WO2012128593A2 - Capteur comportant une électrode incorporée, et procédé de fabrication associé - Google Patents

Capteur comportant une électrode incorporée, et procédé de fabrication associé Download PDF

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Publication number
WO2012128593A2
WO2012128593A2 PCT/KR2012/002153 KR2012002153W WO2012128593A2 WO 2012128593 A2 WO2012128593 A2 WO 2012128593A2 KR 2012002153 W KR2012002153 W KR 2012002153W WO 2012128593 A2 WO2012128593 A2 WO 2012128593A2
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WO
WIPO (PCT)
Prior art keywords
sensing
sensor
electrode
conductive layers
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/002153
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English (en)
Korean (ko)
Other versions
WO2012128593A3 (fr
Inventor
김선기
김성열
정현학
김정석
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Expantech Co Ltd
Joinset Co Ltd
Original Assignee
Expantech Co Ltd
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120026553A external-priority patent/KR101389971B1/ko
Application filed by Expantech Co Ltd, Joinset Co Ltd filed Critical Expantech Co Ltd
Priority to CN201280014918.0A priority Critical patent/CN103443619B/zh
Publication of WO2012128593A2 publication Critical patent/WO2012128593A2/fr
Publication of WO2012128593A3 publication Critical patent/WO2012128593A3/fr
Priority to US14/034,859 priority patent/US9347806B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid

Definitions

  • the present invention relates to a sensor having a buried electrode and a manufacturing method thereof, and more particularly, to a sensor having a buried electrode which can reduce the manufacturing cost and can be applied to various fields, and a manufacturing method thereof.
  • Most of these sensors form a pair of sensing electrode patterns on a substrate and form a sensing film coated with a sensitive material on the pair of sensing electrode patterns to form a sensor.
  • the senor When a gas or other light comes into contact with the sensing film, the sensor changes the electrical conductivity (or resistance value) of the sensing film, and the sensing is performed by measuring the change in electrical conductivity.
  • an object of the present invention is to provide a sensor having a buried electrode that can overcome the above-mentioned conventional problems.
  • Another object of the present invention is to provide a sensor having a buried electrode with low manufacturing cost.
  • Still another object of the present invention is to provide a sensor having a buried electrode capable of forming a fine pattern at a low cost.
  • Still another object of the present invention is to provide a sensor having a buried electrode capable of precise sensing.
  • Still another object of the present invention is to provide a sensor having a buried electrode having improved reliability.
  • Another object of the present invention is to provide a method of manufacturing the sensor.
  • the above object is a sensing stack comprising a first conductive layer and a second conductive layer embedded in a separation layer via a separation layer, and an electrode terminal provided on the side of the sensing stack by electrically connecting the first and second conductive layers. It is achieved by a sensor having a buried electrode to form a sensing surface by exposing the first and second conductive layer on at least one side except the side on which the electrode terminal is installed.
  • At least one slot is formed in the sensing surface over the entire stacking direction.
  • the side and the sensing surface on which the electrode terminal is installed are cut down and polished to form a flat surface.
  • the first and second conductive layers may not overlap each other by overlapping or buried end portions spaced apart from each other.
  • each of the first and second conductive layers may be different so that some parts overlap each other and others do not overlap each other.
  • the electrode terminals are electrically separated into a plurality of sub electrode terminals for each conductive layer to form a plurality of independent sensor modules, and different numbers of conductive layers may be electrically connected to the sub electrode terminals.
  • the electrode terminal extends to the opposite side of the sensing surface, and the first and second conductive layers are each electrically connected to the electrode terminal at an extension of the electrode terminal.
  • the above object is to form a sensing stack by laminating a first conductive layer and a second conductive layer via a separation layer; A second electrode terminal to which the first conductive layer exposed to one side of the sensing stack is electrically connected, and a second electrode terminal to which the second conductive layer exposed to the other side of the sensing stack is electrically connected Forming a; And forming a sensor by exposing the first and second conductive layers to at least one side of one side and the other side of the sensing stack to a sensing surface, and applying a sensitive material to the sensing surface. It is achieved by a method for manufacturing a sensor having a buried electrode comprising a.
  • one side and the other side of the sensing stack and the sensing surface may be cut or polished in the vertical direction.
  • the first and second conductive layers may be stacked so as to overlap each other or the buried ends so as not to overlap each other.
