WO2010096355A2 - Système de refroidissement utilisant de multiples plaques froides - Google Patents

Système de refroidissement utilisant de multiples plaques froides Download PDF

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Publication number
WO2010096355A2
WO2010096355A2 PCT/US2010/024219 US2010024219W WO2010096355A2 WO 2010096355 A2 WO2010096355 A2 WO 2010096355A2 US 2010024219 W US2010024219 W US 2010024219W WO 2010096355 A2 WO2010096355 A2 WO 2010096355A2
Authority
WO
WIPO (PCT)
Prior art keywords
cold plate
cooling system
devices
cold
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2010/024219
Other languages
English (en)
Other versions
WO2010096355A3 (fr
Inventor
Tim Louvar
Scott Gill
Dale Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parker Hannifin Corp
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Publication of WO2010096355A2 publication Critical patent/WO2010096355A2/fr
Publication of WO2010096355A3 publication Critical patent/WO2010096355A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/022—Evaporators with plate-like or laminated elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/01—Geometry problems, e.g. for reducing size

Definitions

  • the present invention relates to cooling of electrical and electronic components, and more particularly, to a cold plate subassembly used in a liquid refrigerant cooling system wherein the cold plate subassembly comprises multiple cold plate/evaporators in thermal contact with the electrical or electronic component to be cooled and in thermal conductive contact with each other.
  • One method for removing heat from components when direct air- cooling is not possible uses a single-phase fluid which is pumped to a cold plate.
  • the cold plate typically has a serpentine tube attached to a flat metal plate.
  • the component to be cooled is thermally attached to the flat plate and a pumped single-phase fluid flowing through the tube removes the heat generated by the component.
  • Vapor compression refrigeration cycles are designed so as not to return any liquid refrigerant to the compressor which may cause physical damage to the compressor and shorten its life by diluting its lubricating oil.
  • the thermal load can be highly variable, causing unevaporated refrigerant to exit the cold plate and enter the compressor. This can cause damage and shorten the life of the compressor. This is yet another disadvantage of vapor compression cooling of components.
  • At least one embodiment of the invention provides a cooling system comprising: a single component generating heat and required to be cooled; at least two cold plate evaporator devices, each in thermal contact with the component and in direct conductive contact with each other; a liquid refrigerant pump; a vaporizable refrigerant circulated by the liquid refrigerant pump to the at least two cold plate evaporator devices, whereby the refrigerant is at least partially evaporated by the heat generated by the component, creating a vapor; a condenser for condensing the partially evaporated refrigerant vapor, creating a single liquid phase; and a conduit for the vaporizable refrigerant to move between the at least two cold plate evaporator devices, condenser, and liquid refrigerant pump.
  • At least one embodiment of the invention provides a cold plate subassembly for cooling an electronic component, the subassembly comprising: at least two cold plate evaporator devices, each cold plate in direct conductive contact with an adjacent cold plate effectively forming a single heat transfer plate contacting the single component generating heat; wherein the at least two cold plate evaporator devices are mounted to a single base plate; wherein the at least two cold plate devices are fluidly connected in series.
  • FIG. 1 is a schematic diagram of a prior art vaporizable dielectric cooling system
  • FIG. 2 is a schematic diagram of an embodiment of the vaporizable dielectric cooling system of the present invention.
  • FIG. 3 is a schematic diagram of an embodiment of the vaporizable dielectric cooling system of the present invention.
  • FIG. 1 An embodiment of the vaporizable dielectric cooling system of the present invention is shown in FIG. 1.
  • the system 10 comprises a pump 12, an evaporator in the form of a cold plate subassembly 18, and a condenser 28, the components connected to each other by various fluid conduits 26.
  • the cooling system 10 operates isothermally, since it uses change of phase to remove heat rather than the sensible heat capacity of a liquid coolant. This allows for cooler temperatures at the evaporator and cooler components than a single-phase liquid system. Low liquid flow rates are achieved through the evaporation of the working fluid to remove heat, keeping the fluid velocities low and the pumping power very low for the heat removed.
  • cooling system 110 circulates any suitable vaporizable refrigerant, such as R-134a.
  • the cooling cycle can begin at liquid pump 12, shown as a Hermetic Liquid Pump.
  • Pump 12 pumps the liquid phase refrigerant to a cold plate subassembly 18, comprising a plurality of cold plates 37A, 37B, 37C, as best shown in FIG. 2.
  • Each cold plate 37A, 37B, 37C is in thermal contact with an electrical or electronic component or components to be cooled, causing the liquid refrigerant to evaporate at system pressure. None, some, or all of the liquid refrigerant may evaporate at cold plates 37A, 37B, 37C, depending on how much heat is being generated by the particular component.
  • FIGS. 2 and 3 an embodiment of the cold plate subassembly 18 of the present invention is shown which comprises an inlet tube 31 to a first cold plate 37A which comprises a cold plate cavity housing 34, a cold plate fin pack 36 positioned in the cavity of the housing 34 and a cold plate lid 38 enclosing and sealing the cavity of the housing 34.
  • a transfer tube 32 forms an outlet from the first cold plate 37A and serves as an inlet to the adjacent second cold plate 37B.
  • a third cold plate 37C adjacent the second cold plate 37B receives refrigerant from a second transfer tube 32. Refrigerant exits the cold plate subassembly 18 through outlet 39.
  • the number of cold plates may be two or more cold plates positioned adjacent to each other and in direct conductive contact with an adjacent cold plate. While the cold plates 37A, 37B, 37C of the subassembly 18 are shown in series, it is contemplated that cold plate subassembly 18 can be configured with a plurality of cold plates in parallel.
  • the cold plates 37A, 37B, 37C may be attached to a base plate 35 using suitable fasteners and mounting holes 33.
  • the cold plates 37A, 37B, 37C are in direct contact with their respective adjacent cold plates while positioned in base plate 35.
  • the direct contact allows conduction between cold plates to better spread the heat generated by the heat generating component and thus provides better cooling as compared to cold plates that are separated from each other.
  • the cold plate subassembly 18 allows multiple passes of the refrigerant to cool a component instead of a single pass as in the prior art cold plates.
  • the cold plates of the present invention provide several advantages over the prior art. The cold plates are easier and less costly to manufacture a single large cold plate.
  • each cold plate is the same temperature as the previous, such that the system is isothermal. There is better thermal contact with the base plate of the IGBT. It is also easier to maintain flatness across the smaller surface of the cold plate as the smaller cold plates are less prone to warpage.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur un sous-ensemble de plaques froides pour un système de refroidissement à fluide frigorigène liquide, le sous-ensemble de plaques froides comprenant de multiples plaques froides/évaporateurs en contact thermique avec le composant électrique ou électronique devant être refroidi, et les multiples plaques froides/évaporateurs étant en contact thermoconducteur les unes avec les autres.
PCT/US2010/024219 2009-02-17 2010-02-15 Système de refroidissement utilisant de multiples plaques froides Ceased WO2010096355A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15311409P 2009-02-17 2009-02-17
US61/153,114 2009-02-17

