WO2011025307A3 - 저온 경화성 감광성 수지 조성물 및 이를 이용하여 제조된 드라이 필름 - Google Patents

저온 경화성 감광성 수지 조성물 및 이를 이용하여 제조된 드라이 필름 Download PDF

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Publication number
WO2011025307A3
WO2011025307A3 PCT/KR2010/005795 KR2010005795W WO2011025307A3 WO 2011025307 A3 WO2011025307 A3 WO 2011025307A3 KR 2010005795 W KR2010005795 W KR 2010005795W WO 2011025307 A3 WO2011025307 A3 WO 2011025307A3
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WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
curable
low temperature
dry film
Prior art date
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Ceased
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PCT/KR2010/005795
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English (en)
French (fr)
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WO2011025307A2 (ko
Inventor
이광주
고주은
김병남
송헌식
경유진
김희정
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LG Chem Ltd
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LG Chem Ltd
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Priority to JP2012510762A priority Critical patent/JP5707394B2/ja
Priority to CN2010800075281A priority patent/CN102317862B/zh
Publication of WO2011025307A2 publication Critical patent/WO2011025307A2/ko
Publication of WO2011025307A3 publication Critical patent/WO2011025307A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

본 발명은 특정 구조의 반복 단위를 포함하는 폴리아믹산; 헤테로고리 아민 화합물; 탄소간 이중결합을 포함하는 (메타)아크릴레이트계 화합물; 광중합 개시제; 및 유기 용매를 포함하는 감광성 수지 조성물 및 이로부터 제조된 드라이 필름에 관한 것으로서, 상기 감광성 수지 조성물은 낮은 온도에서 경화가 가능하여 공정의 안정성 및 공정 작업상의 편리성을 제공할 수 있으며, 우수한 내열성 및 기계적 물성을 나타낼 뿐만 아니라 우수한 내굴곡성, 납땜 내열성 및 패턴 채움성 등의 특성을 구현할 수 있다.
PCT/KR2010/005795 2009-08-28 2010-08-27 저온 경화성 감광성 수지 조성물 및 이를 이용하여 제조된 드라이 필름 Ceased WO2011025307A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012510762A JP5707394B2 (ja) 2009-08-28 2010-08-27 低温硬化性感光性樹脂組成物およびこれを用いて製造されたドライフィルム
CN2010800075281A CN102317862B (zh) 2009-08-28 2010-08-27 可低温固化的光敏树脂组合物和用该组合物制备的干膜

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20090080612 2009-08-28
KR10-2009-0080612 2009-08-28

Publications (2)

Publication Number Publication Date
WO2011025307A2 WO2011025307A2 (ko) 2011-03-03
WO2011025307A3 true WO2011025307A3 (ko) 2011-07-07

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PCT/KR2010/005795 Ceased WO2011025307A2 (ko) 2009-08-28 2010-08-27 저온 경화성 감광성 수지 조성물 및 이를 이용하여 제조된 드라이 필름

Country Status (6)

Country Link
US (1) US8288656B2 (ko)
JP (1) JP5707394B2 (ko)
KR (1) KR101021947B1 (ko)
CN (1) CN102317862B (ko)
TW (1) TWI418935B (ko)
WO (1) WO2011025307A2 (ko)

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KR20130108027A (ko) 2012-03-23 2013-10-02 주식회사 엘지화학 유기전자소자용 기판의 제조방법
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WO2013165211A1 (ko) * 2012-05-03 2013-11-07 주식회사 엘지화학 신규한 폴리아믹산, 감광성 수지 조성물, 드라이 필름 및 회로 기판
CN103694701B (zh) * 2012-09-27 2017-07-21 新日铁住金化学株式会社 聚酰胺酸组合物、聚酰亚胺组合物、电路基板及其使用方法与层压体以及其制造方法
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CN105388703A (zh) * 2015-12-10 2016-03-09 苏州城邦达力材料科技有限公司 一种用于制备感光性覆盖膜的感光组合物及fpc用感光性覆盖膜的制备方法和应用方法
KR102329943B1 (ko) * 2016-03-16 2021-11-22 동우 화인켐 주식회사 네가티브 감광형 수지 조성물 및 이로부터 제조된 광경화 패턴
JP6947519B2 (ja) * 2016-04-14 2021-10-13 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置
CN110462514B (zh) * 2017-03-29 2023-12-15 富士胶片株式会社 感光性树脂组合物、固化膜、层叠体、固化膜的制造方法及半导体器件
CN108196429B (zh) * 2017-12-06 2022-02-11 中国乐凯集团有限公司 一种水洗凸版感光树脂组合物及制品
TWI851752B (zh) * 2019-07-01 2024-08-11 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化性樹脂組成物的製造方法、硬化膜、積層體、硬化膜的製造方法及半導體器件
JP7495477B2 (ja) * 2020-03-19 2024-06-04 富士フイルム株式会社 転写フィルム、感光性材料、パターン形成方法、回路基板の製造方法、タッチパネルの製造方法
JP2022126150A (ja) * 2021-02-18 2022-08-30 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング レジスト膜厚膜化組成物および厚膜化パターンの製造方法
KR20220132106A (ko) * 2021-03-22 2022-09-30 삼성디스플레이 주식회사 경화성 수지 조성물 및 컬러 필터층을 포함하는 표시 장치
CN113061338B (zh) * 2021-05-08 2022-11-15 深圳先进电子材料国际创新研究院 聚酰胺酸组合物、聚酰亚胺组合物、聚酰亚胺薄膜及聚酰亚胺覆铜板

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US20110067907A1 (en) 2011-03-24
US8288656B2 (en) 2012-10-16
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