WO2012148117A2 - Appareil de retrait de film mince sélectif utilisant des faisceaux laser divisés - Google Patents

Appareil de retrait de film mince sélectif utilisant des faisceaux laser divisés Download PDF

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Publication number
WO2012148117A2
WO2012148117A2 PCT/KR2012/002928 KR2012002928W WO2012148117A2 WO 2012148117 A2 WO2012148117 A2 WO 2012148117A2 KR 2012002928 W KR2012002928 W KR 2012002928W WO 2012148117 A2 WO2012148117 A2 WO 2012148117A2
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WO
WIPO (PCT)
Prior art keywords
thin film
head
laser
split beam
film removal
Prior art date
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Ceased
Application number
PCT/KR2012/002928
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English (en)
Korean (ko)
Other versions
WO2012148117A3 (fr
Inventor
김수찬
이시영
이찬구
배현섭
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WI A Corp
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WI A Corp
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Publication of WO2012148117A2 publication Critical patent/WO2012148117A2/fr
Publication of WO2012148117A3 publication Critical patent/WO2012148117A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Definitions

  • the present invention relates to a selective thin film removing apparatus using a laser split beam, and more particularly, to a thin film removing apparatus that can increase productivity by selectively removing a thin film by independently controlling a plurality of divided laser beams.
  • Pattern formation and removal of thin films is generally carried out by photo lithography processes to coat, expose and develop photo resist. , Through wet or dry etching and stripping.
  • photolithography processes to coat, expose and develop photo resist.
  • wet or dry etching and stripping Through wet or dry etching and stripping.
  • Thin film removal technology is developing.
  • thin film removal techniques using a diode pumped solid state (DPSS) laser mainly use 1064nm, 532nm, and 355nm which can output high power.
  • DPSS diode pumped solid state
  • the laser is transmitted to the lower layer during the removal of the thin film, thereby limiting the selective patterning and damaging a part of the lower layer so that it cannot be used for circuit formation.
  • the present invention has been made to solve the above-mentioned problems, and to provide a selective thin film removing apparatus using a laser split beam that can remove only the thin film to be removed and have only a minimum allowable effect on the lower layer.
  • the present invention is to provide a selective thin film removal apparatus using a laser split beam that can be processed for a substrate of various sizes and shapes to increase the productivity.
  • a thin film removing apparatus comprising: a beam generator configured to generate an excimer laser beam having a deep UV wavelength, at least two head parts configured to split the laser beam, and outputting a split beam; And a head support part for allowing the linear movement of the head, a stage positioned under the head part and capable of position movement on a plane, and a head driving part for moving each head part independently on the head support part and positioning the head part.
  • the head portion includes a beam shutter that enables on and off of the split beam.
  • the thin film removing apparatus may include one or more of the following embodiments.
  • the head unit may include a beam homogenizer for improving the uniformity of the split beam at the upper end of the object to be processed, and a projection lens unit for reducing the split beam at the upper part of the object to be processed.
  • the laser beam may correspond to an excimer laser having a wavelength of any one of 157 nm, 193 nm, 248 nm or 308 nm, which excimer laser serves to prevent damage to the underlying layer as much as possible.
  • the beam shutter may include a beam dump to prevent external reflection of the split beam.
  • the head unit may be provided with an energy meter for measuring the energy of the split beam, and an attenuator for correcting the energy of the split beam. Therefore, when an energy difference between each split beam occurs, the energy can be uniformed after measuring the difference.
  • the head unit may adjust the DOF of the split beam transmitted to the processing area so as to prepare for a change in thickness of the object to be processed.
  • the head unit may include a beam adjuster for adjusting the size of the split beam.
  • the beam adjuster may be any one of a metal mask, a ceramic mask, and a photo mask.
  • Nitrogen is injected into the head to protect the lens system.
  • the thin film removing apparatus may include a beam profiler capable of identifying the shape of the split beam.
  • the head unit may be provided with a cleaning unit that blows air to adsorb the vacuum to remove the foreign matter.
  • the thin film removing apparatus may include a telescope unit that changes the shape of the laser beam or the split beam and generates parallel light.
  • the thin film removing apparatus may include a vision camera or a line scan camera capable of checking the state of the removed thin film.
  • the stage is provided with a mirror bar and an interferometer, and the distortion of the stage can be corrected by the mirror bar and the interferometer.
  • the stage may be supported by the air bearing to be movable.
  • the present invention can provide a selective thin film removing apparatus using a laser split beam that can remove only the thin film to be removed and have only an acceptable minimum effect on the lower layer.
  • the present invention can provide a selective thin film removal apparatus using a high-productivity laser split beam is possible to process a substrate of various sizes and shapes.
  • FIG. 1 is a perspective view of a thin film removing apparatus using a laser split beam according to an embodiment of the present invention.
  • FIG. 2 is a plan view of the thin film removing apparatus illustrated in FIG. 1.
  • FIG. 3 is a front view of the thin film removing apparatus illustrated in FIG. 1.
  • FIG. 4 is a block diagram illustrating an internal configuration of the thin film removing device illustrated in FIG. 1.
  • FIG. 5 is a block diagram illustrating an internal configuration of a thin film removing apparatus according to another embodiment of the present invention.
  • FIG. 6 is a perspective view illustrating a state in which a head portion of a thin film removing device is processed on a workpiece.
