WO2010090432A3 - 베이스 블록을 구비한 히트파이프 및 이를 제조하는 방법 - Google Patents

베이스 블록을 구비한 히트파이프 및 이를 제조하는 방법 Download PDF

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Publication number
WO2010090432A3
WO2010090432A3 PCT/KR2010/000646 KR2010000646W WO2010090432A3 WO 2010090432 A3 WO2010090432 A3 WO 2010090432A3 KR 2010000646 W KR2010000646 W KR 2010000646W WO 2010090432 A3 WO2010090432 A3 WO 2010090432A3
Authority
WO
WIPO (PCT)
Prior art keywords
base block
heat pipe
hole
manufacturing same
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/000646
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English (en)
French (fr)
Other versions
WO2010090432A2 (ko
Inventor
박상웅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zalman Tech Co Ltd
Original Assignee
Zalman Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zalman Tech Co Ltd filed Critical Zalman Tech Co Ltd
Publication of WO2010090432A2 publication Critical patent/WO2010090432A2/ko
Publication of WO2010090432A3 publication Critical patent/WO2010090432A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 베이스 블록을 구비한 히트파이프 및 이의 제조방법에 관한 것이다. 베이스 블록을 구비한 히트파이프는, 발열부품에 접하도록 장착되는 베이스 블록; 상기 베이스 블록에 형성되되, 단면이 일정하게 횡 방향으로 연장 형성된 적어도 하나의 구멍; 상기 구멍의 단면과 동일한 내부 단면 형상을 가지고, 상기 구멍의 입구에 그 일측단부가 결합되고 그 타측단부는 밀봉되어 형성된 관형부재; 및 상기 관형부재의 내측면과 상기 구멍의 내측면에 형성된 윅을 포함하여 구성된 것을 특징으로 한다.
PCT/KR2010/000646 2009-02-04 2010-02-03 베이스 블록을 구비한 히트파이프 및 이를 제조하는 방법 Ceased WO2010090432A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090008859A KR20100089553A (ko) 2009-02-04 2009-02-04 베이스 블록을 구비한 히트파이프 및 이를 제조하는 방법
KR10-2009-0008859 2009-02-04

Publications (2)

Publication Number Publication Date
WO2010090432A2 WO2010090432A2 (ko) 2010-08-12
WO2010090432A3 true WO2010090432A3 (ko) 2010-11-04

Family

ID=42542496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000646 Ceased WO2010090432A2 (ko) 2009-02-04 2010-02-03 베이스 블록을 구비한 히트파이프 및 이를 제조하는 방법

Country Status (2)

Country Link
KR (1) KR20100089553A (ko)
WO (1) WO2010090432A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201213760A (en) * 2010-09-23 2012-04-01 Gao-De Cai Heat dissipation device with multiple heat pipes
FR3043764B1 (fr) * 2015-11-16 2018-01-05 Airbus Defence And Space Sas Dispositif d'echange thermique pour satellite artificiel, mur et assemblage de murs comprenant un tel dispositif d'echange thermique
CN106879166A (zh) * 2017-03-06 2017-06-20 华南理工大学 一种具有热管散热结构的印刷电路板及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000130972A (ja) * 1998-10-21 2000-05-12 Furukawa Electric Co Ltd:The 板型ヒートパイプとその製造方法
KR200319218Y1 (ko) * 2003-04-19 2003-07-07 (주)프라임테크 진동세관 히트파이프형 냉각장치
KR20030065686A (ko) * 2002-01-30 2003-08-09 삼성전기주식회사 히트 파이프 및 그 제조 방법
KR20040019150A (ko) * 2002-08-26 2004-03-05 (주) 대홍기업 평판형 히트파이프와 히트싱크

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000130972A (ja) * 1998-10-21 2000-05-12 Furukawa Electric Co Ltd:The 板型ヒートパイプとその製造方法
KR20030065686A (ko) * 2002-01-30 2003-08-09 삼성전기주식회사 히트 파이프 및 그 제조 방법
KR20040019150A (ko) * 2002-08-26 2004-03-05 (주) 대홍기업 평판형 히트파이프와 히트싱크
KR200319218Y1 (ko) * 2003-04-19 2003-07-07 (주)프라임테크 진동세관 히트파이프형 냉각장치

Also Published As

Publication number Publication date
KR20100089553A (ko) 2010-08-12
WO2010090432A2 (ko) 2010-08-12

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