  • the length of each of the first and second conductive layers may be different so that a part of the first and second conductive layers may overlap each other and the other may not be overlapped with each other.
  • the method may further include forming a slot in the sensing surface over the entire stacking direction.
  • a groove or a slot may be formed in the sensing surface to expose both the first and second conductive layers.
  • the exposed cross-sections of the first and second conductive layers may be plated to grow metal, and the sensitive material may be applied and planarized between ends of each of the metal-grown first and second conductive layers.
  • the above object includes an insulating sensing stack having a first conductive layer and a second conductive layer embedded therein, and an electrode terminal provided on the side of the sensing stack by electrically connecting the first and second conductive layers. And a sensor having a buried electrode that forms a sensing surface by exposing the first and second conductive layers to at least one side surface except for the side surface on which the electrode terminal is installed.
  • the above object is a sensing stack comprising a first conductive layer and a second conductive layer embedded in a separation layer via a separation layer, and an electrode terminal provided on the side of the sensing stack by electrically connecting the first and second conductive layers. And at least one groove having a predetermined width is formed on at least one side surface except for a side surface on which the electrode terminal is installed to form a sensing surface. This is achieved by a sensor with a buried electrode to which the second conductive layer is exposed.
  • the width and length of the conductive layer can be easily adjusted, and the thickness of the separation layer can be easily adjusted.
  • the width and length of the sensing electrode formed of the conductive layer and the electrode terminal can be easily adjusted.
  • the conductive layer constituting the sensing electrode has a structure embedded in the sensing stack, so that the short circuit or disconnection of the electrode does not occur, so that the reliability of the sensor can be improved and the sensing sensitivity can be increased.
  • the number of conductive layers can be freely adjusted, it is possible to adjust the sensing sensitivity, and it is possible to implement a single sensing stack without increasing the sensing sensitivity by connecting several sensors in parallel or in series as in the related art.
  • the manufacturing process is simple and the manufacturing cost can be reduced.
  • the senor according to the present invention can be variously applied as a sensor for sensing gas, infrared light, biomaterials, etc.
  • the electrode is mounted on a circuit board and the sensing surface as a receiving surface for receiving a signal antenna Not only can it be used, but it can also be used as a discharge arrester using the conductive layer insulated and separated by the insulating separation layer using either electrode terminal as a ground terminal.
  • FIG. 1 shows a sensor according to a first embodiment of the present invention.
  • FIG. 2 illustrates an example in which a sensitive material is applied to a sensing surface by cutting along A-A of FIG. 1.
  • FIG. 3 is a manufacturing process diagram illustrating a method of manufacturing a sensor according to an embodiment.
  • FIG. 5 shows a sensor according to another embodiment of the present invention.
  • FIG. 6 shows a sensor according to another embodiment of the present invention.
  • FIG. 7 shows a sensor according to another embodiment of the present invention.
  • FIG. 8 shows a sensor according to another embodiment of the present invention.
  • FIG. 9 shows a sensor according to another embodiment of the present invention.
  • FIG 1 shows a sensor 100 according to a first embodiment of the present invention.
  • the sensor 100 may be electrically connected to the sensing stack 102, in which the conductive layer 120 and the conductive layer 122 are stacked and interposed through the separation layer 110, for each of the conductive layers 120 and 122. It includes electrode terminals (130, 132) provided on the side of the sensing stack 102, the conductive layer (120, 122) is exposed from at least one side except for the side on which the electrode terminals (130, 132) are installed so that the sensing surface ( 104).
  • the conductive layer 120 is exposed to only one side thereof and is electrically connected to the electrode terminal 130 to form one sensing electrode of the sensor 100, and the conductive layer 122 is exposed only to the opposite side of the electrode terminal 132. Is electrically connected to the other sensing electrode of the sensor 100.
  • the width and length of the conductive layers 120 and 122 can be easily adjusted, and the thickness of the separation layer 110 can be easily adjusted, resulting in the conductive layers 120 and 122 and the electrode terminals 130 and 132. It is easy to control the width and length of the sensing electrode and the gap therebetween.
  • the manufacturing process is simple and the manufacturing cost can be reduced.
  • the conductive layers 120 and 122 constituting the sensing electrode have a structure embedded in the sensing stack 102, short-circuit or disconnection of the electrode does not occur, thereby improving the reliability of the sensor and increasing the sensing sensitivity. have.
