WO2011137995A2 - Procédé et dispositif de mesure de propriétés de liaison d'un composite de matériaux - Google Patents

Procédé et dispositif de mesure de propriétés de liaison d'un composite de matériaux Download PDF

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Publication number
WO2011137995A2
WO2011137995A2 PCT/EP2011/002171 EP2011002171W WO2011137995A2 WO 2011137995 A2 WO2011137995 A2 WO 2011137995A2 EP 2011002171 W EP2011002171 W EP 2011002171W WO 2011137995 A2 WO2011137995 A2 WO 2011137995A2
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WO
WIPO (PCT)
Prior art keywords
deformation
measured
elements
connection property
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/002171
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German (de)
English (en)
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WO2011137995A3 (fr
Inventor
Tina Wilhelm
Wolfgang Schmidt
Michael Hinnen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Publication of WO2011137995A2 publication Critical patent/WO2011137995A2/fr
Publication of WO2011137995A3 publication Critical patent/WO2011137995A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/16—Investigating or analyzing materials by the use of thermal means by investigating thermal coefficient of expansion

Definitions

  • the invention relates to a method and a device for measuring at least one, preferably mechanical, connection property of a composite material, which has at least two interconnected elements, wherein at least one of the elements is heated at least in one area, a resulting deformation of a surface the composite material is measured and determined from the measured deformation, the connection property.
  • a composite material in which several functional materials connected to each other, for example, glued, are becoming increasingly important.
  • a special role is played by the formation of the adhesive bond, which is characterized by the characteristic properties of cohesive and adhesive adhesion. is correct and exerts a significant influence on the effective system behavior. In order to ensure a desired effective system behavior, it is desirable to determine the mechanical properties of the compound in quantitative form. This usually happens during the process in the laboratory.
  • the object of the present invention is therefore to obtain a non-destructive test and to provide a device for carrying out such a method with which a quantitative production-integrated investigation of the connection properties outside a laboratory is possible. This object is achieved by the method according to
  • a method for measuring at least one, preferably mechanical, connection property of a composite material.
  • a composite of materials is here understood to mean an object which has at least two interconnected elements, which preferably have at least one connecting surface are connected to one another, which are therefore preferably connected to one another in a flat manner.
  • Such a composite of materials may, for example, be a laminate or all types of adhesive compound, all types of composite materials (CFRP,
  • At least one of the elements of the material composite will now be at least locally, i. in a limited area, heated. Even a complete warming is possible.
  • the heating should preferably be carried out in such a way that it leads to a deformation of at least one of the elements, a surface of the composite material and / or a bonding layer between the elements, such that the deformation is detectable on at least one surface of the composite material and measurable is.
  • a deformation resulting from the heating of a surface of the material composite is measured.
  • the deviation of the surface from its unheated state is determined.
  • the measurement of the deformation of the surface may in this case preferably be carried out in a spatially resolved manner or else only at one or more isolated points of the surface.
  • the at least one connection property is then determined from the measured deformation.
  • the measured values of the deformation can be used directly or one or more values or functions are derived from the measured deformation, by means of which the at least one connection is then derived. personality.
  • a shear modulus and / or a modulus of elasticity of the connecting parts between the at least two elements is determined as the connecting property.
  • the Verbundverbünd may have a laminate, which several interconnected, for example, glued, flat
  • the heating of the at least one element or a connecting layer between two elements can now be effected by means of irradiation of electromagnetic radiation. Preference is given to local heating, in particular with a laser beam of defined diameter and defined
  • the measurement of the deformation of the surface can preferably take place by means of speckle interferometry and / or, preferably digital, shearography and / or by means of image correlation.
  • the device for measuring the deformation preferably perpendicular, is arranged opposite or above that surface whose deformation is to be measured as a result of heating.
  • the speckle interferometry is a method of deformation measurement.
  • the surface to be measured is illuminated by means of coherent light, for example laser light. Coherent light scattered on a rough surface creates locally constructive and destructive interference that appears as a spotty pattern. This pattern is sensitive to changes in the illuminated surface. Therefore, it can be concluded from a change of the speckle pattern on a change of the surface, in particular its local distance to the source of the coherent light.
  • Shearography is a short name for laser speckle shearing interferometry and thus a special form of speckle interferometry.
  • the principle of shearography is based on the fact that deformations both in the plane (in-plane) and out of the plane (out-of-plane) by the detection of path length changes coherent electromagnetic waves between an object and a Detector can be determined areally. This is made possible by the utilization of interferometry of respectively adjacent laser beams and evaluation of resulting phase changes. With this method, it is possible to determine planar deformations in the range of a fraction of the wavelength of the laser used - thus in the nanometer range.
