WO2012110032A2 - Module d'appareil photographique - Google Patents

Module d'appareil photographique Download PDF

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Publication number
WO2012110032A2
WO2012110032A2 PCT/DE2012/100034 DE2012100034W WO2012110032A2 WO 2012110032 A2 WO2012110032 A2 WO 2012110032A2 DE 2012100034 W DE2012100034 W DE 2012100034W WO 2012110032 A2 WO2012110032 A2 WO 2012110032A2
Authority
WO
WIPO (PCT)
Prior art keywords
module housing
opening
imaging system
carrier plate
camera module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2012/100034
Other languages
German (de)
English (en)
Other versions
WO2012110032A3 (fr
Inventor
Konrad ROTHENHÄUSLER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to DE112012000147T priority Critical patent/DE112012000147A5/de
Publication of WO2012110032A2 publication Critical patent/WO2012110032A2/fr
Publication of WO2012110032A3 publication Critical patent/WO2012110032A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the invention relates to a camera module comprising a module housing in which an imaging system, e.g. a lens stack, and an image pickup element, e.g. a CMOS imager, are arranged.
  • an imaging system e.g. a lens stack
  • an image pickup element e.g. a CMOS imager
  • Camera modules with an image pickup element as the imaging unit e.g. Cameras with a CMOS or CCD chip are used, inter alia, in vehicles equipped with driver assistance systems.
  • the cameras are used in the case to record the environment or the interior of a vehicle and pass on evaluable images.
  • the driver assistance systems are, for example, lane assist, traffic sign recognition, collision warning, pedestrian recognition or similar applications.
  • the cameras used are usually constructed of a lens and a camera body, which are connected by a suitable connection technique, e.g. by means of an adhesive connection, are interconnected.
  • the quality of cameras depends crucially on the quality of the connection between the lens and the camera body and u. a. from camera intrinsic tolerances and installation tolerances.
  • a camera for use in a motor vehicle is known, for example, from EP 1 723 782 B1, comprising a lens carrier, which is arranged on a printed circuit board with an image sensor, and an objective for projecting an image onto the image sensor, wherein the objective is connected to the lens carrier ,
  • the invention is therefore based on the object of specifying an optical device and a method for its production, wherein the imaging system and the image pickup element can be precisely adjusted by suitable design of the optical device with respect to all known degrees of freedom.
  • An essential concept of the invention is to design an optical device, wherein the imaging system and the image pickup element are not arranged separately in the lens and the camera body, but in a common housing.
  • the common housing hereinafter referred to as module housing, is preferably configured with engagement and adjustment openings, whereby the image acquisition element can be arranged inside the module housing behind the imaging system and precisely aligned there.
  • the image-receiving element is preferably arranged with curing adhesive on a Klebefizze in the module housing, wherein the materials or Materials of the module housing and the adhesive can be selected such that there is a temperature-compensating system.
  • the orientation and adjustment of a camera module or that of an imaging system to an image pickup element generally relates
  • the normal of the imaging system corresponds to the optical axis of the camera module and is defined by the fact that it passes through the center of the imaging system and passes through the imaging system without beam deflection.
  • the center of the image pickup element is defined by the center of its surface sensitive to electromagnetic radiation and is thus located in particular at half height and half width of the sensitive surface.
  • the normal of the image pickup element is defined by the fact that it runs perpendicular to the sensitive surface of the image pickup element and through its center.
  • the orientation of the center of the image pickup element to the normal of the imaging system is aimed at having the normal of the imaging system intersect the center of the image pickup element.
  • the orientation of the image pickup element in terms of its yaw or pitch angle to the image-side main plane of the imaging system aims at that the normal of the image pickup element is parallel to the optical axis or that normal and optical axis overlap, so that yaw and pitch angles each have the value 0th ° and thus the sensitive surface of the image pickup element is aligned in particular parallel to the image-side main plane of the imaging system.
  • the orientation of the image pickup element with respect to its roll angle relates to the orientation of the image pickup element with respect to the rotation about its normal or about the optical axis.
  • the setting of a defined distance between the image pickup element and the imaging system in the direction of the optical axis relates to adjusting the distance between the image-side main plane of the imaging system and the sensitive surface of the image pickup element in the direction of the optical axis and in particular serves to focus the optical system or the camera module.
  • the camera module according to the invention comprises a module housing with at least one light incidence opening.
  • the light incidence opening serves, in particular, for light or electromagnetic radiation to be able to enter the module housing in a controlled manner and thus corresponds in its function to that of a lens, as is used in optical systems or cameras known from the prior art.
  • the light incidence opening can be designed as a cylindrical shaft or as a tube with uniform or uneven internal diameter.
  • an imaging system which comprises at least one lens is arranged in the light entrance opening of the camera module.
  • the imaging system may, for example, also be designed as a lens stack which is introduced into the light incidence opening when the camera module is manufactured.
