WO2012110102A1 - Dispositif à scier à fil, procédé de construction d'une lame à fil dans un dispositif à scier à fil et procédé d'utilisation d'un dispositif à scier à fil - Google Patents

Dispositif à scier à fil, procédé de construction d'une lame à fil dans un dispositif à scier à fil et procédé d'utilisation d'un dispositif à scier à fil Download PDF

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Publication number
WO2012110102A1
WO2012110102A1 PCT/EP2011/052455 EP2011052455W WO2012110102A1 WO 2012110102 A1 WO2012110102 A1 WO 2012110102A1 EP 2011052455 W EP2011052455 W EP 2011052455W WO 2012110102 A1 WO2012110102 A1 WO 2012110102A1
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WO
WIPO (PCT)
Prior art keywords
wire
web
saw device
inlet
spool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/052455
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English (en)
Inventor
John SPEYRER
Franck GENONCEAU
Ming Yin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to PCT/EP2011/052455 priority Critical patent/WO2012110102A1/fr
Publication of WO2012110102A1 publication Critical patent/WO2012110102A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Definitions

  • WIRE SAW DEVICE METHOD OF BUILDING A WIRE WEB IN A WIRE SAW DEVICE AND METHOD FOR OPERATING A WIRE SAW DEVICE
  • Embodiments of the present invention relate to a wire saw device, a wire saw device, use of a wire saw device and a method for operating a wire saw device. More particularly, they relate to a wire saw device with improved wire transport direction, and a wire saw device for cutting or sawing hard materials such as blocks of silicon or quartz, e.g., for cutting silicon wafers, for a squarer, for a cropper, or the like.
  • Wire saw devices exist for cutting blocks or bricks, thin slices, e.g., semiconductor wafers, from a piece of hard material such as silicon.
  • a stretched wire is fed from a spool and is both guided and tensioned by pulleys for guiding the wire in the cutting area.
  • the wire that is used for sawing is generally provided with an abrasive material.
  • the abrasive material can be provided as slurry. This may be done shortly before the wire touches the material to be cut. Thereby, the abrasive is carried to the cutting position by the wire for cutting the material.
  • the abrasive can be provided on the wire with a coating.
  • diamond particles can be provided on a metal wire, e.g., with a coating, wherein the diamond particles are imbedded in the coating of the wire. Thereby, the abrasive is firmly connected with the wire.
  • the maximum speed for moving the piece through the web, and also the maximum effective cutting area within a given amount of time is limited by several factors including wire speed, hardness of the material to be sawed, disturbing influences, desired precision, and the like.
  • the yield of the cutting is also an important factor for defining the throughput. Thereby, the yield can be reduced if a few percent of the final workpieces are not within the specified ranges of precision. This can be, for example, the thickness of a wafer or the thickness variation within a wafer.
  • a wire saw device for sawing a hard material.
  • the device includes an inlet spool for providing wire towards the wire web, the wire web having an inlet side and an outlet side, a main frame of the wire saw device, a set of wire guides for building the wire web, wherein the set of wire guides is connected to the main frame more rigidly at a connection side than at an opposing side or wherein a connections of the wire guides at the connection side is configured for higher loads than at the opposing side, and a pulley arrangement configured for guiding the wire from the spool to the inlet side of the wire web, wherein the inlet side is closer to the side opposing the connection side than to the connection side.
  • a method of building a wire web in a wire saw device includes: guiding the wire from a inlet spool over a first pulley arrangement to an inlet side of the wire web, guiding the wire over a set of wire guides for forming the wire web to extend from the inlet side of the wire web to the outlet side of the wire web, wherein the set of wire guides is connected to the main frame at a connection side more rigidly than at an opposing side or wherein a connections of the wire guides at the connection side is configured for higher loads than at the opposing side, and guiding the wire from the outlet side of the wire web over a second pulley arrangement to a take-up spool.
  • a method of operating a wire saw device having a wire forming a wire web includes rotating a set of wire guides such that the web is guided in axial rotation direction towards a connection side at which the set of wire guides is connected to the main frame more rigidly than at an opposing side or towards a connection of the set of wire guides at the connection side which is configured for higher loads as compared to the opposing side, and building a wire web.