Publications (2)

Publication Number Publication Date
WO2010096355A2 true WO2010096355A2 (fr) 2010-08-26
WO2010096355A3 WO2010096355A3 (fr) 2011-01-06

Family

ID=42634404

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/024219 Ceased WO2010096355A2 (fr) 2009-02-17 2010-02-15 Système de refroidissement utilisant de multiples plaques froides

Country Status (1)

Country Link
WO (1) WO2010096355A2 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039676A1 (de) * 2010-08-24 2012-03-01 Behr Gmbh & Co. Kg Verbindungsvorrichtung zum Verbinden von Aufstecköffnungen mindestens einer Kühlvorrichtung und Kühlsystem zum Kühlen von Elektronikkomponenten
US8368208B2 (en) 2010-10-01 2013-02-05 Raytheon Company Semiconductor cooling apparatus
DE102012014813A1 (de) 2012-07-26 2014-01-30 Wieland-Werke Ag Strukturierte Kühlkörper in Modulbauweise
EP2937656A3 (fr) * 2013-10-29 2016-06-22 Tai-Her Yang Égaliseur de température installé de manière adjacente avec transfert de chaleur côté unique
US9472487B2 (en) 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
US9553038B2 (en) 2012-04-02 2017-01-24 Raytheon Company Semiconductor cooling apparatus
JP2018063977A (ja) * 2016-10-11 2018-04-19 昭和電工株式会社 冷却装置
DE202023103576U1 (de) 2022-06-29 2023-10-31 Dana Automotive Systems Group, Llc Batteriekühlsystem
EP4401523A1 (fr) * 2023-01-13 2024-07-17 Vertiv Corporation Systèmes et procédés de refroidissement de plaque froide à deux phases

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
JPH09121557A (ja) * 1995-10-23 1997-05-06 Hitachi Ltd 回転機器の電子部品冷却構造及びその製作方法
JP2002181487A (ja) * 2000-12-12 2002-06-26 Daikin Ind Ltd 空気調和機用熱交換器
AU2002306161A1 (en) * 2001-06-12 2002-12-23 Liebert Corporation Single or dual buss thermal transfer system
US6989989B2 (en) * 2003-06-17 2006-01-24 Utc Power Llc Power converter cooling
CA2482483A1 (fr) * 2003-09-26 2005-03-26 Thermal Form & Function Llc Utilisation de materiaux de mousse de graphite dans des plaques de refroidissement biphase a liquide vehicule
ITPD20050028U1 (it) * 2005-04-13 2006-10-14 Tubes Radiatori Srl Elemento riscaldante per caloriferi
DE102007023058A1 (de) * 2007-05-16 2008-10-30 Siemens Ag Kühlplattensystem

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039676A1 (de) * 2010-08-24 2012-03-01 Behr Gmbh & Co. Kg Verbindungsvorrichtung zum Verbinden von Aufstecköffnungen mindestens einer Kühlvorrichtung und Kühlsystem zum Kühlen von Elektronikkomponenten
DE102010039676B4 (de) * 2010-08-24 2016-06-09 Mahle International Gmbh Kühlsystem zum Kühlen von Elektronikkomponenten
US8368208B2 (en) 2010-10-01 2013-02-05 Raytheon Company Semiconductor cooling apparatus
US9472487B2 (en) 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
US9553038B2 (en) 2012-04-02 2017-01-24 Raytheon Company Semiconductor cooling apparatus
DE102012014813A1 (de) 2012-07-26 2014-01-30 Wieland-Werke Ag Strukturierte Kühlkörper in Modulbauweise
EP2937656A3 (fr) * 2013-10-29 2016-06-22 Tai-Her Yang Égaliseur de température installé de manière adjacente avec transfert de chaleur côté unique
JP2018063977A (ja) * 2016-10-11 2018-04-19 昭和電工株式会社 冷却装置
DE202023103576U1 (de) 2022-06-29 2023-10-31 Dana Automotive Systems Group, Llc Batteriekühlsystem
EP4401523A1 (fr) * 2023-01-13 2024-07-17 Vertiv Corporation Systèmes et procédés de refroidissement de plaque froide à deux phases

Also Published As

Publication number Publication date
WO2010096355A3 (fr) 2011-01-06

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