WO2010006876A3 - Wärmeüberträger für ein thermoelektrisches dünnschichtelement - Google Patents

Wärmeüberträger für ein thermoelektrisches dünnschichtelement Download PDF

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Publication number
WO2010006876A3
WO2010006876A3 PCT/EP2009/057692 EP2009057692W WO2010006876A3 WO 2010006876 A3 WO2010006876 A3 WO 2010006876A3 EP 2009057692 W EP2009057692 W EP 2009057692W WO 2010006876 A3 WO2010006876 A3 WO 2010006876A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin layer
heat exchanger
layer element
thermoelectric thin
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/057692
Other languages
English (en)
French (fr)
Other versions
WO2010006876A2 (de
Inventor
Michael Bisges
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OFlexx Technologies GmbH
Original Assignee
OFlexx Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OFlexx Technologies GmbH filed Critical OFlexx Technologies GmbH
Priority to CN200980127509XA priority Critical patent/CN102089894B/zh
Priority to US12/988,441 priority patent/US8763680B2/en
Priority to ES09779853T priority patent/ES2427769T3/es
Priority to EP09779853.2A priority patent/EP2245677B1/de
Priority to JP2011517838A priority patent/JP5331881B2/ja
Publication of WO2010006876A2 publication Critical patent/WO2010006876A2/de
Publication of WO2010006876A3 publication Critical patent/WO2010006876A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

Die Erfindung betrifft einen Wärmeüberträger für mindestens ein thermoelektrisches Dünnschichtelement mit einer heißen und einer kalten Seite, die jeweils an gegenüberliegenden Längsseiten des Dünnschichtelementes angeordnet sind, wobei die heiße Seite mit einem Ankopplungselement an eine Wärmequelle und die kalte Seite mit einer Wärmesenke verbunden ist. Ausgehend von diesem Stand der Technik liegt der Erfindung die Aufgabe zu Grunde, einen Wärmeüberträger zu schaffen, der eine einfache und wirksame Verbindung mit dem thermoelektrischen Dünnschichtelement ermöglicht und den Wirkungsgrad des eingesetzten thermoelektrischen Dünnschichtelementes verbessert. Die Lösung dieser Aufgabe basiert auf dem Gedanken, die insbesondere flexiblen Dünnschichtelemente zwischen dem Ankopplungselement und der Wärmesenke des Wärmeüberträgers aufzuspannen und die Lasten zwischen Ankopplungselement und Wärmesenke über eine insbesondere thermisch isolierende Tragstruktur abzutragen.
PCT/EP2009/057692 2008-07-14 2009-06-19 Wärmeüberträger für ein thermoelektrisches dünnschichtelement Ceased WO2010006876A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN200980127509XA CN102089894B (zh) 2008-07-14 2009-06-19 用于热电薄层元件的换热器
US12/988,441 US8763680B2 (en) 2008-07-14 2009-06-19 Heat exchange for a thermoelectric thin film element
ES09779853T ES2427769T3 (es) 2008-07-14 2009-06-19 Intercambiador de calor para un elemento de capa fina termoeléctrico
EP09779853.2A EP2245677B1 (de) 2008-07-14 2009-06-19 Wärmeüberträger für ein thermoelektrisches dünnschichtelement
JP2011517838A JP5331881B2 (ja) 2008-07-14 2009-06-19 熱電気薄膜素子用熱伝導装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008032856.1 2008-07-14
DE102008032856A DE102008032856A1 (de) 2008-07-14 2008-07-14 Wärmeüberträger für ein thermoelektrisches Dünnschichtelement

Publications (2)

Publication Number Publication Date
WO2010006876A2 WO2010006876A2 (de) 2010-01-21
WO2010006876A3 true WO2010006876A3 (de) 2010-05-06

Family

ID=41382102

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/057692 Ceased WO2010006876A2 (de) 2008-07-14 2009-06-19 Wärmeüberträger für ein thermoelektrisches dünnschichtelement

Country Status (7)

