WO2012007247A1 - Module et dispositif pour mesurer un courant haute fréquence traversant un conducteur - Google Patents

Module et dispositif pour mesurer un courant haute fréquence traversant un conducteur Download PDF

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Publication number
WO2012007247A1
WO2012007247A1 PCT/EP2011/060140 EP2011060140W WO2012007247A1 WO 2012007247 A1 WO2012007247 A1 WO 2012007247A1 EP 2011060140 W EP2011060140 W EP 2011060140W WO 2012007247 A1 WO2012007247 A1 WO 2012007247A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
conductor
coil
board unit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/060140
Other languages
German (de)
English (en)
Inventor
Robert Baumgartner
Werner Hartmann
Martin Hergt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2012007247A1 publication Critical patent/WO2012007247A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/028—Electrodynamic magnetometers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/20—Instruments transformers
    • H01F38/22—Instruments transformers for single phase AC
    • H01F38/28—Current transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/18—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
    • G01R15/181—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers using coils without a magnetic core, e.g. Rogowski coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Measuring current only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the invention relates to an arrangement consisting essentially of printed circuit board modules with integrated coils for measuring a high-frequency current through a conductor. Electric currents in the high frequency range, eg. In one
  • Magnitudes of 100MHz can be determined most accurately with the detection of the magnetic field around the conductor carrying the current.
  • a coil is, for example, arranged on the conductor such that the magnetic field passes through the coil, so that a voltage is induced which can be tapped off at the corresponding contacts of the coil.
  • the structure and arrangement of conductor and coil can be realized differently.
  • Power meters are known as accessories for oscilloscopes (eg Tektronix, TCP305), etc., which are only suitable for measurements in research and development as well as for troubleshooting.
  • An inventive module for measuring the current intensity of a high frequency current through a conductor of a carrier board comprises:
  • a part of the conductor sections of the coil at the top and at the bottom of the board unit is arranged and another part of the conductor sections of the coil as
  • Conductor sections at the top and conductor sections at the bottom are connected to each other via the vias.
  • the module also has an input contact and an output contact, wherein the input contact is electrically connected to an input of the conductor of the coil and the output contact to an output of the conductor of the coil and wherein the induced current flow through the conductor Voltage at the input contact and the output contact can be tapped.
  • the module can, for example, be soldered to corresponding contact points on the carrier board.
  • the input contact and the output contact are located on the same side of the module, for example, on the bottom, so that a simple contact with the carrier board is possible.
  • the module may comprise a second board unit, wherein
  • Input of the coil and between the output contact and the one output of the coil are formed as vias through the second board unit.
  • This second board unit causes the coil conductor does not come into contact with the conductor of the carrier board.
  • a third and a fourth board unit may be provided, wherein
  • Board unit is arranged and on its side facing away from the first board unit side has a metal coating
  • Board unit is arranged and on its side facing the second board unit side has a metal coating
  • Metal coatings cause shielding of the coil with respect to the electric field.
  • the metal coating of the third board unit and / or the fourth board unit may or may
  • the conductor sections of the coil can be advantageously slotted, so that no induction currents flow in them.
  • the conductor sections of the coil can be advantageously slotted, so that no induction currents flow in them.
  • An arrangement according to the invention for measuring the current intensity of a high-frequency current through a conductor has at least a first and a second one of those described
  • Ladder add the voltages induced in the individual coils, so that between the input contact of the first module and the output contact of the second module, a total voltage can be tapped.
  • the conductor may, for example, be formed as a planar conductor track on or in the surface of the carrier board.
  • the first module can with its input and
  • the electrical connection between the output contact of the coil of the first module and the input contact of the coil of the second module can as through-hole through the
  • Carrier board of the conductor to be formed.
  • At least one conductor track to the input contact of the first module and at least one conductor track to the output contact of the second module can be provided on the carrier board. It can be one of these
  • the first and second modules are not identical.
  • the first module which is placed on top of the carrier board, i. on the side where the conductor is located, has at least the first and the second board unit.
  • the second board unit causes the isolation of the coil of the first module of the conductor.
  • the second module has only the first board unit and no second one
  • PCB unit is redundant in the second module.
  • Figure 1 is a plan view of an inventive Anord ⁇ voltage for current measurement
  • FIG. 3 a top view of a module according to the invention
  • FIG. 4 shows a further embodiment of the module in side view
  • FIG. 5 is a plan view of a metal coating with egg ⁇ nem through slot
  • Figure 6 shows a module consisting of only one circuit board.
  • FIG. 1 shows a side view of a conductor 310, which is, for example, as a planar line on or in a surface at the top of a carrier board 300.
  • a conductor 310 Through the conductor 310 flows to be measured high-frequency alternating current I, which is known to generate a corresponding alternating magnetic field around the conductor 300.
  • a module 100 according to the invention for measuring the current intensity of the high-frequency current I is arranged above the carrier board 300 and the conductor 310.
  • Below the carrier board 300 or on the underside of another module 200 is arranged that is substantially identical to the first module 100 is formed.
  • the module 100 consists in the first shown here
  • Embodiment of two juxtaposed boards 110, 120 The conductor 310 facing away from the board 110 of the module 100 has a coil 130 which is arranged such that the magnetic field generated by the RF alternating current I induces a voltage U in the coil (hereinafter, the carrier board 300 facing side of Module or a board as the bottom and the carrier board side facing away from the top).
  • the function of the board 310 facing the conductor 120 of the module 100 is essentially to prevent electrical contact between the coil 130 and the conductor 310.
  • this second board can in principle be dispensed with if it can be ruled out that an electrical connection between the coil and the conductor can be excluded
