WO2012144597A1 - Tête à jet d'encre - Google Patents

Tête à jet d'encre Download PDF

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Publication number
WO2012144597A1
WO2012144597A1 PCT/JP2012/060716 JP2012060716W WO2012144597A1 WO 2012144597 A1 WO2012144597 A1 WO 2012144597A1 JP 2012060716 W JP2012060716 W JP 2012060716W WO 2012144597 A1 WO2012144597 A1 WO 2012144597A1
Authority
WO
WIPO (PCT)
Prior art keywords
channel
row
wiring
electrode
head chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/060716
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English (en)
Japanese (ja)
Inventor
光 高松
渡辺　英生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta IJ Technologies Inc
Original Assignee
Konica Minolta IJ Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta IJ Technologies Inc filed Critical Konica Minolta IJ Technologies Inc
Priority to EP12774310.2A priority Critical patent/EP2700506B1/fr
Priority to JP2013511055A priority patent/JP5846201B2/ja
Publication of WO2012144597A1 publication Critical patent/WO2012144597A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection

Definitions

  • the present invention relates to an ink jet head, and more particularly, to an ink jet head having a head chip in which drive channels and dummy channels are alternately arranged, and capable of increasing the density of the channels.
  • the drive wall By applying a drive signal of a predetermined voltage to the drive electrode formed on the drive wall that partitions the channel, the drive wall is subjected to shear deformation, and ink in the channel is ejected from the nozzle by using the pressure generated at that time.
  • a shear mode type ink jet head one having a so-called harmonica type head chip in which opening portions of channels are respectively arranged on the front surface and the rear surface is known.
  • the drive electrode faces the channel and is not exposed to the outside, the problem is how to electrically connect each drive electrode to the drive circuit.
  • the channel row located outside forms a connection electrode that is electrically connected to the drive electrode from each channel to the end of the head chip using the rear surface of the head chip. It is easy to make an electrical connection with an FPC or the like at the end of the head chip.
  • the drive signal is applied to the drive electrodes of the channel rows located on the inner side from the end of the head chip, the connection electrodes that are electrically connected to the drive electrodes extend beyond the outer channel row to the end of the head chip. There is a problem that it has to be formed.
  • Patent Document 1 discloses that four channel rows are arranged by shifting the channel pitch by 1 ⁇ 4, and driving electrodes in each channel are arranged on the rear side of the head chip. An electrical contact is formed by being exposed to the periphery of each of the openings, a flexible substrate having a wiring electrode formed on one side of the rear surface of the head chip, and a wiring electrode forming surface facing the rear surface of the head chip, It is disclosed that a drive signal can be applied from one side of the head chip to each drive electrode of all channel rows by bonding so as to cover the entire rear surface.
  • through holes are formed at positions corresponding to the respective channels, and ink can be supplied to the respective channels through the through holes.
  • a wiring electrode is formed which is electrically connected to the electrical contacts of the channel row located on the inner side.
  • Patent Document 1 by shifting the pitch by 1 ⁇ 4 between the four channel columns, a maximum of three wiring electrodes pass between the channels. Since each wiring electrode passes between adjacent through holes, the wiring electrodes are arranged so as to be within the range of the width (thickness) of the drive wall when viewed from the direction along the ink ejection direction.
  • each channel in the channel row is divided into a drive channel that discharges ink and a dummy channel that does not discharge ink, and the channel row is configured by alternately arranging these channels.
  • connection electrode that is electrically connected to a drive electrode in each channel is formed on the rear surface of such an independent drive type harmonica type head chip, and is positioned inside a plurality of juxtaposed channel rows.
  • the connection electrode of the channel row to be used is formed on the rear surface of the head chip on the rear surface of the head chip by using a flexible substrate having a wiring electrode formed on one side so as to have a narrow width equal to the width of the wiring electrode. Pulling out to the end is disclosed.
  • the flexible substrate on which the wiring electrode is formed is provided so as to close the opening on the rear surface side of the dummy channel when crossing the outer channel row. Since the surface opposite to the wiring electrode formation surface faces the rear surface of the head chip, the flexible substrate may cause a short circuit with the drive electrode or connection electrode exposed in or near the opening of the dummy channel. Is prevented. In addition, since the flexible substrate is provided so as to close the opening on the rear surface side of the dummy channel, there is an advantage that it is easy to cope with the higher density of the channel.
