WO2011055902A2 - Scie à fil et procédé de fabrication d'une scie à fil - Google Patents

Scie à fil et procédé de fabrication d'une scie à fil Download PDF

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Publication number
WO2011055902A2
WO2011055902A2 PCT/KR2010/006210 KR2010006210W WO2011055902A2 WO 2011055902 A2 WO2011055902 A2 WO 2011055902A2 KR 2010006210 W KR2010006210 W KR 2010006210W WO 2011055902 A2 WO2011055902 A2 WO 2011055902A2
Authority
WO
WIPO (PCT)
Prior art keywords
layer
diamond
wire
wire saw
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/006210
Other languages
English (en)
Korean (ko)
Other versions
WO2011055902A3 (fr
Inventor
이형윤
정용화
류민호
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Diamond Co Ltd
Original Assignee
Iljin Diamond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Diamond Co Ltd filed Critical Iljin Diamond Co Ltd
Publication of WO2011055902A2 publication Critical patent/WO2011055902A2/fr
Publication of WO2011055902A3 publication Critical patent/WO2011055902A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires

Definitions

  • the present invention relates to a wire saw and a method for producing a wire saw having a nickel electrodeposition layer disposed on a core wire outer surface and a protective plating layer covering diamond.
  • wire saws which are known in Korean Patent Laid-Open Publication No. 2006-118392, are super-coated particles separately coated with the wire 10 and the organic binder 16 and attached to the wire 10 ( And a superabrasive layer 12 having 14).
  • the superabrasive particles 14 are made of diamond or the like, and is formed to partially expose the outer side of the superabrasive layer 12.
  • the super abrasive layer 12 may be composed of a nickel electrodeposition layer and the like.
  • This conventional wire saw cuts the workpiece with the super abrasive grains 14 substantially serving as cutting edges.
  • the ultra abrasive particles 14 are substantially attached to the wire 10 so as to be fixed.
  • the abrasive layer 12 abuts against the workpiece and is rubbed.
  • the super abrasive layer 12 which is thus rubbed on the workpiece, is gradually worn out over time, and the thickness thereof becomes thinner.
  • the stress concentration at the portion where the superabrasive layer 12 and the superabrasive particle 14 abuts is increased, and thus, the superabrasive layer 12 adhered to the wire 10 by the superabrasive layer 12. Adhesion of the abrasive grains 14 is lowered, causing the super abrasive grains 14 to fall off from the superabrasive layer 12.
  • Prior Art 1 a first electrodeposition layer having a large and large diamond is formed on the outer circumferential surface of the wire, and the outside of the first electrodeposition layer is formed.
  • a second electrodeposition layer having thin and small diamonds is formed on the side.
  • thin and small diamonds are disposed between the large and large diamonds, and the binding force between the large and large diamonds and the thin and small diamonds is improved, thereby increasing hardness.
  • the prior art 1 also increases the stress concentration in the portion where the first electrodeposition layer and the large diamond contact each other and the portion where the second electrodeposition layer and the thin and small diamond contact each other when cutting the workpiece.
  • the adhesion strength of the large and thin diamonds and the small and small diamonds attached to the wires by the layer and the second electrodeposition layer, respectively, is reduced, resulting in the problem that the large and thin diamonds are separated from the first electrodeposition layer and the second electrodeposition layer. It was.
  • Prior Art 2 discloses a technique in which diamond is attached to an outer surface of a wire by an electrodeposition layer and an electroless plating layer.
  • the stress concentration of the portion where the electrodeposition layer, the electroless plating layer and the diamond contact each other when cutting the workpiece increases, respectively, the adhesion force of the diamond attached to the wire by the electrodeposition layer and the electroless plating layer, respectively. This lowered, causing the diamond to fall off from the electrodeposition layer and the electroless plating layer.
  • Japanese Laid-Open Patent Publication No. 1997-150314 discloses a technique in which diamond is attached to an outer surface of a wire by a nickel plating layer and a copper plating layer formed on the outer surface of the nickel plating layer.
