WO2010049211A1 - Ensemble de capteurs pour la mesure de pression différentielle - Google Patents

Ensemble de capteurs pour la mesure de pression différentielle Download PDF

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Publication number
WO2010049211A1
WO2010049211A1 PCT/EP2009/062005 EP2009062005W WO2010049211A1 WO 2010049211 A1 WO2010049211 A1 WO 2010049211A1 EP 2009062005 W EP2009062005 W EP 2009062005W WO 2010049211 A1 WO2010049211 A1 WO 2010049211A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor element
sensor
pressure
membrane
sensor arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/062005
Other languages
German (de)
English (en)
Inventor
Eric Ochs
Sascha Goetzl
Frieder Haag
Eckart Schellkes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2010049211A1 publication Critical patent/WO2010049211A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Definitions

  • the invention relates to a sensor arrangement for measuring differential pressure with at least one first micromechanical sensor element, in whose front side a first pressure-sensitive membrane is formed, and with a mold housing for the sensor element, wherein in the mold housing at least one opening for pressurization is formed.
  • German Laid-Open Specification DE 10 2005 038 443 A1 describes such a sensor arrangement.
  • the micromechanical sensor element is here mounted on a carrier and embedded together with the carrier in a mold housing.
  • the sensor element is mounted on the support so that the active region of the sensor element, i. the region in which the pressure-sensitive membrane is formed protrudes laterally beyond the carrier.
  • an opening is formed in the mold housing, into which projects the active region of the sensor element and also takes place via the pressurization of the membrane.
  • the known sensor arrangement has proven itself in practice, in particular for absolute pressure measurements with sensor elements, whose
  • Membrane is formed in the front of the sensor element over a closed back cavern.
  • differential pressure sensing sensor elements with a pressure-sensitive membrane, which can be pressurized on both sides with pressure.
  • the membrane is usually in formed the front.
  • the back pressure is usually via a narrow channel, which has been generated by known methods, such as by KOH etching or Trenchen, in the back of the sensor element.
  • KOH etching or Trenchen a narrow channel
  • particles can settle in this narrow channel or it can lead to icing of the channel, which can ultimately lead to breakage of the membrane.
  • such sensor elements are provided in practice with a complicated scrubnetung.
  • Absolute pressure sensors to detect the differential pressure then determined by appropriate interconnection of the measurement signals electrically.
  • the measurement accuracy of these two-chip differential pressure sensors depends essentially on the thermal coupling of the two sensor elements, since the measurement signals of the individual absolute pressure sensors are highly temperature-dependent.
  • a sensor arrangement for differential pressure measurement is proposed, which is simple in construction, robust in the application and reliable in the measured value acquisition.
  • the sensor arrangement according to the invention for differential pressure measurement comprises a first and a second micromechanical sensor element in whose
  • Front is formed in each case a pressure-sensitive membrane.
  • the two sensor elements are connected to each other via their backs.
  • This composite is embedded in a mold housing such that the membrane of the first sensor element can be acted upon by a first measuring pressure and the membrane of the second sensor element can be acted upon by a second measuring pressure.
  • circuit-technical means for determining the difference between the first and second measuring pressures are provided.
  • the composite of the two sensor elements can be embedded very well in a mold housing with pressure connections. Since mold housings with a wide variety of geometries can be produced in a simple manner and also offer good protection against mechanical influences and a chemically aggressive measuring environment, the inventive sensor arrangement can be configured very well for use in special applications by appropriate design of the mold housing.
  • the sensor arrangement according to the invention can be realized with different sensor elements, as long as a back-side bond can be established between the two sensor elements and an independent measuring pressure detection is ensured.
  • a combination of two absolute-pressure sensor elements fabricated in surface micromechanics (OMM) proves to be advantageous with regard to reliable measuring pressure detection, in which the membrane in each case spans a closed cavity in the layer structure of the sensor element.
  • OMM surface micromechanics
  • the bond between the two sensor elements can be realized simply by adhesive bonding.
  • a thermally good conductive adhesive should be used to achieve the best possible thermal coupling between the two sensor elements.
  • first and the second sensor element also have a substantially identical dimensioning and sensor structure and are constructed from the same semiconductor materials. As a result, it can be ensured that thermal influences on the sensor arrangement also have the same effect on the two sensor elements.
  • the sensor arrangement according to the invention also includes other combinations of sensor elements. may include. It would also be possible, for example, to combine a first sensor element implemented in OMM, the membrane of which spans a closed cavity in the layer structure, with a second sensor element realized in microelectromechanical technology, the membrane of which spans a cage in the rear side. In this case, however, the bond between the two sensor elements must be produced by bonding in order to seal off the cavern of the second sensor element in a pressure-tight manner and thus to ensure independent measurement pressure detection.
  • the composite of the first and second sensor element is mounted on a support via a pressure connection opening in this carrier.
  • the known from semiconductor flip-chip mounting technology can be used.
  • at least a portion of the carrier is integrated into the mold housing.
  • a complete sensor module for determining the differential pressure can be created simply by arranging not only the composite of the sensor elements but also the circuit-technical means for determining the difference between the first and second measuring pressures on the carrier and integrating them with the corresponding carrier section into the mold housing.
  • FIGURE shows a schematic sectional view through a sensor arrangement 10 according to the invention.
  • the sensor assembly 10 shown in the single figure is used for differential pressure measurement.
  • the sensor arrangement 10 comprises two micromechanical sensor elements 1 and 2 for absolute pressure measurement and circuit technology
  • the sensor elements 1 and 2 are arranged together with the circuitry means 3 in a mold housing 4 with two independent pressure port openings 5 and 6.
  • the sensor structure of both sensor elements 1 and 2 comprises a pressure-sensitive membrane 1 1 or 12 which spans a closed cavity 13 or 14 in the layer structure of the sensor element 1 or 2.
  • these sensor structures were generated in OMM. Accordingly, the two membranes 1 1 and 12 respectively in the front of the sensor element 1 and 2 are formed.
  • the two sensor elements 1 and 2 are interconnected via their rear sides, so that the two membranes 11 and 12 are arranged opposite each other. Since the geometry and dimensioning as well as the layer structure of the two sensor structures are essentially identical, the combination of the two sensor elements 1 and 2 is mirror-symmetrical here. In addition, thermal influences thereby affect in the same way on the sensor structures and thus the measurement signals of the two sensor elements 1 and 2. In order to achieve the best possible thermal coupling between the two sensor structures, a thermally well conductive adhesive 15 was used to produce the composite.
  • the composite of the two sensor elements 1 and 2 is mounted in flip-chip technology on a support 16 which has a pressure connection opening 17.
  • the membrane 1 1 of the carrier 16 facing sensor element 1 is positioned above this pressure port opening 17 in the carrier 16.
  • the circuit-technical means for determining a differential pressure are here realized in the form of an ASIC 3, which is likewise arranged on the carrier 16 and is connected via wire bonds 18 to the sensor elements 1 and 2.
  • the combination of the two sensor Elements 1 and 2 were embedded together with the ASIC 3 and the wire bonds 18 in the molding compound 19 of the housing 4.
  • the pressure port openings 5 and 6 were formed for the membranes 1 1 and 12 by using the film-molding technique.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

