WO2009149153A2 - Allumage de feuilles multicouches réactives dans des ensembles microélectroniques - Google Patents

Allumage de feuilles multicouches réactives dans des ensembles microélectroniques Download PDF

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Publication number
WO2009149153A2
WO2009149153A2 PCT/US2009/046085 US2009046085W WO2009149153A2 WO 2009149153 A2 WO2009149153 A2 WO 2009149153A2 US 2009046085 W US2009046085 W US 2009046085W WO 2009149153 A2 WO2009149153 A2 WO 2009149153A2
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WO
WIPO (PCT)
Prior art keywords
ignition
pad
multilayer foil
reactive multilayer
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/046085
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English (en)
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WO2009149153A3 (fr
Inventor
Michael Baum
Daniel L. Minge
Maureen A. Curran
John Hannafin
Timothy P. Weihs
Ramzi Vincent
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Reactive Nanotechnologies Inc
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Reactive Nanotechnologies Inc
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Publication date
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Publication of WO2009149153A2 publication Critical patent/WO2009149153A2/fr
Publication of WO2009149153A3 publication Critical patent/WO2009149153A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Patent Application Serial No. 61/058,448 filed on June 3, 2008, and which is herein incorporated by reference.
  • the present application is related generally to methods for initiating exothermic reactions in reactive composite materials, and in particular, to electrical ignition of an exothermic reaction in a multilayer reactive composite foil for high speed automation of electric component assembly.
  • Electrical ignition is a simple and consistent method for the activation of reactive multilayer foils or reactive composite materials, as discussed in U.S. Patent Application Publication No. 2005-0142495 A1 to Van Heerden et al., which is hereby incorporated by reference.
  • an electrical ignition strategy localized Ohmic heating of a reactive multilayer foil starts the intermixing of the reactive multilayer foil constituents (e.g. Ni and Al) which then produce an exothermic reaction, generating heat, and forming an intermetallic or ceramic compound (e.g. NiAI).
  • the electrical power required to ignite a reactive multilayer foil is dependent upon the local power density at the point of ignition: concentrating the electrical current to as small a point a possible permits ignition of the reactive multilayer foil with the minimum possible electrical power.
  • reactive multilayer foils are used as a localized heat source for bonding.
  • a reactive multilayer foil can be used to bond electronic components to printed circuit boards.
  • the heat from the exothermic reaction melts adjacent layers of solder or tin or other -?-
  • the fusible layers alloy and wet any non- molten surfaces. As the heat dissipates, the fusible material solidifies forming a bond between the bond pad and the component. When bonding components to printed circuit boards, a problem often arises.
  • a component may be much larger in footprint than the bond pads and contacts beneath it that are to be bonded, making it challenging to reach the reactive multilayer foil underneath the component for purposes of initiating the exothermic reaction. Accordingly, a simple method of conveying electricity to the reactive multilayer foil underneath a component is needed in order to ignite the reactive foil. This method should be robust and able to withstand the electric current necessary to ignite the reactive multilayer foil, while if possible, minimizing the amount of current necessary to ignite the reactive multilayer foil.
  • the method should also be suitable to high-speed automation of electronics assembly and compatible with current manufacturing practices.
  • the present disclosure provides an ignition trace pattern on a printed circuit board for conveying an initiating electrical current to a reactive multilayer foil preform in a bonding region.
  • the ignition trace pattern includes an ignition pad, a remote pad, and an electrical trace.
  • the ignition pad is disposed on the printed circuit board adjacent to, but electrically isolated from, a bond pad in the bonding region on the printed circuit board.
  • the remote pad is disposed outside the bonding region on the printed circuit board to which an electrode may be electrically connected for delivering an initiating electrical current.
  • the electrical trace connecting the remote pad and the ignition pad is configured to conduct an initiating electrical current from the remote pad to the ignition pad.
  • a method of the present disclosure provides for igniting a reactive multilayer foil at a bonding region of a printed circuit board.
  • the printed circuit board includes an ignition trace pattern with an ignition pad disposed in the bonding region, a remote pad disposed outside the bonding region to which an electrode may be electrically connected for delivering an initiating electrical current, and an electrically conductive trace connecting the remote pad and the ignition pad.
  • the method begins by positioning the reactive multilayer foil preform above the ignition pad in the bonding region. A load is applied to said reactive multilayer foil preform to maintain an electrical contact between the reactive multilayer foil preform and the ignition pad.
  • a pulse of electricity is applied to the remote pad.
  • the applied pulse is conducted through the electrically conductive trace to the ignition pad and to the reactive multilayer foil preform.
