WO2011160046A2 - Appareil destiné à être utilisé dans un puits comprenant des dispositifs présentant des canaux caloporteurs - Google Patents

Appareil destiné à être utilisé dans un puits comprenant des dispositifs présentant des canaux caloporteurs Download PDF

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Publication number
WO2011160046A2
WO2011160046A2 PCT/US2011/040924 US2011040924W WO2011160046A2 WO 2011160046 A2 WO2011160046 A2 WO 2011160046A2 US 2011040924 W US2011040924 W US 2011040924W WO 2011160046 A2 WO2011160046 A2 WO 2011160046A2
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
heat
substrate
temperature
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/040924
Other languages
English (en)
Other versions
WO2011160046A3 (fr
Inventor
Joerg Lehr
Sebastian Jung
Sascha Schwarze
Ludger Overmeyer
Tobias Kruhn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baker Hughes Holdings LLC
Original Assignee
Baker Hughes Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baker Hughes Inc filed Critical Baker Hughes Inc
Priority to BR112012032351-2A priority Critical patent/BR112012032351A2/pt
Priority to AU2011268130A priority patent/AU2011268130B2/en
Priority to GB1223430.8A priority patent/GB2494094A/en
Publication of WO2011160046A2 publication Critical patent/WO2011160046A2/fr
Publication of WO2011160046A3 publication Critical patent/WO2011160046A3/fr
Anticipated expiration legal-status Critical
Priority to NO20130005A priority patent/NO20130005A1/no
Ceased legal-status Critical Current