  • the sensing sensitivity can be adjusted, and by using a single sensing stack without increasing the sensing sensitivity by connecting several sensors in parallel or in series as in the related art. Can be implemented.
  • the sensor 100 according to the present invention may be variously applied as a sensor for sensing gas, infrared light, biomaterials, and the like.
  • the electrode terminals 130 and 132 may be mounted on a circuit board, and the sensing surface 104 may be used as an antenna for receiving signals.
  • the reception sensitivity may be controlled by adjusting the permeability of the separation layer 110.
  • the electrode may be used as a discharge arrester using the conductive layer 120 and the conductive layer 122 insulated and separated by the insulating separation layer 110 by using one of the electrode terminals as the ground terminal.
  • FIG. 2 illustrates an example in which a sensitive material is applied to the sensing surface 104 by cutting along A-A of FIG. 1.
  • Various kinds of sensitive materials corresponding to the material to be sensed are coated on the sensing surface 104 to operate as a sensor, and a sensor (heating pattern) may be further formed as necessary.
  • the separation layer 110 and the conductive layers 120 and 122 are formed at the same height and apply a sensitive material thereon, but if necessary, increase the height of the conductive layers 120 and 122. can do.
  • a hydrogen sensitive material such as a platinum catalyst
  • platinum is applied to the sensing surface 104, and there is a problem that platinum is difficult to bond to the ceramic constituting the sensing stack 102. .
  • a zinc oxide film 160 easily bondable with platinum may be formed first, and then platinum may be applied thereon, in which case the conductive layers 120 and 122 may be applied. Since it is to be exposed to the outside, it is necessary to form the conductive layers 120 and 122 above the thickness of the zinc oxide film 160.
  • the end surfaces of the conductive layers 120 and 122 are plated with metal to increase the height of the ends of the conductive layers 120 and 122, and then a zinc oxide film 160 is formed on the entire surface, and the flattened layer is polished. Apply catalyst.
  • This structure is not limited to the platinum sensitive material, and may be applied when applying a sensitive material that is difficult to bond to the sensing stack 102.
  • the separation layer 110 may be etched so that the height of the conductive layers 120 and 122 is relatively higher. Do.
  • FIG. 3 is a manufacturing process diagram illustrating a method of manufacturing the sensor 100 according to an embodiment, and FIG. 4 shows the manufactured sensing stack 102.
  • the separation layer 110 may vary in material depending on a function or a sensing target of an insulating material such as ceramic or resin, a piezoelectric material, or a semiconductor material.
  • the conductive layer 120 is formed on the separation layer 110.
  • the conductive layer 120 is formed so as not to be exposed to one side (eg, left side in the figure) and not to the opposite side (eg right side in the figure).
  • the conductive layer 120 may or may not be exposed to the other side except for one side and the opposite side. That is, at least one side of the other side except for one side and the opposite side is used as the sensing surface 104, even if the conductive layer 120 is not exposed to the side to be used as the sensing surface 104, cutting or polishing in a subsequent process
  • the sensing surface 104 may be formed by forming a groove.
  • the conductive layer 120 may be any material as long as the material has excellent conductivity, including platinum, silver, gold, alloys thereof, and the like. Both conductive layers 120 and 122 may be made of the same material or different materials. For example, the conductive layer 120 may be made of nickel and the conductive layer 122 may be made of platinum.
  • the separation layer 110 and the conductive layer 122 are further stacked on the structure in which the conductive layer 120 is formed. Since the separation layer 110 formed on the conductive layer 120 is formed of the same material as the separation layer 110 formed in FIG. 3A, the separation layer 110 is represented by the same reference numeral and name.
  • the conductive layer 122 is made of the same material or forming method as the conductive layer 120 except that the conductive layer 122 is exposed to the opposite side and not to one side. Similarly, the conductive layer 122 may or may not be exposed to the other side except the one side and the opposite side.
  • the side where the conductive layers 120 and 122 are exposed that is, one side and the opposite side, is referred to as an 'electrode terminal mounting surface' for convenience.
  • the stacking structure is repeatedly arranged in the order of the separation layer 110, the conductive layer 120, the separation layer 110, and the conductive layer 122 by repeatedly performing the processes of FIGS. 3A and 3B.
