WO2012171680A2 - Module de photopile et procédé de fabrication dudit module de photopile - Google Patents

Module de photopile et procédé de fabrication dudit module de photopile Download PDF

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Publication number
WO2012171680A2
WO2012171680A2 PCT/EP2012/057101 EP2012057101W WO2012171680A2 WO 2012171680 A2 WO2012171680 A2 WO 2012171680A2 EP 2012057101 W EP2012057101 W EP 2012057101W WO 2012171680 A2 WO2012171680 A2 WO 2012171680A2
Authority
WO
WIPO (PCT)
Prior art keywords
solar cell
solar cells
stack
conductive
cell module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/057101
Other languages
German (de)
English (en)
Other versions
WO2012171680A3 (fr
Inventor
Ulrich Schaaf
Andreas Kugler
Patrick Zerrer
Martin Zippel
Patrick Stihler
Metin Koyuncu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2012171680A2 publication Critical patent/WO2012171680A2/fr
Publication of WO2012171680A3 publication Critical patent/WO2012171680A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/908—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells for back-contact photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/804—Materials of encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention relates to a solar cell module and method for its production.
  • Solar cell modules based on semiconductors which are known from the prior art consist of an entirety of solar cells. In these, an electric voltage is generated under the action of an external light incidence.
  • the solar cells are appropriately interconnected in order to be able to tap the highest possible current intensity from the solar cell module. For a contacting of the solar cells and a proper wiring within the solar cell module is necessary.
  • bands or strings are used for routing, band-shaped conductor sections made of metal, in particular copper.
  • these are guided from an upper photoactive side of a solar cell to a light-remote rear side of an adjacent solar cell.
  • the contacting between a ribbon and the solar cells connected thereto is usually carried out by means of a soft solder connection.
  • solder connection At the contact points between the ribbon and the solar cell are located on the solar cells metallized contact areas on which the solder joint is made.
  • solar cell modules with back-contacted solar cells and processes for their production of a solar cell module with back-contacted solar cells are described in which a film-like nonconductive support with an electrically conductive coating is used instead of individual ribbons.
  • the conductive coating is located on the surface of the carrier facing away from the solar cell rear sides and is connected to contact openings of the solar cells via openings filled with contacting material.
  • the invention provides a solar cell module with the features of claim 1 and a method for producing such having the features of claim 8.
  • an interconnection carrier substrate comprising sections of conductive layers and electrically contacted with the solar cells is provided with an electrically insulating support layer or a stack of such support substrates with a plurality of electrically insulating support layers and a plurality of conductive layers isolated from one another by the support layers / which is laid with insulation spacers and / or an insulating layer to the solar cell back sides.
  • at least part of contact sections for contacting the solar cells and / or for locally connecting a plurality of conductive layers of the stack to one another are filled with a conductive paste or ink which is compatible with the material of the or each conductive layer, filled through holes or blind holes in the interconnection carrier substrate or formed the stack.
  • the conductive paste or ink has a finely divided, highly conductive filler, in particular nanoparticles and / or a sintered material. More specifically, the conductive paste or ink has a copper or aluminum directly contacting and corrosive-free or corrosive free or contaminant adhesive.
  • a conductive solidified state of the conductive paste or ink introduced into the through or blind holes is present in the finished solar module.
  • To convert the paste or ink-like initial state into the solidified final state it is possible to resort to proven drying or crosslinking technologies, from simple air drying to the various possibilities of radiation-induced or chemically initiated curing or crosslinking in suitable components of the starting material.
  • locally insulating plastic covers are provided on the surface of the base layer facing away from the solar cells or of the outermost base layer of the stack at the location of the contact sections.
  • the initial state of the insulating plastic fabric covers may be pasty, and the manufacturing process comprises a step of curing or crosslinking of this plastic paste.
  • the support layer is made of optionally fiber-reinforced material, in particular plastic.
  • the interconnection carrier substrate is formed as a double-sided copper-clad plastic film.
  • the contact sections for contacting the solar cells and / or for local connection of the two conductive layers is formed together by prefabricated through holes provided with a conductive filling or lining in the interconnection carrier substrate.
  • the openings in the interconnection carrier substrate with suitable conductive filling or lining are already present before the beginning of the assembly process of the solar cell module and are only suitably positioned as contact connections, which of course shortens and simplifies the process sequence.
  • interconnection carrier substrate instead of discrete conductor strips offers the possibility of a simplified integration of electronic components which are typically present in a solar cell module in addition to the solar cells. These are then preferably placed directly on the interconnection carrier substrate and electrically connected.
  • the process of the invention comprises the following steps:
  • the contacting of the conductive layers with each other can also be done in advance and, for example, galvanically.
  • the provision of the prefabricated interconnection carrier substrate has an upstream structuring of at least one of the two conductive layers.
  • a further embodiment provides that the provision of the prefabricated interconnection carrier substrate has an upstream generation of apertures extending between the two conductive layers and their filling or lining with a conductive material. Both allow a shift otherwise steps to be classified in the assembly process in the supplier sphere and simplifies and shortens the process flow at the producer of the solar cell modules. It is understood that both embodiments may also be combined with specific structuring and / or contacting steps, which are classified in the assembly process and with which specific configuration requirements are met.