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B36/00—Heating, cooling or insulating arrangements for boreholes or wells, e.g. for use in permafrost zones
    • E21B36/001—Cooling arrangements
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E21B47/0175—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • the present disclosure relates to regulating temperature of devices in a tool operating in a wellbore.
  • Measurement-while-drilling operations generally employ a drilling tool that includes various sensors, processors and devices operating downhole in order to enable drilling operations.
  • Typical downhole devices are composed of a multitude of printed circuit boards and individual components like sensors and integrated circuits. The lifetime of these electrical components depends on various factors including their operating temperature, their temperature specification, and temperature stability (low temperature variations have an important impact). As drilling takes place at increasingly greater depths and hence higher temperatures, there is a growing demand for downhole devices that operate at high temperatures.
  • the disclosure provides an apparatus that includes a heat source, a channel associated with the heat source and a device configured to flow a carrier through the channel that absorbs heat from the heat source.
  • the disclosure provides an apparatus for use in a downhole tool, including a substrate; a heat source associated with the substrate, the heat source inducing heat into the substrate; a fluid channel in the substrate; and a fluid flow unit configured to flow a fluid through the fluid channel to regulate a temperature of the component.
  • the present disclosure provides a method for regulating a temperature of a device in a tool in a wellbore, including providing the device having a substrate having a fluid channel therein in the wellbore; inducing heat from a heat source into the substrate; and flowing a fluid through the fluid channel to regulate the temperature of the device.
  • FIG. 1 shows a schematic illustration of a drilling system that includes a downhole tool that contains an apparatus for cooling devices in the downhole tool during operation of such tool downhole, according to various embodiments of the present disclosure
  • FIG. 2 shows an exemplary embodiment of the apparatus for regulating the temperature of a heat-generating device used in the exemplary tool during downhole operations
  • FIGS. 3-6 show various exemplary embodiments of components that may be used downhole with the exemplary temperature control apparatus disclosed herein.
  • FIG. 1 shows a schematic illustration of a measurement-while-drilling system 100 that includes an apparatus for cooling various devices used downhole according to various embodiments of the present disclosure.
  • the drilling system 100 has a drill string 120 carrying a drilling assembly 190 (also referred to as a "bottom hole assembly” or “BHA”) conveyed in a "wellbore” or “borehole” 126 for drilling the wellbore 126 into geological formations 195.
  • the drilling system 100 may include a conventional derrick 111 erected on a floor 112 that may support a rotary table 114 that may be rotated by a prime mover such as an electric motor (not shown) at a desired rotational speed.
  • a prime mover such as an electric motor (not shown) at a desired rotational speed.
  • the drill string 120 may include tubing such as a drill pipe 122 or a coiled- tubing extending downward from the surface into the borehole 126.
  • the drill string 120 may be pushed into the wellbore 126 when the drill pipe 122 is used as the tubing.
  • a tubing injector (not shown) may be used to move the coiled-tubing from a source thereof, such as a reel (not shown), to the wellbore 126.
  • a drill bit 150 attached to the end of the drill string 120 breaks up the geological formations 195 when the drill bit 150 is rotated.
  • the drill string 120 may be coupled to a drawworks 130 via a Kelly joint 121, a swivel 128, and a line 129 through a pulley 123.
  • the drawworks 130 may be operated to control the weight on the drill bit 150 or the "weight on bit,” which is an important parameter that affects the rate of penetration (ROP) into the geological formations 195.
  • ROP rate of penetration
  • a suitable drilling fluid 131 (also referred to sometimes as “mud” or “drilling mud”) from a mud pit (source) 132 may be circulated under pressure through a channel in the drill string 120 by a mud pump 134.
  • the drilling fluid 131 may pass from the mud pump 134 into the drill string 120 via a desurger (not shown), a fluid line 138, and the Kelly joint 121.
  • the drilling fluid 131 is generally discharged downhole at a wellbore bottom 151 through an opening (not shown) in the drill bit 150 and circulates uphole through an annular space 127 between the drill string 120 and the wellbore 126, returning to the mud pit 132 via a return line 135.
  • the drilling fluid 131 lubricates the drill bit 150 and carries wellbore 126 cuttings and/or chips away from the drill bit 150.
  • a flow rate sensor or dynamic pressure sensor Si is typically placed in the fluid line 138 and may provide information about the drilling fluid 131 flow rate and/or dynamic pressure.
  • a surface torque sensor S 2 and a surface rotational speed sensor S 3 associated with the drill string 120 may provide information about the torque and the rotational speed of the drill string 120, respectively. Additional sensors (not shown) may be associated with the line 129 to provide the hook load of the drill string 120.
  • the drill bit 150 may be rotated by only rotating the drill pipe 122.
  • a downhole motor 155 (mud motor) may be disposed in the BHA 190 to rotate the drill bit 150.
  • the drill pipe 122 may be rotated to supplement the rotational power of the mud motor 155 or to effect changes in the drilling direction.
  • the mud motor 155 may be coupled to the drill bit 150 via a drive shaft (not shown) disposed in a bearing assembly 157.
  • the mud motor 155 may rotate the drill bit 150 when the drilling fluid 131 passes through the mud motor 155 under pressure.
  • the bearing assembly 157 may support the radial and/or the axial forces of the drill bit 150.
  • a stabilizer 158 coupled to the bearing assembly 157 may act as a centralizer for the lowermost portion of the mud motor 155 and/or the BHA 190.
