage of one or more substrates.
- the standardized speakers for transporting and storing side opening plates of the FOUP type (Front Opening Unified Pod) or FOSB (Front Opening Shipping Box) are available, or at the bottom by type bottom SMIF Pod ("Standard Mechanical Interface Pod” in English), or standardized speakers “for transport and storage of photomasks such as RSP (" Reticle SMIF Pod “in English) or MRP (" Multiple Reticle SMlF Pod “ ⁇ .
- These transport enclosures are made of materials such as polycarbonate, which can in some cases; concentrate contaminants and in particular organic, amine or acidic contaminants.
- the transport chambers are manipulated, which leads to the formation of polluting particles that lodge in the walls of; transport enclosures and contaminate them.
- the particles stuck on the walls of the transport enclosures can then peel off, fall back on the substrates stored in these enclosures and damage them.
- the object of the present invention is therefore to propose a measurement station and a corresponding measurement method, making it possible to measure a contamination level in transport container particles for conveying and atmospheric storage of semiconductor substrates, by a measurement made in real time, which can be implemented in a manufacturing process chain directly in the manufacturing plant.
- the subject of the invention is a station for measuring the particle contamination of a transport chamber for the conveying and atmospheric storage of semiconductor substrates, said enclosure comprising a closable envelope.
- said station comprising: an interface capable of coupling to said transport enclosure envelope, in place of said door, the interface comprising at least one injection nozzle disposed at one end movable of a protruding pipe of said interface for directing a jet of gas in a direction perpendicular to a wall portion within said envelope coupled to said measuring station, so as to detach particles from said envelope by the impact of the gas jet on said wall and, a measuring device including a vacuum pump, a particle counter and a measuring channel, an inlet of which opens into the interior of said housing and an outlet of which is connected to the vacuum pump, the measurement pipe being further connected the particle counter, for communicating, the inside of the casing of the transport chamber coupled to said measuring station with the particle counter.
- said interface is provided with a plurality of spacers allowing said interface to mate with said envelope leaving gaps for the passage of a leakage flux between the bottom of said envelope and the external environment, - the spacer circuits are in the form of pads, the measuring station comprises an atmospheric chamber of cleanroom type, preferably Iso 3 certified, surrounding said interface, the nozzle injection device is configured to inject a jet of pulsed gas, the interface comprises a plurality of injection nozzles provided with particle filters, - the measuring station comprises obnirados for closing filter gas passages of the envelope of the transport enclosure, the measuring station comprises a processing unit for transmitting a signai representative of a state of cleanliness of the envelope of said pregnant te to a cleaning unit.
- the subject of the invention is also a method for measuring the particulate contamination of a transport enclosure for conveying and atmospheric storage of semiconductor substrates, comprising: a first stage in which a jet of gas is directed perpendicularly to a portion of wall inside a casing of an enclosure coupled to said station for measuring particulate contamination, as defined above, so as to detach particles from the casing by the impact of the jet of gas on said wall and the operation of the vacuum pump so as to produce a gas flow from inside the casing of the transport chamber coupled to said measuring station to the particle counter and a second step in which a number of particles is measured with the particle counter and the result of the measurement is compared to a predefined threshold to determine whether a cleaning step e. by a liquid is necessary depending on the result of the comparison. .
- a jet of gas is injected discontinuously, during the first step of said measurement process, during said first step, said jet of gas is injected against. Ia wall, then during said second step, the injection is stopped to measure the number of particles and the injection base is moved perpendicularly to a new wall portion, and said first and second steps are repeated to determine if a liquid cleaning step is necessary depending on the result from the comparisons, the injection flow is greater than the pumping flow.
- FIG. 1 is a schematic view of a measuring station in a position coupled to an envelope of a transport chamber
- Figure 2 shows a variant of the station.
- FIGS. 3 and 4 are diagrammatic views of elements of a measuring station coupled to an enclosure shell during operation
- FIG. 5 is a flowchart of a measurement method. For the sake of clarity, the "tape" of the measurement process is numbered starting from 100.
- the invention relates to a station for measuring the particle contamination of a transport enclosure envelope for conveying and atmospheric storage of semiconductor substrates.
- the measuring station is likely to. mating in particular with at least one standard transport enclosure SMIF, FOUP, FOSB, RSP or MRP.
- SMIF standard transport enclosure
- FOUP field-up enclosure
- FOSB field-up enclosure
- RSP RSP
- MRP MRP
- Atmospheric pressure is the pressure that the transport enclosures have in their environment of use, such as the atmospheric pressure of the clean room.
