WO2012129580A3 - Leiterplattenelement mit wenigstens einer led - Google Patents

Leiterplattenelement mit wenigstens einer led Download PDF

Info

Publication number
WO2012129580A3
WO2012129580A3 PCT/AT2012/000070 AT2012000070W WO2012129580A3 WO 2012129580 A3 WO2012129580 A3 WO 2012129580A3 AT 2012000070 W AT2012000070 W AT 2012000070W WO 2012129580 A3 WO2012129580 A3 WO 2012129580A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
circuit board
board element
waveguide cavity
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AT2012/000070
Other languages
English (en)
French (fr)
Other versions
WO2012129580A2 (de
Inventor
Alexander Kasper
Gregor Langer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&S Austria Technologie und Systemtechnik AG
Original Assignee
AT&S Austria Technologie und Systemtechnik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&S Austria Technologie und Systemtechnik AG filed Critical AT&S Austria Technologie und Systemtechnik AG
Priority to EP12718028.9A priority Critical patent/EP2695010A2/de
Priority to CN201280025969.3A priority patent/CN103562762A/zh
Priority to US14/009,129 priority patent/US9903539B2/en
Priority to KR1020137029112A priority patent/KR101922206B1/ko
Publication of WO2012129580A2 publication Critical patent/WO2012129580A2/de
Publication of WO2012129580A3 publication Critical patent/WO2012129580A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Leiterplattenelement (1) mit einem Substrat (2), auf dem wenigstens eine dielektrische Schicht (7) angeordnet ist, sowie mit wenigstens einer LED (Leuchtdiode) (10), wobei in der dielektrischen Schicht (7) zumindest eine von der LED (10) wegführende kanalförmige Wellenleiter-Kavität (11) vorgesehen ist, die zu wenigstens einem integrierten lichtempfindlichen, zur Überprüfung der Lichtemission angeordneten Bauelement (12), vorzugsweise einer Fotodiode bzw. einer Fotozelle, führt, wobei die LED (10) vorzugsweise ebenfalls in einer Kavität (9) angeordnet ist, die mit der Wellenleiter-Kavität (11) verbunden ist; sowie Verfahren zum Herstellen eines derartigen Leiterplattenelements (1).
PCT/AT2012/000070 2011-04-01 2012-03-20 Leiterplattenelement mit wenigstens einer led Ceased WO2012129580A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP12718028.9A EP2695010A2 (de) 2011-04-01 2012-03-20 Leiterplattenelement mit wenigstens einer led
CN201280025969.3A CN103562762A (zh) 2011-04-01 2012-03-20 带有至少一个发光二极管的电路板元件
US14/009,129 US9903539B2 (en) 2011-04-01 2012-03-20 Circuit board element having at least one LED
KR1020137029112A KR101922206B1 (ko) 2011-04-01 2012-03-20 적어도 하나의 ｌｅｄ를 갖는 회로 보드 엘리먼트

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATGM183/2011U AT12749U1 (de) 2011-04-01 2011-04-01 Leiterplattenelement mit wenigstens einer led
ATGM183/2011 2011-04-01

Publications (2)

Publication Number Publication Date
WO2012129580A2 WO2012129580A2 (de) 2012-10-04
WO2012129580A3 true WO2012129580A3 (de) 2013-01-31

Family

ID=46025270

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2012/000070 Ceased WO2012129580A2 (de) 2011-04-01 2012-03-20 Leiterplattenelement mit wenigstens einer led

Country Status (6)

Country Link
US (1) US9903539B2 (de)
EP (1) EP2695010A2 (de)
KR (1) KR101922206B1 (de)
CN (1) CN103562762A (de)
AT (1) AT12749U1 (de)
WO (1) WO2012129580A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8995801B2 (en) 2013-06-26 2015-03-31 International Business Machines Corporation Planar coaxial electrically and optically conductive structure
DE102014107090B4 (de) * 2014-05-20 2022-10-20 HELLA GmbH & Co. KGaA Beleuchtungsvorrichtung für Fahrzeuge
GB2530307A (en) * 2014-09-19 2016-03-23 Johnson Electric Sa LED lighting assembly
JP6712742B2 (ja) * 2014-09-24 2020-06-24 日東電工株式会社 光電気混載基板およびその製法
KR102276647B1 (ko) * 2015-01-13 2021-07-13 엘지이노텍 주식회사 발광소자 패키지용 회로기판
DE102015225808B4 (de) * 2015-12-17 2022-07-14 Automotive Lighting Reutlingen Gmbh Verfahren zum Anordnen eines SMD-Bauteils in Bezug zu einer Leiterplatte
EP3181459B1 (de) * 2015-12-17 2020-02-12 Goodrich Lighting Systems GmbH Äussere flugzeugbeleuchtungseinheit und flugzeug damit
FR3107752B1 (fr) * 2020-02-28 2022-04-15 Valeo Iluminacion Sa Dispositif d'éclairage automobile
CN112888108B (zh) * 2021-03-22 2025-05-02 深圳市浩志科技有限公司 一种led驱动电路及led灯具
DE102022125554A1 (de) * 2022-10-04 2024-04-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Package mit Komponententräger mit Hohlraum und elektronischer Komponente sowie funktionellem Füllmedium darin

