WO2011127416A2 - Support mécanique amélioré destiné à un dispositif de refroidissement thermoélectrique à couche mince - Google Patents

Support mécanique amélioré destiné à un dispositif de refroidissement thermoélectrique à couche mince Download PDF

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Publication number
WO2011127416A2
WO2011127416A2 PCT/US2011/031807 US2011031807W WO2011127416A2 WO 2011127416 A2 WO2011127416 A2 WO 2011127416A2 US 2011031807 W US2011031807 W US 2011031807W WO 2011127416 A2 WO2011127416 A2 WO 2011127416A2
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WO
WIPO (PCT)
Prior art keywords
mechanical support
heat
improved mechanical
disposed
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/031807
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English (en)
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WO2011127416A3 (fr
Inventor
Anthony P. Arnold
Ramaswamy Mahadevan
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2011127416A2 publication Critical patent/WO2011127416A2/fr
Publication of WO2011127416A3 publication Critical patent/WO2011127416A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof

Definitions

  • the present invention relates generally to thin-film thermoelectric cooling devices and particulariy to thin-film thermoelectric cooling devices for persona! heat control applications. More specifically, the present invention relates to an improved mechanical support for a personal heat control device employing a thin-film
  • thermoelectric cooling apparatus which may be worn by an Individual to control his or her body temperature.
  • thermoelectric cooling devices employing the Peltier effect for controlling the temperature of electronic, electro-optical and electro-mechanical devices
  • the Peltier effect Is applied to heating and/or cooling situations in which heat is either drawn from or directed to an interface between two different conducting materials In response to a flow of electrical current therebetween.
  • Peltier Cooler Component with a Peltier Cooler, published on June 30, 2005.
  • the Weigert publication discloses an optoelectronic assembly including a cooling element comprising a Peltier cooler of a thickness of less than one nanometer which Is embedded in silicon and which may be either coupled directly to the optical component or mounted on a substrate material coupled to the optical component.
  • a Peltier effect cooler Is disclosed by Bottner et al. in U.S. Patent No.
  • thermoelectric cooling apparatus for cooling a microelectromeehanical device which addresses the problems associated with lateral mechanical stresses generated between thin thermoelectric cooler layers as a result of differences between the coefficients of thermal expansion of the substrate materials.
  • thermoelectric cooling apparatus for cooling a microelectromeehanical device which addresses the problems associated with lateral mechanical stresses generated between thin thermoelectric cooler layers as a result of differences between the coefficients of thermal expansion of the substrate materials.
  • thermoelectric cooling device having properties of strength and rigidity sufficient to provide adequate structural support, and which also possesses thermal conductivity characteristics and chemical reactive properties which will enhance the operating efficiency of the device and minimize surface discoloration.
  • the mechanical support system of the present invention addresses the aforementioned problems associated with the prior art by providing a mechanical support for a TEC having sufficient holes or cutout regions formed therein to Increase the thermal resistance between the hot and the cold sides of the TEC.
  • a mechanical support system Is provided which includes a pyrogel insulation layer disposed in a recess formed in the mechanical support system between that mechanical support system and the composite heat spreader assembly.
  • a mechanical support system which includes a thermally insulating mechanical support disposed intermediate the TEC and the composite heat spreader assembly.
  • portions of the composite heat spreader assembly may be formed of copper or a copper alloy and may further include an exposed silicon pad or SIL Pad positioned on the cooling face of the device to prevent the greening or discoloration of copper materials employed in the construction of the device.
  • Fig. 1 is a cross-sectional side elevational view of a prior art thermoelectric cooling device and mechanical support system
  • Fig. 2 is a cross-sectional side elevational view of a thermoelectric cooling device and mechanical support system of an embodiment of the present Invention
  • thermoelectric cooling device and mechanical support system in accordance with another embodiment of the present invention.
  • Fig. 4 is a cross-sectional side elevational view of a thermoelectric cooling device and mechanical support system In accordance with yet another embodiment of the present invention.
