WO2010104332A2 - Dispositif de refroidissement pour composants électronique et sont procédé de fabrication - Google Patents

Dispositif de refroidissement pour composants électronique et sont procédé de fabrication Download PDF

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Publication number
WO2010104332A2
WO2010104332A2 PCT/KR2010/001511 KR2010001511W WO2010104332A2 WO 2010104332 A2 WO2010104332 A2 WO 2010104332A2 KR 2010001511 W KR2010001511 W KR 2010001511W WO 2010104332 A2 WO2010104332 A2 WO 2010104332A2
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WO
WIPO (PCT)
Prior art keywords
space
base portion
body member
shape
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/001511
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English (en)
Korean (ko)
Other versions
WO2010104332A3 (fr
Inventor
윤선규
정상준
정경채
부성덕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zalman Tech Co Ltd
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Zalman Tech Co Ltd
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Filing date
Publication date
Application filed by Zalman Tech Co Ltd filed Critical Zalman Tech Co Ltd
Publication of WO2010104332A2 publication Critical patent/WO2010104332A2/fr
Publication of WO2010104332A3 publication Critical patent/WO2010104332A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Definitions

  • the present invention relates to a cooling device for an electronic component, and more particularly, in order to cool a heat generating component that generates heat during operation in an electronic component embedded in an electronic device such as a computer, an internal space may allow a working fluid to circulate.
  • the present invention relates to a cooling device for an electronic component capable of cooling heat generated in a heat generating component more efficiently than conventionally by using a new type of body in a chamber form and a heat radiation fin coupled thereto.
  • heat generating parts that generate heat during operation are embedded.
  • heating components such as a central processing unit (CPU) mounted on a motherboard or a chipset mounted on a board of a graphic adapter.
  • CPU central processing unit
  • Various types of cooling devices are currently used to cool the heat of the heat generating parts.
  • the cooling device of the recent years has been used a lot of configurations employing a heat pipe that is significantly superior in thermal conductivity compared to other materials, and heat dissipation fins are coupled to the heat pipe to dissipate heat to the outside.
  • the cooling device having such a configuration has a problem that heat is generated at the interface because heat of the heat generating parts must be transferred to one end of the heat pipe through the heat transfer block, and thus the efficiency of heat transfer is not sufficient.
  • the present invention is to solve the above problems, the heat is directly received in contact with the heat generating parts, the working fluid is circulated by the heat received in the inner space to be able to transfer the heat to the radiator to maximize the cooling performance It is an object to provide a cooling device.
  • the cooling apparatus comprises a body having a base portion mounted at one side thereof to be in direct contact with a heating element, and a ring portion connected to both ends of the base portion, and a heat dissipation portion coupled to the ring portion of the body.
  • a cooling device for an electronic component the base portion having a first space therein, the ring portion having a second space communicating therewith with the first space therein, and a working fluid inside the body. Is injected, and a sintered wick formed by sintering metal powder is formed on at least part of the inner surface of the body, and when the base part is mounted on the heat generating part to receive heat generated from the heat generating part,
  • the working fluid may be configured to circulate the first space and the second space.
  • the body is preferably made of a body member formed to form an inner space consisting of the first space and the second space, and a cover member coupled to the body member to seal the internal space.
  • the body member is formed by a die casting processing method or one metal sheet material by press working to be integrated.
  • the sintered wick is preferably formed integrally on the inner side facing the inner space of the body member.
  • the base portion the outer shape is substantially hexahedral
  • the ring portion the hollow plate-like member is bent to form a circular arc as a whole
  • the ring portion is extended from one side edge portion of the base portion and the base It is preferable that it is a shape connected to the other edge part of a part.
  • the base portion has a lower side thereof coupled to an upper surface of the heat generating part, and the ring portion is provided at an upper portion of the base portion, and the ring portion has an inner space at an upper end portion thereof and a first space inside the base portion. It is preferable to further provide the connection passage part which communicates in the up-down direction so that this mutual communication may be carried out.