  • the applied pulse of electricity heats the reactive multilayer foil preform to an ignition point, initiating an exothermic reaction within the reactive multilayer foil preform.
  • An alternative method of the present disclosure provides for bonding an electronic component to a bonding region of a printed circuit board.
  • the printed circuit board includes an ignition trace pattern with an ignition pad disposed in the bonding region, a remote pad disposed outside the bonding region to which an electrode may be electrically connected for delivering an initiating electrical current, and an electrically conductive trace connecting the remote pad and the ignition pad.
  • the method begins by positioning a reactive multilayer foil preform above the ignition pad. Next, a portion of the electronic component is positioned over the reactive multilayer foil preform. A compressive load is applied to hold the component, the reactive multilayer foil preform, and the printed circuit board together in contact in the bonding region.
  • a pulse of electricity is applied to the remote pad and conducted through the electrically conductive trace to the ignition pad and to the reactive multilayer foil preform in contact with the ignition pad.
  • the applied pulse of electricity heats the reactive multilayer foil preform to an ignition point, initiating an ⁇ xoth ⁇ rmic reaction within the multilayer foil preform to melt a fusible layer and bond the component to the printed circuit board.
  • Figure 1 A illustrates a first embodiment of the present disclosure
  • Figure 1 B illustrates a method for implementation the embodiment of the present invention shown in Figure 1 A;
  • Figure 2A illustrates a variation in the shape of the ignition pad
  • Figure 2B illustrates a second variation in the shape of the ignition pad
  • Figure 3 shows an embodiment of the present invention for initiating ignition of multiple sheets of reactive multilayer foil
  • Figure 4 shows another embodiment of the present disclosure
  • Figure 5 illustrates a multilayer ignition pathway of the present disclosure
  • FIG. 6 shows another embodiment of the present disclosure
  • Figure 7 shows an example bonding geometry for bonding an electrical component to a printed circuit board
  • Figure 8 illustrates a variation of the present disclosure for igniting a reactive multilayer foil at multiple points
  • FIG. 9 shows another embodiment of the present disclosure
  • FIG. 10 shows another embodiment of the present disclosure
  • Figure 1 1 A shows another embodiment of the present disclosure
  • Figure 1 1 B shows another embodiment of the present disclosure
  • an ignition trace 10 of the present disclosure comprises an ignition pad 1 1 situated adjacent to, but isolated electrically from, a surface mount bonding pad 12 in a bonding region on a printed circuit board 19.
  • the ignition pad 1 1 is connected electrically, e.g. with an electrically conductive copper connector (trace) 18, to a remote pad 13 a short distance away on the printed circuit board 19.
  • a sheet of reactive multilayer foil preform 14 is placed in overlapping proximity to the pads 1 1 and 12, and the lead, heat slug, or other part 15 of an electronic component 20 to be bonded to the bonding pad 12 is positioned above the reactive multilayer foil preform 14.
  • the ignition pad 1 1 is small (0.05 to 1 mm 2 , limited by the power supply and by manufacturability) to concentrate an electrical current where it enters the reactive multilayer foil preform 14, causing localized heating and ignition in the reactive multilayer foil preform 14, which temporarily melts fusible layers, which ultimately solidify to bond the component part 15 to the bonding pad 12.
  • a compressive pressure or loading is applied to hold the component part 15 against the reactive multilayer foil preform 14, and in turn, the reactive multilayer foil preform 14 against the ignition pad 1 1 and the bonding pad 12.
  • An electrical circuit is made by applying a voltage (e.g. from a power supply 16) to the remote pad 13 with ground electrically connected to the component part 15. Current then passes through the ignition trace 10 (the remote pad 13, connector 18, and ignition pad 1 1 ), the reactive multilayer foil preform 14, to ground.
  • the ground may be connected in such a way that current cannot travel through the circuitry of th ⁇ component 15. For instance, as shown in Figure 1 B, ground is connected to the device 20 being bonded.
  • the circuit could also be connected to ground through the bonding pad 12.
  • the ground may be connected such that the electrical current could travel through the device 20, but the voltage of the ignition pulse is maintained below the activation threshold of the device 20.
  • ignition of the multilayer preform foil may be detected.
  • a high-frequency AC signal may be different depending on whether the reactive multilayer foil has ignited or not, and it may vary with the number of interfaces it passes through.
  • a similar signal may also permit monitoring of the resulting bond quality.
  • the component part 15 bonded to the bonding pad 12 (and ignition pad 1 1 ) may have any of a variety of well known configurations, such as, but not limited to, a gull-wing lead, a flat lead, a j-bend lead, a "leadless leadframe” package contact, a heat slug, a ball in a ball grid array, an end termination, a flat contact, or any other surface mount-suitable shape.