  • this step may comprise laminating the solar cells with insulating films, in particular EVA or silicone films. More particularly, the step of laminating with insulating films comprises simultaneous fixing on a glass plate as a mechanical support of the solar cell module.
  • the provision of an insulating film or application of an insulating layer comprises providing the same with recesses at the location of contact sections for contacting the solar cells. This can be done by providing a correspondingly preconfigured insulating or laminating film (possibly in the form of individual strips) and / or by timely structuring of same in the assembly process, ie immediately prior to placement of the solar cells on the interconnection carrier substrate, or even after placement and Lamination done.
  • the invention has the significant advantage of realizing different interconnection concepts of the solar cells in a solar cell module, such as a parallel and coupled serial interconnection of cells, as well as additional functions within the interconnection, eg. As securing the cell by bypass diodes, easy and flexible to implement. Further advantages are:
  • FIG. 1 is a schematic diagram for illustrating aspects of
  • FIG. 2A and 2B a schematic circuit layout and a detailed view of an embodiment of the invention
  • FIG. 1 shows in a synoptic representation, which serve only to illustrate aspects of the invention and is not intended to represent a circuit configuration relevant to practice and otherwise is not to scale
  • a section of a solar cell module 1 of solar cells 3 with a first and second EVA film 5a, 5b are laminated and arranged on a glass carrier 7.
  • the glass carrier facing surfaces of the solar cells are the photoactive surfaces (front sides), and on the opposite surfaces (backs) terminal contacts 9 for interconnecting the solar cell 3 are arranged.
  • This interconnection is accomplished by a stack 11 of two interconnection carrier substrates, which is arranged on the rear sides of the solar cells.
  • the stack 11 comprises, as electrically insulating support layers, in each case a plastic film 13a, 13b and structured conductive layers arranged thereon
  • each contact points 19 are formed by filling a conductive paste or ink and subsequent drying or curing, via one of the two conductive layers 17a, 17b selected contacts connect different solar cell 3 with each other or even can connect only one compound of the two conductive layers together.
  • the contact points 19 are covered with plastic caps 23, which are formed by local application and subsequent curing or crosslinking of a plastic paste.
  • connection points which connections are ultimately formed electrically effective results in the embodiment shown here from the concrete conductor structure of the two conductive layers.
  • the figure is intended to illustrate that the two left contact points establish a connection of the respectively left connection contacts of the left and middle solar cell 3 via the conductive layer 17b, while the second conductive layer 17a (also contacted by the contact points in question) is interrupted between the contact points and thus is not connected effectively.
  • the two right-hand contact points are electrically connected to the conductive layer 17a, and through these, the right-hand terminal of the center solar cell and the left-hand terminal of the right solar cell are connected to each other, while the existing electrical contact of said points with the other conductive layer 17b remains ineffective because it is interrupted between the contact points.
  • a prefabricated through hole 21 which is provided with a (for example, galvanically generated) conductive lining 21a.
  • the conductive liner 21a interconnects the two conductive layers 17a, 17b, but is not associated with a solar panel. Contact.
  • this may be different in the practical implementation of a desired circuit configuration.
  • blind holes can also be arranged in the interconnection carrier substrate which, from the outset, only permit contacting of one of the two conductive layers.
  • contact points can also be formed in openings provided with prefabricated lining of the interconnection carrier substrate.
  • FIGS. 2A and 2B show a first sub-array 1a and a second sub-array 1b of solar cells 3 arranged in matrix form in each case, wherein the two sub-arrays are formed by first connecting lines 4a and second crossing one another
  • Connecting lines 4b are interconnected.
  • bypass diodes 6 are directly integrated.
  • other electronic components or circuits for example logic modules, to be inserted into the interconnection using a multilevel carrier substrate.
  • FIG. 2B schematically shows, such an interconnection may be advantageously formed using the invention by approximately (recourse to the representation and notation in FIG. 1) the first and second interconnect lines being formed by the interconnect carrier substrate 11.
  • both groups of connecting lines extend here on its upper side, that is to say in a suitably structured conductive layer 17a.
  • a "bridge" 8 is provided over a section of the lower conductive layer 17b and two contact layers. points 19.1, 19.2 formed.
  • 3A schematically shows a starting material 11 '' of a simple interconnection carrier substrate 11 'which can be used in a simplified assembly configuration, such as that shown in Fig. 1, instead of the carrier substrate stack 11.
  • the raw material 11'' consists of a A film of an insulating plastic film 13a and a Cu film 17a, which is applied by lamination or pressing on the surface of the support layer.
  • Lamination or compression can be done in blanks, such as. B. known from printed circuit board technology, or in a roll-to-roll process, as z. B. is used in the production of endless flex circuits.
  • a structuring of the conductive layer 17a is carried out, whereby the ready-to-use interconnection carrier substrate 11 'is produced; see. Fig. 3B.
  • the wiring supporting substrate 11, the solar cells 3, the laminating sheets 5a, 5b, and the glass substrate 7 are assembled to form a solar cell module
  • FIG. 3D shows the assembled state of the layer stack, which is achieved with known production processes for solar cell modules using elevated temperature and vacuum steps.
  • Via openings (vias) through the interconnection carrier substrate 11 are formed at the location of selected connection contacts of the solar cells 3, for example by means of laser drilling techniques.
  • the vias are then filled with a conductive paste or ink, for example by means of a coordinate-controlled dispenser or else using an ink-jet printing device, and this is, for example using IR or UV radiation and / or a chemical curing initiator, solidified.
  • This is then still electrically isolated with a similar to the conductive paste or ink applied plastic cap 23 'and protected against environmental influences (corrosion).
  • the result is the state shown in Fig. 3E of the assembled and interconnected solar cell module. 1