  • the base portion is substantially hexahedron
  • the ring portion the hollow plate-like member is bent to form a polygonal shape as a whole
  • the ring portion is extended from one side edge portion of the base portion and the base It is preferable that it is a shape connected to the other edge part of a part.
  • the base portion the outer shape is substantially "U" shaped
  • the ring portion is a shape that is connected to the other upper upper corner portion of the base portion after extending from the upper corner portion of the base portion.
  • the heat dissipation portion is composed of a plurality of heat dissipation fins, each of the heat dissipation fins is provided with a "U" shaped fitting groove in the middle portion, it is preferable that the fitting groove is fixed to the ring portion.
  • the method of manufacturing an electronic device cooling apparatus includes a body having a base portion forming a first space therein, and a ring portion formed at both ends of the base portion and having a second space connected therein and communicating with the first space.
  • a working fluid input and vacuum step of making and sealing a state Characterized in that comprises a.
  • the body member forming step it is preferable that the body member is molded by pressing a single metal plate.
  • the body member is preferably molded by die-casting (die-casting).
  • the base portion, the outer shape is substantially hexahedron, the ring portion, the hollow plate-like member is bent to form a circular or polygonal shape as a whole, the ring portion, the base It is preferable that the mold is formed to have a shape connected to the other edge portion of the base portion after extending from one edge portion of the portion.
  • the manufacturing method preferably further comprises a radiating portion coupling step of coupling the radiating portion to the ring portion.
  • the heat dissipation unit includes a plurality of heat dissipation fins, each of the heat dissipation fins has a fitting groove having a “U” shape in the middle portion thereof, and the grooves formed in each of the heat dissipation fins have the ring. After aligning the plurality of heat dissipation fins so as to correspond to the shape of the part, it is preferable to fix the ring part by fitting the fitting groove.
  • the heat dissipation unit may be coupled to the ring by soldering, and the soldering may be performed after filling an inert gas into the internal space, and after the soldering is completed, the inert gas may be applied to the heat dissipation unit. It is preferable to further include the step of removing from the interior space.
  • the cooling device for an electronic component of the present invention is coupled so that one side of the base portion is in direct contact with the heat generating part, there is an effect that the heat transfer efficiency that the heat of the heat generating part is transferred to the base part can be maximized.
  • the inner side of the body is provided with a sintered wick, and the inside of the body is composed of the first space and the second space so that the working fluid can circulate and operate, it is possible to achieve improved performance than conventional heat pipes There is.
  • FIG. 1 is a perspective view of a cooling apparatus
  • FIG. 1 shows only the body of the cooling device of Figure 1
  • FIG. 3 is an exploded perspective view in a state of rotating the body of FIG. 2 by 180 degrees;
  • FIG. 4 is a vertical cross-sectional view of FIG.
  • FIG. 5 is an exploded perspective view of FIG. 1;
  • FIG. 6 and 7 are views for explaining that the heat radiation fin is coupled to the base portion and the ring portion, respectively.
  • 17 to 21 are views for explaining a method of manufacturing a cooling device for an electronic component according to another embodiment of the present invention.
  • FIGS. 1 to 7 An electronic device cooling apparatus 1 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 7.
  • 1 is a perspective view of the cooling device 1
  • Figure 2 is a view showing only the body of the cooling device 1 of Figure 1
  • Figure 3 is an exploded perspective view of the body of FIG. 4 is a vertical cross-sectional view of FIG. 2
  • FIG. 5 is an exploded perspective view of FIG. 1
  • FIGS. 6 and 7 are views for explaining that the heat dissipation fins are coupled to the base part and the ring part, respectively.
  • the cooling device 1 for an electronic component is a heat generating component that generates heat during operation as an electrical and electronic component, for example, a central processing unit (cpu) mounted on a main board of a computer, or a graphic adapter. Cools heating elements such as chipsets mounted on an adapter's substrate.
  • a central processing unit cpu
  • Cools heating elements such as chipsets mounted on an adapter's substrate.
  • the electronic device cooling device 1 includes a body 30 and a heat dissipation part 40. Meanwhile, referring to FIG. 1, the cooling device 1 is provided with a cooling fan 70. However, according to the embodiment, the cooling fan may be provided only by natural convection without a cooling fan.