  • the camera module comprises at least one image recording element, for example a CMOS or CCD chip, which is arranged on a carrier plate, for example a printed circuit board.
  • the image pickup element comprises at least one area sensitive to electromagnetic radiation.
  • the support plate with image-receiving element is preferably arranged by means of curing adhesive on an adhesive surface in the interior of the module housing.
  • the adhesive surface is preferably an area in the interior of the module housing, which faces the light incidence opening, so that the imaging system projects the electromagnetic radiation incident through the light incidence opening onto the sensitive surface of the image recording element.
  • the module housing of the camera module further comprises at least a first engagement opening.
  • the first engagement opening is preferably designed such that the carrier plate can be introduced with image receiving element through the first engagement opening in the module housing.
  • the first engagement opening is preferably designed in a wall of the module housing, which is aligned perpendicular to the adhesive surface and / or parallel to the optical axis.
  • the module housing is configured with a second engagement opening.
  • the second engagement opening can be configured in the region of the adhesive surface in the wall of the module housing and is preferably located below the carrier plate with image recording element.
  • the second engagement opening is cylindrical and configured with a thread.
  • a closure lid is arranged in the second engagement opening.
  • the closure lid can for example also be designed with a thread and screwed into the second engagement opening.
  • the closure lid is configured with at least one nipple.
  • the nipple is formed, for example, as a hemispherical material elevation on a surface of the closure cap.
  • the nipple is configured on the side facing the interior of the module housing and in the center of the closure lid.
  • the nipple can be arranged on the closure lid in such a way that, in particular when the closure lid is screwed in, it is aligned centrally in the module housing with respect to the optical axis and / or on the rear side of the carrier plate with image recording element arranged in the interior of the module housing.
  • the rear side of the carrier plate is meant in particular the adhesive surface in the module housing facing side of the carrier plate.
  • thermal compound is arranged between the contact areas of nipple and carrier plate with image pickup element.
  • thermal compound is arranged between the contact areas of nipple and carrier plate with image pickup element.
  • the module housing of the camera module is configured with at least one adjustment opening.
  • the at least one adjustment opening is preferably arranged in a wall of the module housing, the is aligned perpendicular to the adhesive surface and / or the wall in which the first engagement opening is configured opposite.
  • the module housing is configured with two adjustment openings, which are arranged, for example, side by side in a wall of the module housing.
  • the material or the materials of the module housing and the adhesive used which is used to arrange the carrier plate with image recording element on the adhesive surface in the module housing, selected such that there is a temperature-compensating system.
  • temperature-compensating system means that the change in the distance between the image-recording element or its sensitive surface and imaging system or its image-side main plane, e.g. by a change in the operating temperature or a resulting material expansion or shrinkage, by an expansion or shrinkage of the adhesive, e.g. also due to the change in operating temperature is compensated.
  • a system is advantageously provided in which the image recording element or its sensitive surface follows a change of location of the imaging system as a result of a temperature change. This results in a temperature-stable focusing and long-term stable alignment between imaging system and image pickup element for the camera module.
  • At least one of the adjustment openings and / or engagement openings is closed by means of a sealant and / or adhesive tape.
  • the first engagement opening and the one or more adjustment openings are closed with a sealant and / or adhesive tape and the second engagement opening with a closure lid.
  • At least one dirt collecting element is arranged in the interior of the module housing in the region of the first engagement opening and / or in the region of the at least one adjustment opening, for example adhesive tape and / or an electrostatically chargeable dust collector.
  • At least one dirt collecting element is configured such that it absorbs moisture from the interior of the camera Module housing dissipates to the outside and / or at least receives or absorbed.
  • the at least one dirt collecting element can have one or more functional elements for removing and / or absorbing the moisture.
  • the carrier plate on which the image recording element is arranged is electrically connected to further electrical or electromechanical components inside and / or outside of the module housing.
  • the components outside the module housing may be, for example, a control unit.
  • the carrier plate preferably comprises at least one electrical connection or at least one electrical interface.
  • the at least one electrical connection or the at least one electrical interface is arranged on a part of the carrier plate, which protrudes through the first engagement opening of the module housing.
  • the at least one connection or the interface is glued to the outer wall of the module housing.
  • the at least one electrical connection or the at least one electrical interface is arranged on a part of the carrier plate which extends into the first engagement opening of the module housing.
  • the at least one connection or the interface is glued to the inner wall of the module housing in the region of the first engagement opening.