- the transport enclosures will comprise a peripheral envelope that can be closed by a removable access door sized for the introduction and extraction of substrates. Inside the casing, the transport enclosures are provided with a substrate support for holding and supporting one of a plurality of substrates.
- Some transport speakers including FOUP-type speakers, include; filtered gas passages to balance the pressure between the inside and the outside of the transport enclosure.
- FIG. 1 shows a measurement station 1 coupled to a transport enclosure envelope 3 for conveying and atmospheric storage of FOUP type semiconductor substrates.
- the measuring station is placed in a clean room to form a control room.
- the measuring station can also be integrated into semiconductor manufacturing equipment.
- the manufacturing equipment then preferably comprises three clean rooms certified Iso 3 in accordance with the ISO 14644-1 standard defining the cleanliness classification of the clean and controlled rooms in terms of particle concentration. suspended in the air.
- a first chamber for removing the access door of a transport chamber a second chamber forms the measuring station for measuring the particle contamination of the envelope 3 and a third chamber is for example a cleaning unit allowing to implement a cleaning process with a liquid.
- the second chamber is in communication with the first and the third chamber in order to be able to transfer the envelope of the transport chamber 3 from one chamber to the other.
- the measuring station 1 comprises, on the one hand, an interface 5 capable of coupling to the envelope of the transport enclosure 3 and, on the other hand, a measuring device 7.
- the interface 5 has the same dimensions as a transport enclosure access door ci: can thus easily be coupled to a transport enclosure envelope 3 in place of the access door. Although represented vertically in FIG. 1, the interface. 5 can also be arranged in any position, especially in a horizontal position.
- the interface 5 further comprises at least one injection nozzle 9 for directing a jet of gas in a direction perpendicular to a wall portion 13 inside the envelope 10 of the enclosure 3 coupled to the station. measurement 1, so as to detach particles il from the casing 3 by the impact of the gas jet on the wall 13.
- the gas is a clean gas, for example. air or nitrogen.
- the gas flow has a low, angular dispersion and generates for a few seconds an aerodynamic force. which picks up the particles adhered to the inner walls 13 of the envelope 3.
- a non-constant flow of gas is injected, that is to say a jet of pulsed gas, a jet of mobile gas that can sweep a wall portion 13, a jet of gas successively injected through a and a flow of gas modulated in amplitude, such as a gas flow ramp.
- the jet of gas atomizes the walls 13 in a discontinuous manner, increasing the number of gas acceleration phases, during which the particles 11 are peeled off, favoring the measurement of the pollution level by significantly improving: the stalling of the particles.
- the measuring device 7 comprises a vacuum pump 17, a particle counter 19 and a measuring pipe 21, an inlet of which is capable of being placed in communication with the inside 10 of the coupled casing 3 and of which one outlet 25 is connected to the vacuum pump 17.
- the inlet 23 opens directly into a front face of the interface 5 (FIG. 1) or can be placed further inside the transport envelope 3 by an extension: 22 of the measurement pipe 21 beyond the interface 5 ( Figure 2).
- the measurement pipe 21 is further connected to the particle counter 19, for communicating the inside 10 of the transport enclosure casing 3 coupled to the measuring station 1 with the particle counter 19.
- particles 19 is of the aerosol type, that is to say it allows to give a quantitative reduction of the particles 11 in suspension in a gaseous environment.
- the particle counter is based on laser technology.
- the pumping flow of the vacuum pump 17 is of the order of 1.7 m 3 / h.
- the entrainment of the gases produced by the nozzles 9 is added to that created by the vacuum pump 17, which makes it possible to amplify the force of the flow of the gases comprising the: separated particles 11, towards the inlet 23.
- An example of the trajectory 18 of the flow of gases in FIG. 3 is shown. This flow of gas 18 caused by the pumping fllux makes it possible on the one hand to collect the particles 11 detached in suspension and on the other hand on the other hand, to direct them to the input 23 of the measuring device 7.
- the measuring station 1 advantageously comprises a processing unit. (Not shown) to transmit a signal representative of a state of cleanliness of the envelope of said enclosure 3 to a cleaning unit.
- the injection nozzle 9 is disposed at a moving end of a projecting pipe 32 of the interfac 5.
- the end of the pipe 32 may further be oriented towards the inside 10 of the casing 3.
- the jet of gas is also capable of reaching a substrate support fixed inside the envelope of the enclosure transport 3.
