WO2011076021A1 - 一种印刷电路板屏蔽方法及印刷电路板 - Google Patents

一种印刷电路板屏蔽方法及印刷电路板 Download PDF

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Publication number
WO2011076021A1
WO2011076021A1 PCT/CN2010/076438 CN2010076438W WO2011076021A1 WO 2011076021 A1 WO2011076021 A1 WO 2011076021A1 CN 2010076438 W CN2010076438 W CN 2010076438W WO 2011076021 A1 WO2011076021 A1 WO 2011076021A1
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WIPO (PCT)
Prior art keywords
layer
oil layer
printed circuit
circuit board
copper foil
Prior art date
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Ceased
Application number
PCT/CN2010/076438
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English (en)
French (fr)
Inventor
沈晓兰
林蕾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Device Co Ltd
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Huawei Device Co Ltd
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Filing date
Publication date
Application filed by Huawei Device Co Ltd filed Critical Huawei Device Co Ltd
Priority to EP10838584A priority Critical patent/EP2519092A4/en
Priority to JP2012545063A priority patent/JP2013515358A/ja
Publication of WO2011076021A1 publication Critical patent/WO2011076021A1/zh
Priority to US13/530,734 priority patent/US20120261173A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Definitions

  • the invention relates to a method for shielding a printed circuit board and a printed circuit board.
  • the application is submitted to the Chinese Patent Office on December 22, 2009, and the application number is 200910254377. 9.
  • the invention is entitled "A printed circuit board shielding method and a printed circuit board”. Priority of the Chinese Patent Application, the entire contents of which is hereby incorporated by reference.
  • the present invention relates to a printed circuit board shield, and more particularly to a shielded method of a printed circuit board and a printed circuit board produced by the method. Background technique
  • PCBs Printed circuit boards
  • Printed circuit boards often have high-speed signal lines, clock lines, etc., which transmit strong interference signals, which are radiated in the form of electromagnetic waves. It is necessary to provide a shield layer in its adjacent layer, usually a power/ground plane, which provides reflow on the one hand and shields on the other.
  • Embodiments of the present invention provide a printed circuit board shielding method and a printed circuit board to overcome the defects of high shielding cost and long manufacturing cycle of existing printed circuit boards.
  • Embodiments of the present invention provide a method for shielding a printed circuit board, the method comprising: providing a substrate; fabricating at least one layer of copper foil on the substrate; forming a first green oil layer on the surface copper foil; Forming a carbon oil layer covering the first green oil layer to shield the traces of all copper foil layers under the carbon oil layer on the printed circuit board.
  • the embodiment of the invention further provides a printed circuit board comprising: a substrate; at least one layer of copper foil formed on the substrate; a first green oil layer formed on the surface copper foil; a carbon oil layer covering The first green oil layer is shielded from traces of all copper foil layers below the carbon oil layer on the printed circuit board.
  • the embodiment of the present invention is directed to the disadvantage that the prior art printed circuit board increases the cost by shielding the copper foil and the shielding cover, and the shielding of the printed circuit board traces by using the carbon film can ensure the shielding effect, reduce the cost, and simplify the production.
  • Embodiment 1 is a flow chart of a method for shielding a printed circuit board according to Embodiment 1 of the present invention
  • FIG. 2 is a schematic structural view of a printed circuit board according to Embodiment 2 of the present invention.
  • FIG. 3 is a schematic structural view of a printed circuit board according to a third embodiment of the present invention. detailed description
  • This embodiment provides a method for shielding a printed circuit board. As shown in FIG. 1, the method includes: Step 101: providing a substrate;
  • Step 102 fabricating at least one layer of copper foil on the substrate
  • Step 103 forming a first green oil layer on the surface copper foil;
  • the first green oil layer is formed only on the outermost copper foil, that is, the surface copper foil.
  • the green oil layer covers the surface copper foil, and the position to be connected with the electronic component is exposed.
  • the surface copper foil needs to be grounded, and the green oil layer does not cover these locations.
  • Step 104 Form a carbon oil layer covering the first green oil layer to shield the traces of all the copper foil layers under the carbon oil layer on the printed circuit board.
