WO2012015131A1 - Substrat de montage d'antenne à puce multibande et dispositif d'antenne à puce multibande le comprenant - Google Patents

Substrat de montage d'antenne à puce multibande et dispositif d'antenne à puce multibande le comprenant Download PDF

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Publication number
WO2012015131A1
WO2012015131A1 PCT/KR2011/000323 KR2011000323W WO2012015131A1 WO 2012015131 A1 WO2012015131 A1 WO 2012015131A1 KR 2011000323 W KR2011000323 W KR 2011000323W WO 2012015131 A1 WO2012015131 A1 WO 2012015131A1
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WO
WIPO (PCT)
Prior art keywords
pad
chip antenna
disposed
ground
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/000323
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English (en)
Korean (ko)
Inventor
정해영
김민성
전찬익
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Partron Co Ltd
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Partron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Partron Co Ltd filed Critical Partron Co Ltd
Publication of WO2012015131A1 publication Critical patent/WO2012015131A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H01Q1/46—Electric supply lines or communication lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors

Definitions

  • the present invention is a multi-band chip antenna mounting substrate and a multi-band chip antenna device including the same.
  • the antenna included in the mobile communication terminal is also a reality in pursuit of high performance and miniaturization.
  • most mobile communication terminal antennas have been converted to built-in types, and also require high efficiency, broadband, or multi-band. Since the frequency bands used in the world are different from country to country, a mobile communication terminal is manufactured using a multi-band antenna that can operate in multiple frequency bands with one antenna.
  • the conventional multi-band chip antenna has no tuning point to easily change the resonant frequency, so it is not easy to adjust the resonant frequency. Therefore, it is difficult to easily adjust the resonant frequency in multiple bands with one antenna. there was.
  • the technical problem to be solved by the present invention is to provide a multi-band chip antenna mounting substrate that is easy to tune the resonant frequency for multiple frequency bands.
  • Another technical problem to be solved by the present invention is to provide a multi-band chip antenna device that is easy to tune the resonant frequency for multiple frequency bands.
  • One aspect of the multiband chip antenna mounting substrate of the present invention for achieving the above technical problem is a ground pattern, the first to third ground line, the first to third ground line disposed to be connected to the ground pattern First to third pads disposed to be connected to the second pads, a power feeding line to be connected to the second pads, and a concentrated water purifying element disposed to be connected to at least one of the first to third ground lines and the power feeding lines. .
  • One aspect of the multiband chip antenna device of the present invention for achieving the above another technical problem is a substrate for mounting the multiband chip antenna mounting according to the present invention, and the substrate is disposed on at least one surface of the dielectric block And a multiband chip antenna including first to third radiator patterns, wherein the substrate is connected to a ground pattern, first to third ground lines disposed to be connected to the ground pattern, and first to third ground lines, respectively.
  • a multiband device comprising: first to third pads disposed; a feeding line arranged to be connected to the second pad; and a concentrated water purifying element arranged to be connected to at least one of the first to third ground lines and the feeding line;
  • the first to third radiator patterns of the chip antenna are arranged to be connected to the first to third pads, respectively.
  • the multi-band chip antenna mounting substrate and the multi-band chip antenna apparatus including the same it is possible to reduce the size of the antenna and to easily tune the frequency band of the chip antenna to suit various frequency bands.
  • the size of the antenna is reduced through the patterned radiators, but the frequency band is adjusted by adjusting only the lumped constant elements without directly changing the patterned radiators.
  • tuning there is an advantage that can easily tune the band for the frequency used in each country.
  • FIG 1 and 2 are layout views of a multi-band chip antenna mounting substrate according to an embodiment of the present invention.
  • 3 and 4 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of an embodiment of the present invention.
  • FIG. 5 is a layout view of a multi-band chip antenna mounting substrate according to another embodiment of the present invention.
  • FIG. 6 and 7 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of another embodiment of the present invention.
  • FIG. 8 is a perspective view of a multiband chip antenna device according to an embodiment of the present invention.
  • 9 to 11 are layout views of a multiband chip antenna of a multiband chip antenna device according to an embodiment of the present invention.
  • the present invention is a multi-band chip antenna mounting substrate and a multi-band chip antenna device including the same.