  • Carrier board is arranged or in the event that the conductor is integrated into the carrier board.
  • the coil 130 has a longitudinal axis S and a
  • Cross-sectional area A is, for example, arranged so that the longitudinal axis S perpendicular to the conductor 310 and to
  • Figure 2 shows a plan view of the module 100, i. the view in the negative z-direction, from which the arrangement and the basic structure of the coil 130 is clear.
  • the coil 130 consists of a plurality of consecutively
  • Plantine 110 interconnected, so that ultimately the Turns of a coil are formed.
  • Vias 130/2, 130/4, 130/6, 130/8 themselves thus also represent conductor sections of the coil 110.
  • the conductor sections 130/3, 130/7 at the bottom of the coil 110 are also represent conductor sections of the coil 110.
  • Circuit board which would not be visible in the view of Figure 2, are shown in dashed lines.
  • the input E130 of the coil 130 is provided on the first conductor section 130/1 and the output A130 of the coil is provided on the last conductor section 130/9.
  • the module 100 has a
  • Input contact 140 and an output contact 150 wherein the input E130 via a further via, which both the first 110 and the second board 120th
  • Output contact 150 electrically connected.
  • the voltage U induced in the coil 130 during current flow through the conductor 310 can therefore be picked up at the input and output contacts 140, 150 of the module 100.
  • the module 100 is in the installed state for measuring the current I in the conductor 310 with the input and the
  • Output contact 140, 150 soldered to corresponding contact points 320, 330 of the carrier board 300 of the conductor 310.
  • the further module 200 is also three-ply of two
  • Boards 210, 220 built.
  • the conductor 210 facing away from the board 210 of the module 200 has a coil 230 which is arranged such that the magnetic field generated by the RF alternating current I induces a voltage U in the coil.
  • the function of the conductor 310 facing the board 220 is essentially to prevent electrical contact between the coil 130 and the conductor 310.
  • the second circuit board 220 of the second module 200 can be dispensed with, since the carrier circuit board 300 itself is used as a
  • Insulation between the coil 230 of the second module 200 and the conductor 310 acts. It brings however production-technical Advantages, if the first and the second module are identical. On the other hand, the two-ply design of the second module with only a single board would be less expensive.
  • the coil 230 is also arranged so that its longitudinal axis perpendicular to the conductor 310 and to the current direction of the
  • FIG. 3 shows a plan view of the second module 200, i. the view in positive z-direction.
  • the coil 230 also consists of a plurality of conductor sections 230/1, 230/2, 230/3,... 230/9, wherein the conductor sections 230/3, 230/7 on the upper side and the conductor sections 230/1, 230 / 5, 230/9 are arranged on the underside of the board 210.
  • a conductor portion on the top of the board is connected via a via to a conductor portion on the underside of the board so that the conductor portions ultimately form a coil of substantially rectangular cross-section.
  • the module 200 has an input contact 240 and an output contact 250, wherein the input E230 is connected to the input contact 240 via a further through-connection 230/10, 230/11, which passes through both the first 210 and the second circuit board 220. Accordingly, the output A230 of the coil is electrically connected to the output contact 250. The voltage U induced in the coil 230 during current flow through the conductor 310 can thus be picked up at the input and output contacts 240, 250 of the module 200.
  • the module 200 is in the installed state for measuring the current I with the input and the output contact 240, 250th soldered to corresponding contact points 340, 350 of the carrier board 300 of the conductor 310.
  • the modules 100, 200 are electrically connected to one another in the installed state in such a way that the voltages induced in the two coils add up. For this is the
  • Output A130 of the coil 130 of the first module 100 is connected to the input E230 of the coil 230 of the second module 200. This is done through a via 360 through the
  • Carrier board 300 realized, which connects the contact points 330, 340 with each other.
  • the contact points 320, 350 can be connected to a measuring device (also not shown) via corresponding conductor tracks (not shown here) of the carrier board 300.
  • This may, for example, also be soldered onto the carrier board 300 as a component.
  • Particularly advantageous effect in the module an addi ⁇ che the coil each surrounding insulated conductor level, which is not connected to the coil itself but only with the ground ⁇ reference potential of the carrier board and mindes ⁇ least on one side of the coil to be measured by a Head has away pointing air gap. This is illustrated for the first Mo ⁇ dul 100 in FIG. 4
  • the module 100 has upper ⁇ and below the sketched in the figure 1 structure per ⁇ wells another board 160 or 170 on.
  • the metal layers 161, 171 are electrically connected to vias 180 by the intermediary boards. Furthermore, the metal layers may be connected to a ground contact on the carrier board 300 (not shown), if any.
  • Output A130 of the coil 130 are connected in this Embodiment on the support plate 300 facing side of the additional board 170 is provided.
  • the metal layer 161 should be made slotted.
  • the Schlit ⁇ pollution here consisting of a through slit 162 in the direction in which the coil is wound, that is, in the y direction . Since the coil will be ⁇ 130 perpendicular to the conductor 310, the air gap is so ⁇ facing from the conductor to be measured away. This is advantageous in that, a ⁇ scatters an electric field can be reduced to the coil, whereby the signal-to-noise ratio lent German is increased.
  • the coils 100, 200 shown in FIGS. 2 and 3 have a comparatively small number of windings for the sake of clarity. In practice, a much higher number of turns is provided.
  • the plated-through hole 360 as well as the contact points 340, 350 could be dispensed with.
  • the induced voltage would then be tapped at the contact points 320, 330.
  • the thicknesses of the individual boards In determining the thicknesses of the individual boards a compromise between compactness of the module, suffi ⁇ chender mechanical stability and functional performance of the coil must be found. Although comparatively large layer thicknesses bring about good stability and a large coil thickness. cross-section, however, the module is correspondingly thick. For ei ⁇ ne AC frequency of about 150 MHz, for example, layer thicknesses of about 1mm are suitable.
  • the coils 130, 230 are aligned in a substantially rectangular cross section, that the conductor portions of one turn are pa rallel ⁇ each other.
  • the conductor sections of a turn essentially form a parallelogram, wherein the corners can certainly also be rounded.
  • the second module 200 can consist of only one circuit board 210.
  • the input contact 240 and the output contact 250 would be attached directly to the side of the board 210 facing the carrier board 300. This is shown in FIG.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

