WO2010104332A3 - 전자부품용 냉각장치 및 그의 제조방법 - Google Patents

전자부품용 냉각장치 및 그의 제조방법 Download PDF

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Publication number
WO2010104332A3
WO2010104332A3 PCT/KR2010/001511 KR2010001511W WO2010104332A3 WO 2010104332 A3 WO2010104332 A3 WO 2010104332A3 KR 2010001511 W KR2010001511 W KR 2010001511W WO 2010104332 A3 WO2010104332 A3 WO 2010104332A3
Authority
WO
WIPO (PCT)
Prior art keywords
space
base portion
cooling apparatus
main body
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/001511
Other languages
English (en)
French (fr)
Other versions
WO2010104332A2 (ko
Inventor
윤선규
정상준
정경채
부성덕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zalman Tech Co Ltd
Original Assignee
Zalman Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zalman Tech Co Ltd filed Critical Zalman Tech Co Ltd
Publication of WO2010104332A2 publication Critical patent/WO2010104332A2/ko
Publication of WO2010104332A3 publication Critical patent/WO2010104332A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

본 발명은 전자부품용 냉각장치에 관한 것으로, 본 냉각장치는 그 일측면이 발열부품에 직접 접촉하도록 장착되는 베이스부 및 이러한 베이스부에 양단부가 연결된 고리부를 구비하는 몸체와, 상기 몸체의 고리부에 결합된 방열부를 포함하여 구성되되, 상기 베이스부는, 그 내부에 제1공간을 구비하고, 상기 고리부는, 그 내부에 상기 제1공간과 연통된 제2공간을 구비하고, 상기 몸체의 내부에는 작동유체가 주입되어 있고, 상기 몸체의 내측면의 적어도 일부에는 금속분말이 소결되어 형성된 소결윅(sintered wick)이 형성되어 있어서, 상기 발열부품에 베이스부가 장착되어 발열부품에서 발생되는 열을 전달받는 경우, 상기 작동유체가 상기 제1공간과 제2공간을 순환할 수 있도록 구성된 것을 특징으로 한다.
PCT/KR2010/001511 2009-03-11 2010-03-11 전자부품용 냉각장치 및 그의 제조방법 Ceased WO2010104332A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0020722 2009-03-11
KR1020090020722A KR20100102376A (ko) 2009-03-11 2009-03-11 전자부품용 냉각장치 및 그의 제조방법

Publications (2)

Publication Number Publication Date
WO2010104332A2 WO2010104332A2 (ko) 2010-09-16
WO2010104332A3 true WO2010104332A3 (ko) 2010-11-25

Family

ID=42728948

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001511 Ceased WO2010104332A2 (ko) 2009-03-11 2010-03-11 전자부품용 냉각장치 및 그의 제조방법

Country Status (2)

Country Link
KR (1) KR20100102376A (ko)
WO (1) WO2010104332A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201108929A (en) * 2010-11-12 2011-03-01 chong-xian Huang Radiation type heat sink with built-in heat conduction pipe
KR101339593B1 (ko) * 2012-07-09 2014-01-02 윤국영 전자부품용 냉각장치
CN106852092B (zh) * 2017-03-31 2017-10-03 华中科技大学 一种新型机械泵液冷散热系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326224A (ja) * 1993-05-11 1994-11-25 Showa Alum Corp ヒートパイプ利用放熱器
KR20030003144A (ko) * 2002-10-29 2003-01-09 (주)네오유토 히트 파이프와 히트 싱크의 결합 구조를 가진 전자기기의발열체 냉각장치
KR20060133347A (ko) * 2005-06-20 2006-12-26 잘만테크 주식회사 컴퓨터 부품용 냉각장치 및 그 제조방법
KR20080028693A (ko) * 2006-09-27 2008-04-01 잘만테크 주식회사 냉각장치 및 이에 채용된 히트파이프를 제조하는 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326224A (ja) * 1993-05-11 1994-11-25 Showa Alum Corp ヒートパイプ利用放熱器
KR20030003144A (ko) * 2002-10-29 2003-01-09 (주)네오유토 히트 파이프와 히트 싱크의 결합 구조를 가진 전자기기의발열체 냉각장치
KR20060133347A (ko) * 2005-06-20 2006-12-26 잘만테크 주식회사 컴퓨터 부품용 냉각장치 및 그 제조방법
KR20080028693A (ko) * 2006-09-27 2008-04-01 잘만테크 주식회사 냉각장치 및 이에 채용된 히트파이프를 제조하는 방법

Also Published As

Publication number Publication date
WO2010104332A2 (ko) 2010-09-16
KR20100102376A (ko) 2010-09-24

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