  • FIGS. 1 and 2 a multiband chip antenna mounting substrate according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 and 2 are layout views of a multi-band chip antenna mounting substrate according to an embodiment of the present invention.
  • FIG. 1 is a layout view of one surface (eg, an upper surface) of a substrate for mounting a multi-band chip antenna according to an embodiment of the present invention
  • FIG. 2 is a multi-band chip antenna mounting according to an embodiment of the present invention. It is a layout view of the other surface (for example, lower surface) of the substrate for a use.
  • the substrate 10 may include a ground pattern 20, first to third ground lines 32, 34, and 36, first to third pads 72, 74, and 76, and a power supply.
  • the line 40 may include lumped elements 50a and 50b.
  • the ground pattern 20 may be disposed on one surface (eg, an upper surface) of the substrate to define a ground region.
  • the inside of the ground pattern, that is, the area surrounded by the ground pattern 20 may be defined as an ungrounded area.
  • the ground pattern 20 may be connected to an external ground electrode (not shown).
  • the first to third ground lines 32, 34, and 36 may be connected to the ground pattern 20.
  • the first to third ground lines 32, 34, and 36 may be connected to the ground pattern 20 in the non-grounding region defined above.
  • each of the first ground line 32 and the third ground line 36 may include the first ground line 32 and the first ground line 36, respectively, as shown in FIG. 1, from the ground pattern 20 to the ungrounded area on one surface (eg, the upper surface) of the substrate. May be disposed to protrude in a direction (eg, X direction), and the second ground line 34 may be disposed in the non-grounded area on the other surface (eg, the bottom surface) of the substrate as shown in FIG. 2. ) May protrude in a second direction (eg, the Y direction).
  • the second ground line 34 may be connected to the second pad 74 to be described later, for example, through the via 60.
  • the first to third pads 72, 74, and 76 may be disposed to be connected to the first to third ground lines 32, 34, and 36, respectively.
  • the first to third pads 72, 74, and 76 may be arranged to be connected to the first to third ground lines 32, 34, and 36, respectively, in the ungrounded area.
  • the first to third pads 72, 74, and 76 may have a second direction (eg, Y direction) in an ungrounded area on one surface (eg, upper surface) of the substrate as shown in FIG. 1. It may be formed to be spaced apart by a predetermined interval to extend side by side.
  • the first and third pads 72 and 76 are disposed to be connected to the first and third ground lines 32 and 36 protruding from the ground pattern 20 in a first direction (for example, X direction).
  • the second pad 74 may protrude from the ground pattern 20 in the second direction (for example, the Y direction) and be disposed in the second ground line 34 and the via 60. It may be arranged to be connected via.
  • the first to third pads 72, 74, and 76 may be formed of one pad, respectively, but the first to third pads 72, 74, and 76 may be separated pads as illustrated in FIG. 1. It may consist of Specifically, the first pad 72 may be formed of the first-first pad 72a and the first-second pad 72b spaced apart from each other, and the second pad 74 may be the second-first pad spaced apart from each other.
  • the third pad 76 may include a 3-1 pad 76a and a 3-2 pad 76b spaced apart from each other.
  • the first to third connection pads 82, 84, and 86 are spaced apart from each other, for example, the first-first pad 72a, the first-second pad 72b, and the second-first pad 74a.
  • the second-second pad 74b, the third-first pad 76a, and the third-second pad 76b may be connected to each other.
  • the feed line 40 may be arranged to be connected to the second pad 74.
  • the feed line 40 may be used as a line for transmitting or receiving a signal to the multi-band chip antenna (100 in FIG. 8).
  • the lumped water purifying elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36, and the feed line 40.
  • FIG. 1 illustrates only the centralized water purification device 50a disposed to be connected to the power supply line 40 and the centralized water purification device 50b disposed to be connected to the third ground line 36, the present invention is limited thereto. It is not. That is, the lumped water purification elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36, and the power supply line 40 as necessary.
  • the lumped constant elements 50a and 50b may be configured by, for example, a combination of a resistor (not shown), an inductor (not shown), and a capacitor (not shown).
  • the lumped constant elements 50a and 50b may be used to adjust, for example, a resonance frequency or an impedance of a multiband chip antenna device to be described later. That is, the user may modify a combination of an inductor (not shown) and a capacitor (not shown) in the lumped constant elements 50a and 50b to adjust, for example, a resonance frequency or an impedance of the multiband chip antenna device to be described later. have.
  • FIG. 1 shows that the length L of the first ground line 32 and the length L of the second ground line 36 are the same, the present invention is not limited thereto.