  • the area of the component part 15 in contact with the reactive multilayer foil preform 14 is oriented substantially parallel to the bonding pad 12, to ensure good contact with the reactive multilayer foil preform 14 over an area larger than the contact area between the ignition pad 1 1 and the reactive multilayer foil preform 14.
  • the size (thickness, area) of the different parts of the ignition trace 10, i.e. the ignition pad 1 1 , the connector 18, and the remote pad 13 are selected to ensure a supplied electrical power will ignite the reactive multilayer foil preform 14 without overheating or damaging the trace 18, the pads 1 1 and 13, or the circuit board 19.
  • the shape of the ignition pad 1 1 may be a triangle, or a semi-circle or ellipse, or a rectangle, preferentially with at least one section narrower than the connector 18 between the remote pad 13 and the ignition pad 1 1 . Keeping connector 18 wide reduces the chance that the applied electrical current will overheat and melt the connector instead of igniting the foil preform 14.
  • the ignition pad 1 1 is not limited to a single body, but may instead, as shown in Figure 8, be divided into several smaller traces or bodies within the bonding region.
  • the reactive multilayer foil preform 14 With a divided geometry, alignment of the reactive multilayer foil preform 14 over the isolated pad(s) 1 1 is simplified if the reactive multilayer foil preform 14 is smaller than the bonding pad 12.
  • the foil preform 14 will always be placed over at least one ignition pad 1 1 .
  • Multiple small ignition pads 1 1 on a single trace 10 ensure that the contact area between the reactive multilayer foil preform 14 and the ignition pads 1 1 is small.
  • the small ignition pads 1 1 may be of different lengths or shapes, as seen in Figure 8, to maximize the current density in each ignition pad 1 1 . This embodiment also ensures that if one branch of the ignition trace 10 to the bonding region 12 is damaged, other branches will remain to carry current in the circuit.
  • the ignition trace 10, including the ignition pad 1 1 , the remote pad 13, and the trace 18 may be integrated into the set of electrical traces 21 which are used by the device 20 when in service, such as shown in Figure 2A.
  • the ignition trace 10, including the ignition pad 1 1 , the remote pad 13, and the trace 18, may be isolated from the traces 21 , as shown in Figure 2B.
  • the power is applied to the remote pad in a short electrical pulse.
  • the electrical pulse duration, shape, and intensity are selected to ignite the reactive multilayer material without overheating or damaging the ignition trace 10, the bonding pad 12, the circuit board 19, or the component 20.
  • the applied electrical power may be either DC or AC of any common frequency.
  • a DC pulse between 9OW and 200W or 100A and 200A over 1 to 5 ms is sufficient to ignite many reactive multilayer foil performs 14.
  • a first, small, electric pulse may be applied to the ignition circuit to break down oxides and contaminants on the surfaces of the ignition pad 11 , the preform 14, and the component 20.
  • a second pulse could then be more consistent from bond to bond and could potentially utilize a lower power.
  • the first pulse could further be used to pre-heat the ignition pad 1 1 and the component 20, improving wetting.
  • the surface finish on the pads 1 1 , 12, and 13 may be any common board finish, including but not limited to HASL (hot air solder leveling), immersion tin, immersion silver, gold over nickel, and palladium over nickel.
  • the connector 18 may or may not be covered by an insulating solder mask layer.
  • the ignition pads 11 , remote pads 14, and traces 18 which form the ignition trace 10 may be configured and coupled in a variety of configurations as required without departing from the scope of the invention.
  • multiple ignition pads 11 may be connected in parallel to a single remote pad 14, permitting multiple pieces of reactive multilayer foil preform 14 to be ignited simultaneously by a common applied electrical pulse.
  • multiple ignition traces 10 may be connected in series to one or more remote pads 13, permitting multiple pieces of reactive multilayer foil preform 14 to be ignited simultaneously with less total current than would be required for parallel ignition points.
  • component parts 15a and 15b are electrically connected inside the component 20, such that an electrical pulse applied to one trace 10 is conveyed through component parts 15a and 15b, and any intervening reactive multilayer foil performs 14, to adjacent traces 10.
  • the previous embodiments have each been described in the environment of a planar printed circuit board, those of ordinary skill will recognize that the specific pathway for the ignition trace 10 is not limited to a planar configuration.
  • the electrical connector 18 between the remote pad 13 and the ignition pad 1 1 may be in an adjacent layer 22 of a printed circuit 19.
  • the ignition pad 1 1 could advantageously be located at the center of the bonding pad 12.