  • building the wire web includes: guiding the wire from a inlet spool over a first pulley arrangement to an inlet side of the wire web, guiding the wire over a set of wire guides for forming the wire web to extend from the inlet side of the wire web to the outlet side of the wire web, wherein the set of wire guides is connected to the main frame at a connection side more rigidly than at an opposing side or wherein a connections of the wire guides at the connection side is configured for higher loads than at the opposing side, and guiding the wire from the outlet side of the wire web over a second pulley arrangement to a take-up spool.
  • a wire saw device for sawing a hard material.
  • the device includes an inlet spool for providing wire towards the wire web, the wire web having an inlet side and an outlet side, a main frame of the wire saw device, a set of wire guides for building the wire web, at least one motor for driving at least one wire guide, wherein the set of wire guides is connected to the main frame at a connection side facing the motor, and a pulley arrangement configured for guiding the wire from the spool to the inlet side of the wire web, wherein the inlet side is closer to the side opposing the connection side than to the connection side.
  • Embodiments are also directed at apparatuses for carrying out the disclosed methods and including apparatus parts for performing each described method step. These method steps may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two, or in any other manner. Furthermore, embodiments according to the invention are also directed at methods by which the described apparatus operates. It includes method steps for carrying out every function of the apparatus.
  • FIG. 1 shows a schematic view of a wire saw device according to embodiments described herein;
  • FIG. 2 shows a schematic view of a yet further wire saw device according to embodiments described herein;
  • FIG. 3 shows a schematic view of wire guide cylinders and a wire web built thereon, according to embodiments described herein;
  • FIG. 4 shows a schematic perspective view of wire guide cylinders and a wire web built thereon according to embodiments described herein;
  • FIG. 5 shows a schematic view of a wire guide cylinder and illustrates one of several factors for the improved wire saw device according to embodiments described herein;
  • FIG. 6 shows a schematic view of a wire guide cylinder and illustrates another one of several factors for the improved wire saw device according to embodiments described herein;
  • FIG. 7 shows a schematic view of a wire guide cylinder and a workpiece support and illustrates a yet further factor of several factors for the improved wire saw device according to embodiments described herein;
  • FIG. 8 illustrates a method of building a wire web and a method of operating a wire saw device according to embodiments described herein.
  • a wire management unit will be understood as a device handling the supply of wire to a cutting area or working area of a wire saw device, such as a cropping wire saw device, a squaring wire saw device, or a wafering wire saw device.
  • the wire saw includes a wire guide for transporting and guiding the wire in a wire moving direction, while the wire management unit provides control of the wire tension.
  • the wire provided by the wire management unit forms a wire web in the cutting area.
  • a wire web will be considered as the web formed by a single wire management unit. It should be understood that a wire web may contain more than one working area portion, which is defined as an area in which a sawing process is performed.
  • a wire web can have multiple areas that are formed each by a wire from different wire management units.
  • wire speed that is, the speed of the wire moving through the wire saw device, the wire management unit and the material to be sawed, respectively, can be, for example, 10 m/s or higher.
  • the wire speed can be in a range of 15 to 20 m/s.
  • higher wire speeds of 25 m/s or 30 m/s, or even 40 m/s or higher can also be desirable and could be realized under certain conditions.
  • the spool rotates with a rotation speed of up to several thousand rotations per minute. For example, 1000 to 2000 rpm can be provided for unwinding and winding the wire.
  • FIG. 1 shows a wire saw device 100.
  • the example shown in FIG. 1 illustrates a wafering wire saw device, sometimes called a wire saw.
  • the wire web is formed in the wire web compartment 110.
  • a housing portion which houses further components and equipment of the wire saw device 100 is provided.
  • a wire handling device compartment 212 and an electrical cabinet can be provided.
  • tanks, as well as respective pumps, can also be provided.
  • a first tank can be used for unused cooling fluid, e.g., in the case where the wire saw device is operated with diamond wire, or can be used, e.g., for unused (fresh) slurry, in the case where the wire saw device 100 is operated with a wire requiring additional abrasive.
  • unused (fresh) slurry in the case where the wire saw device 100 is operated with a wire requiring additional abrasive.
