WO2011006301A1 - Ordinateur portatif, son enceinte et sa carte mère - Google Patents

Ordinateur portatif, son enceinte et sa carte mère Download PDF

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Publication number
WO2011006301A1
WO2011006301A1 PCT/CN2009/072785 CN2009072785W WO2011006301A1 WO 2011006301 A1 WO2011006301 A1 WO 2011006301A1 CN 2009072785 W CN2009072785 W CN 2009072785W WO 2011006301 A1 WO2011006301 A1 WO 2011006301A1
Authority
WO
WIPO (PCT)
Prior art keywords
main board
peripheral interface
motherboard
main
air inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2009/072785
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English (en)
Chinese (zh)
Inventor
秦彪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/CN2009/072785 priority Critical patent/WO2011006301A1/fr
Publication of WO2011006301A1 publication Critical patent/WO2011006301A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position

Definitions

  • the present invention is in the field of personal computer technology, and relates to a portable computer, and in particular, a computer which is called a notebook type together with a host computer for a hinged connection.
  • the invention is directed to the imperfection of the above patent, and proposes to realize the standardization of the notebook computer, the specific key structure of the main box and the design layout of the main components therein, and the design layout of the key components on the main board, and propose an optimized design. Program.
  • the external structure is similar to the current notebook computer, and includes: a flat panel display and a host computer; the display and the host are hinged connections, and also have a hinged connection; the host is a flat type, and the keyboard is on the upper surface of the main body.
  • the main unit's main box includes an upper case and a lower cover.
  • the main unit is provided with a main board, a hard disk and a battery; the main board is mounted in the upper case, a CPU or a GPU chip, and those devices that require a heat sink to be installed on the main board are disposed on the main board.
  • the hard drive and the optical drive are also mounted in the upper case.
  • the present invention is characterized in that: the front end of the main board is opposite to the front side wall of the main box, and one of the left and right sides of the main board is provided with a peripheral interface, and the side is opposite to the side wall corresponding to the main box;
  • the front end has an air inlet hole, the fan abuts on the downward facing surface of the main board, the air inlet of the fan overlaps with the air inlet hole on the main board, or the air inlet hole on the main board directly enters the air inlet of the fan;
  • An air intake window is formed on the front side wall of the upper shell or on the upper wall of the front end; the air intake window is elongated, and the air inlet hole on the main board is directly opposite to the air inlet window or the front panel of the main board and the main box
  • the air intake window is placed at the front end of the main unit. It directly sucks the air outside the case (cold air) and blows it onto the heat sink of the CPU or GPU. It is beneficial for the heat dissipation of the CPU or GPU, and the air intake window is not easily blocked.
  • the intake window and the intake chamber are designed to be elongated, which not only increases the intake area, but also reduces the intake flow resistance. More importantly: the position, number and size of the air intake holes on the main board can be changed as long as they are satisfied.
  • the air inlet hole is opposite to the air intake window or the condition of the air inlet cavity, which is not only convenient for the motherboard wiring design, but also a very important structural feature for the standardization of the notebook computer.
  • the existing notebook computer, CPU and GPU heat dissipation fins are arranged in the air outlet on the side wall of one side of the main box, and the heat on the CPU or GPU chip is transmitted to the heat dissipation fins by the heat pipe, and the air outlet of the centrifugal fan is used.
  • the fan For the heat sink, the fan must have a hood with a concentrated air outlet. With such a structure, the heat transfer distance of the heat pipe is long, and the fan hood takes up a large space, which not only limits the position of the CPU or the GPU on the motherboard, but more importantly, generates heat to the CPU and GPU on the motherboard (involving computer performance) Configuration) is closely related to the size and position of the vent on the side wall of the main box and the size and shape of the fan.
  • the heat generated by chips such as CPU and GPU is less than 5W to 40W.
  • the heat dissipation is from simple heat dissipation from the metal case of the main box to the heat dissipation rib that extends from the CPU and GPU chip to the inside of the exhaust port by using multiple heat pipes.
  • On-chip, fan cooling is used again, which means that it is impossible to develop a standard notebook computer heatsink, so it is impossible to develop a standard for the mainframe, and the standard of the motherboard is more difficult to formulate.
  • the fan is directly mounted on the main board, and the position of the fan on the main board (ie, the position of the air intake hole), the size and the number can be varied within a wide range, and the heat sink of the CPU and the like are all in the main board.
  • the fan diameter and number, and the type, number, and size of the heat sink (heat sink) to meet the heat dissipation requirements of all devices (mainly CPU and GPU) on the motherboard, the association with the host box involves only the thickness of the main box. And it can be solved by replacing the lower cover of the main box.