  • FIG. 1 is a perspective view of a thin film removing apparatus 100 using a split laser beam according to an embodiment of the present invention
  • Figures 2 and 3 are a plan view and a front view of the thin film removing apparatus 100 illustrated in FIG. to be.
  • 4 is a block diagram of an internal configuration of the thin film removing apparatus 100 illustrated in FIG. 1.
  • the thin film removing apparatus 100 may include a beam generation unit 110 that generates an excimer laser beam having a deep UV wavelength, and a laser beam is divided into a plurality of split beams. Fixing the two or more head portion 140 to irradiate the processing area, the head support portion 150 to allow the head portion 140 to move linearly in the upper portion of the object to be processed 220, and the object to be processed 220 A stage 160, a stage driver 162 that enables movement of the stage 160, and a head driver 180 that moves and positions the head 140 independently on the head support 150. .
  • the optical unit 210 provided on the side of the head support 150 is provided with an attenuator 112, a main beam shutter 114, and a telescope unit 116.
  • the optical unit 210 includes a beam generator. It is connected with (110).
  • the beam generator 110 generates an excimer laser beam having a deep UV wavelength.
  • the wavelength of the laser beam generated by the beam generator 110 may be any one of 157 nm, 193 nm, 248 nm or 308 nm.
  • the thin film removing apparatus 100 selectively removes the thin film on the object 200 using an excimer laser having such a wavelength.
  • the energy required to remove the general thin film is 0.05 ⁇ 0.3J / cm2
  • the laser beam generated by the beam generator 110 passes through the optical unit 210 and then branches while passing through each head 140 to generate a branch beam.
  • a plurality of head parts 140 are provided on the horizontal part 152 of the head support part 150, and inside the attenuator 122, the beam shutter 124, the beam homogenizer 126, and the projection unit 128. And a cleaning unit 130.
  • the head 140 is moved independently by the head driving unit 180 to match the output position of the split beam and the position of the processing area.
  • the head driving part 180 causes the head part 140 to linearly move on the head support part 150.
  • the head driving unit 180 is composed of an LM rail, a linear motor, or a stepping motor (not shown) positioned on the head support unit 150, and a linear encoder (linear) to improve movement accuracy.
  • the scale of the encoder can be recognized and precisely controlled. In addition, the precision can be improved by using an air bearing LM.
  • the head support part 150 has a gantry shape, and includes a horizontal part 152 corresponding to a horizontal beam and a support extending from both ends of the horizontal part 152.
  • the stage 160 is provided below the head support part 150.
  • a plurality of head parts 140 are positioned on the horizontal part 152 of the head support part 150 to be movable.
  • the stage 160 fixes the workpiece 220, and the stage driver 162 allows the xy axis to move and rotate.
  • the stage 160 may be manufactured in the form of a general metal or casting, and may include a granite plate made of granite material to prevent deformation and improve precision.
  • a mirror bar and an interferometer may be provided at a side surface thereof.
  • the stage driving unit 162 is an air bearing type and can be driven using a linear motor, a stepping motor, or a servo motor, and in order to precisely control the position by recognizing the scale of the linear encoder in order to increase the accuracy of the movement. have.
  • An attenuator 112, a main beam shutter 114, and a telescope unit 116 are provided inside the optical unit 210.
  • the laser beam output from the beam generator 110 sequentially passes through the attenuator 112, the main beam shutter 114, and the telescope unit 116.
  • the attenuator 112 adjusts the energy of the laser beam output from the beam generator 110 to a desired value.
  • the main beam shutter 114 blocks the laser beam so that the laser beam is not transmitted to the head 140.
  • the telescope unit 116 serves to convert the rectangular laser beam into a square shape and parallel light.
  • the laser beam from the optical unit 210 is 100% reflected by the mirror 118 is transmitted to each head portion 140.
  • Mirror 118 is formed by fused silica and a reflective coating adapted to the wavelength.
  • the beam splitters 120 and 132, the attenuator 122, the beam shutter 124, the beam homogenizer 126, the projection unit 128 and the cleaning unit 130 are sequentially formed. It is provided with.
  • the beam splitters 120 and 132 serve to branch the laser beams reflected by the mirror 118 while being located at the respective head portions 140.
  • the head unit 140 located farthest from the mirror 118 is not provided with the beam splitters 120 and 132, but has a mirror 118. 1 to 4 illustrate a thin film removing apparatus 100 having three head portions 140.
  • the beam splitter 120 positioned in the first head portion 140 is formed by the incident laser beam. It transmits 67% and reflects the remaining 33%.
  • the beam splitter 132 positioned in the second head 140 transmits only 50% of incident light and reflects the rest. Due to the configuration of the beam splitters 120 and 132, laser beams having almost the same energy can be used for the three head parts 140.
  • the split beams passing through the beam splitters 120 and 132 or the mirror 136 are all uniformly adjusted in energy while passing through the attenuator 122.
  • the split beams having the same energy all arrive at the processing region 222.
  • the split beam passing through the attenuator 122 is allowed to pass through the beam shutter 124.
  • the beam shutter 124 serves to turn off the path of the split beam.
  • the beam shutter 124 has a path of the split beam coming from some head parts 140. By cutting off, the number of heads is adjusted corresponding to the machining area 222. For example, when the processing region 222 is divided into four and the number of the head 140 is three in the object 220, the beam shutter 124 located in one head 140 is operated to divide the beam. By blocking the path of the two heads 140 allows the four machining zones 222 to work sequentially.
  • the beam shutter 124 may include a beam dump to prevent the blocked split beam from being reflected to the outside.
  • the split beam passing through the beam shutter 124 passes through the beam homogenizer 126.