  • the sensing stack 102 is formed, and accordingly, the number of conductive layers 120 and 122 stacked through the separation layer 110 may be adjusted as necessary.
  • FIG. 1 a perspective view of the sensing stack 102 manufactured as described above is shown in FIG. 1
  • the sensing stack 102 has a structure in which conductive layers 120 and 122 are alternately stacked and arranged through the separation layers 110, and the bottom and top portions are covered with the separation layers 110.
  • the conductive layer 120 is exposed only to one side of the sensing stack 102, the conductive layer 122 is exposed only to the opposite side of the sensing stack 102, and one side and the opposite side are external in the subsequent process. Electrode terminals 130 and 132 for connection are installed.
  • conductive layers 120 and 122 are embedded in one separation layer 110, respectively. It may be represented as having a stacked arrangement structure, or the conductive layers 120 and 122 may be represented as having a stacked arrangement structure embedded in the sensing stack 102. In this structure, the number of conductive layers 120 and 122 buried in the sensing stack 102 may be increased by increasing the number of stacking or stacking.
  • the side surface may be processed through a cutting process of cutting the sensing stack 102 in the vertical direction or a polishing process of polishing, if necessary, the cutting process or the polishing process may be performed only when necessary.
  • the degree of protrusion of the conductive layers 120 and 122 may be different from each other, so that the cutting and polishing processes may be performed to flatten them. This may be necessary.
  • the protruding degree of the conductive layers 120 and 122 may also be different from the side selected as the sensing surface 104, it may be necessary to arrange them evenly.
  • cutting or polishing by-products may remain on the cutting surface or the polishing surface. Therefore, an etching process, a cleaning process, or a heat treatment process may be performed on the cutting surface or the polishing surface to remove such by-products. have.
  • the etching process or the cleaning process is performed, the exposed conductive layers 120 and 122 may enter the separation layer 110.
  • the heat treatment process is performed, the exposed conductive layers 120 and 122 may slightly protrude. There is a case.
  • both sides facing in the Y-axis direction may be used as the electrode terminal mounting surface, and both sides facing in the X-axis direction may be used as the sensing surface 104. have. Of course, only one of the two sides can be used as the sensing surface 104, of course.
  • the cutting stack 102 may be cut in the vertical direction to use the newly formed cut surface as the sensing surface.
  • the sensing stack 102 is cut into a plurality of vertically along the X axis in FIG. 4, it is possible to manufacture a plurality of sensors having each cut surface as a sensing surface.
  • the electrode terminal 130 and the electrode terminal 132 are installed on the electrode terminal mounting surface of the sensing stack 102, respectively.
  • the electrode terminals 130 and 132 function as terminals for external connection of the sensor 100, all the conductive layers 120 are electrically connected to the electrode terminals 130, and all the conductive layers are connected to the electrode terminals 132. 122 is electrically connected.
  • the cutting process and the polishing process for forming the sensing surface are performed before the electrode terminals 130 and 132 are formed, but the present invention is not limited thereto.
  • 132 may be performed to form the sensing surface 104 or to manufacture a plurality of sensors each having a sensing surface as shown in FIG. 4.
  • FIG 5 shows a sensor 200 according to another embodiment of the present invention.
  • a plurality of conductive layers 220 and 222 are separated and embedded by a separation layer 210, and a plurality of sub electrode terminals 230, 240, and 250 are provided on each electrode terminal mounting surface.
  • 232, 242, and 252 are provided to constitute independent sensors 200a, 200b, and 200c.
  • Sub-electrode terminals 230, 240 and 250 provided on one side and sub-electrode terminals 232, 242 and 252 provided on the opposite side are electrically separated from each other.
  • different numbers of conductive layers 220 and 222 are provided. This is electrically connected.
  • one conductive layer is connected to the sub electrode terminals 230 and 232, and two conductive layers are connected to the sub electrode terminals 240 and 242, respectively, and three conductive layers are respectively connected to the sub electrode terminals 250 and 252.
  • the conductive layer is connected.
  • three sensors 200a, 200b, and 200c which are substantially independent of one sensing stack 202, are formed as a result, and different sensing materials are applied to the sensing surface of each sensor, thereby forming a plurality of sensors at a specific place.
  • the sensing of the substance can be made possible.