  • a drilling sensor module 159 placed near the drill bit 150 may contain sensors, circuitry, and/or processing software to determine dynamic drilling parameters, such as bit bounce of the drill bit 150, stick-slip of the BHA 190, backward rotation, torque, shocks, borehole pressure, annulus pressure, acceleration measurements, etc.
  • a suitable telemetry and/or communication sub 172 may also be provided to communicate data to and from the surface.
  • the drilling sensor module 159 may process the raw sensor information and/or may transmit the sensor information to a surface control 140 via the telemetry system 172 or a transducer 143 coupled to the fluid line 138, as shown at 145.
  • the communication sub 172, the power unit 178, and a formation evaluation (FE) tool 179 may all be connected in tandem with the drill string 120. Flex subs, for example, may be used in connecting the FE tool 179 to the BHA 190.
  • the BHA 190 may perform various measurements, such as pulsed nuclear magnetic resonance (NMR) measurements and/or nuclear density (ND) measurements, for example, while the borehole 126 is being drilled.
  • NMR pulsed nuclear magnetic resonance
  • ND nuclear density
  • the BHA 190 may include one or more formation evaluation and/or other tools and/or sensors 177, such as a temperature sensor 177a, capable of making measurements of the downhole mud (drilling fluid) 131 temperature over time and arranged to do so, and/or a mud (drilling fluid) 131 dynamic pressure and/or flow rate sensor 177b, capable of making measurements of the downhole mud (drilling fluid) 131 dynamic pressure and/or flow rate.
  • a temperature sensor 177a capable of making measurements of the downhole mud (drilling fluid) 131 temperature over time and arranged to do so
  • a mud (drilling fluid) 131 dynamic pressure and/or flow rate sensor 177b capable of making measurements of the downhole mud (drilling fluid) 131 dynamic pressure and/or flow rate.
  • These various measurement devices may employ, for example, a microprocessor, a multi-layered circuit board or any other electrical components that generate excess heat during their operation. In another aspect, the devices or electrical
  • Such heat- generating devices and/or heated devices may be provided with heat carrier channels proximate to them that provide a circulating heat carrier into and away from the device for removing heat.
  • a heat-generating device or heated device may have a channel integrated therein to provide flow of the heat carrier within the device and to bring the heat carrier into thermal contact with the heat-generating portion (or heated portion) of the device.
  • the heat carrier channel may be provided on one side of the device or may be wrapped around the device.
  • the communication sub 172 typically obtains the measurements from the various sensors and transfers the signals, to be processed at the surface.
  • the signals may be processed downhole, using a downhole processor 177c in BHA.
  • the communication between the surface and the downhole devices may be established using any suitable telemetry technique, including, but not limited to, mud pulse telemetry, electromagnetic telemetry, acoustic telemetry, and wired pipe.
  • the wired pipe may be: a coiled tubing, in which the tubing caries a communication link; or jointed tubulars, wherein the individual tubulars carry a communication link, such as an electrical conductor or an optical fiber.
  • the surface control unit 140 receives and processes signals from one or more other downhole sensors as well as the flow rate sensor Si, the surface torque sensor S 2 , and/or the surface rotational speed sensor S 3 and other sensors used in the drilling system 100.
  • the surface control unit 140 may display desired drilling parameters on a display 142 that may be utilized by an operator to control the drilling operations.
  • the surface control unit 140 may typically include a computer or processor, at least one memory for storing programs and data, and a recorder for recording data.
  • the surface control unit 140 may typically be configured to activate one or more alarms 144 under certain operating conditions.
  • the present disclosure provides a temperature control system for controlling temperature of one or more components in the BHA 190 or another apparatus, such as a wireline tools used for logging wellbores.
  • the temperature control system in general, pumps a heat carrier through a channel or a channel system made proximate to or integrated or embedded in a housing or body of the one or more components in the BHA 190.
  • Such components may include, but are not limited to, electrical components (such as microprocessors, etc.), sensors or devices having multiple layers, such as multilayer circuit boards or substrates.
  • the one or more components may be heat-generating components, components heated by the downhole environment, or other components that may benefit from rapid heat dissipation therefrom.
  • the heat carrier flows through the channel system and carries heat to or away from the component in order to regulate (raise or lower) the temperature of the component.
  • the geometry of the heat carrier channels and their proximity to the heat sources allows not only controlling of the temperature of the components but also allows removing of various hot spots.
  • FIG. 1 shows a downhole tool in the wellbore during a drilling operation, the temperature control apparatus disclosed herein is equally applicable in wireline tools that are used to log wells after the wellbore has been drilled, as well as in any other tools used in the wellbore, such as tools or devices used in production wells.
  • FIG. 2 shows an exemplary embodiment of a temperature control apparatus 200 for regulating the temperature of a device used in a tool downhole, such as the exemplary measurement- while-drilling system of FIG. 1.
  • the apparatus 200 includes a heat carrier storage unit 210, a heat-generating device 230, a heat sink 240, and one or more heat carrier transfer devices 220a-c.
  • the heat-generating device 230 refers to a device that generates heat by operation of the device.
  • the heat-generating device 230 refers to a device that is heated by or absorbs heat from its surrounding environment, such as a downhole environment.