Citations (10)

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US5015059A (en) * 1988-01-15 1991-05-14 E. I. Du Pont De Nemours And Company Optical fiber connector assemblies and methods of making the assemblies
JPH07234345A (ja) * 1993-12-27 1995-09-05 Nec Corp 導波路型光デバイスの受光構造
JPH08264748A (ja) * 1995-03-27 1996-10-11 Furukawa Electric Co Ltd:The 光導波路集積回路装置及びその製造方法
US20020085785A1 (en) * 2000-12-28 2002-07-04 Yoshio Kishimoto Light-wave circuit module and method for manufacturing the same
JP2002258084A (ja) * 2000-12-28 2002-09-11 Matsushita Electric Ind Co Ltd 光波回路モジュールおよびその製造方法
WO2004010191A1 (en) * 2002-07-23 2004-01-29 Terahertz Photonics Ltd Connection to optical backplane
EP1950587A2 (de) * 2006-12-31 2008-07-30 Rohm and Haas Electronic Materials LLC Verfahren zur Herstellung von Leiterplatten mit optischer Funktionalität
US20090225565A1 (en) * 2008-03-05 2009-09-10 Micha Zimmermann Sub-assembly and methods for forming the same
DE102009019412A1 (de) * 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren
US20110043724A1 (en) * 2009-08-21 2011-02-24 Tae Ho Kim Backlight unit and display device using the same

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AT4138B (de) 1899-10-02 1901-05-10 Jakob Heinrich
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US4883743A (en) * 1988-01-15 1989-11-28 E. I. Du Pont De Nemours And Company Optical fiber connector assemblies and methods of making the assemblies
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AT503027B1 (de) * 2006-05-08 2007-07-15 Austria Tech & System Tech Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
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KR102142450B1 (ko) 2009-10-30 2020-08-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작방법
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015059A (en) * 1988-01-15 1991-05-14 E. I. Du Pont De Nemours And Company Optical fiber connector assemblies and methods of making the assemblies
JPH07234345A (ja) * 1993-12-27 1995-09-05 Nec Corp 導波路型光デバイスの受光構造
JPH08264748A (ja) * 1995-03-27 1996-10-11 Furukawa Electric Co Ltd:The 光導波路集積回路装置及びその製造方法
US20020085785A1 (en) * 2000-12-28 2002-07-04 Yoshio Kishimoto Light-wave circuit module and method for manufacturing the same
JP2002258084A (ja) * 2000-12-28 2002-09-11 Matsushita Electric Ind Co Ltd 光波回路モジュールおよびその製造方法
WO2004010191A1 (en) * 2002-07-23 2004-01-29 Terahertz Photonics Ltd Connection to optical backplane
EP1950587A2 (de) * 2006-12-31 2008-07-30 Rohm and Haas Electronic Materials LLC Verfahren zur Herstellung von Leiterplatten mit optischer Funktionalität
US20090225565A1 (en) * 2008-03-05 2009-09-10 Micha Zimmermann Sub-assembly and methods for forming the same
DE102009019412A1 (de) * 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren
US20110043724A1 (en) * 2009-08-21 2011-02-24 Tae Ho Kim Backlight unit and display device using the same

Also Published As

Publication number Publication date
KR20140027210A (ko) 2014-03-06
CN103562762A (zh) 2014-02-05
WO2012129580A2 (de) 2012-10-04
US20140233241A1 (en) 2014-08-21
US9903539B2 (en) 2018-02-27
AT12749U1 (de) 2012-10-15
KR101922206B1 (ko) 2018-11-26
EP2695010A2 (de) 2014-02-12

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