  • a portion of the used consumable fluid can be recycled and re-used if it is reinserted into the tank.
  • the consumable fluid can be cooling fluid or slurry.
  • the slurry also takes over the function of cooling the position at which the wire cuts the material.
  • the wire handling compartment 212 two handling sections for delivering the wire 10 to the cutting area and receiving the wire from the cutting area, respectively, are provided.
  • the wire is provided on a spool 130 rotating around a spool axis.
  • the wire is guided over a plurality of rollers 134 into the wire web compartment 110.
  • Further pulleys 134 guide the wire 10 in the cutting area to form the wire web 111.
  • some of the further pulleys are not shown in FIG. 1. Further, the locations of shown pulleys can vary.
  • the wire is guided by a further pulley 134 towards the wire handling compartment 212, and is therein provided over pulleys 134 on the spool 132 rotating around the spool axes.
  • a unidirectional sawing is also provided, wherein the wire 10 is guided in the cutting area, i.e., in the area of the wire web 111, in a reverse direction.
  • the inlet spool and, particularly, the pulley arrangement for guiding the wire towards the web from the inlet spool differs from a bi-directional sawing, as the wire from the inlet spool, which is different from the take-up spool for various reasons described below, is guided to a different position of the wire web for defining a starting point of the wire web.
  • the wire is guided from the wire handling compartment to the wire cutting area and back with a wire speed of 10 m/s or higher, typically in a range of 15 to 20 m/s, or even up to 25 m/s or 30 m/s.
  • the material to be cut is positioned on a support.
  • the support and the wire web provided by the wire guide cylinders 180 can be moved relative to each other such that cutting of the material can be conducted.
  • the wire guide cylinders 180 remain in a fixed position and the support moves the material to be cut through the wire web while the wire is at a speed of about 10 m/s or higher. For easier understanding, in FIG. 1, this movement of the support would be perpendicular to the plane of the drawing.
  • the wire guide cylinders 180 and, thus, the web 111 generated by wire 10 is moved relative to the support to cut the wire through the material.
  • both the support and the wire guide cylinders 180 can be both moved with respect to each other.
  • a wire saw device can be a cropper, a squarer, a wire saw, or a multiple wire saw.
  • a cropper is to be understood as a device which can be used to saw end pieces from bricks or blocks, which have been separated into bricks in a squarer.
  • a squarer is a wire saw that generally saws the silicon ingot into squares of the desired size, such that a wire saw or a multiple wire saw can saw wafers from the bricks in a wafering process.
  • the wire management unit herein is particularly useful for the wire saw device being a wafering wire saw device but not limited to a wafering wire saw device.
  • the wire handling sections and wire saw devices described herein are adapted for thin wires having a diameter below about 500 ⁇ , such as diameters between about 200 ⁇ and about 400 ⁇ , more particularly between about 200 ⁇ and about 300 ⁇ .
  • embodiments may also have a wire diameter as low as, for example, 100 ⁇ , 80 ⁇ , or even thinner.
  • the wire saw device 100 which is shown in figure 1, includes a mainframe 140.
  • the mainframe can include the first portion 142 and a second portion 143.
  • the mainframe can provide a stabilizing functionality and/or a plurality of components can be connected to the mainframe in order to provide these components with positions relative to each other.
  • the main bearings 172 are connected to the mainframe 140.
  • the main bearings 172 are bearings for allowing rotation of the wire guides 180 around an axis of the wire guide cylinders.
  • a secondary frame 150 is provided and secondary bearings 174 are connected to the secondary frame 150.
  • the secondary bearings 174 can also support the wire guides 180 during rotation thereof.
  • the side of the main bearings (the lower side of wire guide 180 in figure 1) have a more rigid connection and/or the connection being configured for higher loads as compared to the secondary bearings 174.
  • the wire guides 180 have a connection side, at which the wire guides are connected to the mainframe 140 and have another side opposing that connection side, at which the wire guides can, for example, be connected to the secondary frame 150.
  • the connection side provides a more rigid connection and/or a connection capable of taking higher loads as compared to the connection at the opposing side.