  • a a parallel gap welding machine 23 is used to ignite a reactive multilayer foil preform 14 disposed between a bond pad 12 on a printed circuit board 19 and a gull-wing style lead 15 of a component device 20.
  • the positive (23a) and negative (23b) electrodes of the machine 23 are both placed on top of the lead 15 and an electric pulse is sent from the positive electrode 23a through the lead 15 to the negative electrode 23b, igniting the reactive multilayer foil preform 14.
  • a parallel gap welding machine 23 is used to attach (tack) a reactive multilayer foil preform 14 to a bond pad 12 on a printed circuit board 19.
  • Pulse power may be between 50 and 200W over fewer than 10 ms.
  • the parallel gap welding machine 23 may be used to attach (tack) a reactive multilayer foil preform 14 to a part 15 of component 20 as shown in Figure 10. This is accomplished by placing the two electrodes 23a and 23b on the reactive multilayer foil preform which in turn is position in contact with part 15. Using a low power electric pulse, the parallel gap welding machine 23 heats a fusible layer 24 on part 15 directly under the electrodes 23a and 23b enough to melt the fusible layer 24, causing the reactive multilayer foil preform 14 to adhere to part 15. Pulse power may be between 50and 200W over fewer than 10ms.
  • FIG. 1 1 A is a top view of the printed circuit board 19 with a bonding pad 12 covered by reactive multilayer foil preforms 14.
  • the preforms 14 have been attached (tacked) to the bonding pad 12 using the embodiments described above.
  • a separate component 25 may be disposed inside the perimeter of the EMI shield.
  • the shield 20 is shown above preforms 14. The shield is pressed against the reactive multilayer foil preform 14 and the mounting pad 12.
  • the reactive multilayer foil preforms 14 are then ignited, using any method known in the art, including the methods described above.
  • the shield may be any electronic component for which it is convenient to attach reactive multilayer foil preforms to either the printed circuit board 19 or the component 20 before igniting the reactive multilayer foil preform 14.
  • the following example are illustrative of applications of the present disclosure, and are not intended as limiting in any way.
  • Example 1 A light emitting diode (LED) in a surface mount package with two tin-plated gull-wing style leads and center tin-plated copper thermal slug was bonded to a metal core printed circuit board (MCPCB) on which the copper traces and pads were 35 ⁇ m thick (1 oz. per square foot) and coated with a layer of tin 1 -2 ⁇ m thick.
  • the reactive multilayer foil used comprised aluminum and nickel layers and was 40 ⁇ m thick. The surfaces of the reactive multilayer foil were coated with Incusil® braze alloy.
  • a side view is shown in Figure 7 while the shapes of the ignition pads 1 1 on the MCPCB are shown in Figure 1 A.
  • the center slug pad 54/55b was 4mm in diameter and the lead pads 54/55a were 1 .2mm x 2mm.
  • the reactive multilayer foil preforms 51 a and 51 b were slightly smaller than the pads.
  • the ignition areas 1 1 were approximately 0.1 mm 2 .
  • the reactive multilayer foil ignited when an electric pulse was used wherein the current rose to 15OA in 1 ms and then was level for 4ms.
  • the foil also ignited with a similar pulse that was stopped after 0.5ms.
  • the current could vary from 120 to 180A and the power from 9OW to 150W.
  • a typical pulse shape had a 3ms rise time, 2ms weld time, and 2ms decrease time. Consistency (ignition of many preforms at the same low current and power) improves with cleanliness of the preforms.
  • Example 2 Using the same reactive multilayer foil, the same LED was bonded to a single-layer FR4 printed circuit board.
  • the thickness of the copper used for the traces and pads on the PCB was 35 ⁇ m (1 oz per square foot) and the pads were lead-free HASL-coated to a thickness of about 7 ⁇ m.
  • the ignition trace geometry was identical to Example 1. Using 5ms square pulses, the foil ignited with 130 to 200A to produce the desired bond.
  • Example 3 (Tacking) A reactive multilayer foil preform was tacked to a bonding pad on a MCPCB. The Ni/AI foil was 40 ⁇ m thick with a layer of Incusil® on each surface.
  • the pad was 1 oz copper (35 ⁇ m thick) with immersion tin on the surface 2 ⁇ m thick.
  • the welding electrodes were copper clad molybdenum, 0.51 mm wide by 0.81 mm thick, spaced 0.021 inches apart.
  • the electric pulse used was 135W DC, with a 2ms rise time, 5ms weld time, 5ms decrease time, 200ms compression, with 8.125lbs of force.