L'invention concerne un dispositif composé de modules de cartes de circuits imprimés à bobines intégrées pour la mesure d'un courant haute fréquence traversant un conducteur. Un tel module de cartes de circuits imprimés comporte une première unité platine et une bobine intégrée au module. La bobine est composée d'une pluralité de segments conducteurs connectés électriquement les uns aux autres et est conçue de telle manière qu'en cas de circulation du courant à travers le conducteur, la section transversale de la bobine peut être traversée par les lignes de champ du champ magnétique produit par le flux de courant, de façon à induire une tension dans la bobine. Une partie des segments conducteurs de la bobine est disposée sur le côté supérieur et sur le côté inférieur de l'unité platine, une autre partie des segments conducteurs est conçue comme trous d'interconnexion à travers l'unité platine. Les segments conducteurs sont montés les uns derrière les autres de telle manière qu'ils forment les enroulements de la bobine, des segments conducteurs sur le côté supérieur et des segments conducteurs sur le côté inférieur étant connectés mutuellement au moyen des trous d'interconnexion.
PCT/EP2011/060140 2010-07-14 2011-06-17 Module et dispositif pour mesurer un courant haute fréquence traversant un conducteur Ceased WO2012007247A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010027130.6 2010-07-14
DE201010027130 DE102010027130A1 (de) 2010-07-14 2010-07-14 Modul und Anordnung zur Messung eines Hochfrequenzstroms durch einen Leiter