  • the heat- generating device 230 refers to a device that is heated by operation of another device in thermal contact with the heat-generating device. Such a device may also be referred to as a hot device or heat source or device whose temperature is desired to be controlled or regulated.
  • a heat carrier 225 flows from the heat carrier storage unit 210 to the heat- generating device 230 and finally to a heat sink 240 via the one or more heat carrier transfer devices 220a-c. In the process, the heat carrier 225 transfers heat generated at the heat- generating device 230 to the heat sink 240, which in turn may distribute the heat into the surrounding environment. In one embodiment, the heat carrier 225 is stored at the heat sink 240 upon arrival at the heat sink.
  • the heat carrier 225 may be transported to and stored in a storage container 250 once heat has been transferred to the heat sink 240. In another embodiment, the heat carrier 225 returns to the heat carrier storage unit 210 once heat has been transferred from the heat carrier 225 to the heat sink 240.
  • the heat carrier 225 is a medium that is able to absorb or resorb thermal energy.
  • the heat carrier may be in a gaseous, liquid or solid state or in any combination of these states.
  • the thermal energy is stored in the heat carrier by temperature changes of the heat carrier, in chemical transformations or phase changes of the heat carrier or by any combination of these processes.
  • the heat carrier 225 may be selected according to various selection criteria, such as the desired operating temperature of the heat-generating device 230 as well as the heat capacity, movability, viscosity and durability of the heat carrier 225.
  • the fluid may be selected to have a boiling point that allows heat storage using the latent heat of the phase transition from liquid to gaseous.
  • the solid material may be selected to have a melting point that allows heat storage using the latent heat of the phase transition from solid to liquid.
  • the one or more heat carrier transfer devices 220a-c includes a thermal conduit system 224 for moving the heat carrier throughout the temperature control apparatus 200.
  • the thermal conduit system 224 may include tubes, hoses or other encapsulation devices that have an entrance and an exit and encapsulate the heat carrier.
  • the geometry and material of the heat carrier transfer device may be selected depending on the application, amount of dissipated heat and desired temperature gradient.
  • the thermal conduit system 224 is arranged to provide a closed-loop system in which the heat carrier 225 moves from the heat carrier storage unit 210 to a channel of the heat- generating device 230 and then to the heat sink device 240 and back to the heat carrier storage unit 210.
  • the thermal conduit system is arranged provide an open loop system in which the heat carrier 225 moves from the heat carrier storage unit 210 to a channel of the heat-generating device 230 and then to the heat sink device 240.
  • An exemplary open loop system may include heat carrier transfer devices 220a and 220b but not the heat carrier transfer device 220c which otherwise returns the heat carrier 225 from the heat sink 240 to the heat carrier storage unit 210.
  • the exemplary temperature control apparatus 200 has been described with respect to three heat carrier transfer devices 220a-c, this is not meant to be a limitation of the disclosure. Any number of heat carrier transfer devices may be used within the scope of the disclosure.
  • At least one of the heat carrier transfer devices includes a pump 222 for circulating the heat carrier 225 throughout the temperature control apparatus 200.
  • the pump 222 may be selected according to various criteria, such as flow rate, pressure difference, operating temperature, power consumption, size, weight and durability under downhole conditions.
  • a passive device such as a heat pipe, may be used in place of the pump 222.
  • the heat- generating device 230 includes a multi-layer circuit board 242 or individual electronic components or sensors having a multilayer structure.
  • the exemplary multi-layer circuit board 242 includes at least one printed circuit board 232, one or more insulating layers 234, a cooling layer 236 and a carrier layer 237.
  • two circuit boards 232 are coupled with the cooling layer 236 such that one circuit board is coupled to a top part of the cooling layer and a second circuit board is coupled to a bottom part of the cooling layer.
  • An insulating layer 234 may be disposed between the circuit boards 232 and the cooling layer 236 to provide electrical isolation between the heat carrier and the various electrical components of the circuit board 242.
  • the insulating layer provides electrical isolation between the heat carrier and the heat-generating elements of the device and also allows heat transfer across the insulating layer between the heat carrier and the heat-generating elements of the device. Insulating the heat carrier from the various electrical components therefore allows direct cooling of conductive or semi-conductive elements. However, if the electrical components and the heat carrier do not require electrical isolation, the heat-generating device may be assembled without the one or more insulating layers 234 in one embodiment.
  • a channel system 238 extends through the cooling layer 236 to provide a flow path for the heat carrier 225 through the multi-layer circuit board 230.
  • the circuit boards 232 provide a top and bottom side of the channel 238.
  • At least one circuit board is in thermal contact with the heat carrier flowing through the channel system 238 therein, wherein the heat transfers from the circuit board to the heat carrier 225.
  • FIG. 2 shows a single channel 238a, any number of suitable channels may be provide for the purposes of this disclosure.
  • the heat carrier 225 enters the channel 238 at an inlet or port 238b, moves through the channel 238a, thereby removing heat from the circuit board 232.
  • the heat carrier 225 exits the channel 238a at an outlet or port 238c.
  • the heat carrier transfer device 220b is connected to the channel outlet 238c for removal of the heat carrier to heat sink 240.
  • the heat sink 240 absorbs or resorbs heat from the heat carrier 225 and dissipates it to a heat carrier storage unit 210.