  • the carbon oil layer is formed by printing by screen printing.
  • a layer of carbon oil is covered and grounded for shielding.
  • the carbon oil layer itself is electrically conductive, as long as the copper foil of the property on the PCB is exposed to make contact with the carbon oil layer, a carbon film can be formed over the surface trace to provide shielding. Or the carbon oil layer is connected to the large-area copper foil of the inner layer of the printed circuit board through the via hole, and the shielding layer can also be formed to achieve the shielding effect.
  • the carbon oil layer is different from the wiring network below it, in order to avoid short-circuiting of the carbon oil into the green oil and the contact copper foil, it is necessary to insulate the insulating layer between the carbon film and the copper foil for insulation, which may be added after the step of making the green oil layer.
  • the insulating layer is not completely overlapped with the first green oil layer, but the insulating layer is disposed on the surface of the first green oil layer corresponding to the surface copper foil according to the position of the surface copper foil.
  • the surface copper foil needs to be grounded or left in contact with the electronic components, and the insulation layer does not cover these locations.
  • the insulating layer is a second green oil layer, and the second green oil layer is formed by screen printing or by exposure development.
  • the insulating layer is a white oil layer, and the white oil layer is a mesh. Printing is formed by printing.
  • the insulating layer is not limited to the above-mentioned green oil layer or white oil layer, and any material that can achieve the function of the above insulating layer should be included in the protection range of the present invention.
  • Embodiment 2 by using the carbon oil layer as a shielding material, the material cost is saved compared with the copper foil or the shielding cover, and the printing carbon oil layer has only two steps of printing and baking, and the manufacturing process is simple and the cycle is short. The shielding effect is good.
  • Embodiment 2 by using the carbon oil layer as a shielding material, the material cost is saved compared with the copper foil or the shielding cover, and the printing carbon oil layer has only two steps of printing and baking, and the manufacturing process is simple and the cycle is short. The shielding effect is good.
  • the embodiment provides a printed circuit board which is fabricated by the method as described in the first embodiment. As shown in FIG. 2, the printed circuit board includes:
  • At least one layer of copper foil 202 is formed on the substrate;
  • a first green oil layer 203 is formed on the surface copper foil 202;
  • only one layer of copper foil is taken as an example, but it is not limited thereto.
  • circuit boards of different layers of copper foil such as 2, 4, 6, and 8 may be fabricated as needed, but the first green oil layer
  • the subsequently produced insulating layer and carbon oil layer are formed only on the outermost surface copper foil.
  • the three-layer construction of the above printed circuit board is the same as that of the prior art printed circuit board.
  • a carbon oil layer 205 covers the first green oil layer 203 to shield the traces of all copper foil layers below the carbon oil layer on the printed circuit board.
  • the surface layer copper foil 202 of the properties of the printed circuit board may be exposed to contact with the carbon oil layer 205 to form a shielding layer according to actual process requirements. It is also possible to connect the carbon oil layer to the ground property copper foil of a large area inside the printed circuit board through the via hole, and also form a shielding layer to reach the screen. The effect of the cover.
  • the surface of the first green oil layer 203 corresponds to the surface copper foil 202; the insulating layer 204 is disposed on the surface of the first green oil layer 203, but not all of the first green oil layer 203 is covered on the surface, only in the surface copper foil 202 corresponds to the position setting, in order to strengthen the protection of the surface copper foil 202, to prevent corrosion by the permeated carbon oil, resulting in a short circuit.
  • the insulating layer employs a second green oil layer.
  • the insulating layer is a white oil layer.
  • the insulating layer is not limited to the above-mentioned green oil layer or white oil layer, and any material that can achieve the function of the above insulating layer should be included in the protection range of the present invention.
  • the printed circuit board of the embodiment uses the carbon film to shield the printed circuit board traces, thereby ensuring the shielding effect, reducing the cost and simplifying the production.
  • the present embodiment provides a printed circuit board which is fabricated by the method as described in the first embodiment.
  • the printed circuit board provided in this embodiment is double-sided as compared with the second embodiment.