  • the motherboard is also associated with the mainframe box and is the peripheral interface on the motherboard.
  • the main board is also associated with the mainframe box and is the peripheral interface on the motherboard.
  • only one side of the two sides of the main board is provided with a peripheral interface, and the other side is located in the main box.
  • the peripheral interface devices are all standard components, as long as the standardized position of the peripheral interface device on the motherboard matches the standardized position of the peripheral interface holes on the side wall corresponding to the host box. If the corresponding side wall of the main box opens a large open rectangular peripheral interface window, the limitation of the peripheral interface device on the main board is reduced.
  • the obstacles restricting the standardization of the main board are eliminated, and the hard disk and the optical drive are already standard components, and the keyboard and the battery are plastically large, and can vary with the specific structure and size of the main box, so that the standardization of the main box can naturally be performed.
  • the motherboard, hard disk, optical drive, and battery are all mounted in the upper case of the main unit, and the upper case becomes a mounting platform for all components in the main unit.
  • This structure is easy to assemble and repair.
  • the lower cover can be designed into multiple specifications for easy replacement.
  • the benefits are: CPU or GPU upgrade, radiator heightening, battery thickening, just replace a thicker
  • the lower cover can be achieved.
  • FIG. 1 is a schematic cross-sectional perspective view of a notebook computer of the present invention.
  • the CPU heat sink employs a heat pipe, the fan is centrifugal, and the fin ribs surround the fan impeller.
  • FIG. 2 is a rear view showing the feature of the notebook computer of the present invention opening the lower cover, and the heat sink is directly attached to a chip such as a CPU and a GPU.
  • Fig. 3 is a rear elevation view showing the feature of the notebook computer of the present invention, which is designed for a 14.1 inch display, and the CPU and GPU are heat pipe type heat sinks.
  • Fig. 4 is a rear elevational view showing the feature of the notebook computer of the present invention opening the lower cover, which is designed for a 12.1 inch display screen.
  • Fig. 5 is a rear elevational view showing the feature of the notebook computer of the present invention in which the lower cover is opened.
  • the main unit is provided with a 14.1 inch display screen, but the main board is a 12.1 inch display type motherboard as shown in Fig. 4.
  • Figure 6 is a cross-sectional view showing the features of the CPU heat sink of Figures 3, 4, and 5, with a centrifugal fan and heat radiating fins surrounding the fan impeller.
  • Figure 7 is a cross-sectional view showing the features of a notebook computer of the present invention, showing the structure of the battery and the battery cover.
  • Figure 8 is a perspective view of a main assembly of the present invention with a display and a keyboard.
  • a peripheral interface window with a long, large opening structure is formed on the left side wall.
  • Figure 9 is a cross-sectional view showing a feature of a main assembly with a keyboard of the present invention.
  • Figure 10 is a characteristic view of a main board of the present invention.
  • the orientation of the notebook computer as viewed by the computer operator is the front view direction, and the viewed face is the front side.
  • the end of the display connected to the main box is the front end, and the opposite end is the lower end. Turn the computer so that the keyboard is facing down, the direction of view is the rear view direction, and the left or right side is the left or right side of the rear view.
  • Hard drives include mechanically rotating hard drives and solid state drives.
  • the display 5 is mounted on the upper casing 3 of the main casing through the hinge type connecting device 4.
  • the air intake window 2 composed of the arrangement of the small holes is opened between the front end of the upper casing 3 and the keyboard 1, and has an elongated shape.
  • the space between the inner side of the air intake window 2 and the main plate 13 is the air inlet chamber 11, and the strip is used.
  • the intake air window structure adopts an intake air structure; the air inlet hole 6 on the main board 13 directly faces the air intake window 2, and the intake air chamber 11 is provided, thereby effectively reducing the intake flow resistance; the fan 10 For the centrifugal type, it is mounted on the face of the main board 13 facing downward, and the CPU or GPU chip 12 is also disposed on the face of the main board 13 facing downward; a heat pipe type heat sink is adopted, and the heat dissipation fins 7 are disposed on the heat pipe 8 and dissipated The rib 7 surrounds the fan impeller 9; the front end of the main board 13 is placed against the front side wall of the main casing (the front side wall of the upper casing 3 in the figure), and the main board 13 sets the fan inlet area (cold air area) and the exhaust area.
  • the main board memory adopts the structure of the memory stick slot of the memory stick inserted on the main board, and two memory sticks 16 are inserted in the memory strip slot 15; the main board 13 and the upper shell 3 upper wall (keyboard 1) There is a gap on the inside of the upper wall) so that the main board is provided with the chip component on the surface; the lower cover 14 basically hits the heat pipe 8, that is, the height of the heat dissipation fin (or the heat sink) has reached the maximum If you want to increase the height of the heat dissipation fins to increase the heat dissipation, you must replace the thicker lower cover 14.