Publications (1)

Publication Number Publication Date
WO2012007247A1 true WO2012007247A1 (fr) 2012-01-19

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PCT/EP2011/060140 Ceased WO2012007247A1 (fr) 2010-07-14 2011-06-17 Module et dispositif pour mesurer un courant haute fréquence traversant un conducteur

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DE (1) DE102010027130A1 (fr)
WO (1) WO2012007247A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104034943A (zh) * 2014-06-23 2014-09-10 深圳市中鹏电子有限公司 一种基于差分布线的pcb罗氏线圈电流感应器

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2526579A (en) * 2014-05-28 2015-12-02 Eaton Ind Netherlands Bv Sensor for measuring current in a conductor
BE1026245B1 (de) * 2018-05-04 2019-12-02 Phoenix Contact Gmbh & Co Stromsensor
CN110702956B (zh) * 2019-08-26 2024-09-10 浙江万胜智能科技股份有限公司 一种用于抗电磁干扰的电子式电能表

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EP0893696A2 (fr) * 1997-07-24 1999-01-27 Robert Bosch Gmbh Dispositif pour mesurer un courant alternatif
EP0930508A1 (fr) * 1997-07-29 1999-07-21 Unitika Ltd. Dispositif a effet d'impedance magnetique
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JP2010176964A (ja) * 2009-01-28 2010-08-12 Denso Corp 電流測定装置

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DE10314602A1 (de) * 2003-03-31 2004-10-21 Infineon Technologies Ag Integrierter differentieller Magnetfeldsensor
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JP2008047718A (ja) * 2006-08-17 2008-02-28 Nec Corp 半導体装置
JP2010176964A (ja) * 2009-01-28 2010-08-12 Denso Corp 電流測定装置
DE202010000328U1 (de) 2009-03-12 2010-05-20 Liaisons Electroniques-Mécaniques LEM S.A. Elektrischer Stromsensor

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104034943A (zh) * 2014-06-23 2014-09-10 深圳市中鹏电子有限公司 一种基于差分布线的pcb罗氏线圈电流感应器
CN104034943B (zh) * 2014-06-23 2016-05-04 深圳市中鹏电子有限公司 一种基于差分布线的pcb罗氏线圈电流感应器

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