  • Image correlation is also a method of deformation measurement. In this process, images of a surface are recorded and deformations are determined on the basis of image correlation algorithms. These identify individual patterns shifted in the image. Based on the displacement data, appropriate methods can be derived.
  • a correlation can preferably be carried out with experimentally conducted direct measurements of the connection properties, such as shear modulus and / or modulus of elasticity. This can be done for example by means of standardized tensile shear tests and / or centric tensile tests.
  • connection properties as well as with simulation results can advantageously be made as follows: First, at least one correlation curve or correlation function can be measured or simulated, which correlates the measured or simulated deformation with set or predetermined values of the corresponding connection properties. If a specific deformation is measured by means of the method according to the invention, it is possible to measure at the Correlation curve of the corresponding value of the connection properties are read.
  • the method according to the invention is particularly advantageously applicable to composite materials whose at least two interconnected elements are bonded together by gluing. It can then be measured a connection property of the adhesive bond.
  • the method can advantageously be carried out with a measuring device according to the invention for measuring at least one connection property of a material composite.
  • a measuring device has at least one heating device with which at least one element of the material composite or a surface of at least one element of the composite material can be heated at least in one region.
  • the measuring device further has a deformation measuring device with which a deformation resulting from the heating of a surface of the composite material can be measured. It also has a determination device with which the connection property can be determined from the measured deformation of the surface.
  • both the deformation measuring device and the heating device are preferably arranged above the surface whose deformation is to be measured or which is to be heated.
  • the surface that is heated is also the surface that is being measured. But it is also conceivable that a different surface is heated than the one that is measured. Thus, in particular for laminates, the measurement on one of the heated surface opposite Surface of the laminate can be performed.
  • FIG. 2 shows a correlation curve
  • FIG. 3 shows a shearographically determined deformation pattern
  • Figure 4 deformations with varying modulus of elasticity of an adhesive
  • FIG. 5 shows deformations on modified surfaces of a substrate.
  • Figure 1 shows a structure according to the invention for carrying out the method according to the invention.
  • a laminate 1 which has two interconnected elements 1 a and 1 b, which are coated by an adhesive layer 2, is measured as a composite material connected to each other.
  • thermal radiation 3 is irradiated onto a surface 4 of the laminate 1.
  • the thermal radiation 3 strikes a region 5 of the laminate 1, thus causing local heating of the element 1 a of the laminate 1 facing the heat source.
  • a deformation of the laminate 1 or the heated element 1a or its surface 4 is measured by means of a deformation measuring device 6.
  • the deformation measuring device 6 here is a Shear growingvorraum, in which the surface 4 of the laminate 1 is illuminated by a laser 8, and with a Shear connectingkopf 6 by deformation of the upper surface 4 ⁇ induced phase changes are measured.
  • connection property can be, for example, a modulus of elasticity or a shear modulus.
  • the maximum deformation ⁇ can be determined by means of the deformation measuring device 6, but it is also possible to determine a spatially resolved deformation of the surface as ⁇ ( ⁇ , y), where x, y indicates the location on the surface of the element 1a.
  • ⁇ ⁇ ( ⁇ , y)
  • x, y indicates the location on the surface of the element 1a.
  • the shape and intensity of this deflection can advantageously be highly precise in quantitative form
  • the unknown adhesion and cohesion properties can be computationally determined by means of numerical simulations or by correlation analysis on an experimental basis on samples of varying adhesion and cohesion properties as described above. Since usually the cohesive properties can be controlled quite reliably, the main focus is usually on the determination of adhesion properties.
  • the deformation measuring device 6 shown may alternatively be, for example, a speckle interferometer or a system for image correlation.
  • a determination device with which the desired connection property can be determined from the measured deformation.
  • the mechanical connection property can be determined.
  • This correlation curve preferably describes the quantitative relationship between measured deformations and the associated mechanical connection. property.
  • FIG. 2 shows, by way of example, a correlation curve which establishes a correlation between the modulus E adhesion zone in the adhesion zone and the maximum deformation w max after heating.
  • Such curves can be measured or derived from simulations. If a specific deformation w max is measured in the method according to the invention, the corresponding connection property, in this example the modulus of elasticity, can be read from such a curve.
  • a wide variety of samples were investigated with varying modulus of elasticity of the adhesive. Adhesion properties were deliberately modified and the samples subjected to mechanical stress. At the same time, analogous numerical simulations were carried out using the finite element method and destructive reference measurements were carried out in the form of tensile shear tests.
  • FIG. 3 shows such a modeling image that w a characteristic local ⁇ from buckling in the area of the heated zone with the maximum out-of-plane deformation of having a few micrometers.
  • FIG. 5 shows that different modifications of the substrate surface have a significant effect on the deformation behavior.
  • thermoelastic deformation behavior If the sample is then subjected to a tensile shear stress, then as the stress increases, significant changes in the thermoelastic deformation behavior occur.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