  • heat is passively conducted to the environment, such as the drilling mud passing through the downhole tool.
  • a heat pump actively transfers heat from the heat carrier 225 to the surrounding environment.
  • the heat pump may move heat from the heat carrier 225 to the environment using mechanical work, where the source has a higher temperature than the environment. This provides an efficient transfer of heat since the temperature of the hot side of the heat pump is higher than the temperature of the environment and further since the environment has a much greater heat capacity.
  • Such a system allows a rapid transfer of heat and brings the hot side of the heat pump close to thermal equilibrium with the environment, thereby lowering its temperature.
  • the heat energy may be stored in a chemical transformation or a phase change reaction.
  • a sensor 245 may be disposed at or proximate the heat-generating device 230 in order to regulate operation of the temperature control apparatus 200.
  • the sensor 245 may be configured to provide a suitable measurement to a controller 228.
  • the measurement is a temperature measurement.
  • the controller 228 may be responsive to a specific temperature of the heat-generating device and be configured to maintain the heat- generating device within a specified temperature range.
  • the controller 228 may be responsive to a temperature gradient between the heat-generating device 230 and the surrounding environment and may be configured to maintain the temperature gradient between the heat-generating device and the environment within a specified range.
  • the controller 228 may affect an operation of the pump 222 to provide faster or slower circulation of the heat carrier 225 through channel 238a.
  • the controller 228 may affect operation of the heat sink 240 (i.e., the heat pump) to decrease or increase a rate at which heat is removed from the heat carrier 225 to the surrounding environment.
  • the controller may also control the temperature of the heat sink (e.g. the temperature of the "cold" side of the heat pump).
  • the sensor may be configured to provide other measurements, such as a flow rate of the heat carrier through the channel system 238.
  • FIGS. 3-6 show various exemplary embodiments of components that may be used downhole with the exemplary temperature control apparatus disclosed herein.
  • FIG. 3 shows a side view of an exemplary printed circuit board 300 having various electronic components 302a-b connected to the circuit board.
  • the electronic components 302a-b are shown on an outer surface of the circuit board but may also be components integrated into the circuit board in one embodiment.
  • the printed circuit board 300 may include a multilayer polyamide board 304 having internal electrical connections 309. Electrical components are attached to the board 304 via electrical feedthroughs 307 which pass through the board 304 to a soldering connection 305 opposite the electrical components.
  • the electrical components are surface-mounted devices without electrical feedthroughs.
  • One or more channels are provided within the printed circuit board 300 to provide circulation of a heat carrier throughout the board and to heat-generating components of the board.
  • the channels may be routed in any manner around the heat-generating components to regulate temperature.
  • Inlets 238bl and 238b2 and outlets 238cl and 238c2 to the one or more channels are shown in the side view of FIG. 3.
  • inlet 238bl and outlet 238cl may provide a channel for temperature control of electronic component 302a
  • inlet 238b2 and outlet 238c2 may provide a channel for temperature control of electronic component 302b.
  • FIG. 4 shows a side view of an exemplary bare die 400 that may be cooled using the exemplary temperature control apparatus disclosed herein.
  • the bare die includes a bulk substrate 404, a buried substrate 406 and an active layer 408 with electronic components.
  • the bare die may have a metal 402 connected to the components of the active layer 408 along path 410.
  • the metal may be a conductive aluminum path providing an electrical connection to the components of the active layer 408.
  • One or more channels are provided within the bare die 400 to provide circulation of a heat carrier throughout the board and to heat-generating components of the bare die. The channels may be routed in any manner around the heat-generating components to regulate temperature.
  • inlets 238bl and 238b2 and outlets 238cl and 238c2 to the one or more channels are shown in the side view of FIG. 4.
  • inlet 238bl and outlet 238cl may provide a first channel throughout the bare die and inlet 238b2 and outlet 238c2 may provide a second channel throughout the bare die.
  • FIG. 5 shows a side view of an exemplary housed component 500 that may be cooled using the exemplary temperature control apparatus disclosed herein.
  • plastic/ceramic housing 504 encases die 502.
  • Electrical connectors 506 provide an electrical connection to the housing 504.
  • Wire bonds 508 provide an electrical connection between electrical connections and the die 502 through the housing 504.
  • One or more channels are provided within the housing 500 to provide circulation of a heat carrier throughout the housing and to heat-generating components of the housing, such as die 502.
  • the channels may be routed in any manner around the heat-generating components to regulate temperature.
  • Exemplary inlets 238bl and 238b2 and outlets 238cl and 238c2 to the one or more channels are shown in the side view of FIG. 5.
  • inlet 238bl and outlet 238cl may provide a first channel throughout the housing and inlet 238b2 and outlet 238c2 may provide a second channel throughout the housing.
  • FIG. 6 shows a side view of an exemplary ceramic substrate 600 that may be cooled using the exemplary temperature control apparatus disclosed herein.
  • the ceramic substrate 600 includes a multi-layer ceramic substrate 604 having internal electrical connections 609 running therethrough. Electrical components 602 are provided on an exterior surface of the substrate 604 and are electrical coupled to the internal electrical connections 609 via wire bonds 608.
  • One or more channels are provided within the ceramic substrate 600 to provide circulation of a heat carrier throughout the substrate and to heat- generating components within the substrate. The channels may be routed in any manner around the heat-generating components to regulate temperature.