  • the double-sided trace shielding is based on the expansion of the second embodiment. It is external to the double-sided strong radiation trace of the PCB.
  • Each layer is covered with a carbon film and grounded for shielding. The structure of each layer is the same as that of the second embodiment. No longer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

一种印刷电路板屏蔽方法及印刷电路板 本申请要求于 2009 年 12 月 22 日提交中国专利局、 申请号为 200910254377. 9、 发明名称为 "一种印刷电路板屏蔽方法及印刷电路板" 的中国专利申请的优先权， 其全部内容通过引用包含于本申请中。
技术领域
本发明涉及一种印刷电路板屏蔽， 尤其涉及一种印刷电路板的屏蔽方 法和采用该方法制成的印刷电路板。 背景技术
印刷电路板（PCB板）上经常有高速信号线、 时钟线等走线， 这类走线 上传输的是强干扰信号， 信号会以电磁波的形式辐射出来。 需要在其相邻 层设置屏蔽层， 通常为电源 /地平面， 一方面提供回流， 一方面进行屏蔽。
现有技术中， 在原有 PCB板的基础上， 再增加两层铜箔。 将强辐射线 走到里层， 外层铺地。 这样一来， 原先是两层板， 第一层和第二层都有走 线， 但走线的辐射太大。 为了避免这一缺陷， 就将 PCB板做成四层板， 将 走线埋入第二层和第三层， 第一层和第四层对应走线的地方铺一层接地的 铜皮， 对内层的走线进行屏蔽。
在实践中， 本发明人发现现有技术这种方案存在如下不足： 需要增加 PCB板的层数， 成本也就相应增加， 制作铜箔线路需要曝光、 显影等步骤， 制作周期长。 发明内容
本发明实施例提供一种印刷电路板屏蔽方法和印刷电路板， 以克服现 有印刷电路板屏蔽成本高、 制作周期长的缺陷。
本发明实施例提供一种印刷电路板屏蔽方法， 该方法包括： 提供一基 板； 于所述基板上制作至少一层铜箔； 于表层铜箔上形成第一绿油层； 形 成一碳油层， 覆盖所述第一绿油层， 以对印刷电路板上碳油层下方所有铜 箔层的走线形成屏蔽。
本发明实施例还提供一种印刷电路板， 包括： 一基板； 至少一层铜箔， 制作于所述基板之上； 一第一绿油层， 形成于表层铜箔之上； 一碳油层， 覆盖所述第一绿油层， 以对印刷电路板上碳油层下方所有铜箔层的走线形 成屏蔽。
本发明实施例针对现有技术印刷电路板通过增加铜箔和屏蔽盖进行屏 蔽造成成本增加的缺点， 利用碳膜实现印刷电路板走线的屏蔽， 能够保障 屏蔽效果， 同时降低成本， 简化生产。 附图说明
此处所说明的附图用来提供对本发明的进一步理解， 构成本申请的一 部分， 并不构成对本发明的限定。 在附图中：
图 1为本发明实施例一的印刷电路板屏蔽方法的流程图；
图 2为本发明实施例二的印刷电路板的结构示意图；
图 3为本发明实施例三的印刷电路板的结构示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚明白， 下面结合 实施例和附图， 对本发明实施例做进一步详细说明。 在此， 本发明的示意 性实施例及其说明用于解释本发明， 但并不作为对本发明的限定。
实施例一
本实施例提供一种印刷电路板屏蔽方法。 如图 1所示， 该方法包括： 步骤 101 : 提供一基板；
步骤 102: 于所述基板上制作至少一层铜箔；
在该步骤中， 是在基板表面制作铜箔， 铜箔的层数可以是 2、 4、 6等 多层。 步骤 103: 于表层铜箔上形成第一绿油层；