  • Example 4 (Gap welding) Reactive foil preforms were tacked to bonding pads of a MCPCB as described in Example 3. Leads of an LED as described in Example 1 were bonded to the pads by use of a parallel gap welder. The two electrodes were placed on one lead as shown in Figure 6. The pulse profile was as follows: 2ms rise time to 9OW, 5ms weld time, no decrease time. A force of 10.5lbs was applied.
  • the present disclosure can be embodied in-part in the form of computer- implemented processes and apparatuses for practicing those processes.
  • the present disclosure can also be embodied in-part in the form of computer program code containing instructions embodied in tangible media, such as floppy diskettes, CD-ROMs, hard drives, or an other computer readable storage medium, wherein, when the computer program code is loaded into, and executed by, an electronic device such as a computer, micro-processor or logic circuit, the device becomes an apparatus for practicing the present disclosure.
  • the present disclosure can also be embodied in-part in the form of computer program code, for example, whether stored in a storage medium, loaded into and/or executed by a computer, or transmitted over some transmission medium, such as over electrical wiring or cabling, through fiber optics, or via electromagnetic radiation, wherein, when the computer program code is loaded into and executed by a computer, the computer becomes an apparatus for practicing the present disclosure.
  • computer program code segments configure the microprocessor to create specific logic circuits.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention porte sur un motif de tracé d'allumage (10) sur une carte de circuits imprimés (19) pour transporter un courant électrique d'initiation vers une préforme de feuille multicouche réactive (14) dans une région de liaison. Le tracé d'allumage (10) comprend une pastille d'allumage (11) disposée sur la carte de circuits imprimés (19) adjacente à, mais électriquement isolée de, une pastille de liaison (12) dans la région de liaison sur la carte de circuits imprimés (19), une pastille distante (13) disposée à l'extérieur de la région de liaison sur la carte de circuits imprimés (19) à laquelle une électrode (16) peut être électriquement connectée pour distribuer un courant électrique d'initiation, et une piste conductrice (18) connectant la pastille distante (13) et la pastille d'allumage (11). La piste conductrice (18) est configurée pour conduire un courant électrique d'initiation de la pastille distante (13) à la pastille d'allumage (11) et dans toutes préformes de feuille multicouche réactive adjacentes (14) en contact électrique avec la pastille d'allumage (11) dans la région de liaison.
PCT/US2009/046085 2008-06-03 2009-06-03 Allumage de feuilles multicouches réactives dans des ensembles microélectroniques Ceased WO2009149153A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5844808P 2008-06-03 2008-06-03
US61/058,448 2008-06-03

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WO2009149153A2 true WO2009149153A2 (fr) 2009-12-10
WO2009149153A3 WO2009149153A3 (fr) 2010-03-11

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CN103311139A (zh) * 2012-03-13 2013-09-18 波音公司 通过同时发生电流脉冲利用放热反应使组件相互结合
US10486405B2 (en) * 2018-01-16 2019-11-26 U.S. Department Of Energy Nanomaterial assisted bonding method to produce curved surfaces
WO2020056053A1 (fr) * 2018-09-13 2020-03-19 Fujifilm Sonosite, Inc. Système de montage de carte électronique
DE102024202866A1 (de) * 2024-03-26 2025-10-02 Zf Friedrichshafen Ag Verfahren zum Herstellen eines Bauteils, Bauteilanordnung und Bauteil

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KR100322177B1 (ko) * 1993-12-27 2002-05-13 이누이 도모지 내연기관용점화장치
SG119185A1 (en) * 2003-05-06 2006-02-28 Micron Technology Inc Method for packaging circuits and packaged circuits

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103311139A (zh) * 2012-03-13 2013-09-18 波音公司 通过同时发生电流脉冲利用放热反应使组件相互结合
EP2639826A3 (fr) * 2012-03-13 2015-07-01 The Boeing Company Collage de composants utilisant de réactions exothermiques par des impulsions de courant simultanées
US10486405B2 (en) * 2018-01-16 2019-11-26 U.S. Department Of Energy Nanomaterial assisted bonding method to produce curved surfaces
WO2020056053A1 (fr) * 2018-09-13 2020-03-19 Fujifilm Sonosite, Inc. Système de montage de carte électronique
US10802547B2 (en) 2018-09-13 2020-10-13 Fujifilm Sonosite, Inc. Electronics board mounting system
US11231751B2 (en) 2018-09-13 2022-01-25 Fujifilm Sonosite, Inc. Electronics board mounting system
US11782484B2 (en) 2018-09-13 2023-10-10 Fujifilm Sonosite, Inc. Electronics board mounting system
DE102024202866A1 (de) * 2024-03-26 2025-10-02 Zf Friedrichshafen Ag Verfahren zum Herstellen eines Bauteils, Bauteilanordnung und Bauteil

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