  • Exemplary inlets 238bl and 238b2 and outlets 238cl and 238c2 to the one or more channels are shown in the side view of FIG. 6.
  • inlet 238bl and outlet 238cl may provide a first channel throughout the substrate and inlet 238b2 and outlet 238c2 may provide a second channel throughout the substrate.
  • the disclosure includes a method and apparatus for regulating a temperature of a heat-generating device such as a multi-layer circuit board using for drilling purposes
  • the method and apparatus may also be used to regulate the temperature of devices used for other purposes such as monitoring purposes, activation purposes, and downhole activities not directly related to drilling a wellbore.
  • Such devices may include temperature sensors, pressure sensors, hydraulic valves and other electronic components.
  • the temperature control apparatus may be used to provide heat to batteries that are designed for operation at high temperatures or in a specific temperature range.
  • the temperature control apparatus may be used to melt salt, which may be used as a buffer for storing heat and work.
  • the temperature control apparatus may be operated to adjust or alter a temperature of the exemplary heat-generating device to operate at a desired temperature range, such as an optimal operation temperature, thereby avoiding temperature ranges in which the device works with low reliability.
  • a desired temperature range such as an optimal operation temperature
  • mechanical fatigue or the break down of components is often caused by temperature cycling or thermal-induced stresses. Shocks of extreme temperature changes of up to 200 K have been noted in geothermal applications, such as in the start of production of hot fluid, the start of pumping to drill, etc.
  • the disclosed temperature control apparatus may be used to reduce mechanical fatigue and maintain a mechanical strength of a component by reducing the impact of thermal stresses on the component.
  • the disclosure provides an apparatus that includes a heat source or a device whose temperature is desired to be regulated, a channel associated with the heat source and a flow device or a flow unit configured to flow a carrier through the channel, which carrier absorbs heat from the heat source.
  • the apparatus further includes a medium associated with the carrier configured to absorb heat from the carrier.
  • the medium may be any suitable medium that is configured to absorb heat from the heated carrier, including, but not limited to, a heat sink, a device in thermal communication with the carrier that is at a temperature below the temperature of the carrier, and a fluid (such a drilling fluid) in thermal communication with the carrier that is at a temperature below the temperature of the carrier.
  • the disclosure provides an apparatus for use in a downhole tool, including a substrate; a heat source associated with the substrate, the heat source inducing heat into the substrate; a fluid channel in the substrate; and a fluid flow unit configured to flow a fluid through the fluid channel to regulate a temperature of the component.
  • the fluid flow unit may include a pump configured to supply the fluid from a storage unit to the channel.
  • a heat sink receives fluid from the substrate.
  • the heat sink may include a thermally conductive element configured to conduct heat from the fluid received from the substrate to a fluid flowing through the tool when the tool is in the wellbore.
  • the apparatus may further include a conduit system configured to provide the fluid into the fluid channel and out of the fluid channel.
  • the conduit system may provide an open loop path for the fluid or a closed loop path for the fluid.
  • the heat source may be at least one of: (i) a component generating heat when the component is in operation; and (ii) an environment surrounding the substrate.
  • a controller of the apparatus regulates the temperature of the component by controlling an operation of one at least one of: (i) a heat sink dissipating heat from the fluid, (ii) a heat sink dissipating heat into the fluid; and (iii) a pump circulating the fluid through the fluid channel.
  • a sensor coupled to the substrate may provide a temperature measurement of the substrate to the controller to regulate the temperature of the component.
  • a flow rate sensor configured measure a flow rate of the fluid through the fluid channel and provides the flow rate measurement to the controller to regulate the temperature of the component.
  • the present disclosure provides a method for regulating a temperature of a device in a tool in a wellbore, including providing the device having a substrate having a fluid channel therein in the wellbore; inducing heat from a heat source into the substrate; and flowing a fluid through the fluid channel to regulate the temperature of the device.
  • the fluid may be provide to the substrate from a fluid storage unit and received from the substrate at a heat sink.
  • the heat sink comprises a thermally conductive element and the method further includes conducting heat from the fluid received from the substrate to a fluid flowing through the tool.
  • a conduit system provides the fluid into the fluid channel and out of the fluid channel.
  • the conduit system may provide one of: (i) an open loop path for the fluid; and (ii) a closed loop path for the fluid.
  • the heat source is at least one of: (i) a component associated with the substrate generating heat when the component is in operation; and (ii) an environment surrounding the substrate.
  • the temperature of the component may be regulated by using a controller to control an operation of one at least one of: (i) a heat sink dissipating heat from the fluid, (ii) a heat sink dissipating heat into the fluid, and (iii) a pump circulating the fluid through the fluid channel.
  • a temperature measurement of the substrate may be provided to the controller from a sensor coupled to the substrate to regulate the temperature of the component. Additionally, a flow rate of the fluid through the fluid channel may be provided to the controller to regulate the temperature of the component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geophysics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)