  • harmonica type head chips are supplied with ink from the rear side to each channel. For this reason, if the wiring electrode is exposed on the rear surface side of the head chip as described in Patent Document 2, the wiring electrode comes into direct contact with the ink, and there is a problem of electrode corrosion.
  • a protective film is formed on the surface of the electrode.
  • the protective film may penetrate, From the viewpoint of avoiding corrosion of steel, there are still problems to be solved.
  • the wiring electrode when the wiring electrode is disposed so as to face the rear surface of the head chip, the wiring electrode can be prevented from coming into direct contact with the ink, but is wired beyond the channel row.
  • the wiring electrode When viewed from the direction along the ink ejection direction, the wiring electrode passes over the driving wall between the channels, so the width of the driving wall becomes narrower as the channel becomes higher in density, making it difficult to achieve high density. There is a problem.
  • the present invention is such that the substrate having the wiring electrode is bonded to the rear surface of the independent drive type harmonica type head chip having a plurality of channel rows so that the wiring electrode is on the rear surface side of the head chip.
  • An object is to provide an inkjet head in which wiring electrodes can be arranged with high density and can easily cope with high density of channels.
  • Channels and drive walls made of piezoelectric elements are alternately arranged, and a plurality of channel rows in which drive electrodes are formed on the drive wall facing the channel are arranged side by side, and openings of the channels are respectively provided on the front surface and the rear surface.
  • a connecting electrode that is electrically connected to the driving electrode in the channel is formed on the rear surface, and the channel row is alternately arranged with a driving channel that ejects ink and a dummy channel that does not eject ink.
  • a head chip A wiring board that covers the plurality of channel rows with respect to the rear surface of the head chip and is bonded so as to protrude to the side of the head chip; By electrically connecting the wiring electrodes formed on the surface of the wiring board on the side bonded to the head chip to the connection electrodes, each of the connection electrodes is electrically drawn to the end of the wiring board.
  • An inkjet head that discharges ink in the drive channel from a nozzle by applying a voltage to the drive electrode via the wiring electrode and the connection electrode;
  • through holes for supplying ink are formed only at positions corresponding to the openings of the drive channels, and at least one of the plurality of through hole rows corresponding to the channel rows.
  • At least one of the wiring electrodes passes through and extends to the end of the wiring board that protrudes to the side of the head chip, At least one of the wiring electrodes passing between the through holes is not in contact with the opening of the dummy channel and overlaps the opening of the dummy channel when viewed from the ink discharge direction.
  • An inkjet head An inkjet head.
  • the head chip has two channel rows of A rows and B rows, One wiring corresponding to the drive channel of the B row among the wiring electrodes electrically connected to the connection electrode of the channel row of the B row is provided between the through holes of one A row. 3.
  • the ink jet head according to claim 1 or 2 wherein a total of two wiring electrodes of the electrode and one wiring electrode corresponding to the dummy channel in the B row adjacent to the driving channel pass therethrough.
  • the head chip has three channel rows of A row, B row and C row, Among the wiring electrodes electrically connected to the connection electrode of the channel row of the C row, between the through holes of one B row, one wiring corresponding to the drive channel of the C row A total of the two wiring electrodes of the electrode and one wiring electrode corresponding to the dummy channel in the C row adjacent to the driving channel pass through, One wiring corresponding to the drive channel of the B row among the wiring electrodes electrically connected to the connection electrode of the channel row of the B row is provided between the through holes of one A row.
  • the substrate having the wiring electrode is joined to the rear surface of the independently driven harmonica type head chip having a plurality of channel rows so that the wiring electrode is on the rear surface side of the head chip, It is possible to provide an inkjet head in which wiring electrodes can be arranged with high density and can easily cope with high density of channels.
  • FIG. 1 is an exploded perspective view of an inkjet head according to the present invention.
  • Partial rear view of a head chip according to the present invention Partial rear view showing the bonding state between the head chip and the wiring board Sectional view along line (iv)-(iv) in FIG. Sectional view along line (v)-(v) in FIG.
