WO2012085728A1 - Dispositif microfluidique comprenant un moyen de commande du flux de fluide - Google Patents

Dispositif microfluidique comprenant un moyen de commande du flux de fluide Download PDF

Info

Publication number
WO2012085728A1
WO2012085728A1 PCT/IB2011/055539 IB2011055539W WO2012085728A1 WO 2012085728 A1 WO2012085728 A1 WO 2012085728A1 IB 2011055539 W IB2011055539 W IB 2011055539W WO 2012085728 A1 WO2012085728 A1 WO 2012085728A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
layer
mems device
metal
track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2011/055539
Other languages
English (en)
Inventor
Maurice Hubertus Elisabeth Van Der Beek
Susanne Maaike VALSTER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of WO2012085728A1 publication Critical patent/WO2012085728A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502769—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements
    • B01L3/502784—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements specially adapted for droplet or plug flow, e.g. digital microfluidics
    • B01L3/502792—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements specially adapted for droplet or plug flow, e.g. digital microfluidics for moving individual droplets on a plate, e.g. by locally altering surface tension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0415—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic
    • B01L2400/0427—Electrowetting

Definitions

  • the invention relates to a component and a method for manufacturing a MEMS device, particularly an electrowetting on dielectric (EWOD) device, as well as to a MEMS device, in particular a micro fluidic device.
  • EWOD electrowetting on dielectric
  • a micro fluidic device that comprises metal tracks realized on a substrate, wherein said tracks are for example used for heating or for electric-field lysis.
  • the tracks are produced photolithographically in a suitable substrate, for example silicon.
  • the invention relates to a component for manufacturing a microelectromechanical-system (MEMS) device.
  • MEMS device shall refer in this context to a device with electrical and mechanical components having "small" characteristic dimensions - preferably smaller than about 1 mm -, wherein the electrical components are typically simple ones, for example electrical conductors (tracks), electrodes, or resistances.
  • the component for manufacturing a MEMS device is altered during the manufacturing of the final product, i.e. the MEMS device.
  • the component shall comprise the following elements:
  • the term "track” shall in this context quite generally refer to any electrically conductive metal structure. This comprises of course tracks in the narrower sense, i.e. electrical conductors, leads, lines or wires.
  • the embedding of the track(s) in the substrate layer can preferably take place in a form-locking manner. This may for example be achieved if the tracks comprise undercuts, recesses, holes, indentations or the like that allow for a positive locking-fit between the tracks and the thermoplastic material.
  • the invention relates to a MEMS device, particularly a micro fluidic device, comprising the following components:
  • the invention relates to a method for manufacturing a MEMS device, particularly a MEMS device of the kind described above, said method comprising the following steps:
  • the component, the MEMS device, and the manufacturing method are related by the common concept that at least one metal track is embedded in a thermoplastic substrate layer. Any features or definitions explained for one of these elements will therefore be valid for the other elements, too.
  • By embedding metal tracks in a thermoplastic material in a form- locking manner it is possible to provide a reliable junction between metal and plastic. From a manufacturing point of view, an embedding is achieved by first providing tracks on an assistant layer which may be removed after the thermoplastic material has been overmolded.
  • the combination of metal tracks with a thermoplastic material has the advantage that MEMS devices with versatile electrical functionality and micromechanical structures can be produced in a cost-effective way.
  • the assistant layer may particularly be removed by etching.
  • etching By adjusting the etching time appropriately and/or choosing a proper combination of removable metal and metal of the track, etching can be done in such a way that it does not affect the metal track.
  • an electrically isolating material is disposed as a "dielectric layer" on the surface which is exposed after removal of the assistant layer.
  • the dielectric layer will hence at least partially occupy the previous position of the assistant layer.
  • the electrically isolating material of the dielectric layer may particularly be selected from the group consisting of poly(p-xylylene) polymers, polytetrafluoroethylene (Teflon®, particularly AF1600 by DuPont) and basically each polymer that can be dissolved and applied as a thin layer by either dipcoating or spin-coating. Most preferably, this isolating material is hydrophobic.
  • the removable metal of the assistant layer is copper (Cu).
  • the track may preferably comprise a metal selected from the group consisting of nickel (Ni), palladium (Pd), and gold (Au).
  • thermoplastic material of the substrate layer is preferably selected from the group consisting of polymers, particularly liquid crystal polymers (LCP),