  • the beam homogenizer 126 improves the uniformity of the split beam, and is manufactured in the form of two or more fly eye lenses to uniformly shorten and shorten the split beam.
  • the beam split through the beam homogenizer 126 is sized to fit the size of the processing region 222.
  • a chromium mask, a metal mask, or a ceramic mask is used. (Not shown) is used to adjust the size of the split beam.
  • a beam adjuster (not shown) with a motor is used to automatically adjust the size of the beam as needed.
  • the split beam that has passed through the beam homogenizer 126 and the beam adjuster passes through the projection unit 128.
  • the projection unit 128 focuses energy before the split beam is incident on the processing region 222, and reduces the split beam by more than a 1: 1 ratio.
  • the projection unit 128 generally uses a 3: 1 or more lens, but in some cases, a 1: 1 optical system may be used as long as it does not affect the processing result in order to reduce the cost and size of the optical system.
  • the head unit 140 is equipped with an energy meter (not shown) in order to check the difference in the actual amount of energy of the split beam reaching the processing region 222 to grasp the energy of the divided split beam.
  • the controller 190 may uniformize the energy using the attenuator 122 when an energy difference occurs between the split beams.
  • the energy meter may use a power meter or a photo diode.
  • an auto focus unit (not shown) may be provided inside each head 140 to prepare a case where the height of the object 220 is not constant.
  • the auto focus unit enables the z-axis movement of the split beam.
  • the auto focus unit automatically adjusts the DOF (Depth Of Focus) of the split beam.
  • the head unit 140 may be provided with a beam profiler (not shown) for checking the shape of the beam.
  • the head unit 140 includes a vision camera or a surveillance camera (not shown) capable of measuring whether the removed thin film remains, the edge sharpness or the removed width of the thin film while removing the object 220. It may be provided.
  • a vision camera or surveillance camera may also be located on the stage 160 or the head support 150.
  • the cleaning unit 130 is provided at the bottom of the head 140.
  • the cleaning unit 130 has a function of spraying air and vacuum adsorbing the air to remove foreign substances generated in the process of removing the thin film. Since the cleaning unit 130 operates in conjunction with the beam shutter 124, the cleaning unit 130 does not operate when the split beam is blocked.
  • Nitrogen may be injected into the head 140 to protect the lens system.
  • the head part 140 and the head part 140 are connected to each other by the connection part 170. Since the connection part 170 has a flexible property, each head part 140 can move independently.
  • the optical unit 210 and the mirror unit 215 are also connected to each other by the connection unit 170.
  • the mirror 118 is provided inside the mirror unit 215.
  • FIG. 5 is a block diagram of a thin film removing apparatus according to another embodiment of the present invention.
  • the telescope unit 116 is not included in the optical unit 210, but the size of the laser beam according to distance due to divergence of the laser beam. Is changed so that the position and distance of the telescope unit 116 are adjusted to equally adjust the moving distance of the actual beam for each optical head for correction thereof. Accordingly, the laser beam is divided into three split beams by the beam splitters 120 and 132, and then passes through each telescope unit 116 through the reflecting mirror 118 through the respective mirror attenuators as many as the divided number. Will pass.
  • FIG. 6 is a perspective view illustrating a state in which a head portion of a thin film removing device is processed on a substrate.
  • the processing regions 222 of the object 220 are arranged in four columns on the x-axis and five rows on the y-axis.
  • the beam is irradiated.
  • two head parts 140 and 140 'are provided two rows in the y-axis direction can be simultaneously processed in the object to be processed 220.
  • the stage 160 moves in the y-axis direction so that each head 140, 140' It is located at the top of the next row.
  • the head portion 140 positioned on the right side is fixed in FIG. 6, the head portion 140 ′ positioned on the left side moves to the right side, or the stage 160 moves in the y axis direction. Moving to the left, the head 140 'is positioned at the top of the third row. At this time, the head unit 140 located on the right side blocks the split beam by operating the beam shutter 124.
  • the head unit 140 is automatically moved by a recipe to a position registered according to the position of the machining area 222.
  • the head unit 140 moves by a linear scale dimension from the origin position to determine the movement position, removes the thin film by operating the laser, and then uses inspection equipment such as a linear scan camera.
  • the edge and the removal state of the removed thin film are automatically inspected, and when the position correction is necessary as a result of the inspection, the position of the head 140 is corrected by the signal of the controller 190.
  • the stage 160 moves in the x-axis direction to remove the thin film, and after completing the process for one row, the stage 160 moves in the y-axis direction by the arrangement interval of the processing region 222.
  • Each head portion 140 is moved according to the arrangement position of the processing region 222 in the object 220, the interval between the head portion 140 may be widened or narrowed.
  • the stage 160 may move repeatedly several times, and the number of rows does not coincide with the number of the head parts 140.
  • a DD motor rotatable more than 270 degrees is used to adjust the processing area irrespective of the direction of the substrate coming upstream.
  • Items requiring recipe management include moving position values of the head unit 140 and position values for turning the beam shutter 124 on and off according to the arrangement and position of the processing area 222, and the upper portion of the stage 160. Adjusting the camera position movement value for checking the mark of the processed product to be mounted on, the movement position value of the branched head portion 140 mounted on the head support unit 150, the beam intensity of the attenuator 122 for adjusting the intensity of the beam Motor movement value, focus change of the head unit 140 and auto focus control position value, vision system camera position movement value, laser intensity and laser output repetition rate (frequency).