  • wire guides 180 and the wire web 111 formed on the wire guides could in isolation be regarded as a symmetric arrangement, there are a plurality of factors which introduce a kind of symmetry in the wire saw device. Accordingly, the wire web 111 cannot be practically considered as fully symmetric.
  • the inventors of the present invention found that there is a sawing direction for which an inlet at a particular side of the wire web, i.e., the upper side of the wire web 111 in figure 1 results in an improved yield.
  • the sawing direction i.e., a transport direction of the wire such that the wire is provided from the inlet spool 132 to the wire web where the wire guides 180 have a less rigid connection to the main frame 140 or where the connection to the main frame 140 is configured for lower loads as compared to the other side, results in a better yield.
  • the inlet spool 130 guides the wire over that plurality of pulleys 134 to the wire web 111 at the side opposing the more rigid or the increased load connection to the mainframe, i.e., the upper side in figure 1.
  • This is indicated by the arrows in figure 1 showing the preferred wire direction in the wire saw device 100 and is further indicated by reference numeral lOi illustrating the wire inlet.
  • the wire outlet lOo is from the outlet side of the wire web 111, which is closer to the more rigid connection or the connection configured for higher loads. As shown in figure 1 this can be the side of the main bearing 172.
  • the wire with reference numeral lOi is a fresh wire
  • the wire indicated by reference 10 ⁇ is used wire.
  • the inventors have found that providing that used wire at a side of the wire web 111 or at the side of the wire guides 180, respectively, having the more rigid connection or the connection configured for a higher load results in an improved yield of the wire saw device 100. It is believed that this is due to the fact that having the used wire which will have a few microns reduction in diameter at a more rigid side of the wire guides is less harmful to the yield of the sawing process.
  • Figure 2 shows another embodiment of a wire saw device 200 having in principle the same features as the embodiments described with respect to figure 1 except for two changes, which can be realized in combination or independently of each other.
  • each wire management unit provides the wire to the wire web 211.
  • the wire web 211 includes two portions, wherein each portion is provided by a separate wire.
  • Each separate wire is fed from an inlet spool 130 to a corresponding outlets were 132.
  • that inlet of the wire 10 to the wire web 211 is for each wire management units at the side of the wire guides 180 which is opposing to the side having the more rigid connection or a connection which is configured for higher loads, i.e., the main bearing 172.
  • the inlet spool 130 is closer to the inlet position of the wire into the wire web 211.
  • the difference of the fist distance of the inlet spool to the inlet position at the wire web and the second distance of the take-up spool 132 to the position of the outlet from the wire web is smaller as compared to the respective distances in figure 1.
  • the distances from the inlet spool to the inlet side of the wire web and the take up spool to the outlet side of the wire web are made more equal, which can be considered beneficial for wire management and can further improve the symmetry of the configuration.
  • Figures 1 and 2 further show a first portion of a support table for supporting workpieces such that they can be moved relative to the web.
  • the wire web can be moved relative to the support table, or both the support table and the wire web can be moved relative to each other.
  • Two further schematic views are illustrated in figures 3 and 4.
  • Figure 4 shows the support table 160 and beams 320 connected thereto.
  • the workpieces 322, which are connected to the beams 320, can be moved along directions, which are indicated by reference numerals 460, by movement of the support table 160.
  • the wire guides 180 are provided to build an upper portion of the wire web 310 and the lower portion of the wire web 310.
  • the wire saw device thereby, exemplarily, four workpieces 322 can be sawed by the wire saw device.
  • the preferred wire direction is indicated by arrow 310 such that the wire has an inlet portion lOi and an outlet portion 10 ⁇ . As described above, that inlet portion is on the side opposing the main bearings 172.
  • the inlet port 130 provides the wire to the inlet side of the wire web 310 and the wire is provided from the outlet side of the wire web 310 to the take-up spool 132.
  • the wire saw device can further include a fluid pipe 420, which is configured for providing slurry or a cooling fluid to that wire positions of the while web 310.
  • the fluid pipe 420 typically has a plurality of outlet nozzles for spraying the fluid, such as slurry or the cooling fluid, onto the wire web.
  • the fluid pipe 420 has a fluid inlet, which is indicated by arrow 422 in figure 4. According to typical embodiments, which can be combined with other embodiments described herein, the fluid inlet is provided at the side of the wire outlet, where the used wire exits the wire web.