  • PS polystyrene
  • COP cyclic-olefm polymer
  • COC cyclic-olefin co-polymer
  • PMMA polymethyl methacrylate
  • PC polycarbonate
  • PP polypropylene
  • PE polyethylene
  • PA polyamide
  • ABS acrylonitrile butadiene styrene
  • a micro fluidic component is disposed on the substrate layer of the thermoplastic material.
  • a microfluidic component with a system of channels and chambers that accommodate and transport fluids can cost- effectively be manufactured from plastic, for example by injection molding. It is a particular achievement of the present invention that such a plastic microfluidic component can readily be combined with a MEMS device because the latter is primarily made of a (compatible) thermoplastic material.
  • the aforementioned micro fluidic component preferably comprises at least one cavity or chamber that is disposed above the track (or above at least one of several tracks). Applying an electrical potential to the track will then allow to affect processes taking place in said cavity.
  • the microfluidic component may particularly comprise an electrode layer.
  • This electrode layer can for instance be used as a counter electrode to the metal track(s), allowing to apply electrical fields to the (microfluidic) structures in between.
  • the microfluidic component is preferably designed to allow the control of fluid flow by electrowetting on dielectric ("EWOD") using the metal track(s) as electrode(s).
  • EWOD electrowetting on dielectric
  • the local wettability of a surface is manipulated by the application of voltages between electrodes placed beneath hydrophobic dielectric layers. This allows to move liquid droplets on the surface. Details about this technology may be found in literature (e.g. Fair,
  • the microfluidic component is designed to allow for controlling the thermal properties of a fluid within it using the metal track as thermal actuator (e.g. heating element) and/or thermal sensor.
  • thermal actuator e.g. heating element
  • thermal sensor may use a temperature-dependent resistance of the track.
  • the microfluidic component is designed to allow for sensing the fluid flow within it using the metal track(s) as flow sensor or part of a flow sensor.
  • a flow sensor may for instance be realized with the aforementioned heating element and thermal sensor, using the principle that heat produced by the heater is spatially distributed by convection depending on the flow of a fluid in the adjacent cavity. Measuring the temperature at one or (preferably) more locations will therefore allow to infer the direction and/or magnitude of the fluid flow.
  • the microfluidic component may comprise a substrate that provides a robust outer surface.
  • Figure 5 shows a bottom view onto the electrical tracks on the assistant layer of a real product
  • Figure 6 shows a sectional side view of a component with metal tracks embedded in a thermoplastic material below a dielectric layer
  • FIG. 7 shows a sectional side view of a MEMS device according to the present invention.
  • Like reference numbers in the Figures refer to identical or similar components.
  • Microfluidic devices for use in in- vitro diagnostics are often disposable to prevent cross contamination when examining samples of multiple patients. Because of their single use, these disposables have to be manufactured at low unit costs. This is the main motif to use thermoplastics and the process of injection molding for the manufacturing of microfluidic devices for IVD.
  • Controlled fluid transport inside such devices can be realized using either capillary flow or pressure driven flow.
  • capillary flow the plastic is made hydrophilic and the fluid control is fully determined by the geometry of the fluidic channels.
  • pressure driven flow an actuator provides a pressure difference to generate flow.
  • the main disadvantages of these transport methods are: i) a relatively high amount of dead volume is resulting, ii) in principle only relatively simple fluid handling is possible, iii) more complex fluid handling comes at the expense of a large increase in fluidic "foot print”, iv) robust bio-chemical assays are required to compensate the relatively simple fluid handling.
  • EWOD electro wetting on dielectric
  • This technique requires the integration of a defined electrode path to transport liquid droplets along. Additionally, electrical interconnections are necessary to connect the electrodes to the outside world.
  • metal structures with dimensions as demanded by EWOD electrodes can be created using photo-lithographic structuring of a sacrificial polymer layer on glass. This is followed by local removal of the polymer leaving the glass exposed underneath. On the glass, metal is sputtered and/or electrochemically grown (Fair, R.B., Microfluid Nanofluid, 2007, 3, pp. 245).
  • metal structures with dimensions as demanded by EWOD electrodes can hardly be created because of the relatively bad surface adhesion of metals to plastics in combination with a relatively large difference in thermal expansion coefficient between plastics and metals.
  • Industrially known techniques to create metal structures on plastics either: i) involve several (wet-)chemical steps and therefore endanger a proper functioning of the biochemical assay due to contaminations, ii) are inherently limited to use on a few types of plastics, iii) are too expensive for use in IVD disposable devices, iv) are from a manufacturing process point of view not compatible with integration of bio molecules as required for use in IVD (residue of etching and