  • the air intake window 2 in Fig. 1 utilizes the neutral space between the keyboard 1 and the front end of the upper casing 3, and can also open a hole in the front side wall of the upper casing 3 to increase the intake air area of the intake window.
  • the gap between the button and the button on the keyboard is also possible to use the gap between the button and the button on the keyboard as the air inlet, and the air intake window on the upper case is expanded under the keyboard.
  • the strip-shaped air intake window is opened only on the front side wall of the upper casing 3.
  • Fig. 2 shows a rear view of a feature of the computer of the present invention opening the lower cover, provided with two fans 10, which are directly attached to three chips (including a CPU and a GPU).
  • the heat sink on the three chips and the front side wall of the main box and the battery 17 surround the two fans 10 so that the air driven by the fan 10 flows through the heat sink.
  • the optical drive 19 and the hard disk 18 are already standard parts.
  • the size of the battery 17 mainly the width
  • the size specifications of the main board are determined.
  • the dimensions (specifications) of the motherboard are the same, they can be interchanged.
  • the motherboard configuration chip model such as CPU or GPU and location on the motherboard, heat sink
  • the standard specifications of the motherboard are closely related to the size of the mainframe. That is to say, only motherboards of the same specification can be interchanged.
  • the hard disk 18 is disposed at the rear end of the host, and on the side of the peripheral interface 20, the optical drive 19 and the battery 17 are juxtaposed against a side wall of the main box (the peripheral interface 20 is opposite) Side wall).
  • the battery 17 is at the front end (of course, the optical drive is also in front of it), the width of the battery 17 is equivalent to that of the optical drive 19, and the main board 13 is rectangular, and a front-end peripheral interface 21 is also provided. Whether the front-end peripheral interface 21 or the side peripheral interface 20 is disposed at a corner of the front end corners of the main board (also one of the two front end angles of the main unit).
  • the computer shown in Figure 3 was designed for a 14.1-inch display.
  • the computer shown in Figure 4 is designed for a 12.1-inch display.
  • the motherboard 13 is smaller than the motherboard 13 shown in Figure 4, but its peripheral interface 20 and front-end peripheral interface 21 are identical in position ( Figure 4 There is one less device in the peripheral interface 20).
  • the size and position of the computer shown in FIG. 5, the main unit box, the hard disk 18, the battery 17 and the optical drive 19 are the same as those shown in FIG. 3, but the main board 13 uses the main board shown in FIG. 4, that is, each specification (each The motherboard of the size) can be replaced with a large-size motherboard as long as the positions of the devices in the peripheral interface are the same (designed according to the same standard) and the fixed holes of the motherboard are designed according to the same standard. Therefore, according to the design layout shown in FIG. 3 and FIGS. 4 and 5, the standardization degree of the main board is higher and the compatibility is stronger.
  • the hard disk 18 in FIG. 3 is disposed on the same side as the main board 13 and is horizontally disposed.
  • the short side of the hard disk is aligned with the side of the main board, so that the length of the side of the main board by the side wall of the main box is larger, so that more outer portions can be disposed.
  • Set the interface to reduce the front-end peripheral interface The number of motherboards has a larger fan space at the front end. The number of fans that can be set is larger, the position can be changed, and the versatility of the motherboard is better.
  • the small-size motherboard is housed in a large-size mainframe, and the extra space can be set with a built-in extended battery.
  • a built-in extended battery 23 is provided between the battery 17 and the main board 13.
  • the back end of the motherboard can be extended to the hard disk, that is, the hard disk is attached to the motherboard.
  • the thickness of the optical drive is larger than the thickness of the hard disk, this arrangement does not cause excessive thickness increase of the host.
  • the CPU and GPU heat sinks in Figure 3 use a heat pipe heatsink.
  • the CPU heatsink has two fans 10, the GPU has only one fan, and the other chip is directly attached to the heat sink.
  • Fig. 6 shows a more detailed structure of the heat pipe type heat sink used in the CPU and the GPU.
  • the fan 10 is centrifugal, the heat radiating fins 7 are disposed on the heat pipe 8, and most of the heat radiating fins 7 are arranged in a circular arc shape.
  • the fan 10 Around the fan impeller 9, the fan 10 has no hood, and the main board 13 is directly the front side panel of the fan 10, that is, the air inlet 6 of the main board 13 is the air inlet of the fan 10.
  • the heat pipe type radiator of such a structure has no components that can be omitted, the space utilization rate has been maximized, the length of the heat pipe is short, and standardization is easy.
  • the heat pipe 8 shown in Figures 1, 3, 4, 5, and 6 is a tubular heat pipe, and a plate type heat pipe can also be used, which has a stronger heat transfer capability.