  • first, second, etc. are used to describe various components, these components are of course not limited by these terms. These terms are only used to distinguish one component from another. Therefore, of course, the first component mentioned below may be a second component within the technical spirit of the present invention.
  • 3 and 4 are layout views of a multi-band chip antenna mounting substrate according to modified embodiments of an embodiment of the present invention.
  • FIG. 3 and 4 are modified examples of the embodiment shown in FIG. 1, and portions overlapping with those described in FIGS. 1 and 2 will be omitted for the sake of effective description. Only the characteristic parts of the modified embodiment shown in FIG. 4 will be described.
  • the lumped water purification elements 50a and 50b may be arranged to be connected to at least one of the first to third ground lines 32, 34, 36 and the power feeding line 40 as necessary.
  • the multiband chip antenna mounting substrate according to the modified embodiment of the present invention illustrated in FIG. 3 is different from the embodiment of the first embodiment of the present invention, and includes a lumped constant element 50a disposed to be connected to the power supply line 40.
  • the lumped water purification device 50c may be disposed to be connected to the ground line 32, and the lumped water purification device 50b may be disposed to be connected to the third ground line 36.
  • the first ground line 32 of the substrate for mounting a multi-band chip antenna according to a modified embodiment of the embodiment of the present invention.
  • the length L1 and the length L2 of the second ground line 36 may be different from each other.
  • the length L1 of the first ground line 32 and the length L2 of the second ground line 36 having different lengths may correspond to, for example, a resonance frequency or an impedance of the multiband chip antenna device to be described later. May affect That is, the user adjusts the length L1 of the first ground line 32 and the length L2 of the second ground line 36, and thus, for example, a resonance frequency or impedance of the multiband chip antenna device to be described later. Can be adjusted.
  • the second pad 74 of the multiband chip antenna mounting substrate includes first subpads 74a and 74b and second subpads 74c and 74d. At least one of the first subpads 74a and 74b and the second subpads 74c and 74d may be connected to the power supply line 40. That is, although the second pad 74 illustrated in FIG. 5 is illustrated in which the first sub pads 74a and 74b are connected to the feed line 40, the present invention is not limited thereto. In the second pad 74 of another embodiment of the present invention, the second sub pads 74c and 74d may be connected to the feed line 40.
  • the second ground line 34 of the substrate for mounting a multi-band chip antenna is disposed on one surface (eg, the upper surface) of the substrate 10. It may be arranged to be connected to the two sub pads 74c and 74d. That is, in the multi-band chip antenna mounting substrate according to another embodiment of the present invention, the second ground line 34 is not connected to the second pad 74 through the via (60 in FIG. 1), and the substrate ( 10 may be disposed on one surface (eg, an upper surface) and connected to the second sub pads 74c and 74d.
  • all of the first to third ground lines 32, 34, and 36 may be disposed on one surface (eg, the upper surface) of the substrate 10.
  • the concentrated water purifying element 50d may be disposed to be connected to the second ground line 34 disposed on one surface (eg, the upper surface) of the substrate 10.
  • the length L1 of the first ground line 32 and the length L2 of the third ground line 36 are the same, but the present invention is not limited thereto. If necessary, the length L1 of the first ground line 32 and the length L2 of the third ground line 36 may be modified to be different.
  • FIG. 5 discloses the concentrated water purifying elements 50a, 50b, 50c, and 50d arranged to be connected to the first to third ground lines 32, 34, 36 and the power supply line 40, but this is also required. You can omit / add as much as you want.
  • the board for mounting a multi-band chip antenna according to another exemplary embodiment of the present invention may further include a fourth ground line 38. That is, in this case, as shown in FIG. 2, the second ground line 34 is disposed to be connected to the second pad 74 through the via 60 on the other surface (eg, the lower surface) of the substrate.
  • the four ground lines 38 are disposed to protrude from the ground pattern 20 in a second direction (for example, Y direction) on one surface (for example, upper surface) of the substrate to form second sub pads 74c and 74d. It can be connected with.
  • Other matters are the same as those of the multiband chip antenna mounting substrate according to the above-described embodiments, and thus redundant description thereof will be omitted.
  • the fourth ground line 38 of the substrate for mounting a multi-band chip antenna according to another modified embodiment of the present invention has a ground pattern on one surface (for example, an upper surface) of the substrate. 20) may be arranged so as not to protrude from.
  • Other matters are also the same as those of the multiband chip antenna mounting substrate according to the above-described embodiments, and thus redundant descriptions thereof will be omitted.