  • the head chip in the present invention has a plurality of parallel channel rows in which channels and drive walls made of piezoelectric elements are alternately arranged.
  • the head chip is arranged with channel openings facing the front and rear surfaces, respectively.
  • Each channel is formed in a straight shape whose cross-sectional shape does not change from the rear opening (channel inlet) to the front opening (channel outlet), and a drive electrode is formed on the surface of the drive wall facing each channel. Is done.
  • Such a head chip is a hexagonal so-called shear mode harmonica type head chip, and by applying a drive signal of a predetermined voltage to each drive electrode on both sides of the drive wall, the drive wall is shear-deformed, A change in pressure for ejection is applied to the ink supplied into the channel, and the ink is ejected as an ink droplet from a nozzle disposed on the front surface of the head chip.
  • a surface on which nozzles are arranged and ink is ejected is defined as a “front surface”, and a surface on the opposite side is defined as a “rear surface”.
  • a direction parallel to the front surface or the rear surface of the head chip and away from the head chip is defined as “side” of the head chip.
  • the channel row in the present invention is an independently driven head chip in which drive channels and dummy channels are alternately arranged.
  • connection electrodes that are electrically connected to the drive electrodes in the drive channel and the dummy channel are individually formed and arranged on the rear surface of the head chip at the same pitch as the corresponding drive channel or dummy channel.
  • the drive channel is a channel that ejects ink from the nozzles according to image data during image recording
  • the dummy channel is a channel that does not always eject ink regardless of the image data. Since the dummy channel does not need to eject ink, generally, ink is not filled or a nozzle corresponding to the dummy channel is not formed on the nozzle plate.
  • the wiring board bonded to the rear surface of the head chip by an adhesive is an intermediate wiring member that connects between the head chip and the drive circuit.
  • the electrical connection between the head chip and the electric wiring member from the drive circuit is relayed to facilitate electrical connection with the electric wiring member.
  • This wiring board electrically draws out each drive electrode to the side orthogonal to the channel row of the head chip via the corresponding connection electrode.
  • the wiring board according to the present invention is bonded to the rear surface of the head chip so as to cover all the channel rows opened in the rear surface and to have the end portion protruding to the side perpendicular to the channel row in the head chip. .
  • This wiring board has a through hole for enabling ink supply in the driving channel only at a position corresponding to the driving channel of the head chip. Therefore, the opening on the rear surface side of the dummy channel is closed by the wiring board.
  • the opening means a portion where the dummy channel is opened flush with the rear surface of the head chip.
  • a wiring electrode that is electrically connected to each connection electrode arranged on the rear surface of the head chip is formed on a surface (hereinafter referred to as a surface) of the wiring substrate that is bonded to the head chip.
  • each wiring electrode has one end electrically connected to the corresponding connection electrode and the other end protruding to the side of the head chip. It extends to the end.
  • At least one wiring electrode passes between the adjacent through holes in at least one through hole row.
  • the wiring electrode passing between the through holes is a wiring electrode that is electrically connected to the connection electrode of another channel row.
  • At least one wiring electrode passing between the through holes is in non-contact with the opening of the dummy channel in a state where the wiring substrate is bonded to the rear surface of the head chip via an adhesive, and When viewed from the ink ejection direction, it overlaps the opening of the dummy channel. That is, the wiring electrode passing between the through holes is not in contact with the rear surface of the head chip other than in contact with the connection electrode to which the wiring electrode is to be conducted.
  • the wiring electrode is in contact with the rear surface of the head chip other than the connection electrode of the corresponding channel. Therefore, occurrence of crosstalk and short circuit can be prevented.
  • at least one wiring electrode passing between the through holes passes over the opening of the dummy channel, even if the space between the channels is narrow, it is between adjacent through holes including the opening of the dummy channel. Since all of the space can be used, high-density wiring is possible without particularly reducing the width of the wiring electrode, and the channel density can be increased.