La présente invention concerne un procédé et un dispositif pour mesurer au moins une propriété de liaison d'un composite de matériaux qui présente au moins deux éléments reliés entre eux, au moins l'un des éléments étant chauffé au moins dans une zone, la déformation qui en résulte d'une surface du composite de matériaux étant mesurée et la propriété de liaison étant déterminée à partir de la déformation mesurée.
PCT/EP2011/002171 2010-05-03 2011-05-02 Procédé et dispositif de mesure de propriétés de liaison d'un composite de matériaux Ceased WO2011137995A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010018980.4A DE102010018980B4 (de) 2010-05-03 2010-05-03 Verfahren und Vorrichtung zur Messung von Verbindungseigenschaften eines Werkstoffverbundes
DE102010018980.4 2010-05-03

Publications (2)

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WO2011137995A2 true WO2011137995A2 (fr) 2011-11-10
WO2011137995A3 WO2011137995A3 (fr) 2012-05-10

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DE (1) DE102010018980B4 (fr)
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011118916A1 (de) 2011-11-21 2013-05-23 Peter Mäckel Strukturierte Beleuchtung zur thermischen und mechanischen Belastung in Kombination mit optischen Messverfahren wie der Shearografie/ESPI zur zerstörungsfreien Prüfung und Analyse des mechnanischen Übertragungsverhaltens und Eigenschaften von mechanischen Strukturen
DE102017104047A1 (de) 2017-02-27 2018-08-30 Universität Kassel Verfahren und Vorrichtung zur Prüfung von Fügeverbindungen
DE102022116477A1 (de) 2021-11-03 2023-05-04 Institut Für Holztechnologie Dresden Gemeinnützige Gmbh Prüfanordnung und Prüfverfahren zur Bewertung des thermischen Verhaltens von temperatursensitiven Materialien

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GB201111039D0 (en) * 2011-06-29 2011-08-10 Rolls Royce Plc Inspection of a component

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FR2371685A1 (fr) * 1976-11-17 1978-06-16 Aerospatiale Procede et dispositif pour le controle de la qualite de points de soudure par resistance
US4484820A (en) * 1982-05-25 1984-11-27 Therma-Wave, Inc. Method for evaluating the quality of the bond between two members utilizing thermoacoustic microscopy
US4752140A (en) * 1983-12-02 1988-06-21 Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee Pulsed dilatometric method and device for the detection of delaminations
US5041726A (en) * 1990-06-11 1991-08-20 Hughes Aircraft Company Infrared holographic defect detector
JPH063303A (ja) * 1992-06-18 1994-01-11 Yamatake Honeywell Co Ltd 板状連続物体の内部検査装置
DE19953415C1 (de) * 1999-11-06 2001-07-05 Fraunhofer Ges Forschung Vorrichtung zum berührungslosen Detektieren von Prüfkörpern
EP2018546A1 (fr) * 2006-05-10 2009-01-28 National Research Council of Canada Procédé d'estimation de l'intégrité de liaison dans des structures liées

Non-Patent Citations (1)

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Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011118916A1 (de) 2011-11-21 2013-05-23 Peter Mäckel Strukturierte Beleuchtung zur thermischen und mechanischen Belastung in Kombination mit optischen Messverfahren wie der Shearografie/ESPI zur zerstörungsfreien Prüfung und Analyse des mechnanischen Übertragungsverhaltens und Eigenschaften von mechanischen Strukturen
DE102017104047A1 (de) 2017-02-27 2018-08-30 Universität Kassel Verfahren und Vorrichtung zur Prüfung von Fügeverbindungen
DE102022116477A1 (de) 2021-11-03 2023-05-04 Institut Für Holztechnologie Dresden Gemeinnützige Gmbh Prüfanordnung und Prüfverfahren zur Bewertung des thermischen Verhaltens von temperatursensitiven Materialien
DE102022116477B4 (de) 2021-11-03 2023-06-29 Institut Für Holztechnologie Dresden Gemeinnützige Gmbh Prüfanordnung und Prüfverfahren zur Bewertung des thermischen Verhaltens von temperatursensitiven Materialien

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Publication number Publication date
DE102010018980B4 (de) 2015-11-19
DE102010018980A1 (de) 2011-11-03
WO2011137995A3 (fr) 2012-05-10

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