  • the multi-band chip antenna (100 of FIG. 8) is described as an example of being manufactured with a surface mount device (SMD), but the present invention is not limited thereto. That is, hereinafter, a multiband chip antenna (FIG. 8) using a surface mount technology (SMT) for attaching a component lead to a surface with solder or the like without inserting the lead of a component into a hole of a substrate (for example, a PCB). 100) is described as an example mounted on the multi-band chip antenna mounting substrate (10 of FIG. 8), but this is only one example, and the present invention is not limited thereto.
  • SMT surface mount technology
  • FIG. 8 is a perspective view of a multiband chip antenna device according to an embodiment of the present invention
  • FIGS. 9 to 11 are layout views of the multiband chip antenna of the multiband chip antenna device according to an embodiment of the present invention.
  • FIG. 9 is a top plan view of the multiband chip antenna
  • FIG. 10 is a side view of the multiband chip antenna
  • FIG. 11 is a bottom view of the multiband chip antenna.
  • the multiband chip antenna device refers to an assembly in which a multiband chip antenna in which various radiator patterns are formed on a dielectric block is formed on a multiband chip antenna mounting substrate according to various embodiments described above.
  • the multiband chip antenna is mounted on the substrate using SMT as an example, the present invention is not limited thereto.
  • a multiband chip antenna apparatus may include a multiband chip antenna mounting substrate 10 and a multiband chip antenna 100.
  • the multi-band chip antenna mounting substrate 10 may be applied to all of the multi-band chip antenna mounting substrate 10 according to various embodiments described above. That is, although only one substrate 10 of the various embodiments described above is shown in FIG. 8, the present invention is not limited to that shown in FIG. 8.
  • the multiband chip antenna 100 may include first to third radiator patterns 102, 104, and 106 disposed on at least one surface of the dielectric block.
  • the first to third radiator patterns 102, 104, and 106 may be mounted to be connected to the first to third pads 72, 74, and 76 of the substrate 10, respectively.
  • FIG. 8 illustrates that the first to third radiator patterns 102, 104, and 106 are spaced apart from each other, the present invention is not limited thereto. That is, a portion connected to the first pad 72 among the radiator patterns formed on the dielectric block may be defined as the first radiator pattern 102, and a portion connected to the second pad 74 may be the second radiator pattern 104. The portion connected to the third pad 76 may be defined as the third radiator pattern 106. 9 to 11 illustrate such first to third radiator patterns 102, 104, and 106.
  • the first to third pads 72, 74, and 76 of the substrate 10 may be symmetrically disposed about the second pad 74, and the first to third pads of the multiband chip antenna 100.
  • the radiator patterns 102, 104, and 106 may be symmetrically disposed about the second radiator pattern 104. In this case, even if the left and right directions of the multi-band chip antenna 100 are reversed, mounting on the substrate 10 may be advantageous.
  • the feed line 40, the first and second radiator patterns 102 and 104, and the first ground line 32 may form a first signal path. That is, the first signal path is formed of, for example, a feed line 40, first and second radiator patterns 102 and 104, and a first ground line 32, and has a signal having a first frequency. Can be sent or received.
  • the feed line 40, the second and third radiator patterns 104 and 106, and the third ground line 36 may form a second signal path. That is, the second signal path is formed of, for example, a feed line 40, second and third radiator patterns 104 and 106, and a third ground line 36, and has a signal having a second frequency. Can be sent or received.
  • the first frequency and the second frequency may be different frequencies. That is, for example, the first frequency may be high frequency, the second frequency may be cursed, and vice versa. Accordingly, the multiband chip antenna apparatus according to an embodiment of the present invention may be a multiband antenna capable of transmitting or receiving signals having different frequencies.
  • the lumped constant elements 50a to 50d may serve to adjust the transmission and reception frequency. That is, by adjusting the inductance or capacitance in the lumped constant elements 50a to 50d, it is possible to easily adjust the transmission / reception frequency without having to adjust the length of the first to third radiator patterns 102, 104 and 106 formed in the dielectric block. .
  • the impedance of the antenna device may be adjusted by adjusting the inductor or capacitance in the lumped constant elements 50a to 50d. Therefore, in the multi-band chip antenna apparatus according to various embodiments of the present invention, the size of the antenna can be reduced, but it is possible to easily tune the band for various frequencies. Furthermore, the difficulty of developing by changing the radiator patterns 102, 104, 106 on the dielectric block for frequency tuning or the like can be compensated for, thereby reducing the development cost and shortening the development period.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)