在制作多层铜箔的情况下， 只在最表面的铜箔上， 也就是表层铜箔上 形成第一绿油层。
以上三步采用目前常用的工艺即可， 绿油层覆盖表层铜箔， 将需要与 电子元件连接的位置进行裸露。 另外， 根据实际工艺需要， 还可以将表层 铜箔需要接地的位置裸露， 绿油层不覆盖这些位置。
步骤 104: 形成一碳油层， 覆盖所述第一绿油层， 以对印刷电路板上碳 油层下方所有铜箔层的走线形成屏蔽。
所述碳油层采用采用丝网印刷的方式印刷形成。
本实施例是在 PCB单面的强辐射走线外部， 覆盖一层碳油层并接地， 进行屏蔽。
由于碳油层本身具有导电性， 只要将 PCB上地属性的铜箔外露， 使之 与碳油层接触， 就可以在表层走线上方做出一层碳膜， 起到屏蔽作用。 或 者碳油层通过过孔与印刷电路板内层大面积的地属性铜箔连接， 也能够形 成屏蔽层， 达到屏蔽的效果。
由于碳油层与其下方的走线网络不同， 为避免碳油渗透进绿油、 接触 铜箔发生短路， 需要在碳膜和铜箔之间印刷绝缘层进行绝缘， 可以在制作 绿油层的步骤之后增加一个步骤： 在所述第一绿油层表面与表层铜箔对应 的位置形成一绝缘层。
在该步骤中， 所述绝缘层不是与第一绿油层完全重合， 而是根据表层 铜箔的位置， 在第一绿油层表面， 与表层铜箔相对应的位置才设置绝缘层， 同样， 在表层铜箔需要接地或者与电子元件连接的位置保持裸露， 绝缘层 也不覆盖这些位置。
在一较佳实施例中， 所述绝缘层采用第二绿油层， 所述第二绿油层采 用丝网印刷的方式印刷形成或曝光显影法形成。
在另一较佳实施例中， 所述绝缘层采用白油层， 所述白油层采用丝网 印刷的方式印刷形成。
所述绝缘层并不限定于上述绿油层或者白油层， 对于本领域的技术人 员来讲， 只要能够达到上述绝缘层功能的任何材质， 都应包括在本发明保 护范围之内。
制作 PCB 时， 先按照常规制作过程， 制作表层铜箔和第一层绿油。 然 后铜箔对应之处， 采用丝网印刷的方式印刷第二层绿油、 固化， 最后再用 丝网印刷的方式印刷碳油、 烘烤固化即可。
本实施例通过用碳油层作屏蔽材料， 与用铜箔或者屏蔽盖相比， 节省 材料成本， 并且印刷碳油层只有印刷和烘烤两个个步骤， 制作工序简单， 周期短。 屏蔽效果好。 实施例二
本实施例提供一种印刷电路板， 其采用如实施例一所述的方法制成， 如图 2所示， 该印刷电路板包括：
一基板 201 ;
至少一层铜箔 202， 制作于所述基板之上；
第一绿油层 203， 形成于表层铜箔 202之上；
在本实施例中， 仅以一层铜箔为例， 但并不仅限于此， 实际应用中可 以根据需要制作 2、 4、 6、 8等不同层数铜箔的电路板， 但第一绿油层以及 后续制作的绝缘层和碳油层仅在最表面的表层铜箔上形成。
以上印刷电路板的三层构造与现有技术印刷电路板的构造相同。
一碳油层 205， 覆盖所述第一绿油层 203， 以对印刷电路板上碳油层下 方所有铜箔层的走线形成屏蔽。
根据实际工艺需要， 可以将所述印刷电路板地属性的表层铜箔 202外 露， 与所述碳油层 205相互接触， 形成屏蔽层。 也可以使碳油层通过过孔 与印刷电路板内层大面积的地属性铜箔连接， 也能够形成屏蔽层， 达到屏 蔽的效果。
由于碳油层与其下方的走线网络不同， 为避免碳油渗透进绿油、 接触 铜箔发生短路， 需要在碳膜和铜箔之间印刷绝缘层进行绝缘， 可以增加一 绝缘层 204，形成于所述第一绿油层 203表面与表层铜箔 202相对应的位置; 该绝缘层 204设置在第一绿油层 203的表面， 但不是全部第一绿油层 203表面都覆盖， 只是在与表层铜箔 202相对应的位置设置，这样是为了加 强对表层铜箔 202的保护， 防止被渗透过碳油腐蚀， 造成短路。
在一较佳实施例中， 所述绝缘层采用第二绿油层。
在另一较佳实施例中， 所述绝缘层采用白油层。