  • the prior art 3 discloses a technique in which diamond is attached to an outer surface of a wire by a nickel plating layer and a copper plating layer formed on the outer surface of the nickel plating layer.
  • the prior art 3 also increases the stress concentration at the portion where the nickel plated layer, the copper plated layer and the diamond contact each other when cutting the workpiece, so that the adhesion force of the diamond attached to the wire by the nickel plated layer and the copper plated layer is lowered. As a result, a problem arises in that the diamond is dropped from the nickel plating layer and the copper plating layer.
  • the prior art 4 has the advantage of being able to quickly adhere the diamond to the outer peripheral surface of the core wire by the coating layer formed on the outer surface of the diamond, it is possible to increase the adhesion between the diamond and the plating layer.
  • the prior art 4 has no problem in that the protective layer for protecting the plated layer is not formed, and thus the plated layer is easily worn when cutting the workpiece or winding the core wire, thereby deteriorating durability.
  • the present invention is to solve the above problems, substantially prevent the super abrasive particles (diamonds) from falling off from the super abrasive layer (nickel electrodeposition layer) to attach the super abrasive particles (diamond) to the wire (core wire) to be fixed. It is an object of the present invention to provide a wire saw and a method for manufacturing the wire saw.
  • Wire saw, core wire of the present invention for achieving the above object;
  • Diamond is formed so that a portion is exposed to the outside of the nickel electrodeposition layer; It comprises a nickel plating layer and a protective plating layer covering the diamond.
  • the protective plating layer is characterized in that consisting of chromium or titanium or tungsten.
  • the adhesive force of a nickel electrodeposition layer and a protective plating layer can be improved.
  • the thickness of the core wire is 100 ⁇ 140 ⁇ m
  • the thickness of the nickel electrodeposition layer is 15 ⁇ 25 ⁇ m
  • the thickness of the protective plating layer is 1 ⁇ 5 ⁇ m.
  • the manufacturing method of the wire saw of the present invention the first step of electrodepositing the core wire through the first plating solution containing diamond; And a second step of forming the protective plating layer by passing the core wire through the second plating solution after the first step.
  • the wire saw of the present invention is covered by a protective plating layer with a nickel electrodeposition layer electrodeposited on the outer surface of the core wire and a diamond formed so as to partially expose the nickel electrodeposition layer to the outside.
  • the protective plating layer can prevent wear of the nickel electrodeposition layer and prevent the diamond from falling off from the nickel electrodeposition layer.
  • the wire saw of the present invention since the protective plating layer is composed of chromium, titanium or tungsten excellent in adhesion with nickel and relatively harder than nickel, it is possible to increase the adhesion between the nickel electrodeposition layer and the protective plating layer and at the same time nickel electrodeposition layer Wear can be prevented, resulting in an improved durability of the wire saw.
  • 1 is a schematic view showing a state of manufacturing the wire saw of the present invention.
  • FIG. 2 is a cross-sectional view of the wire saw located at A in FIG. 1.
  • FIG. 3 is a cross-sectional view of the wire saw located at B in FIG. 1.
  • FIG. 4 is a cross-sectional view of a wire saw showing a state in which diamond is exposed from the protective plating layer in FIG.
  • FIG. 5 is a cross-sectional view of a conventional wire saw.
  • the wire saw of the present invention As shown in FIG. 3, the wire saw of the present invention, the core wire 100, the nickel electrodeposition layer 200 electrodeposited on the outer surface of the core wire 100, and a part of the nickel electrodeposition layer 200 to the outside.
  • the diamond 300 is formed so as to expose, and the nickel electrodeposition layer 200 and the protective plating layer 400 covering the diamond 300 is configured to include.
  • the thickness of the core wire 100 is 100 ⁇ 160 ⁇ m.