  • galvanization/electroplating processes may be incompatible with subsequent application of biomolecules - immobilization of proteins, DNA, R A - for a biochemical assay).
  • Integration and fluid tight interfacing of a glass based EWOD driven (sub)device into a larger plastic device is relatively difficult in rendering a fluid tight connection (due to limited design freedom in glass for joining features and limited sealing techniques of glass-plastic interface). Integration and fluid tight interfacing of a plastic EWOD driven (sub)device into a larger plastic device is easier because of the additional sealing/joining techniques available to join two plastic parts (e.g. thermal techniques such as laser welding, and the additional design freedom to shape joining features).
  • a new design for a microfluidic device (or, more generally, a MEMS device) is proposed that is based on the embedding of metal tracks in a substrate layer of a thermoplastic material.
  • a particular embodiment of this approach will in the following be described in more detail with respect to the associated manufacturing method.
  • a first step of the manufacturing method is to create nickel-palladium-gold (Ni/Pd/Au) metal tracks 120 on an "assistant layer" 110 of a removable metal, e.g. copper (Cu).
  • a removable metal e.g. copper (Cu).
  • the control electrodes to transport liquid droplets using EWOD are created.
  • Figures 1 to 4 illustrate an exemplary way how this can be done.
  • a first Cu layer 110 called “assistant layer” (e.g. 65 ⁇ thick);
  • an intermediate Ni layer 121 (e.g. 1 ⁇ thick);
  • a second Cu layer 122 (e.g. 25 ⁇ thick);
  • Ni-Pd-Au material 123 has been deposited in the resulting openings by electroplating.
  • the aforementioned metal tracks 120 are embedded in a "substrate layer" 210 of a thermoplastic material.
  • a substrate layer 210 of a thermoplastic material.
  • an (intermediate) component 200 is achieved that can be further used and processed as desired.
  • the assistant layer 110 can be removed in a next step by etching, as shown in Figure 4.
  • Figure 5 shows a bottom view onto electrical Ni/Pd/Au tracks 120 on an assistant layer 110 for a real product (corresponding to a top view onto the state of Figure 2).
  • the Ni-Pd/Au tracks 120 are then overmolded by a substrate layer 210 using a thermoplastic material, for example polystyrene (PS).
  • PS polystyrene
  • the Ni/Pd/Au metal tracks 120 will thus be mechanically anchored by the plastic 210 due to the form factor inherent to the described manufacturing of the Cu assistant layer.
  • the resulting intermediate component has been further processed by removal of the Cu assistant layer using etching techniques, and by depositing an electrically isolating dielectric layer 310 (parylene C) at the previous position of the assistant layer.
  • FIG. 7 shows a schematic cross section of the resulting EWOD device 300. From bottom to top, this device 300 comprises the following components:
  • a substrate layer 210 of a thermoplastic material for example a polymer like LCP/PS (typical thickness: about 1 - 2 mm).
  • Metal tracks 120 e.g. Ni/Pd/Au that are embedded in the substrate layer 210 and that may later serve as control electrodes for EWOD (typical thickness: about 25 ⁇ ).
  • An electrically isolating dielectric layer 310 for example of Parylene C (from Parylene Coating Services, Inc, Texas, USA) (typical thickness:
  • An additional ((super)-hydrophobic) layer 320 for example consisting of AF1600 Teflon (typical thickness: about 10 nm).
  • Another additional ((super)-hydrophobic) layer 340 for example consisting of AF1600 Teflon (typical thickness: about 10 nm).
  • a (transparent) electrode layer 350 that may be operated as ground electrode and that may consist of ITO or ZnO or any other electrically conductive material.
  • a substrate (could be glass or plastic) 360 (typical thickness:
  • the invention relates to a component 200 and a method for manufacturing a MEMS device, particularly a microfluidic device 300.
  • the component 200 comprises at least one metal track 120 on an assistant layer 110 of a removable metal.
  • the track 120 is embedded in a substrate layer 210 of a thermoplastic material.
  • the assistant layer 110 can later be removed, and a microfluidic component can be built upon the thus exposed surface.
  • the invention is inter alia applicable to disposable microfluidic cartridges (i.e. lab-on-chip devices, for use in (hand held) IVD applications, or disposable parts of nebulizers), and to control the wettability of physiological liquids and/or liquid reagents on a substrate surface that could result in fluid manipulation and/or transportation.
  • disposable microfluidic cartridges i.e. lab-on-chip devices, for use in (hand held) IVD applications, or disposable parts of nebulizers
  • control the wettability of physiological liquids and/or liquid reagents on a substrate surface that could result in fluid manipulation and/or transportation.
  • EWOD enables fast and complex fluid handling steps. Droplets can be merged, split, or parallel processed without the need for a complex fluidic circuit with (physical) valves and pumps.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