  • an electric wiring member having a wiring electrically connected to the wiring electrode is joined to an end portion of the wiring substrate protruding to the side of the head chip.
  • the electric wiring member is connected to the drive circuit, and a voltage from the drive circuit is applied to the drive electrode via the wiring electrode and the connection electrode of the wiring board.
  • the ink in a drive channel can be discharged from a nozzle.
  • a flexible printed circuit board hereinafter referred to as FPC
  • the substrate material is preferably one of glass, silicon, and ceramics.
  • the rigidity is higher than that of the resin material having the same thickness, the wiring board can be made thinner by that amount, and the flow path resistance of the through hole can be suppressed.
  • FIG. 1 is an exploded perspective view of an inkjet head
  • FIG. 2 is a partial rear view of the head chip.
  • 1 is a shear mode type harmonica head chip
  • 2 is a nozzle plate
  • 3 is a wiring board
  • 4 is an FPC.
  • the head chip 1 has two channel rows, A row and B row.
  • the lower channel row in FIG. 2 is the A row
  • the upper channel row is the B row.
  • drive channels 11A and 11B and dummy channels 12A and 12B are alternately arranged.
  • Drive walls 13A and 13B made of piezoelectric elements are formed between the drive channels 11A and 11B and the adjacent dummy channels 12A and 12B.
  • Each drive channel 11A, 11B and each dummy channel 12A, 12B are opened to the front surface 1a and the rear surface 1b of the head chip 1, respectively, and the drive electrode 14 is formed in close contact with the inner surface by plating, vapor deposition, sputtering, or the like. Has been.
  • the drive channel 11A and the dummy channel 12A of the channel row of the A row and the drive channel 11B and the dummy channel 12B of the channel row of the B row are arranged so as to be shifted from each other by one pitch. That is, when viewed in a direction parallel to the rear surface 1b of the head chip 1 and orthogonal to the channel row, the A-channel drive channel 11A and the B-row dummy channel 12B are positioned on the same straight line, and the A-row dummy channel The channel 12A and the drive channel 11B in the B row are located on the same straight line.
  • connection electrodes 15A and 15B that are electrically connected to the drive electrodes 14 of the drive channels 11A and 11B and the dummy channels 12A and 12B are formed by plating, vapor deposition, sputtering, or the like.
  • One end of each connection electrode 15A, 15B is electrically connected to the drive electrode 14 in the corresponding drive channel 11A, 11B or dummy channel 12A, 12B.
  • the other end of each connection electrode 15A corresponding to the drive channel 11A and the dummy channel 12A in the A row is formed from the inside of each channel 11A, 12A to one end edge 1c (lower end edge in FIG. 2) of the head chip 1.
  • connection electrode 15B corresponding to the drive channel 11B and the dummy channel 12B in the B row, the connection electrodes 15B extend from the channels 11B and 12B toward the A row side and before the channel row in the A row. Is formed. Accordingly, all of the connection electrodes 15A and 15B extend from the channels 11A, 11B, 12A, and 12B in the same direction (direction of the edge 1c).
  • the nozzle plate 2 is bonded to the front surface 1a of the head chip 1 with an adhesive.
  • nozzles 21 are opened only at positions corresponding to the drive channels 11A and 11B.
  • the wiring board 3 is a flat board that is larger than the outer shape of the rear surface 1 b of the head chip 1.
  • the wiring board 3 is joined to the rear surface 1b of the head chip 1, it is preferably difficult to bend, and glass, silicon, and ceramics are preferably used. In this embodiment, a glass substrate is used.
  • the bonding region 31 (the region indicated by the alternate long and short dash line in FIG. 1) 31 that is bonded to the rear surface 1b of the head chip 1, only the positions corresponding to the drive channels 11A and 11B opened on the rear surface 1b of the head chip 1 are not present.
  • Through holes 32A and 32B for individually supplying ink into the drive channels 11A and 11B from the illustrated common ink chamber are individually opened.
  • the opening areas of the through holes 32A and 32B are the same as or slightly larger than the opening areas of the drive channels 11A and 11B.
  • the thickness of the wiring board 3 is preferably 0.3 mm to 0.8 mm from the viewpoint of ensuring appropriate rigidity while suppressing the flow resistance of the through holes 32A and 32B.
  • wiring electrodes 33A and 33B that are electrically connected in a one-to-one correspondence with the connection electrodes 15A and 15B arranged on the rear surface 1b of the head chip 1 are provided on the wiring board.
  • 3 is formed by plating, vapor deposition, sputtering, or the like so as to extend in a direction crossing the channel row of the head chip 1 on the surface of 3.