  • FIGS. 5 and 6 Further factors, which provide an asymmetry in the wire web, and, thus, the preferred wire direction within the wire web along and rotation axis of the wire guides 180 are illustrated in figures 5 and 6. These figures show a wire guide 180 being supported by a main bearing 172 and secondary bearing 174, the wire guides 180 have an outer portion rotating around the rotation axis 581 around a central portion 580. As shown in figure 5, the wire guides have a plurality of grooves for having that wire being provided within the grooves for forming the web, respectively, whereby the wire web is formed. According to typical embodiments, the grooves can be formed as follows. The grooves shown in figure 5 have a first slope 581 and a second slope 584.
  • the grooves can also be formed without flat portions in either one or both of these positions. 582 and 583. During operation, the wires are positioned at the flat portions 583. According to yet further embodiments, the grooves can also have first and second slopes without flat portions. Yet, according to further embodiments, the grooves have a first slope 581 steeper than a second slope 584.
  • the wire inlet and the wire outlet of the wire web which are indicated by arrow 310 in figure 5, is such that the wire inlet is towards that slope 584, which is less steep. Accordingly, asymmetry in the slopes, which form the grooves in the wire guide 185, is provided. The resulting preferred wire transportation direction along the rotation axis of the wire guides 180 can result in better yield than an opposing wire guide direction.
  • the manufacturing process of the grooves i.e., the grooving
  • the grooves will generally result in some asymmetry.
  • the grooves will be used up during the sawing process and can result in asymmetry due to the use of the wire saw device.
  • an asymmetry will generally be generated and will, thus, result in a preferred wire transportation direction.
  • FIG. 6 A further factor, which results from a deviation of perfect conditions, is shown in figure 6.
  • Arrow 610 illustrates a tension varies in the wire during the sawing process and within the wire web.
  • the wire which is introduced on an inlet side of the wire web (see arrow 310), i.e., the right-hand side in figure 6, saws a plurality of portions of the workpiece while being transported in figure 5 from the right-hand side to the left-hand side.
  • the sawing process that is, the movement of the wire through the workpiece to be sawed, results in a change in tension on the wire.
  • the tension of the wire on the wire guide 180 at a side towards the secondary bearing 174 will be different from the tension of the wire on the wire guide 180 at a position towards that main bearing 172.
  • Another factor, which can according to yet further additional or alternative embodiments be combined with the embodiments described herein, is illustrated with respect to figure 7.
  • the wire guide 180 is provided and supported by the main bearing 172.
  • the secondary bearing is not required and the more rigid connection and/or the connection configured for high loads is the connection at the main bearing side.
  • the wire guide 180 is configured for rotation around the axis 581. An outer portion of the wire guide rotates around an inner portion 580.
  • the wire inlet and wire outlet with respect to the wire guide and, thus, the wire web is illustrated by arrow 310.
  • Figured 7 further shows a beam 320 and the workpiece 322, which is connected thereto.
  • the workpiece 322 for example a multi-crystalline silicone block has a side with a harder material and a side with softer material. This is indicated by arrow 720.
  • the hardness of the material increases along arrow 720. Accordingly, the harder side of the workpiece 322 is at the side of the workpiece, which is in Fig. 7 facing the main bearing.
  • the increase of hardness of the workpiece for wavering is generally generated by the fact that the workpieces 322 for wavering our sawed from a block of multi-crystalline silicone, or the like.
  • the upper side of the block will generally have a harder material structure than the bottom side of the block.
  • that side of the sawed bar corresponding to the upper side of the block will have a harder material.
  • the harder side can be provided to be oriented towards the connection side of the wire guide 180.
  • the harder side should be sawed with the fresh wire which is provided at the inlet position, i.e. the right-hand side in figure 7.
  • the overall yield can be improved by providing the harder side of the material at the position, where the wire guide 180 has the more rigid connection to the main frame of the wire saw advice and/or the connection of the wire guide 180 to the mainframe of the wire saw advice is configured for higher loads as compared to an opposing side.
  • figure 8 illustrates a method of building a wire web in the wire saw advice and a method of operating a wire saw device.