- the gas injection nozzle 9 is configured to inject a jet of pulsed gas.
- the frequency and the pulsating force of the gas jet 9 associated with a pumping speed of the vacuum pump 17 adapted so as to generate a flow wave of the gases M in the envelope 3 to optimize the flow are then adjusted. detachment of particles »11.
- the mobility in translation and / or rotation of the end of the pipe 32 makes it possible to adapt the speed of attack of the jet of gas to the internal walls 13 and in particular to adapt the perpendicular component of the speed of the jet of gas, in order to optimize the impact causing the particles 11 to detach.
- the inlet 23 of the measuring pipe 21 is then advantageously arranged in an extension 22 of the measuring pipe 21, preferably also movable in translation and / or in rotation.
- the inlet 23 can be placed at a constant distance and angle with respect to the injection nozzle 9, making it possible to obtain a measurement independent of the orientation of the injection nozzle 9.
- the interface 5 comprises a plurality of gas injection nozzles 9.
- the discontinuous injection is then obtained by successively injecting a jet of gas into each of the injection nozzles 9.
- the interface 5 comprises a plurality of gas injection nozzles 9 configured to inject a jet of pulsed gas.
- the discontinuous injection is then obtained by the successive scanning of the different injection nozzles 9 and / or by the pulsation of the jet of gas.
- the successive injection through the different injection nozzles 9 allows a patr. to target the injection in some dead zones of the envelope 3 and other, part, to reach a large portion of wall 13 by scanning the jet of gas.
- the processing unit can determine an informantion of the contamination of the envelope 3 relative to each injection nozzle 9.
- the processing unit transmits a signal representative of the state of cleanliness associated with each portion of envelope 3 to be analyzed, making it possible to determine more or less dirty areas of the envelope 3. 3, n distinguishes in Figure 4. an advantageous embodiment of the interface 5 in which the interface 5 comprises a plurality of injection nozzles 9, five in this example.
- the nozzles 9 can be aligned in a peripheral band of the front face of the interface 5, so as to direct a jet of gas perpendicular to a plane defined by the interface 5.
- the dimensions and inclination of the injection nozzles 9 are adapted to generate a jet of gas perpendicular to the internal walls 13 of the envelope of the enclosure 3 for causing the detachment of the particles 11 adhered to the walls 13, particularly in significant areas of a state of pollution of the enclosure of the transport enclosure 3.
- the size of the injection nozzles 9 is relatively small, for example the nozzles 9 have an orifice of the order of one millimeter of diameter so as to impose a high speed gas jet, while being simple to achieve.
- the measuring station 1 advantageously comprises shutters for closing off the filtered gas passages of the envelope of the transport enclosure 3 (not visible in this figure ).
- the shutters may for example be carried by a plate 16 of the measuring station 1.
- the shutters also make it possible to ensure that no external particle penetrates inside the envelope of the transport enclosure 3.
- the coupling of the interface 5 with the transport envelope 3 is made in an unsealed manner.
- the interface 5 is provided with a plurality of encretois (not shown), allowing the interface 5 to mate with the casing 3 leaving gaps for the passage of a leakage flow between the inside 10 of the envelope 3 and the external environment.
- the spacers have, for example, the shape of studs regularly distributed in a peripheral band of the front face of the interface 5.
- a gas injection flow is provided that is greater than the pumping flow, so that the interior of the transport envelope 3 is slightly overpressure compared to the external environment, favoring. and the flow of fluids to the outside of the casing 3. The leakage flow is then directed through the interstices to the outside environment. In this way particle contamination is prevented from the inside of the casing 3.
- the injection nozzles 9 are advantageously provided with particle filters for filtering any polluting particles coming from the external environment.
- the measuring station 1 comprises an atmospheric chamber 27 of the cleanroom type, preferably Iso 3 certified, in accordance with the ISO 14644-1 standard. surrounding the interface 5, so as to form a mini environment around the interface 5, thus enhancing the cleanliness of the gas injection.
- an atmospheric chamber 27 of the cleanroom type preferably Iso 3 certified, in accordance with the ISO 14644-1 standard. surrounding the interface 5, so as to form a mini environment around the interface 5, thus enhancing the cleanliness of the gas injection.
- the processing unit is configured to process and exploit the measurement results of the particle counter 19 and to start the measurement process 100.
- FIG. 5 illustrates the various steps of the measurement method 100
- the measurement method particulate contamination 100 is preferably carried out before sending a transport chamber to a cleaning unit by a liquid.
