WO2012122150A2 - Système de refroidissement - Google Patents

Système de refroidissement Download PDF

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Publication number
WO2012122150A2
WO2012122150A2 PCT/US2012/027831 US2012027831W WO2012122150A2 WO 2012122150 A2 WO2012122150 A2 WO 2012122150A2 US 2012027831 W US2012027831 W US 2012027831W WO 2012122150 A2 WO2012122150 A2 WO 2012122150A2
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
condenser
environment
cooling system
conduit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2012/027831
Other languages
English (en)
Other versions
WO2012122150A3 (fr
Inventor
Timothy Louvar
Michael Trumbower
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parker Hannifin Corp
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Publication of WO2012122150A2 publication Critical patent/WO2012122150A2/fr
Publication of WO2012122150A3 publication Critical patent/WO2012122150A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—Component parts or details not otherwise provided for in this subclass
    • F25B2400/04—Refrigeration circuit bypassing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—Component parts or details not otherwise provided for in this subclass
    • F25B2400/16—Receivers

Definitions

  • the present invention relates generally to cooling air inside an enclosed space that is used to cool components within that space such as power electronics, batteries, etc., and more particularly to a method and apparatus for cooling the air inside the container both when the required air temperature inside container is warmer or cooler than the outside ambient air temperature.
  • the evaporator may be in the form of a cold plate mounted in contact with the heat sink of an electronic device.
  • Refrigerant fluid absorbs heat from the electronic device and partially evaporates as it flows through the cold plate. Partially evaporated refrigerant fluid is collected in a manifold, and then flows in the condenser heat exchanger.
  • the condenser heat exchanger may be air cooled or water cooled and it may be located indoors or outdoors. For the condenser to reject heat to a cold medium, the refrigerant fluid temperature must be above that of the cold medium, or the ambient air. Since the refrigerant is undergoing a condensing process, the refrigerant pressure will follow the refrigerant temperature based on the fluid's saturation pressure - temperature relationship.
  • the refrigerant fluid will leave the condenser as a subcooled liquid, the temperature will be above ambient, and the pressure will correspond to an even higher saturation temperature.
  • the sub-cooled liquid flows into a receiver tank which acts a storage tank to compensate for varying volumes of the fluid in the system.
  • the refrigerant fluid volume of liquid and vapor will vary throughout the system based on operating temperatures and heat load, due to varying densities through the operating temperature range.
  • At least one embodiment of the invention provides a cooling system comprising: a pumped loop cooling system comprising an evaporator, and a pump located in a first environment having a first ambient temperature and a first compressor located in a second environment having a second ambient temperature; a vapor compression system comprising an expansion valve, a second condenser, a compressor, and a liquid to liquid heat exchanger, the vapor compression system located in the second environment; a primary fluid conduit through which a first refrigerant fluid is circulated by the pump through the evaporator, to the first condenser, and back to the pump; a secondary fluid conduit selectively diverting the first refrigerant fluid from the evaporator to the liquid to liquid heat exchanger of the vapor compression system and back to the pump; and a third fluid conduit through with a second refrigerant fluid is circulated from the compressor to the liquid to liquid heat exchanger, to the expansion valve, to the second condenser, and back to the compressor.
  • At least one embodiment of the present invention provides a cooling system comprising: a pumped loop cooling system comprising an evaporator, a first liquid receiver, and a pump located in a first environment having a first ambient temperature and a first compressor Iocated in a second environment having a second ambient temperature; a vapor compression system comprising an expansion valve, a second condenser, a second liquid receiver, a compressor, and a liquid to liquid heat exchanger, the vapor compression system Iocated in the second environment; a primary fluid conduit through which a first refrigerant fluid is circulated by the pump through the evaporator, to the first condenser, to the first liquid receiver, and back to the pump; a secondary fluid conduit selectively diverting the first refrigerant fluid from the evaporator to the liquid to liquid heat exchanger of the vapor compression system, to the liquid receiver, and back to the pump; and a third fluid conduit through with a second refrigerant fluid is circulated from the compressor to the liquid to liquid
  • At least one embodiment of the invention provides a cooling system comprising: a pumped loop cooling system comprising an evaporator, a first liquid receiver, and a pump located in a first environment having a first ambient temperature and a first compressor located in a second environment having a second ambient temperature; a vapor compression system comprising an expansion valve, a second condenser, a second liquid receiver, a compressor, and a liquid to liquid heat exchanger, the vapor compression system located in the second environment; a primary fluid conduit through which a first refrigerant fluid is circulated by the pump through the evaporator, to the first condenser, to the first liquid receiver, and back to the pump; a secondary fluid conduit selectively diverting the first refrigerant fluid from the evaporator to the liquid to liquid heat exchanger of the vapor compression system, to the liquid receiver, and back to the pump; and a third fluid conduit through with a second refrigerant fluid is circulated from the compressor to the liquid to liquid heat exchanger, to the expansion
  • FIG. 1 is a schematic view of an embodiment of the cooling system of the present invention.
  • the cooling system 10 comprises a pumped loop cooling system 20 and an imbedded vapor compression system 22.
  • the pumped loop cooling system 20 comprising at least one evaporator 30, a first liquid receiver 32, and at least one pump 34 located In a first environment 40 (represented as a box) having a first ambient temperature and a first condenser 36 located In a second environment 42 (outside the box) having a second ambient temperature - all connected by a first fluid conduit 8.
  • the vapor compression system 22 is located in the second environment 42 and comprises an expansion valve 44, a second condenser 46, a second liquid receiver 48, a compressor 50, and a liquid to liquid heat exchanger 52 - all connected by a third fluid conduit 6.
  • the one or more liquid pumps 34 circulate refrigerant fluid through the pumped loop cooling system 20 portion of the cooling system 10.
  • the fluid flows through one or more evaporators 30, each shown with an associated fan 31 to assist the evaporator in the absorption of heat from the air inside the enclosed space designated and referred to as the first environment 40.
  • the absorption of the heat partially boils the refrigerant fluid.
  • the two- phase fluid is then routed outside the first environment 40 to second environment 42. If the outside ambient temperature is much colder than the required air temperature within the enclosed space 40, the fluid is routed through condenser 36 where the fluid is cooled back to a liquid by means of blowing cooler ambient air across the condenser coil.
  • a secondary conduit or bypass conduit 9 If the outside ambient air temperature is nearly the same or warmer than the required enclosed space temperature, fluid is diverted through a secondary conduit or bypass conduit 9 by one or more valves 56, 54 to a liquid to liquid heat exchanger 52.
  • the heat is transferred to the secondary refrigerant loop comprising vapor compression system 22.
  • the vapor compression system 22 includes compressor 50 and expansion valve 44 which allow for that fluid circuit to remain below outside ambient temperature.
  • the vapor compression loop 22 only turns on when sub- ambient cooling is needed.
  • the heat from the vapor compression loop 22 is rejected to the outdoor ambient air by means of a condenser coil 46 and a fan 47.
  • the system 10 includes a control system 60 based on the temperature within the enclosed space and optionally the outdoor ambient temperature to determine when to switch to the vapor compression system.
  • the control system 60 may be adapted to direct the first refrigerant through the first conduit 8 to the first condenser 36 and to bypass the second conduit 9 (utilizing valves 54, 56) when the temperature in the first environment 40 is higher than the temperature in the second environment 42.
  • the control system 60 may be adapted to direct the first refrigerant through the second conduit 6 and bypass a portion of first conduit 8 including the first condenser 36 and selectively operating the compressor 50 of the vapor compression system when the temperature in the first environment 40 is higher than the temperature in the second environment 42.
  • the control system 60 may be adapted to selectively activate the compressor 50 when the temperature of the second environment 42 Is higher than the temperature of the first environment 40 and to deactivate the compressor 50 when temperature of the second environment 42 is lower than the temperature of the first environment 40.
  • the system 10 also allows for complete bypass of all condensing by allowing all of the pumped system flow to go through the liquid to liquid heat exchanger 52 without the vapor compression system 22 running. In this mode, there would be no cooling of the fluid. This is necessary when there is only a light heat load on the cooling system and a cold outside ambient temperature. [0014] Furthermore, in some applications it may be required to initially heat the enclosed space ambient air on initial start-up in cold ambient environments. This is usually just temporary until the devices needing cooled can create enough heat on their own to maintain a warmer enclosed space temperature.
  • the vapor compression loop 22 can be designed as a heat pump loop, where it can run in reverse when needed to put heat into the system and thus reject hot air into the enclosed space.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