  • the air is sucked from one side of the main board by the driving of the fan 10, directly blown onto the heat radiating fins 7, and then flows along the main board, and an exhaust window 22 is opened on the side wall of the main body near the hard disk 18, as shown in FIG.
  • This design allows air to flow through a large area of the motherboard, dissipating heat from other components on the motherboard, and the hard drive can be effectively dissipated.
  • the venting window 22 is remote from the intake window to reduce hot air backflow into the intake window.
  • the heat generation of the battery 17 is also large, so it should be considered that an exhaust window is opened on the side wall beside the battery 17, so that air flows through the battery.
  • the diagram shown in FIG. 3 is a rear view. From the front view, the peripheral interface 20 on the main board and the front peripheral interface 21 are disposed on the left front end corner of the main unit, that is, the peripheral interface is disposed on the left side, and the right side is disposed. Without a peripheral interface, this design is more convenient for the operator. Because people are used to operating the mouse in the right hand direction, placing items, such as cups, books, etc. If the peripheral interface is set on the right side, it is easy to interfere, and the air outlet 22 next to the hard disk will also face the right hand of the mouse. The hot air blown out in the summer will feel bad.
  • the design advantages of the front end of the battery 17 and the rear end of the optical drive 19 are as follows: As shown in FIG.
  • the lower cover 14 is opened with a window of the battery 17, and a battery cover 24 is provided, and the gap of the optical drive 19 is used.
  • the battery cover fastener 25 is provided to increase the space of the battery 17, and the capacity of the battery is also large.
  • the battery 17 and the battery cover 24 are shown as separate components, and the battery 17 and the battery cover 24 may be designed as a unitary structure.
  • Figure 8 shows a main assembly box of the present invention, and is equipped with a display 5 and a keyboard 1.
  • the air intake window opening 2 is disposed between the front end of the upper wall of the upper casing 3 of the main assembly and the keyboard 1, and has an elongated shape for the purpose of adding
  • the intake air flow area can also open a long air intake window on the front side wall of the upper casing.
  • a peripheral interface window 26 having a long and large opening structure is opened.
  • the peripheral interface port of the individual peripherals can be used to standardize the necessary interfaces of the computer, such as the network cable interface, the power socket, and the two USB interfaces (the position of each device is standardized).
  • the side walls of the case 3 and the lower cover 14 are respectively opened in half, which facilitates the mounting of the main board and facilitates the use of the plastic injection process.
  • the upper case and the lower cover can be designed as a two-injection molded overall structure, which has high production efficiency and low cost.
  • Figure 9 is a cross-sectional view showing a main assembly of the present invention, the upper wall of the upper casing 3 where the air intake window 2 is located is higher than the upper wall of the upper casing 3, so that the thickness of the keyboard 1 is increased.
  • the air chamber is high.
  • the height of the air inlet chamber should be more than 3 mm, that is, the inner surface of the front wall of the upper shell 3 is higher than the fixed surface of the main board (the main board fixing column 27 shown in the figure) The countertop) 3 mm or more.
  • the motherboard of the present invention shown in FIG. 10 is a motherboard in the computer shown in FIG.
  • the memory module slot 15 is disposed at the rear end of the position where the CPU or GPU is located, parallel to the front end side of the main board, and is adjacent to the opposite side of the side where the peripheral interface is located.
  • the memory module slot 15 is arranged such that the space between the hard disk and the optical drive (or battery) is used to place the memory module, as shown in FIG.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur un ordinateur portatif, sa carte mère et son enceinte, qui permet obtenir une généralisation standard pour la dimension de structure de la carte mère et de l’enceinte, et qui présente une grande compatibilité et une grande interchangeabilité, les structures caractéristiques clés étant : la carte mère (13), un disque dur et une unité de disque optique sont montés dans la coque supérieure (3) de l’enceinte, une unité centrale ou une puce GPU (12) est disposée sur le côté de la carte mère (13) faisant face vers le bas, une fenêtre d’entrée d’air (2) en forme de bande est formée sur l’extrémité antérieure de la coque supérieure (3), ainsi qu'une cavité d’entrée d’air (11), un ventilateur de refroidissement (10) est collé sur la carte mère (13) et un trou d’entrée d’air (6) du ventilateur de refroidissement sur la carte mère (13) est placé directement contre la fenêtre d’entrée d’air (2) ou la cavité d’entrée d’air (11), le disque dur est disposé sur l'extrémité inférieure de l’enceinte et sur le même côté que la carte mère et les interfaces d’équipement périphériques de la carte mère sont placées dans un coin antérieur de l’enceinte.
PCT/CN2009/072785 2009-07-16 2009-07-16 Ordinateur portatif, son enceinte et sa carte mère Ceased WO2011006301A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2009/072785 WO2011006301A1 (fr) 2009-07-16 2009-07-16 Ordinateur portatif, son enceinte et sa carte mère