La présente invention vise à créer un ensemble de capteurs pour la mesure de pression différentielle, de construction simple, robuste à l'usage et fiable dans la détection des valeurs de mesure. À cet effet, l'ensemble de capteurs (10) selon l'invention comprend un premier et un deuxième élément capteur micromécanique (1, 2) dont chaque face antérieure comporte une membrane sensible à la pression (11, 12). Les deux éléments capteurs (1, 2) sont reliés entre eux par leurs faces postérieures. Cet objet composite est noyé dans un boîtier moulé (4) afin que la membrane (11) du premier élément capteur (1) puisse être exposée à une première pression de mesure, et la membrane (12) du deuxième élément capteur (2), à une deuxième pression de mesure. Il est prévu en outre des moyens de circuiterie (3) destinés à déterminer la différence entre la première et la deuxième pression de mesure.
PCT/EP2009/062005 2008-10-29 2009-09-16 Ensemble de capteurs pour la mesure de pression différentielle Ceased WO2010049211A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008043271A DE102008043271A1 (de) 2008-10-29 2008-10-29 Sensoranordnung zur Differenzdruckmessung
DE102008043271.7 2008-10-29

Publications (1)

Publication Number Publication Date
WO2010049211A1 true WO2010049211A1 (fr) 2010-05-06

Family

ID=41323571

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/062005 Ceased WO2010049211A1 (fr) 2008-10-29 2009-09-16 Ensemble de capteurs pour la mesure de pression différentielle

Country Status (2)

Country Link
DE (1) DE102008043271A1 (fr)
WO (1) WO2010049211A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2584332A1 (fr) * 2011-10-19 2013-04-24 Baumer Bourdon Haenni SAS Capteur de pression
DE102012209235B4 (de) 2012-05-31 2023-08-10 Robert Bosch Gmbh Sensormodul mit zwei mikromechanischen Sensorelementen

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012203135B4 (de) * 2012-02-29 2020-11-12 Robert Bosch Gmbh Mikromechanische Sensoranordnung und ein entsprechendes Herstellungsverfahren sowie entsprechende Verwendung
DE102020210130A1 (de) 2020-08-11 2022-02-17 Robert Bosch Gesellschaft mit beschränkter Haftung Chip-Anordnung; Verfahren zur Herstellung einer Chip-Anordnung; Verfahren zum Betreiben einer Chip-Anordnung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437189A (en) * 1994-05-03 1995-08-01 Motorola, Inc. Dual absolute pressure sensor and method thereof
US6550339B1 (en) * 1999-05-06 2003-04-22 Denso Corporation Pressure sensor for detecting differential pressure between two spaces

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005038443A1 (de) 2005-08-16 2007-02-22 Robert Bosch Gmbh Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437189A (en) * 1994-05-03 1995-08-01 Motorola, Inc. Dual absolute pressure sensor and method thereof
US6550339B1 (en) * 1999-05-06 2003-04-22 Denso Corporation Pressure sensor for detecting differential pressure between two spaces

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2584332A1 (fr) * 2011-10-19 2013-04-24 Baumer Bourdon Haenni SAS Capteur de pression
DE102012209235B4 (de) 2012-05-31 2023-08-10 Robert Bosch Gmbh Sensormodul mit zwei mikromechanischen Sensorelementen

Also Published As

Publication number Publication date
DE102008043271A1 (de) 2010-05-06

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