  • the body 30 includes a base portion 10 and a ring portion 20.
  • the base unit 10 is mounted such that one side thereof, such as a central processing unit (CPU), a VGA chipset, and the like, which is built into the computer, is in direct contact with the heating component. That is, the contact surface, which is one side surface of the base portion 10, is mounted to be in direct contact with and fixed to the upper surface of the heat generating component.
  • the heating element is mounted on the heating part with a medium such as a heating block provided separately, but in the present invention, the contact surface of the base 10 is in direct contact with the heating part. In the case of this embodiment, the contact surface of the base part 10 is its lower surface.
  • the mounting of the base part 10 is by clamping (not shown) which can press the base part 10 from top to bottom.
  • the mounting protrusion may be formed on one side of the base to mount the base.
  • the base portion 10 includes a first space 12 therein (see FIGS. 3 and 4).
  • the first space 12 is a space formed therein surrounded by the members forming the base portion 10.
  • the first space 12 is sealed from the outside.
  • the base portion 10 has an external shape as a whole or substantially hexahedron. Forming a cube does not mean forming a mathematically correct cube, but it means that the shape of the cube as a whole.
  • the shape of the base portion in the other embodiment, as long as it is provided with a contact surface that can be in direct contact with the heat generating parts and the first space therein can be variously modified. Various modifications will be described later.
  • Both ends of the ring portion 20 are connected to the base portion 10.
  • the ring portion 20 has a second space 22 therein.
  • the second space 22 is connected to and communicated with the first space 12.
  • the gaseous working fluid generated in the first space 12 can move to the second space 22 connected to both sides of the first space 12 without any obstacle.
  • the working fluid may be returned to the first space 12 after moving from the first space 12 to the second space 22, regardless of whether it is a gas or a liquid. That is, the working fluid can circulate between the first space 12 and the second space 22.
  • the ring portion 20 is bent so that the hollow hollow plate-like member to form a circular arc as a whole. That is, the ring part 20 is a rectangular shape with a flat cross section, hollow inside, and the rectangular cylindrical member extended in elongate shape is substantially curved in a circle.
  • the shape of the ring portion 20 may be variously modified as long as the second space, which is a space therein, communicates with the first space.
  • the shape of the cross section may be a polygon other than a rectangle, or the surface facing the cooling fan may be curved. Referring to FIG. 6, the surface on the left side may be formed to be convex toward the left side rather than the plane. This configuration allows for better flow of wind by the cooling fan.
  • the ring portion 20 has a shape connected to the other edge portion of the base portion 10 after extending from one edge portion of the base portion 10.
  • one corner portion referring to FIG. 2, means a corner portion where a line extending rearward from one point 14 of the upper left portion of the base portion 10 is located, and the other corner portion, at the other point 15.
  • the two edges face each other and are parallel.
  • the ring portion 20 of the present embodiment the inner member is a complete circle and the outer member is connected to each of the pair of corners facing the upper portion of the base portion 10 is a circular arc
  • the ring portion 20 of the present embodiment is to mean a portion of the arc shape connected to each of the pair of corner portions. Therefore, the upper surface of the base portion 10 is not a horizontal plane but becomes a surface that is gently concave downward.
  • the heat dissipation unit 40 is coupled to the ring portion 20 of the body 30 to radiate heat transferred to the ring portion 20 to the outside.
  • the heat dissipation part 40 is composed of a plurality of heat dissipation fins 42.
  • the heat dissipation fin 42 is provided with a fitting groove of a “U” shape in the middle portion thereof. Insert the fitting groove into the ring portion 20 to fix the heat radiation fins 42 to the ring portion 20 (see Fig. 6).
  • the contact portion of the heat dissipation fin 42 and the ring portion 20 is coupled to each other by a method such as soldering.
  • the fitting groove of the heat dissipation fin 42 is preferably provided with a burr (not shown) bent in a right angle when manufacturing the heat dissipation fin. These burrs are fixed to each other in contact with the contact portion of the ring portion 20.