  • the first engagement opening, the second engagement opening and / or the at least one adjustment opening are configured such that, for example, during manufacture and / or alignment of the camera module by means of engagement tools, the carrier plate can be gripped through the openings in the interior of the module housing ,
  • the first engagement opening, the second Engagement opening and / or the at least one adjustment opening are for this purpose preferably designed with cutouts, so that engagement tools can grip the support plate through the openings therethrough.
  • the module housing and / or the closure lid consist of copper, brass, aluminum and / or glass-fiber-reinforced plastic. This results in particular in a good thermal conductivity of the camera module, whereby, for example, operating heat can be derived from the image recording element or from the carrier plate via the closure lid and / or the module housing.
  • the imaging system is arranged in the light incidence opening such that the imaging system is pressed with a defined force along the optical axis in the direction of the image recording element.
  • the imaging system for example, if it is a lens stack, to the outside, i. out of the module housing, with a spring element and inwards, i. in the direction of the interior of the module housing and thus in the direction of the image pickup element, complete with a securing element, wherein the spring element and the securing element are preferably also arranged in the light incident opening.
  • the spring element presses in the previously described embodiment, the imaging system or the lens stack with a defined spring force in the direction of the image pickup element against the fuse element. This ensures in particular that the imaging system is kept as stable or constant as possible with regard to the distance to the image recording element, for example even with a material expansion of the module housing as a result of a change in the operating temperature.
  • An inventive method for producing a camera module comprising the arrangement of an image pickup element which is arranged on a support plate in a module housing of the camera module, wherein the module housing simultaneously serves to receive an imaging system in a light incidence opening.
  • the carrier plate on which the Image receiving element is arranged thereby introduced by a first engagement opening in the module housing.
  • the camera module in particular the carrier plate or the image pickup element arranged on the carrier plate, is aligned in the interior of the module housing after insertion through the first engagement opening into the module housing.
  • the orientation of the camera module is preferably carried out through the first engagement opening, for example, in which the carrier plate is manipulated by means of a special intervention tool with respect to its position and orientation.
  • the orientation of the camera module or the carrier plate with image recording element for imaging system additionally by at least one configured in the module housing adjustment opening.
  • the introduction of the carrier plate with image recording element and the alignment of the camera module by means of one or more special interventional and / or adjustment tools done.
  • the image-receiving element is aligned at a desired nominal distance from the imaging system and arranged on the adhesive surface by means of curing adhesive.
  • the alignment in a desired nominal distance is in particular the setting of a defined distance between the image recording element and the imaging system in the direction of the optical axis, so that a desired object distance is focused.
  • the support plate, on which the image pickup element is arranged arranged at an actual distance from the imaging system in the interior of the module housing and pressed into liquid adhesive, which is arranged on an adhesive surface.
  • the actual distance is in particular greater than the desired target distance.
  • the closure lid is designed with at least one nipple as the point of contact between the closure lid and Carrier plate is used.
  • the subsequent alignment of the carrier plate with Jardinaumahmeelement can be done, for example, not yet fully cured adhesive.
  • Another method according to the invention for producing a camera module comprises the steps:
  • Imaging system in the interior of the module housing with one or more adjustment tools that engage the support plate at one or more points of attack through the first and / or second engagement openings and / or at least one adjustment opening.
  • (V) adhesive curing by introducing UV light and / or IR light through the first and / or second engagement opening and / or the at least one
  • Another method according to the invention for producing a camera module comprises the steps:
  • Imaging system in the interior of the module housing with one or more adjustment tools that grab the support plate at one or more points of attack through the first and / or second engagement opening and / or the at least one Justageöff opening.
  • (V) adhesive curing by introducing UV light and / or IR light through the first and / or second engagement opening and / or at least one adjustment opening.
  • a decoupling of the one or more adjustment tools is closed after the decoupling of the one or more adjustment tools.
  • the engagement and adjustment openings are closed after the decoupling of the one or more adjustment tools.
  • a closure lid which can preferably be screwed into the second engagement opening.
  • the first engagement opening and / or the at least one adjustment opening can be closed, for example, with a sealant and / or by means of adhesive tape.
  • the module housing is held during insertion of the support plate with image pickup element such that the support plate is introduced with image pickup element from above and with slight inclination through the first engagement opening in the module housing.
  • one or more additional components are arranged in the interior of the module housing and / or on the carrier plate with image recording element.
  • the additional components may be, for example, electronic components.