Abstract

La présente invention concerne un dispositif d'antenne à puce multibande qui permet un réglage aisé de fréquences de résonnance. Le dispositif d'antenne à puce multibande selon la présente invention comprend : un substrat de montage d'antenne à puce multibande ; et une antenne à puce multibande qui est montée sur le substrat et comprend des premier à troisième modèles d'émetteurs disposés sur au moins un côté d'un bloc diélectrique. Le substrat comprend un modèle de mise à la terre, des première à troisième lignes de mise à la terre disposées pour se connecter au modèle de mise à la terre, des premier à troisième atténuateurs disposés pour se connecter respectivement aux première à troisième lignes de mise à la terre, une ligne d'alimentation disposée pour se connecter au deuxième atténuateur et un élément à paramètres localisés disposé pour se connecter à au moins une ligne des première à troisième lignes de mise à la terre et à la ligne d'alimentation. Les premier à troisième modèles d'émetteur de l'antenne à puce multibande sont disposés pour se connecter respectivement aux premier à troisième atténuateurs. Selon la présente invention, il est possible de miniaturiser la taille des antennes tout en facilitant le réglage de la bande de fréquences de l'antenne à puce afin de faire correspondre une variété de bandes de fréquences en même temps.
PCT/KR2011/000323 2010-07-26 2011-01-17 Substrat de montage d'antenne à puce multibande et dispositif d'antenne à puce multibande le comprenant Ceased WO2012015131A1 (fr)

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KR1020100071909A KR101055786B1 (ko) 2010-07-26 2010-07-26 멀티밴드 칩 안테나 실장용 기판 및 이를 포함하는 멀티밴드 칩 안테나 장치
KR10-2010-0071909 2010-07-26

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WO2012015131A1 true WO2012015131A1 (fr) 2012-02-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3157097A4 (fr) * 2014-06-13 2017-11-22 NTN Corporation Antenne de puce
EP3121896A4 (fr) * 2014-03-20 2017-11-22 NTN Corporation Antenne à puce

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102607579B1 (ko) * 2018-12-31 2023-11-30 삼성전자주식회사 다중 대역 안테나를 포함하는 전자 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013139A (ja) * 1996-06-19 1998-01-16 Murata Mfg Co Ltd 表面実装型アンテナおよびこれを用いた通信機
KR100548057B1 (ko) * 2005-06-03 2006-02-01 (주)파트론 트리오 랜드구조를 갖는 표면실장 안테나 장치
KR20060094716A (ko) * 2005-02-25 2006-08-30 삼성전기주식회사 안테나 모듈 및 이를 구비한 전자 장치
JP2006270995A (ja) * 2006-05-29 2006-10-05 Kyocera Corp 表面実装型アンテナおよびアンテナ装置ならびに共振周波数の調整方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1013139A (ja) * 1996-06-19 1998-01-16 Murata Mfg Co Ltd 表面実装型アンテナおよびこれを用いた通信機
KR20060094716A (ko) * 2005-02-25 2006-08-30 삼성전기주식회사 안테나 모듈 및 이를 구비한 전자 장치
KR100548057B1 (ko) * 2005-06-03 2006-02-01 (주)파트론 트리오 랜드구조를 갖는 표면실장 안테나 장치
JP2006270995A (ja) * 2006-05-29 2006-10-05 Kyocera Corp 表面実装型アンテナおよびアンテナ装置ならびに共振周波数の調整方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3121896A4 (fr) * 2014-03-20 2017-11-22 NTN Corporation Antenne à puce
EP3157097A4 (fr) * 2014-06-13 2017-11-22 NTN Corporation Antenne de puce
US10079426B2 (en) 2014-06-13 2018-09-18 Ntn Corporation Chip antenna

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