WO2012156102A3 - Netzmittel für elektrolytische anwendungen und dessen verwendung - Google Patents

Netzmittel für elektrolytische anwendungen und dessen verwendung Download PDF

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Publication number
WO2012156102A3
WO2012156102A3 PCT/EP2012/002151 EP2012002151W WO2012156102A3 WO 2012156102 A3 WO2012156102 A3 WO 2012156102A3 EP 2012002151 W EP2012002151 W EP 2012002151W WO 2012156102 A3 WO2012156102 A3 WO 2012156102A3
Authority
WO
WIPO (PCT)
Prior art keywords
wetting agent
application
electroplating
wetting
pfos
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/002151
Other languages
English (en)
French (fr)
Other versions
WO2012156102A2 (de
Inventor
Carsten MENDUS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anke & Co KG GmbH
Original Assignee
Anke & Co KG GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anke & Co KG GmbH filed Critical Anke & Co KG GmbH
Priority to CN201280035950.7A priority Critical patent/CN103687983A/zh
Priority to US14/118,666 priority patent/US20140107230A1/en
Priority to EP12728175.6A priority patent/EP2710171A2/de
Publication of WO2012156102A2 publication Critical patent/WO2012156102A2/de
Publication of WO2012156102A3 publication Critical patent/WO2012156102A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K23/00Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K23/00Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
    • C09K23/56Glucosides; Mucilage; Saponins
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38Chromatising
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/04Electroplating: Baths therefor from solutions of chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/22Electroplating: Baths therefor from solutions of zinc
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Die Erfindung betrifft ein Netzmittel sowie dessen Verwendung, wobei dieses umfasst. Das erfindungsgemäße Netzmittel für galvanische Anwendungen umfasst ein biologisch abbaubares Tensid, welches in einer Konzentration von 1:1 bis 1:10 in Wasser gelöst vorliegt und eine Schaumbildung während der galvanischen Anwendung ermöglicht, wobei der gebildete Schaum eine Stabilität aufweist, die eine verlangsamte Freisetzung des während der galvanischen Anwendung gebildeten Wasserstoffs ermöglicht. Das Netzmittel ist dabei abbaustabil und hat keinerlei Einfluss auf die galvanische Anwendung, sodass die mit der galvanischen Anwendung bearbeiteten Werkstücke durch den Einsatz des erfindungsgemäßen Netzmittels nicht beeinträchtigt werden. Zudem zeigt das erfindungsgemäße Netzmittel eine gute biologische Abbaubarkeit, sodass eine gesonderte Entsorgung des Netzmittels nach der Anwendung entfällt. Weiterhin liegt der Verbrauch des Netzmittels in vergleichbarem Ausmaß, wie bei der Verwendung PFOS-haltiger Netzmittel. Im Ergebnis wird mit dem erfindungsgemäßen Netzmittel eine einfache, umweltverträgliche und zugleich kostengünstige Alternative zu den bekannten PFOS-freien Netzmitteln bereitgestellt, wobei das erfindungsgemäße Netzmittel sich durch einen verringerten Verbrauch und durch seine chemische inerten Eigenschaften keinen Einfluss auf das Ergebnis der galvanischen Anwendung ausübt.
PCT/EP2012/002151 2011-05-19 2012-05-21 Netzmittel für elektrolytische anwendungen und dessen verwendung Ceased WO2012156102A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201280035950.7A CN103687983A (zh) 2011-05-19 2012-05-21 用于电解应用的润湿剂及其应用
US14/118,666 US20140107230A1 (en) 2011-05-19 2012-05-21 Wetting Agent for Electrolytic Applications and Use Thereof
EP12728175.6A EP2710171A2 (de) 2011-05-19 2012-05-21 Netzmittel für elektrolytische anwendungen und dessen verwendung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011102052A DE102011102052A1 (de) 2011-05-19 2011-05-19 Netzmittel für elektrolytische Anwendung und dessen Verwendung
DE102011102052.0 2011-05-19

Publications (2)

Publication Number Publication Date
WO2012156102A2 WO2012156102A2 (de) 2012-11-22
WO2012156102A3 true WO2012156102A3 (de) 2013-06-20

Family

ID=46319682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/002151 Ceased WO2012156102A2 (de) 2011-05-19 2012-05-21 Netzmittel für elektrolytische anwendungen und dessen verwendung

Country Status (5)

Country Link
US (1) US20140107230A1 (de)
EP (1) EP2710171A2 (de)
CN (1) CN103687983A (de)
DE (1) DE102011102052A1 (de)
WO (1) WO2012156102A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016001317A1 (en) * 2014-07-04 2016-01-07 Basf Se Additive for alkaline zinc plating
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
DE102015002008A1 (de) * 2015-02-20 2016-08-25 Dräger Safety AG & Co. KGaA Elektrochemischer Gassensor und Elektrolyt für einen elektrochemischen Gassensor
US10718060B2 (en) 2015-06-25 2020-07-21 Basf Se Additive for alkaline zinc plating
CN105018979A (zh) * 2015-08-24 2015-11-04 苏州昕皓新材料科技有限公司 一种山梨醇酐棕榈酸酯的应用
CN105463523A (zh) * 2015-12-23 2016-04-06 苏州市金星工艺镀饰有限公司 抑制镀层锡须生长的电镀液及其应用
CN110947338B (zh) * 2019-12-09 2021-10-12 南京科技职业学院 一种烷基糖苷磺基甜菜碱型两性表面活性剂及其制备方法
CN113818056B (zh) * 2021-09-18 2023-05-26 中国航发北京航空材料研究院 一种亚氨基二琥珀酸无氰镀银工艺添加剂及使用方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
DE102005006982A1 (de) * 2005-02-15 2006-08-17 Basf Ag Verwendung nichtionischer Tenside bei der Metallgewinnung durch Elektrolyse
US20100125095A1 (en) * 2008-11-20 2010-05-20 Ioana Annis Biocidal composition of 2,6-dimethyl-m-dioxane-4-ol acetate and methods of use

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US3772269A (en) 1969-07-24 1973-11-13 Ici America Inc Glycoside compositions and process for the preparation thereof
US3839318A (en) * 1970-09-27 1974-10-01 Rohm & Haas Process for preparation of alkyl glucosides and alkyl oligosaccharides
DE2508708C2 (de) 1975-02-28 1982-07-01 Bayer Ag, 5090 Leverkusen Elektrolytlösungen auf Cr (VI)-Basis zur galvanischen Abscheidung von Chromschichten
DE3723826A1 (de) 1987-07-18 1989-01-26 Henkel Kgaa Verfahren zur herstellung von alkylglykosiden
JPH0229468A (ja) * 1988-07-19 1990-01-31 Kansai Paint Co Ltd カチオン性電着塗料組成物
DE3827534A1 (de) 1988-08-13 1990-02-22 Henkel Kgaa Verfahren zur herstellung von alkylglucosidverbindungen aus oligo- und/oder polysacchariden
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US20100125095A1 (en) * 2008-11-20 2010-05-20 Ioana Annis Biocidal composition of 2,6-dimethyl-m-dioxane-4-ol acetate and methods of use

Also Published As

Publication number Publication date
US20140107230A1 (en) 2014-04-17
EP2710171A2 (de) 2014-03-26
DE102011102052A1 (de) 2012-11-22
WO2012156102A2 (de) 2012-11-22
CN103687983A (zh) 2014-03-26

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