- a jet of gas is directed perpendicularly towards a wall portion 13 inside, 10 of an envelope of a transport enclosure 3 coupled to a measuring station 1 so as to detach particles 11 of the envelope 3 by the jet of gas.
- the injection of the gas jet can be performed, before or after the coupling of the envelope 3 to the measuring station 1.
- the vacuum pump 17 is operated to produce a flow of gas from inside the casing of the transport enclosure 3 coupled to the measuring station 1 to the particle counter 19.
- the injection flow is greater than the pumping flow so as to create a leak flow to the outside of the station.
- the gas injection is injected and / or a jet of gas is injected successively into each of the injection nozzles 9 and / or the orientation and / cm the position of the injection nozzle 9 are modified so as to scan a wall portion 13 and / or a gas flow ramp is injected during the first step 101 of the measurement method 100 to obtain a discontinuous injection of gas.
- the particles 11 removed from the patois 13 are directed to the input 23 of the measuring device 7 to be detected by the particle counter 19.
- a number of particles 11 are measured with the particle counter 19 and the result of the measurement is compared with a predefined threshold for determining whether a cleaning step with a liquid is necessary depending on the result. from the comparison
- Step 103 or if the transport enclosure is sufficiently clean to remain in production and continue to transport or store substrates (step 104).
- the jet of gas is injected perpendicularly against the wall 13, for a relatively short period of between 5 and 30 seconds,
- the injection is stopped and the measurement is measured. number of particles.
- the measurement is stabilized or when the particle counter 19 does not count of particles, or moves the injection nozzle 9 perpendicularly to e new wall portion.
- the nozzle 9 is for example offset axially, by a translation of the projecting pipe 32, so that the injection angle remains perpendicular to the same wall 13.
- the first and second steps 101, 102 are then reiterated to determine whether a liquid cleaning step is necessary based on the result from the comparisons.
- the measurement process 100 thus makes it possible to measure in real time a level of contamination in particles of transpour speakers by a succession of strands that can be implemented in one. manufacturing process industrial chain-
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09745956.4A EP2272083B1 (fr) | 2008-04-24 | 2009-04-16 | Station et procede de mesure de la contamination d'une enceinte de transport de substrats semi-conducteurs |
| CN2009801138444A CN102007569B (zh) | 2008-04-24 | 2009-04-16 | 用于测量半导体衬底传送盒的污染的站和方法 |
| US12/736,532 US8356526B2 (en) | 2008-04-24 | 2009-04-16 | Contamination measurement station and method for a semiconductor substrates transport pod |
| JP2011505570A JP5711657B2 (ja) | 2008-04-24 | 2009-04-16 | 半導体基板の搬送に使用するエンクロージャの汚染を測定するためのステーションおよび方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0802284A FR2930675B1 (fr) | 2008-04-24 | 2008-04-24 | Station de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs et procede de mesure correspondant |
| FR0802284 | 2008-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009138637A1 true WO2009138637A1 (fr) | 2009-11-19 |
Family
ID=39672938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FR2009/050713 Ceased WO2009138637A1 (fr) | 2008-04-24 | 2009-04-16 | Station et procede de mesure de la contamination d'une enceinte de transport de substrats semi-conducteurs |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8356526B2 (fr) |
| EP (1) | EP2272083B1 (fr) |
| JP (1) | JP5711657B2 (fr) |
| KR (1) | KR101641390B1 (fr) |
| CN (1) | CN102007569B (fr) |
| FR (1) | FR2930675B1 (fr) |
| TW (1) | TWI483330B (fr) |
| WO (1) | WO2009138637A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014083151A1 (fr) | 2012-11-30 | 2014-06-05 | Adixen Vacuum Products | Station et procede de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs |
| WO2014083152A1 (fr) | 2012-11-30 | 2014-06-05 | Adixen Vacuum Products | Station et procede de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9677985B2 (en) * | 2014-05-13 | 2017-06-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for inspecting filtering cartridge |