  • This embodiment functions as a plurality of sensors 200a, 200b, 200c while maintaining one sensing stack 202 as opposed to configuring a plurality of sensors by cutting the sensing stack 102 itself in FIG. 4. I did it.
  • FIG. 6 shows a sensor 300 according to another embodiment of the present invention.
  • a plurality of conductive layers 320 and 322 are alternately arranged and interposed through the separation layer 310, and the conductive layer 320 is exposed at one end only on one side thereof. It is electrically connected to the electrode terminal 330 is provided on the side, the conductive layer 322 is electrically connected to the electrode terminal 332 is provided on this side with the end exposed only to the opposite side.
  • One edge of the plurality of conductive layers 320 and 322 is exposed to one side of the sensing stack 302 except for the side on which the electrode terminals 330 and 332 are installed to form the sensing surface 304 and the sensing surface 304. ), Slots 340 are formed throughout the stacking direction of the conductive layers 320 and 322.
  • a plurality of slots 340 may be formed side by side.
  • the cross-sectional shape, the number, the size or the depth of the slot 340 may vary as necessary to form a slot having various shapes and structures.
  • the lengths of the conductive layers 320 and 322 exposed to the sensing surface 304 can be adjusted freely, and as a result, the length of the sensing electrode can be adjusted, and the size of the sensing surface 304 can be adjusted.
  • Freely adjustable Adjusting the length of the sensing electrode or the size of the sensing surface 304 may be controlled by controlling the width or depth of the slot 340.
  • the inner surface of the slot 340 may be formed unevenly and unevenly, and the sensitive material applied to the sensing surface 304 may be coated to a predetermined thickness along the inner surface of the slot 340 or may fill the slot 340 to sense the sensing surface ( 304 may be applied so that the whole is flat.
  • FIG. 7 shows a sensor 400 according to another embodiment of the present invention.
  • a plurality of conductive layers 420 and 422 are alternately arranged and interposed through the separation layer 410, and the conductive layer 420 has exposed ends only on one side thereof. It is electrically connected to the electrode terminal 430 provided on the side, and the conductive layer 422 is electrically connected to the electrode terminal 432 provided on this side with the end exposed only to the opposite side.
  • a groove 440 is formed on one side of the sensing stack 402 except for the side on which the electrode terminals 430 and 432 are installed, and all edges of one side of the electrode terminals 430 and 432 are exposed on the bottom of the groove 440.
  • the sensing surface 404 is configured through a window defined by the groove 440.
  • the inner surface of the groove 440 may also be used as the sensing surface 404 to increase the size of the sensing surface 404. can do.
  • one groove 440 is formed, but a plurality of grooves 440 may be spaced apart from each other.
  • the number or size of the grooves 440 may vary depending on necessity, so that grooves having various shapes and structures can be formed.
  • the size of the groove 440 may be determined so that the ends of the conductive layers 420 and 422 embedded in the sensing stack 402 may not be exposed, and the depth of the grooves 440 may be adjusted to adjust the conductive layers 420 and 422. ) May be exposed to the bottom and sidewalls of the groove 440 (see FIG. 9).
  • the sensitive material applied to the sensing surface 404 may be applied to the bottom of the groove 440 with a predetermined thickness or may be applied to fill the groove 440, the inner surface of the groove 440 is not flat and is formed unevenly can do.
  • the groove 450 having both edges open in the stacking direction may be formed. In this case, the groove 450 may be easily formed as compared with FIG. 7A.
  • the size of the sensing surface 404 may be adjusted by adjusting the number and width or depth of the grooves 440 and 450.
  • FIG 8 illustrates sensors 500 and 600 according to another embodiment of the present invention.
  • the conductive layer 520 embedded in the sensing stack 502 and electrically connected to the electrode terminal 530 and the conductive layer 522 electrically connected to the electrode terminal 532 are respectively inside the sensing stack 502. Do not overlap with each other.
  • the lengths of the conductive layers embedded in the sensing stack 602 and electrically connected to the electrode terminals 630 and 632 may be different so as not to overlap or overlap each other in the sensing stack 502. .
  • the conductive layers 620 and 623 are formed longer than the conductive layers 621 and 622 and overlap each other, whereas the short conductive layers 621 and 622 do not overlap each other.
  • the conductive layer may have any arrangement or arrangement structure. You may have it. In addition, various arrangements are possible, including arrangements well known to those skilled in the art.