  • the wire which is provided on an inlet spool is guided from the inlet pool over a pulley arrangement to the inlet side of the wire web, i.e. an axial inlet position of the wire onto wire guides.
  • the wire is provided around the wire guides for forming the wire web.
  • the wire can be guided around four wire guides, which are provided in a rectangular configuration as shown in figure 4.
  • steps 802, 804, and 806 provide a method for building a wild web with the preferred orientation of wire transportation in the wire web according to embodiments described herein.
  • the method of operating a wire sought advice according to embodiments described herein can further include step 808, wherein the wire guides are rotated such that the wire is guided along the actual rotation direction towards the connection side.
  • a wire saw device for sawing a hard material.
  • the device includes an inlet spool for providing wire towards the wire web, the wire web having an inlet side and an outlet side, a main frame of the wire saw device, a set of wire guides for building the wire web, wherein the set of wire guides is connected to the main frame more rigidly at a connection side than at an opposing side or wherein a connections of the wire guides at the connection side is configured for higher loads than at the opposing side, and a pulley arrangement configured for guiding the wire from the spool to the inlet side of the wire web, wherein the inlet side is closer to the side opposing the connection side than to the connection side.
  • a wire saw device for sawing a hard material.
  • the device includes an inlet spool for providing wire towards the wire web, the wire web having an inlet side and an outlet side, a main frame of the wire saw device, a set of wire guides for building the wire web, at least one motor for driving at least one wire guide, wherein the set of wire guides is connected to the main frame at a connection side facing the motor, and a pulley arrangement configured for guiding the wire from the spool to the inlet side of the wire web, wherein the inlet side is closer to the side opposing the connection side than to the connection side.
  • one or more of the following features can additionally or alternatively be selected from the group consisting of: the device can further include a take-up spool, and a further pulley arrangement configured for guiding the wire from the outlet side of the wire web to the take-up spool, wherein the outlet side is closer to the connection side than to the side opposing the connection side;
  • the set of wire guides can be a set of wire guide cylinders having a main bearing for rotation around an axis of the cylinder at the connections side, and optionally a secondary bearing for rotation around an axis of the cylinder at the opposing side;
  • the set of wire guides can include two wire guide cylinders or four wire guide cylinders; and the system can further include a secondary frame portion being less rigid than the main frame portion or being configured for lower loads than the main frame portion, and wherein the secondary bearing is connected to the secondary frame portion.
  • the inlet spool and the take-up spool can be different types of spools, particularly wherein the take-up spool can have a conical wire receiving portion; each of the set of wire guides can include a plurality of grooves for guiding the wire to form the wire web, and wherein each of the plurality of grooves includes a first slope being steeper than a second slope, and wherein the stepper slope is closer to the outlet side than to the inlet side; the device can further include at least one support table configured for supporting the hard material to be sawed, wherein the material has a harder side and a softer side opposing the hard side, wherein the support table is configured to support the table with the harder side closer to the connection side; and/or the device can further include a fluid pipe having a plurality of nozzle outlets and having a fluid inlet, wherein the fluid inlet is closer to the connections side than to the opposing side.
  • a method of building a wire web in a wire saw device includes: guiding the wire from a inlet spool over a first pulley arrangement to an inlet side of the wire web, guiding the wire over a set of wire guides for forming the wire web to extend from the inlet side of the wire web to the outlet side of the wire web, wherein the set of wire guides is connected to the main frame at a connection side more rigidly than at an opposing side or wherein a connections of the wire guides at the connection side is configured for higher loads than at the opposing side, and guiding the wire from the outlet side of the wire web over a second pulley arrangement to a take-up spool.
  • the inlet spool and the take-up spool can be different types of spools, particularly wherein the take-up spool can have a conical wire receiving portion.
  • a method of operating a wire saw device having a wire forming a wire web includes rotating a set of wire guides such that the web is guided in axial rotation direction towards a connection side at which the set of wire guides is connected to the main frame more rigidly than at an opposing side or towards a connection of the set of wire guides at the connection side which is configured for higher loads as compared to the opposing side, and building a wire web.