Abstract

L'invention concerne un procédé et un appareil permettant de réguler la température d'un dispositif dans un outil utilisé dans un puits de forage. Le dispositif comprend généralement un substrat et une source de chaleur associée au substrat qui induit de la chaleur dans le substrat. Le substrat comprend un canal de fluide à l'intérieur. Un système de fluide permet la fourniture de fluide dans le canal de fluide et hors du canal de fluide afin de réguler la température de l'élément.
PCT/US2011/040924 2010-06-18 2011-06-17 Appareil destiné à être utilisé dans un puits comprenant des dispositifs présentant des canaux caloporteurs Ceased WO2011160046A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
BR112012032351-2A BR112012032351A2 (pt) 2010-06-18 2011-06-17 aparelho para uso poço abaixo incluindo dispositivos tendo canais portadores
AU2011268130A AU2011268130B2 (en) 2010-06-18 2011-06-17 Apparatus for use downhole including devices having heat carrier channels
GB1223430.8A GB2494094A (en) 2010-06-18 2011-06-17 Apparatus for use downhole including devices having heat carrier channels
NO20130005A NO20130005A1 (no) 2010-06-18 2013-01-03 Anordning for bruk nedihulls som inkluderer utstyr som har varmebaererkanaler

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35643410P 2010-06-18 2010-06-18
US61/356,434 2010-06-18

Publications (2)

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WO2011160046A2 true WO2011160046A2 (fr) 2011-12-22
WO2011160046A3 WO2011160046A3 (fr) 2012-02-16

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PCT/US2011/040924 Ceased WO2011160046A2 (fr) 2010-06-18 2011-06-17 Appareil destiné à être utilisé dans un puits comprenant des dispositifs présentant des canaux caloporteurs

Country Status (6)

Country Link
US (1) US20110308791A1 (fr)
AU (1) AU2011268130B2 (fr)
BR (1) BR112012032351A2 (fr)
GB (1) GB2494094A (fr)
NO (1) NO20130005A1 (fr)
WO (1) WO2011160046A2 (fr)

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Also Published As

Publication number Publication date
AU2011268130A1 (en) 2013-01-17
GB2494094A (en) 2013-02-27
AU2011268130B2 (en) 2017-02-02
BR112012032351A2 (pt) 2019-09-24
WO2011160046A3 (fr) 2012-02-16
US20110308791A1 (en) 2011-12-22
GB201223430D0 (en) 2013-02-06
NO20130005A1 (no) 2013-01-14

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