  • the fitting groove represented by the "U" shape is provided in a size and shape corresponding to the size of the ring portion 20 to be fitted to the ring portion (20).
  • a heat radiation fin (44) coupled to the base portion (10).
  • a heat radiation fin 44 is provided, which is more effective for heat radiation.
  • the heat radiation fin 44 is also provided with a "U" shaped fitting groove, the base portion 10 is coupled as shown in FIG.
  • the sintered wick 50 which will be described later, is formed on the inner side surfaces 65, 66, and 68 of the ring portion 20 to which the heat dissipation fins 42 are coupled, so that heat is transferred to the heat dissipation fins 42. Effective for delivery. 7, the sintered wick 50 is formed on the inner side surfaces 64 and 69 of the base portion 10 to which the heat dissipation fins 44 are coupled.
  • the body 30, the body member 60 and the cover member 63 is made of a combination.
  • the lower portion of the base portion 10 and the ring-shaped portion coupled thereto may be referred to as the ring portion 20, and divided into the members constituting the body 30 by the body
  • the member 60 and the cover member 63 can be divided.
  • the body member 60 is formed to form an inner space 62 having a first space 12 and a second space 22 therein.
  • the first space 12 and the second space 22, which are connected to each other and communicate with each other, are defined as an interior space 62.
  • the body member 60 is integrally formed with one metal plate by a press working method. That is, the flat metal sheet having sufficient ductility is pressed with a press and processed into a shape as shown in FIG.
  • the body member 60 may be integrally formed by a die casting processing method, not a press working method.
  • the cover member 63 is coupled to the body member 60 to seal the inner space 62. Although the inner side surface of the cover member 63 was mentioned that the sintering wick is not provided, it can be provided as needed.
  • the sintered wick 50 is provided on at least a portion of the inner surface of the body 30, the metal powder is formed by sintering. At least in part, the sintered wick means at least the inner side face 64 of the inner side 64 of the lower side of the base part 10 and the inner side face 65 of the outer part of the ring part 20 with reference to FIG. . This is because the sintered wicks are connected to each other and integrally formed at this portion, so that the working fluid injected into the inner space 62 can circulate the first space 12 and the second space 22.
  • the base part 10 Since the working fluid is injected into the body 10 and the sintered wick 50 is formed on the inner side of the body, the base part 10 is mounted on the heat generating parts to receive heat generated from the heat generating parts. In this case, the working fluid repeats the vaporization and the liquefaction alternately, and is able to circulate the first space 12 and the second space 22.
  • the sintered wick 50 is integrally formed on all of the inner side surfaces 64, 65, 66, 68, and 69 facing the inner space 62 of the body member 60 (FIG. 3 4, 6 and 7). This configuration makes the working fluid that transfers heat more efficient in circulating and moving.
  • the heat generated from the heat generating parts is transferred to the lower side of the base part 10, and this heat vaporizes the working fluid penetrating into the sintered wick 50 provided on the upper side of the lower side.
  • the working fluid vaporized in the first space 12 is moved to the second space 12 connected to the first space 12 on both sides of the upper part by the pressure difference.
  • the base portion 10 and the ring portion 20 are made of a metal such as copper, heat is also transmitted by conduction.
  • the working fluid in the gas state moved to the second space 22 exchanges heat with the ring portion 20 to which the heat dissipation fins 42 are coupled, and then changes to a liquid state.
  • the working fluid in the liquid state penetrates into the sintered wick 50 formed on the inner side of the ring portion 20, and then the base portion 10 rapidly moves to the sintered wick 50 formed on the lower side by capillary action.
  • the above-described process is repeated, and the working fluid circulates through the first space and the second space and continuously evaporates and condenses to transport heat in the form of latent heat, thereby cooling the heating element.
  • the cooling device 1 for the electronic component is coupled so that the lower side of the base 10 directly contacts the heat generating component. Therefore, there is an effect that the heat transfer efficiency that the heat of the heat generating parts is transferred to the base portion can be maximized.