  • the conductive layers are exposed only to opposite sides of the conductive layers, so that the electrode terminals face each other. have.
  • FIG 9 illustrates a sensor 700 according to another embodiment of the present invention.
  • the electrode terminals 730 and 732 disposed on opposite sides of the electrode extend to the lower surface of the sensing stack 702, and one end of the conductive layers 720 and 722 is bent to the lower surface of the sensing stack 702. It is formed in a pattern to be in electrical contact with the conductive layers (720, 722).
  • the electrode terminals 730 and 732 formed on the lower surface of the sensing stack 702 can be easily mounted on a circuit board or the like.
  • the sensitive material is filled only in the grooves or the slots 740 to cover the conductive layers 720 and 722 exposed through the bottom and sidewalls of the grooves or the slots 740.
  • the present invention has various advantages.
  • the thickness of the separation layer between the conductive layers can be made finer spacing between the sensing electrodes, it is easy to adjust the width or length of the sensing electrode for sensing, the manufacturing process is simple, and the manufacturing cost can be reduced Can be.
  • the sensing electrode has a structure embedded in the sensing stack, shorting or disconnection of the electrode does not occur, so that the reliability of the sensor can be improved and the sensing sensitivity can be increased.
  • the sensing sensitivity can be adjusted, and a single sensor or a plurality of sensors without the need of a conventional multiplexer type sensor that increases sensing sensitivity by connecting several sensors in parallel or in series There is a corresponding advantage.

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Abstract

La présente invention concerne un capteur qui comporte une électrode incorporée, qui peut être fabriqué à coût réduit et appliqué à de nombreux domaines différents. Le capteur comprend : une pile de détection dans laquelle une première couche conductrice et une seconde couche conductrice sont empilées et stratifiées avec une couche de séparation interposée entre les première et seconde couches conductrices ; et une borne d'électrode agencée dans une surface latérale de la pile de détection et connectée électrique aux première et seconde couches conductrices. Les premières et seconde couches conductrices sont exposées sur au moins une surface latérale de la pile de détection à l'exception de la surface latérale sur laquelle la borne d'électrode est agencée, pour ainsi former une surface de détection.
PCT/KR2012/002153 2011-03-24 2012-03-23 Capteur comportant une électrode incorporée, et procédé de fabrication associé Ceased WO2012128593A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280014918.0A CN103443619B (zh) 2011-03-24 2012-03-23 具有埋设型电极的传感器及其制造方法
US14/034,859 US9347806B2 (en) 2011-03-24 2013-09-24 Sensor having an embedded electrode, and method for manufacturing same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20110026380 2011-03-24
KR10-2011-0026380 2011-03-24
KR10-2012-0026553 2012-03-15
KR1020120026553A KR101389971B1 (ko) 2011-03-24 2012-03-15 매립형 전극을 구비한 센서 및 그 제조방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/034,859 Continuation US9347806B2 (en) 2011-03-24 2013-09-24 Sensor having an embedded electrode, and method for manufacturing same

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Publication Number Publication Date
WO2012128593A2 true WO2012128593A2 (fr) 2012-09-27
WO2012128593A3 WO2012128593A3 (fr) 2012-12-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4202429A1 (fr) * 2021-12-23 2023-06-28 Vmti Fiziniu Ir Technologijos Mokslu Centras Procédé de fabrication d'une cellule électrochimique et cellule électrochimique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4342005C2 (de) * 1993-12-09 2003-03-27 Bosch Gmbh Robert Planare elektrochemische Sonde und Verfahren zu deren Herstellung
JP3244249B2 (ja) * 1995-03-20 2002-01-07 日本電信電話株式会社 センサー用電極
JP2002148343A (ja) * 2000-11-07 2002-05-22 Canon Inc 放射線検出器及びそれを用いた放射線撮像システム
KR20060110278A (ko) * 2003-10-22 2006-10-24 도요 잉키 세이조 가부시끼가이샤 프로톤 수용형 센서, 수소가스 센서 및 산 센서
KR20100111558A (ko) * 2009-04-07 2010-10-15 삼성전기주식회사 가스센서

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4202429A1 (fr) * 2021-12-23 2023-06-28 Vmti Fiziniu Ir Technologijos Mokslu Centras Procédé de fabrication d'une cellule électrochimique et cellule électrochimique

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