  • thermoelectric cooling device includes a heat sink 12, a heat pump 14 having a hot side 16 and a cold side 18, a mechanical support structure 20 and a heat spreader assembly 22 forming the cooling side of the device constructed as a
  • the heat pump shown is a UPF Model 40 designed and manufactured by Nextreme Thermal Solutions of Durham, North Carolina; however, it is to be appreciated that other types of heat pumps may be used without departing from the scope of the present Invention.
  • the heat pump 14 comprises a TEC unit 28, by way of example, a CP20151 module (which is not a thin-film TEC) that is commercially available from GUI, Inc.; although, other commercially available TEC modules may be used.
  • the spreader layer 24 is positioned on the cold side 18 of the device to spread the heat over a larger surface area.
  • the spreader layer 20 is typically manufactured from copper or a copper alloy due to their high thermal conductivity properties; however, other materials having comparable thermal properties may he used in this application as well.
  • spreader layer 24 Is overlaid with a protective layer or pad 28 generally known to those skilled in the art as a SIL pad, the primary function of which is to protect the copper layer from so-called "greening". Greening is an undesirable surface discoloration attributable to chemical reactions which occur at the surface of the copper layer as a result of contact with other materials, moisture and oxygen.
  • the mechanical support structure 16 provides a parasitic shunt thermal path between the hot and the cold sides of the TEC, thereby reducing its efficiency. Accordingly, it is desirable to increase the thermal resistance of the support structure which may be accomplished by decreasing the area of support, or by introducing a layer of material having a low thermal conductivity, as will be described in greater detail below.
  • thermoelectric cooling device employing a mechanical support system in accordance with an embodiment of the present
  • the device includes a heat sink 52 forming a hot side 54 of the TEC, a thin-film Peltier cooler or heat pump 58 and a mechanical support structure 58.
  • the improved mechanical support structure 58 having air ⁇ Hed apertures 60 formed therein is disposed intermediate a heat spreader assembly 62 (of substantially the same construction as the heat spreader assembly of the embodiment of Fig, 1) and the hot side 54 of the heat sink 52 to reduce the surface area of the supporting material and to, in effect, reduce the thermal conductivity of the support structure.
  • the reduction in thermal conductivity increases the overall efficiency of the TEG.
  • Stationary members 64 are disposed between the heat pump 56 and a corresponding one of the mechanical support structures 58 to form the air-fled apertures 60,
  • a thin-film thermoelectric cooling device employing a mechanical support system is illustrated generally by the numeral 150 in Fig. 3.
  • the device includes a heat sink 152, a thin-film Peltier cooler or heat pump 156 having a hoi side 154 and a cold side 155, and a mechanical support structure 158, as hereinabove describee! with respect to the embodiment of Fig. 2.
  • the mechanical support structure 158 includes recessed areas 170 formed therein containing an insulating member 158 disposed intermediate a heat spreader assembly 162 and the support structure 158 on the cold side 155 of the TEC.
  • the insulating member 159 includes insulating material such as a pyrogel or other suitable materia! having a low thermal conductivity.
  • the recesses 170 reduce the surface area of the supporting material, and the insulating member 158 positioned in the recessed areas 170 cooperates therewith to effectively reduce the overall thermal conductivity of the support structure, thereby enhancing the efficiency of the TEC.
  • the mechanical support structure 158 further includes an extension member 172 extending inwardly so that an end portion of the extension member is disposed adjacent the heat pump 158.
  • the extension member 172 Is coupled to the hot side 154 on one side and coupled to the insulating member 159 on another side.
  • a thin-film thermoelectric cooling device employing a mechanical support system in accordance with yet another embodiment of the instant invention is Illustrated generally by the numeral 250.
  • the device includes a heat sink 252, a thin-film Peltier cooler or heat, pump 256 having a hot side 254 and a cold side 255, and a mechanical support structure 258, as hereinabove described with respect to the embodiments of Figs. 2 and 3,
  • the mechanical support structure 258 is of a simplified, generally rectangular configuration when compared to the mechanical support structure configurations of the embodiments described earlier herein or the prior art and includes enlarged apertures 260.
  • the apertures 260 do not contain any insulating material (other than the ambient atmosphere) and serve to reduce the thermal conductivity or the support structure, thereby increasing the overall efficiency of the TEC,