  • each wiring electrode 33A corresponding to the connection electrode 15A drawn from each channel 11A, 12A in the A row is located in the vicinity corresponding to each channel 11A, 12A in the A row in the bonding region 31, and the other end is , Extending from the bonding region 31 toward a side perpendicular to the channel row of the head chip 1, protruding from the bonding region 31 and reaching the end 3 a of the wiring substrate 3.
  • each wiring electrode 33B corresponding to the connection electrode 15B drawn from each channel 11B, 12B in the B row is located in the vicinity corresponding to each channel 11B, 12B in the B row in the junction region 31.
  • the end extends in the same direction as the wiring electrode 33A, passes between adjacent through holes 32A in the A row, protrudes from the bonding region 31, reaches the end portion 3a of the wiring board 3, and alternates with the wiring electrodes 33A. It is arranged to be.
  • the wiring board 3 is positioned so that the wiring electrodes 33A and 33B are electrically connected to the connection electrodes 15A and 15B of the corresponding head chip 1, and bonded to the rear surface 1b of the head chip 1 by an adhesive.
  • an adhesive an anisotropic conductive adhesive containing conductive particles can be used, but it is preferable to use an adhesive containing no conductive particles in order to increase the reliability of short circuit prevention. .
  • FIG. 3 is a partial rear view of the state in which the wiring board 3 is bonded to the rear surface 1b of the head chip 1 as viewed from the back side of the wiring board 3.
  • FIG. 4 is a line (iv)-(iv) in FIG.
  • FIG. 5 is a sectional view taken along line (v)-(v) in FIG.
  • These wiring electrodes 33B 1 and 33B 2 extend between the adjacent through holes 32A and 32A in the A row to the end portion 3a of the wiring board 3.
  • Wiring electrodes 33B 2 having one end connected to the connecting electrodes 15B and electrically dummy channel 12B of the B column, the other end side of the through hole 32A of the A column from a connection portion between said connection electrode 15B, wire toward between 32A substrate 3 passes through the opening 120A so as to partially cover the edge 121a of the opening 120A of the dummy channel 12A in the A row located between the through holes 32A and 32A. Bends on the surface of the wiring board 3 toward the space between adjacent connection electrodes 15A and 15A in row A so as not to contact the connection electrode 15A of the dummy channel 12A, and is electrically connected to the connection electrodes 15A and 15A. It extends to the end portion 3a so as to be parallel to the wiring electrodes 33A and 33A.
  • the wiring electrodes 33B 1 whose one end is connected to the connection electrode 15B and the electrically driven channel 11B of row B, the other end is positioned between the through holes 32A, 32A of the A column from a connection portion between said connection electrode 15B on the opening 120A of the dummy channels 12A of the a column, after passing through the opening upper 120A so as to cover a portion to the wiring electrodes 33B 2 faces the edge portion 121a which is overlaying edges on 121b, the dummy so as not to contact with the connection electrodes 15A of the channel 12A, bent to the connection electrodes 15A of adjacent a column, and the wiring electrodes 33B 2 on the surface of the wiring board 3 toward between 15A opposite the connection electrodes 15A, It extends to the end 3a so as to be parallel to the wiring electrodes 33A and 33A electrically connected to 15A.
  • edges 121a and 121b of the opening 120A of the dummy channel 12A are drive electrodes formed on the opposing drive wall 13 among the four edges forming the periphery of the opening 120A of the dummy channel 12A.
  • 14 is the edge portion on the opening side.
  • the wiring electrodes 33B 1 and 33B 2 corresponding to the B-row channel row adjacent to the A-row channel row located on the outermost side of the head chip 1 are arranged.
  • the through holes 32A and 32A in the A row not only in the space on the drive walls 13A and 13A in the A row on the rear surface 1b of the head chip 1, but also in the opening 120A of the dummy channel 12A from this space
  • a part protrudes by the amount of protrusion c.
  • the wiring electrodes 33B 1 and 33B 2 are arranged so as to partially overlap the edges 121a and 121b of the opening 120A of the dummy channel 12A when viewed in the ink ejection direction (from the top to the bottom in FIG. 4). Has been.
  • these wiring electrodes 33B 1 and 33B 2 are both formed in close contact with the surface of the wiring substrate 3, they are not in contact with the opening 120A of the dummy channel 12A, that is, the rear surface 1b of the head chip 1. Since the gap S corresponding to the thickness of the connection electrodes 15A and 15B + the thickness of the wiring electrodes 33A and 33B is formed between the head chip 1 and the wiring board 3, as shown in FIGS. The surfaces of the wiring electrodes 33B 1 and 33B 2 are separated from the rear surface 1b of the head chip 1 by a distance corresponding to the thickness of the connection electrodes 15A and 15B at a portion other than the connection portion with the connection electrode 15B.