  • the sintered wick 50 is formed integrally with the inner side of the body 30, and the inner space of the body to the first space 12 and the second space 22 so that the working fluid can circulate and operate. Because it is configured, the working fluid circulates and cooling is effectively performed. At this time, the base portion 10 is to evaporate the working fluid is generated, the heat radiation portion 40 is coupled to the ring portion 20 is coupled to the condensation of the working fluid is to occur. Due to this configuration, it is made of a single pipe has an advantage that the performance fluid can be improved than the conventional heat pipe, which tends to generate a collision and flow resistance resistance when moving.
  • the contact surface of the base portion 10 can be configured to be the same or larger than the upper surface of the heat generating parts, there is an advantage that the heat of the heat generating parts can be transmitted more effectively.
  • the width of the ring portion 20 is wide enough to couple the heat radiation fins, not only is it easy to join the heat radiation fins, but also it is possible to secure a sufficient contact area with the heat radiation fins so that the ring portion There is an advantage that the heat transfer to the heat radiation fins in the effective.
  • the heat radiation fins are provided with fitting grooves of a shape corresponding to the ring portion, it is easy to couple to the ring portion 20.
  • the heat radiation fins 44 coupled to the base portion 10 are also provided, the heat radiation area is maximized.
  • the body member 60 is integrally processed by pressing a single member, there is an advantage that the heat resistance does not occur in the heat transfer.
  • FIG. 8 and 9 show a cooling device 1a for an electronic component of a second embodiment.
  • FIG. 8 is a perspective view and
  • FIG. 9 is a view showing only the body of FIG. 8 separately.
  • the shape of the base portion 10a of the body 30a is configured differently from the first embodiment, and the rest of the configuration is the same.
  • the outer portion of the base portion 10a has a substantially “U” shape. Therefore, the first space, which is an inner space of the base portion 10a, is not a rectangular cylindrical shape as in the first embodiment, It is in the form of a "U”.
  • the ring portion 20a extends from one upper edge portion of the base portion 10a and then bends into an arc shape and is connected to the other upper edge portion of the base portion 10a.
  • the shape of the ring portion 20a is almost the same as in the first embodiment.
  • FIG. 10 and 11 show a cooling device 1b for an electronic component of a third embodiment.
  • FIG. 10 is a perspective view
  • FIG. 11 is a view illustrating the body 30b and the heat dissipation fins 42b and 44b of FIG. 10 separately.
  • the shape of the ring portion 20b of the body 30b is configured differently from the previous embodiments.
  • the base portion 10b has a hexahedron whose outer shape is similar to that of the first embodiment.
  • the ring portion 20b is bent to form a hollow hollow plate-like member as a whole.
  • the ring portion may be variously modified into a triangle, a pentagon, a hexagon, and the like instead of a rectangle.
  • One end of the ring portion 20b is connected to one corner portion of the base portion 10b and the other end is connected to the other edge portion of the base portion 10b.
  • the inner space of the base portion 10a and the ring portion 20b are connected to each other as in the previous embodiment.
  • the shape of the heat radiation fins 42b and 44b is different compared to the first embodiment. This is modified to maximize the heat dissipation area corresponding to the shape of the ring portion (20b).
  • the cooling fan 70 is provided in the front part of the heat radiation part 40b.
  • FIG. 12 to 14 show a cooling device 1c for an electronic component of a fourth embodiment.
  • FIG. 12 is a perspective view
  • FIG. 13 shows only the body 30c of FIG. 12
  • FIG. 14 is a longitudinal schematic cross-sectional view of the body 30c of FIG. 12.
  • the shape of the body 30c is similar to that of the first embodiment as a whole, but the forming direction of the contact surface of the base portion 10c intended to be in contact with the heat generating component is different.
  • the cooling device 1c of this embodiment is mainly used for cooling a computer graphics chip set, and is configured to be used in a horizontal direction in consideration of the mounting environment.
  • the protrusion 11c which is a part where the contact surface of the base part 10c is formed, is formed to protrude from the other parts.
  • the first space 12c is formed inside the base portion 10c, and the sintered wick 50c is integrally formed on both side surfaces facing each other and the inner side surface of the protrusion 11c.
  • the body 30d is a modified form of the body 30 of the first embodiment.
