WO2012019044A3 - Techniques de comparaison entre des spectres mesurés et des spectres de référence pour effectuer un contrôle optique in situ - Google Patents

Techniques de comparaison entre des spectres mesurés et des spectres de référence pour effectuer un contrôle optique in situ Download PDF

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Publication number
WO2012019044A3
WO2012019044A3 PCT/US2011/046646 US2011046646W WO2012019044A3 WO 2012019044 A3 WO2012019044 A3 WO 2012019044A3 US 2011046646 W US2011046646 W US 2011046646W WO 2012019044 A3 WO2012019044 A3 WO 2012019044A3
Authority
WO
WIPO (PCT)
Prior art keywords
spectra
spectrum
best matching
sequence
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/046646
Other languages
English (en)
Other versions
WO2012019044A2 (fr
Inventor
Xiaoyuan Hu
Zhihong Wang
Harry Q. Lee
Zhize Zhu
Jeffrey Drue David
Dominic J. Benvegnu
Jimin Zhang
Wen-Chiang Tu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to KR1020137005721A priority Critical patent/KR20130135241A/ko
Priority to CN2011800479788A priority patent/CN103155110A/zh
Publication of WO2012019044A2 publication Critical patent/WO2012019044A2/fr
Publication of WO2012019044A3 publication Critical patent/WO2012019044A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B24B49/045—Specially adapted gauging instruments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne un procédé de contrôle de polissage, le procédé comprenant le stockage d'une banque contenant plusieurs spectres de référence, le polissage d'un substrat, la mesure d'une séquence de spectres de lumière provenant du substrat pendant le polissage, pour chaque spectre mesuré de la séquence de spectres, la recherche d'un spectre de référence présentant la meilleure correspondance au moyen d'une technique de comparaison différente de la somme des différences au carré pour générer une séquence de spectres de référence présentant la meilleure correspondance, et la détermination d'un point final de polissage et/ou d'un ajustement du taux de polissage sur la base de la séquence de spectres de référence présentant la meilleure correspondance. La recherche d'un spectre de référence présentant la meilleure correspondance peut comprendre la mise en œuvre d'une corrélation croisée entre le spectre mesuré et chaque spectre de la banque de spectres et la sélection d'un spectre de référence présentant la meilleure corrélation avec le spectre mesuré en tant que spectre de référence présentant la meilleure correspondance.
PCT/US2011/046646 2010-08-06 2011-08-04 Techniques de comparaison entre des spectres mesurés et des spectres de référence pour effectuer un contrôle optique in situ Ceased WO2012019044A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020137005721A KR20130135241A (ko) 2010-08-06 2011-08-04 인-시츄 광학 모니터링을 위해 레퍼런스 스펙트럼들에 측정된 스펙트럼들을 매칭시키는 기법들
CN2011800479788A CN103155110A (zh) 2010-08-06 2011-08-04 将测量光谱匹配至参考光谱以进行原位光学监测的技术

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37140510P 2010-08-06 2010-08-06
US61/371,405 2010-08-06

Publications (2)

Publication Number Publication Date
WO2012019044A2 WO2012019044A2 (fr) 2012-02-09
WO2012019044A3 true WO2012019044A3 (fr) 2012-05-18

Family

ID=45556483

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/046646 Ceased WO2012019044A2 (fr) 2010-08-06 2011-08-04 Techniques de comparaison entre des spectres mesurés et des spectres de référence pour effectuer un contrôle optique in situ

Country Status (5)

Country Link
US (1) US20120034845A1 (fr)
KR (1) KR20130135241A (fr)
CN (1) CN103155110A (fr)
TW (1) TW201223702A (fr)
WO (1) WO2012019044A2 (fr)

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US8755928B2 (en) * 2011-04-27 2014-06-17 Applied Materials, Inc. Automatic selection of reference spectra library
WO2013133974A1 (fr) * 2012-03-08 2013-09-12 Applied Materials, Inc. Adaptation de modèle optique à un spectre mesuré
US9168630B2 (en) * 2012-04-23 2015-10-27 Applied Materials, Inc. User-input functions for data sequences in polishing endpoint detection
US9482610B2 (en) 2012-11-12 2016-11-01 Applied Materials, Inc. Techniques for matching spectra
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
US20140242877A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Spectrographic metrology with multiple measurements
KR101699197B1 (ko) * 2013-03-15 2017-01-23 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 프로파일 제어(ｉｓｐｃ)를 이용한 동적 잔류물 클리어링 제어
US9679823B2 (en) 2013-03-15 2017-06-13 Applied Materials, Inc. Metric for recognizing correct library spectrum
JP6105371B2 (ja) 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
US10012494B2 (en) 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
CN104778181B (zh) * 2014-01-14 2018-08-10 睿励科学仪器（上海）有限公司 一种进行测量光谱与库光谱匹配的方法及其设备
CN106457507B (zh) * 2014-04-22 2019-04-09 株式会社荏原制作所 研磨方法
US9754846B2 (en) * 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
US9362186B2 (en) 2014-07-18 2016-06-07 Applied Materials, Inc. Polishing with eddy current feed meaurement prior to deposition of conductive layer
TW201822953A (zh) 2016-09-16 2018-07-01 美商應用材料股份有限公司 基於溝槽深度的電磁感應監控進行的過拋光
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN111886686B (zh) * 2018-09-26 2024-08-02 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
CN114729835B (zh) * 2019-11-21 2025-09-26 朗姆研究公司 制造室中异常等离子体事件的检测和定位
CN111276414A (zh) * 2020-02-03 2020-06-12 长江存储科技有限责任公司 一种检测方法及装置
CN111208063A (zh) * 2020-03-03 2020-05-29 度亘激光技术（苏州）有限公司 反射光谱监测装置和方法
CN111446179B (zh) * 2020-03-31 2022-11-01 中国科学院微电子研究所 一种晶圆测试方法及装置
KR102732531B1 (ko) 2020-06-24 2024-11-21 어플라이드 머티어리얼스, 인코포레이티드 연마 패드 마모 보상을 이용한 기판 층 두께의 결정
EP4301549A4 (fr) * 2021-03-05 2025-02-26 Applied Materials, Inc. Commande de paramètres de traitement pendant le polissage d'un substrat à partir d'une fonction de coût ou de futurs changements de paramètres attendus
CN113295090A (zh) * 2021-04-08 2021-08-24 睿励科学仪器（上海）有限公司 一种用于比对光谱的方法和装置
US20220371152A1 (en) * 2021-05-20 2022-11-24 Applied Materials, Inc. Fourier filtering of spectral data for measuring layer thickness during substrate processing
CN118254097B (zh) * 2024-05-29 2024-09-10 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法及化学机械抛光设备
US12416490B1 (en) * 2024-05-29 2025-09-16 Beijing Tsd Semiconductor Co., Ltd. Method and chemical mechanical planarization device for in-situ measurement of film thickness

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US20100130100A1 (en) * 2008-11-26 2010-05-27 Applied Materials, Inc. Using optical metrology for wafer to wafer feed back process control

Also Published As

Publication number Publication date
US20120034845A1 (en) 2012-02-09
WO2012019044A2 (fr) 2012-02-09
TW201223702A (en) 2012-06-16
CN103155110A (zh) 2013-06-12
KR20130135241A (ko) 2013-12-10

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