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

L'invention porte sur un appareil de retrait de film mince sélectif utilisant des faisceaux laser divisés. L'appareil de retrait de film mince selon la présente invention comprend : une unité de génération de faisceaux pour générer un faisceau laser à excimères d'une longueur d'onde des ultraviolets lointains ; deux ou plus de deux unités de tête pour délivrer en sortie des faisceaux divisés par division du faisceau laser ; une unité de support de tête pour permettre aux unités de tête de se déplacer linéairement à partir d'une partie supérieure d'une cible de traitement ; une platine qui est disposée à une partie inférieure de chaque unité de tête et qui peut être déplacée sur un plan ; et une unité d'entraînement de tête pour déplacer indépendamment chaque unité de tête à partir de l'unité de support de tête de façon à établir un emplacement de chaque unité de tête. De plus, l'unité de tête comprend : un obturateur de faisceau pour permettre le passage/l'interruption des faisceaux divisés ; un homogénéiseur de faisceau pour améliorer l'uniformité des faisceaux divisés à une extrémité supérieure de la cible de traitement ; et une unité de lentille de projection pour réduire les faisceaux divisés à une partie supérieure de la cible de traitement.
PCT/KR2012/002928 2011-04-25 2012-04-18 Appareil de retrait de film mince sélectif utilisant des faisceaux laser divisés Ceased WO2012148117A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110038392A KR20120120670A (ko) 2011-04-25 2011-04-25 레이저 분할빔을 이용한 선택적 박막 제거장치
KR10-2011-0038392 2011-04-25

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WO2012148117A2 true WO2012148117A2 (fr) 2012-11-01
WO2012148117A3 WO2012148117A3 (fr) 2013-01-03

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CN114453829A (zh) * 2021-06-30 2022-05-10 江西应用科技学院 一种多轴线及轴线可变零构件的快速成形方法及装置

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CN110883420B (zh) * 2019-12-24 2022-01-18 深圳市斯普莱特激光科技有限公司 一种高智能双激光头激光加工设备
CN114453829A (zh) * 2021-06-30 2022-05-10 江西应用科技学院 一种多轴线及轴线可变零构件的快速成形方法及装置

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