  • the additional components are dummy components which serve as running surfaces or for guiding the carrier plate when introduced into the module housing and thus enable a controlled introduction or slipping of the carrier plate through the first engagement opening into the interior of the module housing.
  • the orientation of the image recording element or the carrier plate, on which the image pickup element is arranged, such that the support plate is held stationary with image pickup element by means of one or more adjustment tools within the module housing and the module housing to the support plate is varied with its picture element in its position and position around.
  • the components arranged and aligned in the interior of the module housing are checked during the method and / or according to the method for impurities, for example dust, and if dirt is detected by introduction of a cleaning tool through at least one of the engagement openings and / or the at least one adjustment openings cleaned.
  • the cleaning tool can be a suction device for extracting contaminants or an air gun for blowing in compressed air.
  • Stubborn impurities for example on the image-receiving element or on a cover glass arranged above the image-receiving element, can in particular also be conveyed through one of the openings with cleaning alcohol, e.g. Ethanol, wiped off.
  • Purified components are preferably rechecked for contamination.
  • the carrier plate on which the image-receiving element is arranged is designed such that the carrier plate has regions which are especially suitable for the attack of adjustment tools are designed.
  • the areas may be, for example, protruding areas of the carrier plate, which also preferably have predetermined breaking points.
  • the protruding areas protrude out of the module housing, in particular when the carrier plate is inserted into the module housing, so that they can be easily gripped by the adjustment tools.
  • the protruding areas can be separated from the rest of the carrier plate after inserting the carrier plate into the module housing and after aligning with the imaging system, for example by means of the predetermined breaking points and / or by means of cutting tools.
  • FIG. 1 shows an example of a camera module 1 according to the invention.
  • the camera module 1 comprises a module housing 2 with a light incidence opening 3.
  • the light incidence opening 3 is designed as a cylindrical shaft and has a non-uniform inner diameter. The inner diameter gradually increases toward the inner space 4.
  • an imaging system 5 is arranged, in this case a lens stack.
  • the imaging system 5 has a normal which corresponds to the optical axis 6 of the camera module 1.
  • the module housing 2 also comprises further openings, in particular a first engagement opening 7, a second engagement opening 8, which is also configured with a screw thread, and an adjustment opening 9.
  • an adhesive surface 11 which is on the light incidence opening 3 opposite side of the interior 4, curing adhesive 12 is arranged.
  • the camera module 1 of FIG. 1 further comprises a closure cap 13 which is configured with a nipple 14 and a thread and which can be screwed into the second engagement opening 8.
  • the nipple 14 is designed as a hemispherical material collection and is located on the side of the closure cap 13, which in the screwed state in the interior 4 of the module housing 2 shows, so that the nipple 14 is located centrally to the optical axis 6 of the camera module 1.
  • the module housing 2 of FIG. 1 can optionally also assume a different form than the one shown.
  • Fig. 2a another camera module 1 according to the invention is shown.
  • the camera module is constructed in large parts in accordance with the description of FIG. 1.
  • the image recording element 15 may be, for example, an imager chip, which is designed as a CMOS or CCD chip and has a surface sensitive to electromagnetic radiation.
  • the carrier plate 16 is for example a printed circuit board and can be designed as a flexible printed circuit board, as a PCB (Printed Circuit Board) and / or ceramic printed circuit board.
  • the support plate 16 is in particular electrically connected to the image recording element 15 and arranged by means of curing adhesive 12 on the adhesive surface 11 in the interior 4 of the module housing 2.
  • a closure cap 13 is screwed with nipple 14 in the second engagement opening 8.
  • the nipple 14 is applied to the back of the support plate 16.
  • Between the support plate 16 and the Ve gleichdeckel 13 curing adhesive 12 is also arranged.
  • an appropriate choice of material for example, in the production of the closure cap 13 and / or the module housing 2 made of copper, aluminum or a similarly thermally conductive material, results for the camera module 1 of Fig. 2a, a particularly good dissipation of, for example, during operation of the camera module 1 heat.
  • the heat dissipation or heat dissipation can also be improved by 16 at the contact surface between nipple 14 and support plate thermal paste (not shown in Fig. 2a) is arranged.
  • the carrier plate 16 in FIG. 2 a is designed such that a part of the carrier plate 16 projects out of the first engagement opening 7.
  • a connection or an interface 17 is arranged, so that components (not shown in Fig. 2a), for example a control device, with the camera module 1 and with the carrier plate 16 can be electrically connected via one or more electrical connections 18.
  • the connection 17 is preferably glued to the outer wall of the module housing 2. According to the invention, more connections 17 than in FIG.
  • FIG. 2b shows a camera module 1 according to the invention which is largely constructed in accordance with the description of FIG. 2a.
  • the carrier plate 16 in FIG. 2 b is designed such that a part of the carrier plate 16 protrudes into the first engagement opening 7 of the module housing 2.
  • the arranged on the support plate 16 electrical connection 17th is glued in this case with a part of the inner wall of the module housing 2 in the region of the first engagement opening 7.
