WO2009143132A3 - Appareil et procédé de formation de couches minces par enduction en solution - Google Patents

Appareil et procédé de formation de couches minces par enduction en solution Download PDF

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Publication number
WO2009143132A3
WO2009143132A3 PCT/US2009/044487 US2009044487W WO2009143132A3 WO 2009143132 A3 WO2009143132 A3 WO 2009143132A3 US 2009044487 W US2009044487 W US 2009044487W WO 2009143132 A3 WO2009143132 A3 WO 2009143132A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin layers
solution coating
coating thin
coating
priming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/044487
Other languages
English (en)
Other versions
WO2009143132A2 (fr
Inventor
Charles D. Lang
Tami Janene Faircloth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Priority to US12/992,992 priority Critical patent/US9138771B2/en
Priority to JP2011510642A priority patent/JP5876292B2/ja
Publication of WO2009143132A2 publication Critical patent/WO2009143132A2/fr
Publication of WO2009143132A3 publication Critical patent/WO2009143132A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/555—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids discharged by cleaning nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention porte sur un appareil et sur un procédé destiné à former des couches par enduction en solution d'un substrat de dispositif électronique. Une enduiseuse à filière à fente conjointement à un dispositif d'assistance par le vide est utilisée dans des stations de dépôt d'une couche primaire d'enduction et de nettoyage pour produire des couches minces présentant des avantages de performance par rapport aux technologies concurrentes.
PCT/US2009/044487 2008-05-19 2009-05-19 Appareil et procédé de formation de couches minces par enduction en solution Ceased WO2009143132A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/992,992 US9138771B2 (en) 2008-05-19 2009-05-19 Apparatus and method for solution coating thin layers
JP2011510642A JP5876292B2 (ja) 2008-05-19 2009-05-19 薄層を溶液コーティングするための装置および方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5430608P 2008-05-19 2008-05-19
US61/054,306 2008-05-19

Publications (2)

Publication Number Publication Date
WO2009143132A2 WO2009143132A2 (fr) 2009-11-26
WO2009143132A3 true WO2009143132A3 (fr) 2010-03-04

Family

ID=41340815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/044487 Ceased WO2009143132A2 (fr) 2008-05-19 2009-05-19 Appareil et procédé de formation de couches minces par enduction en solution

Country Status (5)

Country Link
US (1) US9138771B2 (fr)
JP (1) JP5876292B2 (fr)
KR (1) KR20110011695A (fr)
TW (1) TW201016325A (fr)
WO (1) WO2009143132A2 (fr)

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CN102405544B (zh) * 2009-04-22 2015-06-10 丰田自动车株式会社 电池用电极的制造方法以及用于其中的涂布模具
WO2011147523A1 (fr) * 2010-05-27 2011-12-01 Merck Patent Gmbh Formulation et procédé pour la préparation de dispositifs électroniques organiques
KR101212201B1 (ko) * 2010-07-02 2012-12-13 삼성에스디아이 주식회사 활물질 코팅 장치
US8771793B2 (en) 2011-04-15 2014-07-08 Roche Diagnostics Operations, Inc. Vacuum assisted slot die coating techniques
KR101527548B1 (ko) * 2012-05-07 2015-06-09 주식회사 엘지화학 코팅층 형성장치, 이를 사용한 세퍼레이터의 제조방법 및 이로부터 형성된 세퍼레이터를 포함하는 전기화학소자
US9263701B2 (en) * 2013-03-14 2016-02-16 Guardian Industries Corp. Coated article and/or device with optical out-coupling layer stack (OCLS) including vacuum deposited index match layer over scattering matrix, and/or associated methods
US20140319241A1 (en) * 2013-04-30 2014-10-30 Armstrong World Industries, Inc. System and method for humidifying a system for applying a coating to a workpiece
WO2016086192A1 (fr) * 2014-11-26 2016-06-02 Kateeva, Inc. Systèmes de revêtement environnementalement maîtrisés
KR101883770B1 (ko) * 2015-12-31 2018-07-31 율촌화학 주식회사 유기 전계 발광 소자용 화합물, 이를 이용한 유기 전계 발광 소자 및 그 제조 방법
KR101922054B1 (ko) * 2017-04-26 2018-11-26 성안기계 주식회사 가변 매니폴드가 구비된 슬롯 다이 및 그 제어 방법

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US20030116881A1 (en) * 2001-12-19 2003-06-26 Nelson James M. Method of improving coating uniformity
US20050150449A1 (en) * 2002-03-29 2005-07-14 Masafumi Matsunaga Liquid dispensing method and apparatus
WO2007055102A1 (fr) * 2005-11-10 2007-05-18 Ulvac, Inc. Applicateur et procede pour deplacer un liquide de dispersion

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US6475282B1 (en) * 1999-01-08 2002-11-05 Fastar, Ltd. Intelligent control system for extrusion head dispensement
US20030116881A1 (en) * 2001-12-19 2003-06-26 Nelson James M. Method of improving coating uniformity
US20050150449A1 (en) * 2002-03-29 2005-07-14 Masafumi Matsunaga Liquid dispensing method and apparatus
WO2007055102A1 (fr) * 2005-11-10 2007-05-18 Ulvac, Inc. Applicateur et procede pour deplacer un liquide de dispersion

Also Published As

Publication number Publication date
US9138771B2 (en) 2015-09-22
US20110086164A1 (en) 2011-04-14
TW201016325A (en) 2010-05-01
WO2009143132A2 (fr) 2009-11-26
KR20110011695A (ko) 2011-02-08
JP5876292B2 (ja) 2016-03-02
JP2011523891A (ja) 2011-08-25

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