  • the surface of the wiring electrodes 33B 1 and 33B 2 and the rear surface 1b of the head chip 1 are insulated by being filled with the adhesive 50. Therefore, even if the wiring electrodes 33B 1 and 33B 2 are arranged so as to overlap the opening 120A, the wiring electrodes 33B 1 and 33B 2 do not come into contact with the driving electrode 14 exposed in the opening 120A, and there is a risk of crosstalk or short circuit. Absent.
  • the wiring space of the wiring electrodes 33B 1 and 33B 2 is not limited to the space corresponding to the thickness of the drive wall 13A, and a wide area extending between the through holes 32A and 32A can be used. Therefore, the wiring electrodes 33B 1 33B 2 can be formed wide. Therefore, an increase in the electrical resistance of the wiring electrodes 33B 1 and 33B 2 can be suppressed.
  • the wiring electrodes 33B 1 and 33B 2 passing over the opening 120A of the dummy channel 12A in the A column are wired so as to overlap the opening 120A of the dummy channel 12A, and then connected to the dummy channel 12A. It is bent so as to avoid the portion of the connection electrode 15A so as not to contact 15A, and is parallel to the wiring electrode 33A at the end 3a of the wiring board 3.
  • the head chip 1 is exemplified as having two channel rows of A row and B row, but the number of channel rows may be three or more.
  • an ink jet head using a head chip 1 ′ having three channel rows of A row, B row and C row will be described.
  • FIG. 6 is a partial rear view of the state in which the wiring board 3 ′ is bonded to the rear surface 1b of the head chip 1 ′ as viewed from the back side of the wiring board 3 ′
  • FIG. 7 is (vii)-(vii) in FIG. FIG.
  • the channel rows A and B have the same configuration as that of the head chip 1 including the two channel rows described above, and thus the description thereof is omitted here.
  • 3 and 4 are parts having the same configuration, and detailed description thereof is omitted.
  • the C columns are arranged such that the arrangement pitch of the drive channels 11C and the dummy channels 12C is the same as the arrangement pitch of the drive channels 11A and the dummy channels 12A of the A columns.
  • two wiring electrodes 33C that pass between adjacent through holes 32B, 32B in the B row of the wiring board 3 ′ that is, wiring that is electrically connected to the connection electrode 15C of the drive channel 11C in the C row.
  • the electrode 33C 1 and the wiring electrode 33C 2 electrically connected to the connection electrode 15C of the dummy channel 12C in the C row pass so as to overlap with the opening 120B of the dummy channel 12B in the B row, and are described above. It has the same configuration as the wiring electrodes 33B 1 and 33B 2 that pass between the through holes 32A and 32A in the A row in the embodiment of the two channel rows. In this case, A in the code is read as B, and B is read as C.
  • the wiring electrodes 33B 1 and 33B 2 that are electrically connected to the connection electrodes 15B in the B row, and the wiring electrodes that are electrically connected to the connection electrodes 15C in the C row are arranged.
  • the wiring electrodes 33B 1 and 33C 1 located on the inner side of the opening 120A are overlapped with the openings 120A of the dummy channels 12A in the A row when viewed from the ink discharge direction.
  • the wiring electrodes 33B 2 and 33C 2 located on the outer side are respectively disposed within the thickness range of the drive wall 13A.
  • Each of the wiring electrodes 33B 1 , 33B 2 , 33C 1 , 33C 2 is not in contact with the rear surface 1b of the head chip 1, and the adhesive 50 is filled between the rear surfaces 1b.
  • the head chip 1 having two channel rows shown in FIGS. 1 to 5 is configured so that the lead-out directions of the wiring electrodes 33A and 33B on the surface of the wiring board 3 are on both ends with the head chip interposed therebetween.
  • the two head chips 1 can be arranged in parallel to form a head chip having four channel rows.
  • a head chip having six channel rows can be similarly formed.
  • the drive wall thickness is 59 ⁇ m
  • the channel width is 82 ⁇ m
  • the through hole width is 102 ⁇ m.
  • the distance a1 between the wiring electrode and the adjacent through hole, and the opening between the wiring electrode and the dummy channel In this case, the width of each wiring electrode is 9 ⁇ m at the maximum. Wiring with a width of 20 ⁇ m or less is highly difficult to manufacture, and even if it can be manufactured, the wiring thickness must be reduced in proportion to the wiring width. It is expected to adversely affect the ink ejection.
  • the channel density up to about 120 dpi is the limit as shown in Table 1.
  • the width of the wiring electrode can be a maximum of 46 ⁇ m, and 1/3 of the distance b in FIG. The width that can be passed.
  • a distance b of 1/7 can pass through the wiring electrode, and can be realized if the channel density is 180 dpi.
  • Head chip 1a Front surface 1b: Rear surface 1c: Edges 11A, 11B, 11C: Drive channels 12A, 12B, 12C: Dummy channels 120A, 120B: Openings 121a, 121b: Edges 13A, 13B: Drive walls 14: driving electrodes 15A, 15B: connection electrode 2: nozzle plate 21: nozzle 3,3 ': wiring board 3a: end 31: junction regions 32A, 32B, 32C: through holes 33A, 33B, 33B 1, 33B 2 , 33C 1 , 33C 2 : Wiring electrode 4: FPC 50: Adhesive