| KR101483224B1 (ko) * | 2014-11-25 | 2015-01-16 | 주식회사 올루 | 다공 형성 부품의 입자 검사 장치 |
| US10725061B2 (en) | 2017-02-03 | 2020-07-28 | Pentagon Technologies Group, Inc. | Modulated air surface particle detector |
| US10446428B2 (en) * | 2017-03-14 | 2019-10-15 | Applied Materials, Inc. | Load port operation in electronic device manufacturing apparatus, systems, and methods |
| US10712355B2 (en) | 2017-06-20 | 2020-07-14 | Pentagon Technologies Group, Inc. | High resolution surface particle detector |
| KR101936026B1 (ko) * | 2018-11-23 | 2019-01-07 | 김진호 | 대칭 가스 분사를 이용한 파티클 제거 장치 |
| FR3101001B1 (fr) | 2019-09-25 | 2022-05-27 | Pfeiffer Vacuum | Station et procédé de nettoyage d’une enceinte de transport pour le convoyage et le stockage atmosphérique de substrats semi-conducteurs |
| TWI769514B (zh) * | 2020-09-01 | 2022-07-01 | 家登精密工業股份有限公司 | 光罩盒潔淨設備 |
| WO2022201831A1 (fr) * | 2021-03-25 | 2022-09-29 | 株式会社Screenホールディングス | Procédé de commande d'échappement pour armoire à liquide de traitement et dispositif de traitement de substrat |
| CN116008003A (zh) * | 2022-12-16 | 2023-04-25 | 西安奕斯伟材料科技有限公司 | 片盒内部离子采集装置及方法 |
| US20250096010A1 (en) * | 2023-09-15 | 2025-03-20 | Kla Corporation | Method to perform in-situ vacuum contamination measurement and identification in arbitrarily large chambers |
| US20260071970A1 (en) * | 2024-09-06 | 2026-03-12 | Applied Materials, Inc. | Portable process tool diagnostic system |
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| JPS641228A (en) * | 1987-06-23 | 1989-01-05 | Toshiba Ceramics Co Ltd | Jig for heat treating wafer |
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| US20020029791A1 (en) * | 2000-09-14 | 2002-03-14 | Kenji Matsuoka | Processing apparatus having particle counter and cleaning device, cleaning method, cleanliness diagnosis method and semiconductor fabricating apparatus using the same |
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2008
- 2008-04-24 FR FR0802284A patent/FR2930675B1/fr not_active Expired - Fee Related
-
2009
- 2009-04-16 WO PCT/FR2009/050713 patent/WO2009138637A1/fr not_active Ceased
- 2009-04-16 CN CN2009801138444A patent/CN102007569B/zh active Active
- 2009-04-16 US US12/736,532 patent/US8356526B2/en active Active
- 2009-04-16 JP JP2011505570A patent/JP5711657B2/ja active Active
- 2009-04-16 KR KR1020107026261A patent/KR101641390B1/ko active Active
- 2009-04-16 EP EP09745956.4A patent/EP2272083B1/fr active Active
- 2009-04-22 TW TW098113318A patent/TWI483330B/zh active
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| JPS641228A (en) * | 1987-06-23 | 1989-01-05 | Toshiba Ceramics Co Ltd | Jig for heat treating wafer |
| US6202318B1 (en) * | 1996-12-13 | 2001-03-20 | Texas Instruments Incorporated | System for processing wafers and cleaning wafer-handling implements |
| US20020029791A1 (en) * | 2000-09-14 | 2002-03-14 | Kenji Matsuoka | Processing apparatus having particle counter and cleaning device, cleaning method, cleanliness diagnosis method and semiconductor fabricating apparatus using the same |
| US20070062561A1 (en) * | 2005-09-19 | 2007-03-22 | International Business Machines Corporation | Method And Apparatus For Testing Particulate Contamination In Wafer Carriers |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014083151A1 (fr) | 2012-11-30 | 2014-06-05 | Adixen Vacuum Products | Station et procede de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs |
| WO2014083152A1 (fr) | 2012-11-30 | 2014-06-05 | Adixen Vacuum Products | Station et procede de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5711657B2 (ja) | 2015-05-07 |
| FR2930675A1 (fr) | 2009-10-30 |
| EP2272083A1 (fr) | 2011-01-12 |
| US20110048143A1 (en) | 2011-03-03 |
| CN102007569B (zh) | 2013-04-17 |
| FR2930675B1 (fr) | 2010-08-20 |
| KR20110010735A (ko) | 2011-02-07 |
| TWI483330B (zh) | 2015-05-01 |
| KR101641390B1 (ko) | 2016-07-29 |
| US8356526B2 (en) | 2013-01-22 |
| TW201007870A (en) | 2010-02-16 |
| JP2011519481A (ja) | 2011-07-07 |
| CN102007569A (zh) | 2011-04-06 |
| EP2272083B1 (fr) | 2016-03-23 |
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