L'invention concerne un composant (200) et un procédé de fabrication d'un dispositif MEMS, en particulier un dispositif microfluidique. Le composant (200) comprend au moins une piste métallique (120) sur une couche auxiliaire (110) d'un métal amovible. La piste (120) est noyée dans une couche de substrat (210) faite d'un matériau thermoplastique. La couche auxiliaire (110) peut ultérieurement être éliminée et un composant microfluidique peut être construit sur la surface ainsi exposée.
PCT/IB2011/055539 2010-12-20 2011-12-08 Dispositif microfluidique comprenant un moyen de commande du flux de fluide Ceased WO2012085728A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10195853 2010-12-20
EP10195853.6 2010-12-20

Publications (1)

Publication Number Publication Date
WO2012085728A1 true WO2012085728A1 (fr) 2012-06-28

Family

ID=45406804

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/055539 Ceased WO2012085728A1 (fr) 2010-12-20 2011-12-08 Dispositif microfluidique comprenant un moyen de commande du flux de fluide

Country Status (1)

Country Link
WO (1) WO2012085728A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896007A (zh) * 2012-10-09 2013-01-30 华中科技大学 一种微流控器件及其制备方法
EP3582892A4 (fr) * 2017-04-21 2020-03-04 Hewlett-Packard Development Company, L.P. Manipulation microfluidique coplanaire
EP3582894A4 (fr) * 2017-04-21 2020-03-04 Hewlett-Packard Development Company, L.P. Puce microfluidique
WO2021097383A1 (fr) * 2019-11-14 2021-05-20 Lcp Medical Technologies, Inc, Dispositif à microélectronique intégrée dans un polymère à cristaux liquides
US11278892B2 (en) 2017-04-21 2022-03-22 Hewlett-Packard Development Company, L.P. Chip to chip fluidic interconnect
US11364496B2 (en) 2017-04-21 2022-06-21 Hewlett-Packard Development Company, L.P. Coplanar fluidic interconnect

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070238164A1 (en) * 2006-04-10 2007-10-11 Skc Co., Ltd. Plastic microchip for microparticle analysis and method for manufacturing the same
WO2008101348A1 (fr) * 2007-02-21 2008-08-28 The Royal Institution For The Advancement Of Learning/Mcgill University Système et procédé de détection de molécule par résonance plasmonique de surface
US20100000866A1 (en) * 2008-07-07 2010-01-07 Commissariat A L'energie Atomique Microfluidic device for controlled movement of liquid
WO2010004014A1 (fr) * 2008-07-11 2010-01-14 Commissariat A L'energie Atomique Procede et dispositif de manipulation et d'observation de gouttes de liquide
WO2010009463A2 (fr) * 2008-07-18 2010-01-21 Advanced Liquid Logic, Inc. Dispositif d'opérations de gouttelettes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070238164A1 (en) * 2006-04-10 2007-10-11 Skc Co., Ltd. Plastic microchip for microparticle analysis and method for manufacturing the same
WO2008101348A1 (fr) * 2007-02-21 2008-08-28 The Royal Institution For The Advancement Of Learning/Mcgill University Système et procédé de détection de molécule par résonance plasmonique de surface
US20100000866A1 (en) * 2008-07-07 2010-01-07 Commissariat A L'energie Atomique Microfluidic device for controlled movement of liquid
WO2010004014A1 (fr) * 2008-07-11 2010-01-14 Commissariat A L'energie Atomique Procede et dispositif de manipulation et d'observation de gouttes de liquide
WO2010009463A2 (fr) * 2008-07-18 2010-01-21 Advanced Liquid Logic, Inc. Dispositif d'opérations de gouttelettes