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2009/072785 WO2011006301A1 (fr) 2009-07-16 2009-07-16 Ordinateur portatif, son enceinte et sa carte mère

Publications (1)

Publication Number Publication Date
WO2011006301A1 true WO2011006301A1 (fr) 2011-01-20

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PCT/CN2009/072785 Ceased WO2011006301A1 (fr) 2009-07-16 2009-07-16 Ordinateur portatif, son enceinte et sa carte mère

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3865978A1 (fr) * 2019-12-20 2021-08-18 INTEL Corporation Entrée mobile pour ventilateur
TWI738462B (zh) * 2020-08-13 2021-09-01 超恩股份有限公司 電腦主機

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1431572A (zh) * 2002-01-09 2003-07-23 广达电脑股份有限公司 笔记本电脑的散热模组件
US6606244B1 (en) * 1999-09-10 2003-08-12 Saint Song Corp. Pointing device having computer host
CN101290531A (zh) * 2008-06-18 2008-10-22 秦彪 便携式计算机
CN101587363A (zh) * 2009-07-03 2009-11-25 秦彪 笔记本式计算机及其主机盒与主板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6606244B1 (en) * 1999-09-10 2003-08-12 Saint Song Corp. Pointing device having computer host
CN1431572A (zh) * 2002-01-09 2003-07-23 广达电脑股份有限公司 笔记本电脑的散热模组件
CN101290531A (zh) * 2008-06-18 2008-10-22 秦彪 便携式计算机
CN101587363A (zh) * 2009-07-03 2009-11-25 秦彪 笔记本式计算机及其主机盒与主板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3865978A1 (fr) * 2019-12-20 2021-08-18 INTEL Corporation Entrée mobile pour ventilateur
US11304329B2 (en) 2019-12-20 2022-04-12 Intel Corporation Movable inlet for a fan
TWI738462B (zh) * 2020-08-13 2021-09-01 超恩股份有限公司 電腦主機

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