L'invention concerne un système de refroidissement comportant un système de refroidissement en boucle à pompe et un système en boucle de compression de vapeur intégré pour refroidir l'air à l'intérieur d'un espace clos tel qu'un contenant, aussi bien quand la température d'air requise à l'intérieur du contenant est plus élevée que la température de l'air ambiant à l'extérieur que quand elle est plus basse. Le système de refroidissement en boucle à pompe est placé à l'intérieur du contenant, à l'exception d'un condenseur placé à l'extérieur du contenant. Le système en boucle de compression de vapeur est placé à l'extérieur du contenant et comprend un échangeur thermique liquide-liquide qui refroidit le fluide dans le système en boucle à pompe quand le condenseur est sélectivement court-circuité lorsque la température à l'intérieur du contenant est supérieure à la température à l'extérieur du contenant.
PCT/US2012/027831 2011-03-10 2012-03-06 Système de refroidissement Ceased WO2012122150A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/044,632 2011-03-10
US13/044,632 US20120227429A1 (en) 2011-03-10 2011-03-10 Cooling system

Publications (2)

Publication Number Publication Date
WO2012122150A2 true WO2012122150A2 (fr) 2012-09-13
WO2012122150A3 WO2012122150A3 (fr) 2012-11-01

Family

ID=45852754

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/027831 Ceased WO2012122150A2 (fr) 2011-03-10 2012-03-06 Système de refroidissement

Country Status (2)

Country Link
US (1) US20120227429A1 (fr)
WO (1) WO2012122150A2 (fr)

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US9854714B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Method of absorbing sensible and latent heat with series-connected heat sinks
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US9901008B2 (en) 2014-10-27 2018-02-20 Ebullient, Inc. Redundant heat sink module
US9901013B2 (en) 2011-06-27 2018-02-20 Ebullient, Inc. Method of cooling series-connected heat sink modules
US9832913B2 (en) 2011-06-27 2017-11-28 Ebullient, Inc. Method of operating a cooling apparatus to provide stable two-phase flow
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CN104776633B (zh) * 2015-03-10 2017-05-10 深圳市艾特网能有限公司 混合动力制冷系统及其控制方法
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US10663199B2 (en) 2018-04-19 2020-05-26 Lennox Industries Inc. Method and apparatus for common manifold charge compensator
US10830514B2 (en) 2018-06-21 2020-11-10 Lennox Industries Inc. Method and apparatus for charge compensator reheat valve
US11555640B2 (en) * 2020-03-26 2023-01-17 Baidu Usa Llc Control and switch design for multiple phase change loops
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Also Published As

Publication number Publication date
WO2012122150A3 (fr) 2012-11-01
US20120227429A1 (en) 2012-09-13

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