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896007A (zh) * 2012-10-09 2013-01-30 华中科技大学 一种微流控器件及其制备方法
CN102896007B (zh) * 2012-10-09 2015-04-15 华中科技大学 一种微流控器件及其制备方法
EP3582892A4 (fr) * 2017-04-21 2020-03-04 Hewlett-Packard Development Company, L.P. Manipulation microfluidique coplanaire
EP3582894A4 (fr) * 2017-04-21 2020-03-04 Hewlett-Packard Development Company, L.P. Puce microfluidique
US11235328B2 (en) 2017-04-21 2022-02-01 Hewlett-Packard Development Company, L.P. Coplanar microfluidic manipulation
US11278892B2 (en) 2017-04-21 2022-03-22 Hewlett-Packard Development Company, L.P. Chip to chip fluidic interconnect
US11278887B2 (en) 2017-04-21 2022-03-22 Hewlett-Packard Development Company, L.P. Microfluidic chip
US11364496B2 (en) 2017-04-21 2022-06-21 Hewlett-Packard Development Company, L.P. Coplanar fluidic interconnect
WO2021097383A1 (fr) * 2019-11-14 2021-05-20 Lcp Medical Technologies, Inc, Dispositif à microélectronique intégrée dans un polymère à cristaux liquides
US11997786B2 (en) 2019-11-14 2024-05-28 Lcp Medical Technologies, Llc Liquid crystal polymer embedded microelectronics device
US12588143B2 (en) 2019-11-14 2026-03-24 Lcp Medical Technologies, Llc Liquid crystal polymer embedded microelectronics device

Similar Documents

Publication Publication Date Title
US7144616B1 (en) Microfabricated elastomeric valve and pump systems
US6951632B2 (en) Microfluidic devices for introducing and dispensing fluids from microfluidic systems
US8104515B2 (en) Microfabricated elastomeric valve and pump systems
Ahn et al. Disposable smart lab on a chip for point-of-care clinical diagnostics
US7216671B2 (en) Microfabricated elastomeric valve and pump systems
Lei Materials and fabrication techniques for nano-and microfluidic devices
US20020145231A1 (en) High throughput screening of crystallization of materials
WO2012085728A1 (fr) Dispositif microfluidique comprenant un moyen de commande du flux de fluide
Han et al. Multi-layer plastic/glass microfluidic systems containing electrical and mechanical functionality
US20140179021A1 (en) High throughput microfluidic device
JP2004000163A (ja) 細胞の処理に用いるセル
Attia et al. Integration of functionality into polymer-based microfluidic devices produced by high-volume micro-moulding techniques
Chartier et al. Fabrication of hybrid plastic-silicon microfluidic devices for individual cell manipulation by dielectrophoresis
Jang et al. Self-operated blood plasma separation using micropump in polymer-based microfluidic device
KR100779083B1 (ko) 플라스틱 미세가열 시스템, 그 미세가열 시스템을 이용한랩온어칩, 및 그 미세가열 시스템의 제조방법
Madou et al. From batch to continuous manufacturing of microbiomedical and microanalytical devices
Liu et al. Microfluidic and lab-on-chip technologies for biosensors
CA2767084C (fr) Obturateur elastomere micro-usine et systemes de pompe
Kulkarni Design, Fabrication and Testing of an Electrically Controlled Microfluidic Capillary Microvalve Based on Hydrophobicity
Dankovic Design, simulation and characterization of compliant microfluidic devices
SONG Modular Architecture in Micropump

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11801851

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11801851

Country of ref document: EP

Kind code of ref document: A1