  • the base portion 10d of the body 30d is configured such that the lower side thereof is coupled to the upper surface of the heat generating part.
  • the ring part 20d is provided in the upper part of the base part 10d.
  • the ring portion 20d further includes a connecting passage portion 24d which communicates in the vertical direction so that the inner space 25d of the upper end portion thereof and the first space 12d inside the base portion 10d communicate with each other. have.
  • a sintered wick 50d is provided on the inner side surface of the connecting passage portion 24d facing the inner space.
  • the rest of the configuration except the connection passage 24d is similar to that of the first embodiment.
  • This deformed body (30d) allows a more smooth movement of the working fluid in the interior space.
  • the working fluid evaporated inside the base portion 10d is not only raised through both inlets of the ring portion 20d, but is also raised through the connecting passage portion 24d.
  • the manufacturing method of the electronic device cooling apparatus of this embodiment the body member forming step (S1), the mandrel (mandrel) insertion step (S2), the sintering step (S3), the mandrel removal and cover member coupling step (S4) and operation Fluid injection and vacuum step (S5) is made.
  • the manufacturing method of the cooling device for electronic components of this embodiment is a method suitable for manufacturing the cooling devices for electronic components mentioned above.
  • the body member forming step (S1) forms a body member 160 having a base portion 110 and a ring portion 120 connected to both ends of the base portion 110. Step.
  • the first space 112 is provided in the base 110, and the second space 122 is formed in the ring 120.
  • the first space 112 and the second space 122 are connected to each other.
  • the body member 160 is molded by pressing a single metal plate. That is, the body member 160 is formed by drawing a plate member made of a metal, such as copper or aluminum, which is easily processed by plastic into a cylindrical columnar shape using a press die. On the other hand, in another embodiment, the body member 160 may be molded by die-casting (die-casting), not press.
  • the base portion 110 of the body member 160 is substantially a hexahedral shape
  • the ring portion 120 is a shape in which the hollow plate-like member is bent in a circular or polygonal shape as a whole.
  • the ring portion 120 is configured to have a shape connected to the other corner portion of the base portion after extending from one corner portion of the base portion 110.
  • the mandrel insertion step (S2) is a step of inserting the mandrel 102 into the inner space of the body member 160 after preparing the mandrel 102 on the upper portion of the body member 160.
  • the mandrel 102 has a size and a shape corresponding to the overall shape of the inner space of the body member 160 including the first space 112 and the second space 122.
  • the size of the mandrel is slightly smaller than the inner space of the body member 160, and is inserted to be spaced apart from the inner surface of the body member 160 by a predetermined interval in the inserted state. That is, a space is provided between the outer surface of the mandrel 102 and the inner surface of the inner space of the body member 160 to be filled with a metal powder to be described later.
  • the metal powder 150 is heated to sinter.
  • the metal powder 150 is filled in the space between all of the body member 160 and the mandrel 102.
  • the metal powder is usually copper powder. In this state, it is heated to a temperature suitable for sintering according to the type of metal powder.
  • the mandrel removal and cover member coupling step (S4) after removing the mandrel 102 from the body member 160 after the sintering (see Fig. 21), the cover on one open side of the body member 160 Joining the members.
  • the outer circumferential surface of the cover member is coupled to the body member 160 by a method such as welding.
  • the working fluid input and vacuum step (S5) is a step of putting the working fluid into the inner space, and vacuums the inner space and seals it.
  • the cover member is provided with an injection hole for the vibration of the internal space and the injection of the working fluid. Using this inlet, the working fluid is injected into the interior space and the interior space is vacuumed.
  • the order of the working fluid injection and the internal space vacuum may be changed as necessary.
  • the vacuum degree of the internal space is also set to an appropriate value within a pressure lower than atmospheric pressure.
  • the cooling device for an electronic component of the present embodiment further includes a heat radiation unit coupling step of coupling the heat radiation portion to the ring portion.
  • a heat radiation unit coupling step of coupling the heat radiation portion to the ring portion The manner of coupling with the shape of the heat dissipation unit coupled to the ring portion, see FIG.