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  • Coating Apparatus (AREA)

Abstract

La présente invention concerne une tête à jet d'encre qui permet de disposer des électrodes de câblage à haute densité et qui peut facilement prendre en charge une densité accrue de canaux. Une tête à jet d'encre selon l'invention comporte une pastille (1) de tête dans laquelle sont disposés alternativement des canaux d'actionnement et des canaux inertes, ainsi qu'un substrat (3) de câblage, et est caractérisée en ce que, dans le substrat (3) de câblage, des trous débouchants servant à amener de l'encre ne sont formés qu'aux positions correspondant aux ouvertures des canaux d'actionnement, en ce qu'au moins une électrode de câblage passe entre des trous débouchants adjacents dans au moins une rangée de trous débouchants parmi une pluralité de rangées de trous débouchants correspondant à des rangées de canaux et s'étend jusqu'à une extrémité du substrat de câblage dépassant latéralement de la pastille de tête, et en ce qu'au moins une électrode de câblage passant entre les trous débouchants n'est pas en contact avec une ouverture du canal inerte et chevauche l'ouverture du canal inerte lorsqu'elle est vue depuis une direction d'éjection de l'encre.
PCT/JP2012/060716 2011-04-22 2012-04-20 Tête à jet d'encre Ceased WO2012144597A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP12774310.2A EP2700506B1 (fr) 2011-04-22 2012-04-20 Tête à jet d'encre
JP2013511055A JP5846201B2 (ja) 2011-04-22 2012-04-20 インクジェットヘッド