  • FIG. 3 shows a camera module 1 according to the invention corresponding to the descriptions for FIG. 2a, viewed from outside on the camera module 1 and perpendicular to the second engagement opening 8.
  • FIG Engagement opening 8 shows no closure lid 13 in the second.
  • Fig. 3 shows the circular configuration of the second engagement opening 8, the terminal 17 which is glued to the outer wall of the module housing 2 and disposed on a part of the support plate 16, which protrudes from the module housing 2.
  • Fig. 3 also shows how the first adjustment opening 9 is configured with cutouts 19.
  • the cutouts 19 serve, in particular, for one or more adjustment tools (not shown in FIG. 3), which serves to align the carrier plate 16 with image recording element 15 to the imaging system 5, to grip the carrier plate 16 on the regions projecting into the first adjustment opening 9 ,
  • FIG. 4a-d show a camera module 1 according to the invention, which is largely constructed in accordance with the description of FIG. 3, with the viewing direction rotated by 90.degree. About the optical axis 6 from the outside onto the camera module 1.
  • no support plate 16 with image pickup element 15 and electrical connection 17 in the interior 4 of the module housing 2 is arranged.
  • the camera module 1 from FIG. 4a-d is configured with a first and a second adjustment opening 9 and 10.
  • the module housing 2 of Fig. 4a-d is configured by way of example largely rotationally symmetrical.
  • FIG. 4 a shows the camera module 1 with a vertical viewing direction on the first engagement opening 7.
  • FIG. 4b shows the camera module 1 with a viewing direction rotated by 90 ° about the optical axis 6 relative to FIG. 4a, wherein the cutout 19 of the first engagement opening 7 is shown.
  • FIG. 4d shows the camera module 1 with a viewing direction rotated by 90 ° about the optical axis 6 relative to FIG. 4c, the cutout 19 of the first engagement opening 7 being illustrated corresponding to FIG. 4b.
  • FIGS. 5 a to 5 f show different possible embodiments of the module housing 2, each with differently configured cutouts 19.
  • the viewing direction on the module housing 2 is in each case perpendicular to the second engagement opening 8 in which a closure cover 13 is arranged.
  • the module housing 2 is designed largely rotationally symmetrical.
  • 9 and 10 free cuts 19 are configured in the region of the first engagement opening 7 and in the region of the adjustment openings.
  • the module housing 2 is configured without cutouts 19, wherein in Fig. 5a, a part of the support plate 16 protrudes from the first engagement openings 7.
  • the module housing 2 is designed rectangular with mutually perpendicular outer walls.
  • the two adjustment openings 9 and 10 in Fig. 5e, however, in addition, the first engagement opening 7 with cutouts 19 are configured.
  • a part of the support plate 16 projects out of the first engagement opening 7.
  • Fig. 6a is a possible process step for producing a camera module 1 according to the invention, in particular for introducing the support plate 16 with image pickup element 15 in the module housing 2.
  • the module housing 2 is held during insertion of the support plate 16 with image pickup element 15 in that the carrier plate 16 with image recording element 15 is introduced from above and with slight inclination through the first engagement opening 7 into the module housing.
  • the arrow in FIG. 6 a shows the direction from which the carrier plate 16 is introduced into the module housing 2.
  • On the support plate 16 15 additional components 10 are arranged in addition to the image pickup element.
  • the additional components 10 in this case are electronic components, in particular SMD (Surface Mounted Device) elements, such as resistors, capacitors, quartzes, diodes, transistors, coils and / or integrated circuits.
  • the additional components 10 are preferably used as running surfaces or for guiding the introduction of the support plate 16 in the module housing 2 and allow a controlled introduction or mixing of the support plate 16 through the first engagement opening 7 in the interior 4 of the module housing. 2
  • the additional components 10 could also be dummy components that do not take on an electrical function but merely as running surfaces or for guidance purposes Insert the carrier plate 16 in the module housing 2 serve.
  • additional components 10 configured as dummy components can also be arranged on one or more inner walls in the interior 4 of the module housing 2.
  • FIG. 6b shows the method step corresponding to the description for FIG. 6a from a plan view of the carrier plate 16 with image recording element 15.
  • a plurality of additional components 10, in particular configured as SMD elements, are arranged on the carrier plate 16. With dashed lines possible running surfaces for the support plate 16 during insertion into the module housing 2 are shown.
  • FIGS. 7a and 7b Possible configurations of the camera module 1 according to the invention are shown in FIGS. 7a and 7b.
  • 7a shows a module housing 2 with a view towards the second engagement opening 8 with the closure cover 13 screwed in.
  • the first engagement opening 7 is configured with two cutouts 19.
  • two adjustment openings 9 and 10 are also provided with cutouts 19.
  • no closure cap 13 is arranged in the second engagement opening 8 in FIG. 7 b, and the first engagement opening 7 is configured in FIG. 7 b not with two but with a free cut 19.
  • FIG. 7a shows a module housing 2 with a view towards the second engagement opening 8 with the closure cover 13 screwed in.
  • the first engagement opening 7 is configured with two cutouts 19.
  • two adjustment openings 9 and 10 are also provided with cutouts 19.
  • no closure cap 13 is arranged in the second engagement opening 8 in FIG. 7 b, and the first engagement opening 7 is configured in FIG. 7 b not with two but with a free cut 19.
  • connection 17 is arranged on the carrier plate for connecting further electrical or electromechanical components by means of electrical connections (not shown in FIG. 7b).