  • Coupling the heat dissipation unit to the ring portion in the present embodiment, is configured to be performed before the operating fluid injection and vacuum step (S5). However, if necessary, the step of coupling the heat dissipation unit to the ring portion may be performed after the operation fluid injection and vacuum step (S5).
  • the heat dissipation portion 40 is composed of a plurality of heat dissipation fins 42, each of the heat dissipation fins 42 is provided with a "U" shaped fitting groove in the middle portion thereof. Therefore, after aligning the plurality of heat dissipation fins so that the fitting grooves are in a predetermined position, and fixing them with the fitting grooves while fixing them with a jig or the like, workability can be improved.
  • coupling the radiating portion to the ring portion is performed by a soldering process.
  • the soldering is made after filling the inert gas such as nitrogen in the inner space of the body member, and after the soldering further comprises the step of removing the inert gas again from the inner space.
  • the body member can be simply formed from one metal plate by a press die, there is an advantage that the manufacturing of the cooling device is made simple.
  • this is a single member that is connected to the body member having a sintered wick on the inner side, there is an advantage in terms of efficiency of heat transfer.
  • the cooling device for an electronic component manufactured by the present manufacturing method has various advantages with the cooling devices of the various embodiments described above.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Cette invention concerne un dispositif de refroidissement pour composants électroniques qui comprend : un corps principal comportant une partie de base, dont un côté est directement en contact avec un composant qui dégage de la chaleur, et une partie annulaire dont les deux extrémités sont reliées à la partie de base ; et une unité de dissipation de la chaleur couplée à la partie de base du corps principal. L'intérieur de la partie de base présente un premier espace, et l'intérieur de la partie annulaire un second espace communiquant avec le premier espace. Un fluide de travail est injecté dans l'intérieur du corps principal. Une partie au moins de la surface intérieure du corps principal comporte une mèche frittée obtenue par frittage d'une poudre métallique. Lorsque la partie de base est montée sur le composant qui dégage de la chaleur et que cette chaleur est transférée à la partie de base, le fluide de travail circule à travers le premier et le second espace.
PCT/KR2010/001511 2009-03-11 2010-03-11 Dispositif de refroidissement pour composants électronique et sont procédé de fabrication Ceased WO2010104332A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090020722A KR20100102376A (ko) 2009-03-11 2009-03-11 전자부품용 냉각장치 및 그의 제조방법
KR10-2009-0020722 2009-03-11

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WO2010104332A2 true WO2010104332A2 (fr) 2010-09-16
WO2010104332A3 WO2010104332A3 (fr) 2010-11-25

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KR (1) KR20100102376A (fr)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012102993A (ja) * 2010-11-12 2012-05-31 崇賢 ▲黄▼ 輻射型排熱器
WO2018176535A1 (fr) * 2017-03-31 2018-10-04 华中科技大学 Nouveau système de dissipation de chaleur à refroidissement liquide par une pompe mécanique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101339593B1 (ko) * 2012-07-09 2014-01-02 윤국영 전자부품용 냉각장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3185043B2 (ja) * 1993-05-11 2001-07-09 昭和アルミニウム株式会社 ヒートパイプ利用放熱器
KR100498000B1 (ko) * 2002-10-29 2005-07-01 (주)네오유토 히트 파이프와 히트 싱크의 결합 구조를 가진 전자기기의발열체 냉각장치
KR20060133347A (ko) * 2005-06-20 2006-12-26 잘만테크 주식회사 컴퓨터 부품용 냉각장치 및 그 제조방법
KR20080028693A (ko) * 2006-09-27 2008-04-01 잘만테크 주식회사 냉각장치 및 이에 채용된 히트파이프를 제조하는 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012102993A (ja) * 2010-11-12 2012-05-31 崇賢 ▲黄▼ 輻射型排熱器
WO2018176535A1 (fr) * 2017-03-31 2018-10-04 华中科技大学 Nouveau système de dissipation de chaleur à refroidissement liquide par une pompe mécanique

Also Published As

Publication number Publication date
KR20100102376A (ko) 2010-09-24
WO2010104332A3 (fr) 2010-11-25

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