  • building the wire web includes: guiding the wire from a inlet spool over a first pulley arrangement to an inlet side of the wire web, guiding the wire over a set of wire guides for forming the wire web to extend from the inlet side of the wire web to the outlet side of the wire web, wherein the set of wire guides is connected to the main frame at a connection side more rigidly than at an opposing side or wherein a connections of the wire guides at the connection side is configured for higher loads than at the opposing side, and guiding the wire from the outlet side of the wire web over a second pulley arrangement to a take-up spool.
  • the method can further include providing a workpiece having a harder side and a less hard side such that the harder side of the workpieces faces the connections side and/or the rotating can be a unidirectional rotating.
  • the yield of a wire saw device and of a sawing process with a wire saw device can further be improved by designing the wire saw device for an improved sawing direction, i.e. a first pulley arrangement guides the wire from the inlet spool to the desired wire web position described herein, and by operating the wire saw device accordingly.
  • the improved yield also results in an improved throughput of the device.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne un dispositif à scier à fil (100 ; 200) permettant de scier un matériau dur. Le dispositif comprend un cylindre d'entrée (130) destiné à fournir du fil en direction de la lame à fil (111 ; 211 ; 310), la lame à fil ayant un côté entrée et un côté sortie, un cadre principal (140) du dispositif à scier à fil, un ensemble de guide-fil pour construire la lame à fil, l'ensemble de guide-fil étant raccordé au cadre principal de manière plus rigide au niveau d'un côté raccordement par rapport à un côté opposé, ou un raccordement des guide-fil au niveau du côté raccordement étant configuré pour des charges supérieures par rapport au côté opposé, et un arrangement de type poulie configuré pour guider le fil en provenance du cylindre jusqu'au côté entrée de la lame à fil, le côté entrée étant plus proche du côté opposé au côté de raccordement qu'au côté de raccordement.
PCT/EP2011/052455 2011-02-18 2011-02-18 Dispositif à scier à fil, procédé de construction d'une lame à fil dans un dispositif à scier à fil et procédé d'utilisation d'un dispositif à scier à fil Ceased WO2012110102A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/052455 WO2012110102A1 (fr) 2011-02-18 2011-02-18 Dispositif à scier à fil, procédé de construction d'une lame à fil dans un dispositif à scier à fil et procédé d'utilisation d'un dispositif à scier à fil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/052455 WO2012110102A1 (fr) 2011-02-18 2011-02-18 Dispositif à scier à fil, procédé de construction d'une lame à fil dans un dispositif à scier à fil et procédé d'utilisation d'un dispositif à scier à fil

Publications (1)

Publication Number Publication Date
WO2012110102A1 true WO2012110102A1 (fr) 2012-08-23

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PCT/EP2011/052455 Ceased WO2012110102A1 (fr) 2011-02-18 2011-02-18 Dispositif à scier à fil, procédé de construction d'une lame à fil dans un dispositif à scier à fil et procédé d'utilisation d'un dispositif à scier à fil

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Country Link
WO (1) WO2012110102A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251063A (ja) * 1986-04-24 1987-10-31 Sumitomo Metal Ind Ltd ワイヤソ−における溝ロ−ラの温度制御方法
US5377568A (en) * 1992-01-22 1995-01-03 Hauser; Charles Device for controlling the cutting geometry of fine slices obtained by thread sawing
JPH07304029A (ja) * 1994-05-11 1995-11-21 M Setetsuku Kk ワイヤソー装置
US5616065A (en) * 1995-03-23 1997-04-01 Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft Wire saw and method for cutting wafers from a workpiece

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62251063A (ja) * 1986-04-24 1987-10-31 Sumitomo Metal Ind Ltd ワイヤソ−における溝ロ−ラの温度制御方法
US5377568A (en) * 1992-01-22 1995-01-03 Hauser; Charles Device for controlling the cutting geometry of fine slices obtained by thread sawing
JPH07304029A (ja) * 1994-05-11 1995-11-21 M Setetsuku Kk ワイヤソー装置
US5616065A (en) * 1995-03-23 1997-04-01 Wacker Siltronic Gesellschft fur Halbleitermaterialien Aktiengesellschaft Wire saw and method for cutting wafers from a workpiece

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