  • the nickel electrodeposition layer 200 has a thickness of 15 to 25 ⁇ m.
  • the protective plating layer 400 covering the core wire 100 and the nickel electrodeposition layer 200 is too thick (more than 5 ⁇ m)
  • the protective plating layer 400 takes a long time to wear and thus cutting efficiency is reduced.
  • the thickness of the protective plating layer 400 when the thickness of the protective plating layer 400 is 1 ⁇ m or less, the thickness of the protective plating layer 400 may be relatively thin so that the ingot may be peeled off.
  • the thickness of the protective plating layer 400 is preferably 1 ⁇ 5 ⁇ m.
  • the wire saw of the present invention, the nickel electrodeposition layer 200 and the diamond 300 formed to expose a portion of the nickel electrodeposition layer 200 to the outside is covered by the protective plating layer 400 to protect Therefore, wear of the nickel electrodeposition layer 200 may be prevented and at the same time, the diamond 300 may be prevented from falling off from the nickel electrodeposition layer 200.
  • the other protective plating layer 400 (that is, the unworn protective plating layer 400) is the nickel electrodeposition layer 200 and diamond 300 Since the diamond 300 and the nickel electrodeposition layer 200 are covered, the diamond 300 is prevented from falling off from the nickel electrodeposition layer 200.
  • the protective plating layer 400 not only has excellent adhesion to nickel (Ni) constituting the nickel electrodeposition layer 200, but also has higher hardness than the nickel (Ni) chromium (Cr) or titanium (Ti). Or tungsten (W).
  • the protective plating layer 400 has a high adhesive strength with the nickel electrodeposition layer 200, so that peeling does not occur and durability thereof is improved.
  • the method for manufacturing a wire saw according to the present invention includes a first step of electrodepositing the core wire 100 through a first plating solution 611 containing diamond 300 and a second wire core 100 after the first step. And a second step of forming the protective plating layer 400 by passing through the plating liquid 612.
  • the first reel 501 supplies the core wire 100
  • the second reel 502 winds up the core wire 100 supplied from the first reel 501.
  • a first plating solution 611 is contained in the first bath 601, and a plurality of diamonds 300 are accommodated in the first plating solution 611.
  • a plate 701 made of nickel (Ni) is connected to the (+) pole of the first power supply unit 751 to be accommodated in the first plating solution 611, and the core wire 100 is connected to the ( ⁇ ) pole. .
  • the second bath 602 contains the second plating solution 612.
  • a plate 702 made of chromium (Cr), titanium (Ti), or tungsten (W) is connected to the (+) pole of the second power supply unit 752 to be accommodated in the second plating solution 612. )
  • the core wire 100 is connected to the pole.
  • the core wire 100 supplied from the first reel 501 is guided by a plurality of rollers 550, and includes a first bath 601 in which the first plating solution 611 is contained and a second plating solution 612.
  • the two tubs 602 are sequentially passed through and wound around the second reel 502.
  • the second reel 502 is rotated, the core wire 100 supplied from the first reel 501 is wound, and power is supplied to the power supply units 751 and 752.
  • nickel ions are generated in the plate 701 made of nickel (Ni) on the outer surface of the core wire 100 passing through the first bath 601, so that the core wire 100 may be formed.
  • Nickel electrodeposition layer 200 is formed while attaching diamond 300 to the outer surface.
  • the core wire 100 passing through the first bath 601 passes through the second bath 602.
  • the outer surface of the core wire 100 passing through the second bath 602 (that is, the core wire 100 to which the diamond 300 is attached by the nickel electrodeposition layer 200 is attached).
  • chromium or titanium or tungsten ions are generated in a plate 702 composed of chromium (Cr) or titanium (Ti) or tungsten (W), and finally the nickel electrodeposition layer 200 and diamond 300 are formed.
  • a wire saw having a protective plating layer 400 formed thereon is manufactured.
  • the wire saw of the present invention is suitably used to be capable of slicing a wafer or the like from a silicon ingot.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