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-096615 2011-04-22
JP2011096615 2011-04-22

Publications (1)

Publication Number Publication Date
WO2012144597A1 true WO2012144597A1 (fr) 2012-10-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/060716 Ceased WO2012144597A1 (fr) 2011-04-22 2012-04-20 Tête à jet d'encre

Country Status (3)

Country Link
EP (1) EP2700506B1 (fr)
JP (1) JP5846201B2 (fr)
WO (1) WO2012144597A1 (fr)

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GB2508082A (en) * 2012-09-24 2014-05-21 Sii Printek Inc Piezoelectric liquid jet head comprising first and second nozzle rows
CN103832073A (zh) * 2012-11-22 2014-06-04 精工电子打印科技有限公司 液体喷射头、液体喷射装置以及液体喷射头的制造方法
GB2509584A (en) * 2012-11-05 2014-07-09 Sii Printek Inc Liquid jet head having ejection and non-ejection grooves
JP2014128940A (ja) * 2012-12-28 2014-07-10 Konica Minolta Inc インクジェットヘッド及びインクジェットヘッドの製造方法
JP2014128950A (ja) * 2012-12-28 2014-07-10 Sii Printek Inc ヘッドチップ、ヘッドチップの製造方法、液体噴射ヘッド、液体噴射装置
EP2829404A1 (fr) * 2013-07-24 2015-01-28 SII Printek Inc Tête à jet liquide, appareil d'éjection de liquide et procédé de fabrication de la tête à jet liquide

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GB2508082A (en) * 2012-09-24 2014-05-21 Sii Printek Inc Piezoelectric liquid jet head comprising first and second nozzle rows
GB2509584A (en) * 2012-11-05 2014-07-09 Sii Printek Inc Liquid jet head having ejection and non-ejection grooves
US9352565B2 (en) 2012-11-05 2016-05-31 Sii Printek Inc. Liquid jet head and liquid jet apparatus
GB2509584B (en) * 2012-11-05 2019-10-02 Sii Printek Inc Liquid jet head and liquid jet apparatus
CN103832073A (zh) * 2012-11-22 2014-06-04 精工电子打印科技有限公司 液体喷射头、液体喷射装置以及液体喷射头的制造方法
GB2510039A (en) * 2012-11-22 2014-07-23 Sii Printek Inc Liquid jet head having ejection and non-ejection grooves
US8944571B2 (en) 2012-11-22 2015-02-03 Sii Printek Inc. Liquid jet head, liquid jet apparatus and method of manufacturing liquid jet head
CN103832073B (zh) * 2012-11-22 2017-03-01 精工电子打印科技有限公司 液体喷射头、液体喷射装置以及液体喷射头的制造方法
JP2014128940A (ja) * 2012-12-28 2014-07-10 Konica Minolta Inc インクジェットヘッド及びインクジェットヘッドの製造方法
JP2014128950A (ja) * 2012-12-28 2014-07-10 Sii Printek Inc ヘッドチップ、ヘッドチップの製造方法、液体噴射ヘッド、液体噴射装置
EP2829404A1 (fr) * 2013-07-24 2015-01-28 SII Printek Inc Tête à jet liquide, appareil d'éjection de liquide et procédé de fabrication de la tête à jet liquide
US9221254B2 (en) 2013-07-24 2015-12-29 Sii Printek Inc. Liquid jet head, liquid jet apparatus and method of manufacturing liquid jet head

Also Published As

Publication number Publication date
EP2700506B1 (fr) 2017-07-19
EP2700506A4 (fr) 2015-07-22
JP5846201B2 (ja) 2016-01-20
JPWO2012144597A1 (ja) 2014-07-28
EP2700506A1 (fr) 2014-02-26

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