  • the connection 17 is preferably adhesively bonded to the module housing 2 in order to create the most stable possible connection 17 for further components.
  • FIGS. 7 a and 7 b show possible points of attack or gripping points for one or more adjustment tools (not shown in FIGS. 7 a and 7 b) for aligning the camera module 1 or for aligning the carrier plate 16 with image recording element 15 to the imaging system 5.
  • FIG. 8 shows the functional principle of the temperature-compensating system created by the camera module 1 according to the invention.
  • imaging system 5 and an image recording element 15 are arranged in a common module housing 2.
  • the image recording element 15 is located on a support plate 16, which is arranged by means of adhesive 12 on an adhesive surface 11 in the interior 4 of the module housing 2.
  • the image-receiving element 15 or its area sensitive to electromagnetic radiation is defined in a specific manner Distance 20 aligned to the imaging system 5 and to its image-side main plane 21, so that a desired object distance is focused on the sensitive surface of the image pickup element 15.
  • the defined distance 20 between the image pickup element 15 and the image-side main plane 21 is also referred to as the desired distance 20.
  • the module housing 2, the support plate 16, the adhesive 12 and the nipple 14 each have an effective distance 22, 23 and 24.
  • the effective distances 22, 23 and 24 change, in particular as a result of temperature expansion.
  • the change in the individual effective paths 22, 23 and 24 causes the distance 20 between image pickup element 15 and image-side main plane 21 of the imaging system 5 would change, resulting in a defocusing of the camera module 1 result ,
  • the camera module 1 according to the invention in particular in the exemplary embodiment shown in FIG.
  • a temperature compensation results from the fact that the temperature expansions of the effective path 24 of the adhesive 12 and nipple 14 and the effective distance 23 of the carrier plate 16, the thermal expansion of the effective distance 22 of Module housing 2 compensates, so that the sensitive surface of the image pickup element 15 of the image-side main plane 21 of the imaging system 5 moves behind or follows and thereby the target distance 20 is not or only minimally changes.
  • image pickup element 15 and imaging system 5 are arranged in separate housing or holders.
  • a lens is glued to a camera body, so that, for example, by bonding between the lens and the camera body exists another effective route, which eliminates the temperature compensation described above and a Wegwandern the image-side main plane 21 of the imaging system 5 of the sensitive surface of the image pickup element 15th caused by temperature increase.
  • FIG. 9 shows a further camera module 1 according to the invention.
  • the camera module 1 is largely constructed according to the description of FIG. 1.
  • the imaging system 5 is arranged in the light incidence opening 3 in such a way that the imaging system 5 with a defined force F along the optical axis 6 in the direction of the image recording element 15 (not shown in FIG. 9) or its sensitive area is pressed.
  • the imaging system 5 is arranged outwardly with a spring element 25 and towards the inside with a securing element 26 finally in the light incidence opening 3.
  • the spring element 25 presses imaging system 5 or its image-side main plane with a defined spring force F in the direction of the interior 4 against the securing element 26. This ensures in particular that the imaging system 5 with respect to the desired distance 20 to the image pickup element 15 and its sensitive area as stable as possible or is kept constant.
  • FIG. 10 shows a section of a camera module 1 according to the invention. Shown is the first engagement opening 7 in the module housing 2.
  • the first engagement opening 7 is configured with a cutout 19 in which a connection 17 is arranged, via which one or more further components via an electrical connection 18 (not shown in FIG Support plate 16 may be connected.
  • the terminal 17 is glued by means of adhesive 12 to the module housing 2.
  • FIG. 10 also shows that the first engagement opening 7 is closed with an adhesive tape 27.
  • the adhesive tape 27 is preferably arranged on the first engagement opening 7, e.g. with inwardly directed adhesive surface, that the adhesive tape additionally serves as a dirt collecting element, in particular for dust or other contaminants, which are located in the interior 4 of the module housing 2 and / or solve during operation.
  • FIG. 11 shows a further camera module 1 according to the invention, as well as a possible method for introducing and aligning a carrier plate 16 with image recording element 15 in the module housing 2 of the camera module 1.
  • the carrier plate 16 with image recording element is stationary in the interior 4 of the module housing 2 by means of an adjustment tool 28 held.
  • the image-receiving element 15 is contacted via a connection 29 arranged especially for the alignment, so that the alignment between the image-recording element 15 and the imaging system 5 during the alignment can be checked.
  • the module housing 2 can be varied around the support plate 16 in its position and position, in particular by means of a Alignment tool 30.
  • the module housing 2 is manipulated in its position and position until the support plate 16 has reached a desired position and orientation in the adhesive 12.
  • the carrier plate 16 is designed with a protruding region 31, which is specially designed for the adjustment tool 28 and for the alignment connection 29. After alignment of the camera module 1, for example, after complete adhesive curing, the protruding portion 31, for example, by means of a predetermined breaking point or by means of a separating tool, separated from the remaining part of the support plate 16 and the first engagement opening are closed.
  • a terminal 17 is further arranged on the support plate 16 which is also glued during or after the method shown above with the module housing 2 by means of adhesive 12.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