所述绝缘层并不限定于上述绿油层或者白油层， 对于本领域的技术人 员来讲， 只要能够达到上述绝缘层功能的任何材质， 都应包括在本发明保 护范围之内。本实施例的印刷电路板利用碳膜实现印刷电路板走线的屏蔽， 能够保障屏蔽效果， 同时降低成本， 简化生产。
实施例三
本实施例提供一种印刷电路板， 其采用如实施例一所述的方法制成， 如图 3所示， 与实施例二相比， 本实施例提供的印刷电路板是双面的。 双 面走线屏蔽是在实施例二基础上的扩充， 是在 PCB双面强辐射走线外部， 各覆盖一层碳膜并接地， 进行屏蔽， 其各个层面结构与实施例二相同， 再 此不再赘述。 以上所述的具体实施例， 对本发明的目的、 技术方案和有益效果进行 了进一步详细说明， 所应理解的是， 以上所述仅为本发明的具体实施例而 已， 并不用于限定本发明的保护范围， 凡在本发明的精神和原则之内， 所 做的任何修改、 等同替换、 改进等， 均应包含在本发明的保护范围之内。

Claims

权利要求
1. 一种印刷电路板屏蔽方法， 其特征在于， 该方法包括：
提供一基板；
于所述基板上制作至少一层铜箔；
于表层铜箔上形成第一绿油层；
形成一碳油层， 覆盖所述第一绿油层， 以对印刷电路板上碳油层下方 所有铜箔层的走线形成屏蔽。
2. 根据权利要求 1所述的方法， 其特征在于， 在形成碳油层之前还包 括：
于所述第一绿油层表面与表层铜箔相对应的位置形成一绝缘层。
3. 根据权利要求 2所述的方法， 其特征在于： 所述绝缘层是第二绿油 层或白油层。
4. 根据权利要求 3所述的方法， 其特征在于： 所述第二绿油层采用丝 网印刷的方式印刷形成或曝光显影法形成。
5. 根据权利要求 3所述的方法， 其特征在于： 所述白油层采用丝网印 刷的方式印刷形成。
6. 根据权利要求 1所述的方法， 其特征在于： 所述碳油层采用采用丝 网印刷的方式印刷形成。
7. 根据权利要求 1所述的方法， 其特征在于： 所述印刷电路板地属性 的铜箔外露， 与所述碳油层相互接触， 形成屏蔽层； 或者
所述碳油层通过过孔与印刷电路板内层大面积的地属性铜箔连接， 形 成屏蔽层。
8. 一种印刷电路板， 其特征在于， 该印刷电路板包括：
一基板；
至少一层铜箔， 制作于所述基板之上；
第一绿油层， 形成于表层铜箔之上； 一碳油层， 覆盖所述第一绿油层和所述绝缘层， 以对印刷电路板上碳 油层下方所有铜箔层的走线形成屏蔽。
9. 根据权利要求 8所述的印刷电路板， 其特征在于， 还包括： 一绝缘层， 形成于所述第一绿油层表面与表层铜箔相对应的位置。
10. 根据权利要求 8或 9所述的印刷电路板， 其特征在于：
所述印刷电路板地属性的铜箔外露， 与所述碳油层相互接触， 形成屏 蔽层； 或者
所述碳油层通过过孔与印刷电路板内层大面积的地属性铜箔连接， 形 成屏蔽层。
11. 根据权利要求 9所述的印刷电路板， 其特征在于： 所述绝缘层是 第二绿油层或白油层。
PCT/CN2010/076438 2009-12-22 2010-08-28 一种印刷电路板屏蔽方法及印刷电路板 Ceased WO2011076021A1 (zh)

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EP10838584A EP2519092A4 (en) 2009-12-22 2010-08-28 METHOD FOR BLINKING A PRINTED CIRCUIT BOARD AND ASSOCIATED PRINTED CIRCUIT BOARD
JP2012545063A JP2013515358A (ja) 2009-12-22 2010-08-28 印刷回路基板をシールドするための方法およびその印刷回路基板
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