Country Link
US (1) US8763680B2 (de)
EP (1) EP2245677B1 (de)
JP (1) JP5331881B2 (de)
CN (1) CN102089894B (de)
DE (1) DE102008032856A1 (de)
ES (1) ES2427769T3 (de)
WO (1) WO2010006876A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010022668B4 (de) * 2010-06-04 2012-02-02 O-Flexx Technologies Gmbh Thermoelektrisches Element und Modul umfassend mehrere derartige Elemente
WO2014135600A1 (de) 2013-03-06 2014-09-12 O-Flexx Technologies Gmbh Trägerelement und modul
US10978313B2 (en) 2018-02-20 2021-04-13 International Business Machines Corporation Fixture facilitating heat sink fabrication

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3212275A (en) * 1964-08-20 1965-10-19 American Radiator & Standard Thermoelectric heat pump
DE10122679A1 (de) * 2001-05-10 2002-12-12 Infineon Technologies Ag Thermoelement, Thermoelement-Anordnung, Elektronisches Gerät und Textilelement
EP1287566A1 (de) * 2000-05-02 2003-03-05 Gerhard Span Thermoelektrisches element
US20030066554A1 (en) * 2001-10-05 2003-04-10 Steven Feher Modular thermoelectric couple and stack
US20060151021A1 (en) * 2003-05-19 2006-07-13 Ingo Stark Low power thermoelectric generator
US20070256427A1 (en) * 2003-07-25 2007-11-08 Kabushiki Kaisha Toshiba Thermoelectric device
DE102006031164A1 (de) * 2006-07-04 2008-01-10 O-Flexx Technologies Gmbh Thermoelektrisches Dünnschichtelement sowie Verfahren zu dessen Herstellung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB929282A (en) * 1958-10-29 1963-06-19 Gen Electric Co Ltd Improvements in or relating to thermoelectric devices
US5260344A (en) * 1992-03-13 1993-11-09 Asahi Glass Company, Ltd. Open cell rigid isocyanurate foams and method for producing the same and vacuum heat insulating layer by use of the same
JPH05327033A (ja) * 1992-05-15 1993-12-10 Hitachi Ltd 熱電変換素子及び熱電発電装置
JPH09196505A (ja) * 1996-01-22 1997-07-31 Zexel Corp 熱電装置
US8907323B2 (en) * 2002-04-23 2014-12-09 Philip D. Freedman Microprocessor assembly
US6958443B2 (en) * 2003-05-19 2005-10-25 Applied Digital Solutions Low power thermoelectric generator
CA2549826C (en) * 2003-12-02 2014-04-08 Battelle Memorial Institute Thermoelectric devices and applications for the same
US7032389B2 (en) * 2003-12-12 2006-04-25 Thermoelectric Design, Llc Thermoelectric heat pump with direct cold sink support

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3212275A (en) * 1964-08-20 1965-10-19 American Radiator & Standard Thermoelectric heat pump
EP1287566A1 (de) * 2000-05-02 2003-03-05 Gerhard Span Thermoelektrisches element
DE10122679A1 (de) * 2001-05-10 2002-12-12 Infineon Technologies Ag Thermoelement, Thermoelement-Anordnung, Elektronisches Gerät und Textilelement
US20030066554A1 (en) * 2001-10-05 2003-04-10 Steven Feher Modular thermoelectric couple and stack
US20060151021A1 (en) * 2003-05-19 2006-07-13 Ingo Stark Low power thermoelectric generator
US20070256427A1 (en) * 2003-07-25 2007-11-08 Kabushiki Kaisha Toshiba Thermoelectric device
DE102006031164A1 (de) * 2006-07-04 2008-01-10 O-Flexx Technologies Gmbh Thermoelektrisches Dünnschichtelement sowie Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
EP2245677B1 (de) 2013-07-10
US8763680B2 (en) 2014-07-01
US20110030917A1 (en) 2011-02-10
JP2011528178A (ja) 2011-11-10
ES2427769T3 (es) 2013-10-31
JP5331881B2 (ja) 2013-10-30
CN102089894A (zh) 2011-06-08
WO2010006876A2 (de) 2010-01-21
EP2245677A2 (de) 2010-11-03
CN102089894B (zh) 2013-05-08
DE102008032856A1 (de) 2010-01-28

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