L'invention concerne un module d'appareil photographique (1) comprenant un boîtier de module (2) dans lequel sont disposés un système d'imagerie (5), par ex. un empilement de lentilles, ainsi qu'un élément de prise de vues (15), par ex. un imageur CMOS. La conception particulière dudit module d'appareil photographique (1), à boîtier (2) commun pour le système d'imagerie (5) et l'élément de prise de vues (15) permet d'obtenir un système optique à compensation de température et stable dans le temps. Ladite invention concerne également un procédé approprié pour produire un tel module d'appareil photographique (1).
PCT/DE2012/100034 2011-02-17 2012-02-14 Module d'appareil photographique Ceased WO2012110032A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112012000147T DE112012000147A5 (de) 2011-02-17 2012-02-14 Kameramodul

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011011527.7 2011-02-17
DE102011011527A DE102011011527A1 (de) 2011-02-17 2011-02-17 Kameramodul

Publications (2)

Publication Number Publication Date
WO2012110032A2 true WO2012110032A2 (fr) 2012-08-23
WO2012110032A3 WO2012110032A3 (fr) 2012-11-22

Family

ID=46025281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2012/100034 Ceased WO2012110032A2 (fr) 2011-02-17 2012-02-14 Module d'appareil photographique

Country Status (2)

Country Link
DE (2) DE102011011527A1 (fr)
WO (1) WO2012110032A2 (fr)

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Also Published As

Publication number Publication date
DE112012000147A5 (de) 2013-05-29
WO2012110032A3 (fr) 2012-11-22
DE102011011527A1 (de) 2012-08-23

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