La présente invention concerne une scie à fil, comprenant : un fil central et une couche de nickel déposée électrolytiquement sur une surface extérieure du fil central, un diamant agencé de telle sorte qu'une partie de celui-ci soit rendue visible vers l'extérieur depuis la couche de nickel déposée électrolytiquement, ainsi qu'une couche de revêtement protectrice qui recouvre la couche de nickel déposée électrolytiquement et le diamant. La présente invention concerne également un procédé de fabrication d'une scie à fil. La couche de revêtement protectrice, qui recouvre la couche de nickel déposée électrolytiquement et le diamant, empêche que le diamant ne s'échappe de la couche de nickel déposée électrolytiquement.
PCT/KR2010/006210 2009-11-03 2010-09-13 Scie à fil et procédé de fabrication d'une scie à fil Ceased WO2011055902A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0105330 2009-11-03
KR1020090105330A KR20110048659A (ko) 2009-11-03 2009-11-03 와이어 쏘 및 와이어 쏘의 제조방법

Publications (2)

Publication Number Publication Date
WO2011055902A2 true WO2011055902A2 (fr) 2011-05-12
WO2011055902A3 WO2011055902A3 (fr) 2011-07-14

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ID=43970489

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006210 Ceased WO2011055902A2 (fr) 2009-11-03 2010-09-13 Scie à fil et procédé de fabrication d'une scie à fil

Country Status (2)

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KR (1) KR20110048659A (fr)
WO (1) WO2011055902A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102392286A (zh) * 2011-11-14 2012-03-28 李园 制备金刚石线锯的设备及使用其制备金刚石线锯的方法
WO2014118003A1 (fr) * 2013-01-30 2014-08-07 Nv Bekaert Sa Fil de sciage abrasif fixe comprenant des interfaces d'oxyde de nickel entre des sous-couches de nickel
WO2018084811A1 (fr) * 2016-11-07 2018-05-11 Jcs Group Pte Ltd Fil de coupe et son procédé de fabrication
CN111394761A (zh) * 2019-12-28 2020-07-10 中国船舶重工集团公司第七一七研究所 一种金刚石钻头及其制备方法
CN117103482A (zh) * 2023-09-05 2023-11-24 晶科能源股份有限公司 一种切割线、切片机及硅棒的切片方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3508890A (en) * 1968-01-02 1970-04-28 Gen Electric Coated abrasive articles having plural metal coatings
US5551959A (en) * 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
JP4083177B2 (ja) * 2005-02-25 2008-04-30 株式会社ノリタケスーパーアブレーシブ ワイヤソー

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102392286A (zh) * 2011-11-14 2012-03-28 李园 制备金刚石线锯的设备及使用其制备金刚石线锯的方法
CN102392286B (zh) * 2011-11-14 2014-07-30 李园 制备金刚石线锯的设备及使用其制备金刚石线锯的方法
WO2014118003A1 (fr) * 2013-01-30 2014-08-07 Nv Bekaert Sa Fil de sciage abrasif fixe comprenant des interfaces d'oxyde de nickel entre des sous-couches de nickel
CN104955601A (zh) * 2013-01-30 2015-09-30 贝卡尔特公司 在镍亚层之间具有氧化镍界面的固定磨料锯线
CN104955601B (zh) * 2013-01-30 2017-09-12 江阴贝卡尔特合金材料有限公司 在镍亚层之间具有氧化镍界面的固定磨料锯线
WO2018084811A1 (fr) * 2016-11-07 2018-05-11 Jcs Group Pte Ltd Fil de coupe et son procédé de fabrication
CN111394761A (zh) * 2019-12-28 2020-07-10 中国船舶重工集团公司第七一七研究所 一种金刚石钻头及其制备方法
CN111394761B (zh) * 2019-12-28 2021-08-13 中国船舶重工集团公司第七一七研究所 一种金刚石钻头及其制备方法
CN117103482A (zh) * 2023-09-05 2023-11-24 晶科能源股份有限公司 一种切割线、切片机及硅棒的切片方法

Also Published As

Publication number Publication date
WO2011055902A3 (fr) 2011-07-14
KR20110048659A (ko) 2011-05-12

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