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention a trait à un support mécanique amélioré destiné à un dispositif de commande de chaleur individuel. Le support mécanique amélioré inclut un puits de chaleur, un ensemble de distribution de chaleur, une pompe à chaleur et une pluralité de structures de support mécanique. Le puits de chaleur est pourvu d'un côté chaud et l'ensemble de distribution de chaleur est disposé de manière à être adjacent au puits de chaleur du côté chaud. La pompe à chaleur est disposée du côté chaud. La pluralité de structures de support mécanique est configurée et agencée de manière à supporter le puits de chaleur sur l'ensemble de distribution de chaleur.
PCT/US2011/031807 2010-04-09 2011-04-08 Support mécanique amélioré destiné à un dispositif de refroidissement thermoélectrique à couche mince Ceased WO2011127416A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32272410P 2010-04-09 2010-04-09
US61/322,724 2010-04-09

Publications (2)

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WO2011127416A2 true WO2011127416A2 (fr) 2011-10-13
WO2011127416A3 WO2011127416A3 (fr) 2012-02-02

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PCT/US2011/031807 Ceased WO2011127416A2 (fr) 2010-04-09 2011-04-08 Support mécanique amélioré destiné à un dispositif de refroidissement thermoélectrique à couche mince

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013169772A1 (fr) * 2012-05-07 2013-11-14 Phononic Devices, Inc. Systèmes et méthodes associés à un système d'échange de chaleur thermoélectrique
WO2014131460A1 (fr) * 2013-02-28 2014-09-04 Klondike Innovations Limited Refroidissement de composants thermogènes
US8893513B2 (en) 2012-05-07 2014-11-25 Phononic Device, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
WO2015066049A1 (fr) * 2013-10-28 2015-05-07 Phononic Devices, Inc. Pompe à chaleur thermoélectrique ayant une structure de périphérie et d'écartement (sas)
CN108227350A (zh) * 2016-12-14 2018-06-29 台达电子工业股份有限公司 数字微型反射投影机
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US10473345B2 (en) 2016-06-20 2019-11-12 Phononic, Inc. Cooled fan for micro-climate control
WO2020143517A1 (fr) * 2019-01-09 2020-07-16 上海众链科技有限公司 Ensemble boîtier emmanché à l'extérieur d'un terminal intelligent, et terminal intelligent

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7440283B1 (en) * 2007-07-13 2008-10-21 Baker Hughes Incorporated Thermal isolation devices and methods for heat sensitive downhole components

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341394B2 (en) 2012-05-07 2016-05-17 Phononic Devices, Inc. Thermoelectric heat exchange system comprising cascaded cold side heat sinks
US8893513B2 (en) 2012-05-07 2014-11-25 Phononic Device, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US8991194B2 (en) 2012-05-07 2015-03-31 Phononic Devices, Inc. Parallel thermoelectric heat exchange systems
WO2013169772A1 (fr) * 2012-05-07 2013-11-14 Phononic Devices, Inc. Systèmes et méthodes associés à un système d'échange de chaleur thermoélectrique
US9103572B2 (en) 2012-05-07 2015-08-11 Phononic Devices, Inc. Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system
US10012417B2 (en) 2012-05-07 2018-07-03 Phononic, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US9234682B2 (en) 2012-05-07 2016-01-12 Phononic Devices, Inc. Two-phase heat exchanger mounting
US9310111B2 (en) 2012-05-07 2016-04-12 Phononic Devices, Inc. Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system
WO2014131460A1 (fr) * 2013-02-28 2014-09-04 Klondike Innovations Limited Refroidissement de composants thermogènes
WO2015066049A1 (fr) * 2013-10-28 2015-05-07 Phononic Devices, Inc. Pompe à chaleur thermoélectrique ayant une structure de périphérie et d'écartement (sas)
US9144180B2 (en) 2013-10-28 2015-09-22 Phononic Devices, Inc. Thermoelectric heat pump with a surround and spacer (SAS) structure
CN105874623B (zh) * 2013-10-28 2019-01-29 弗诺尼克设备公司 具有环绕和间隔(sas)结构的热电热泵
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US10473345B2 (en) 2016-06-20 2019-11-12 Phononic, Inc. Cooled fan for micro-climate control
CN108227350A (zh) * 2016-12-14 2018-06-29 台达电子工业股份有限公司 数字微型反射投影机
WO2020143517A1 (fr) * 2019-01-09 2020-07-16 上海众链科技有限公司 Ensemble boîtier emmanché à l'extérieur d'un terminal intelligent, et terminal intelligent

Also Published As

Publication number Publication date
WO2011127416A3 (fr) 2012-02-02

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