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un module de photopile doté d'une pluralité de photopiles disposées sur un support mécanique et branchées dans une configuration de circuit prédéfinie par l'intermédiaire de cavaliers s'étendant sur les faces arrière des photopiles. Un substrat de support de branchement comportant par endroits une couche conductrice sur une surface, localement en contact électrique avec les photopiles et doté d'une couche de support électriquement isolante ou une pile des substrats de support de ce type sont destinés à réaliser les cavaliers, ladite couche de support/ladite pile pouvant être décalées des faces arrière des photopiles par des entretoises d'isolation et/ou une couche intermédiaire isolante. Au moins une partie des segments de contact destinés à mettre en contact les photopiles et/ou à relier localement ensemble plusieurs couches conductrices de la pile sont formés dans le substrat de support de branchement ou dans la pile par des trous de passage ou des trous borgnes remplis d'une pâte ou d'une encre conductrice compatible avec le matériau de la ou de chaque couche conductrice.
PCT/EP2012/057101 2011-06-14 2012-04-19 Module de photopile et procédé de fabrication dudit module de photopile Ceased WO2012171680A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011077469A DE102011077469A1 (de) 2011-06-14 2011-06-14 Solarzellenmodul und Verfahren zu dessen Herstellung
DE102011077469.6 2011-06-14

Publications (2)

Publication Number Publication Date
WO2012171680A2 true WO2012171680A2 (fr) 2012-12-20
WO2012171680A3 WO2012171680A3 (fr) 2013-05-02

Family

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Application Number Title Priority Date Filing Date
PCT/EP2012/057101 Ceased WO2012171680A2 (fr) 2011-06-14 2012-04-19 Module de photopile et procédé de fabrication dudit module de photopile

Country Status (2)

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DE (1) DE102011077469A1 (fr)
WO (1) WO2012171680A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104516591B (zh) * 2015-01-09 2018-01-23 业成光电（深圳）有限公司 保护盖板组件以及触控模块
AU2017337293A1 (en) * 2016-09-30 2019-05-16 Greatcell Energy Limited A solar module and a method of fabricating a solar module

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Publication number Priority date Publication date Assignee Title
US5972732A (en) * 1997-12-19 1999-10-26 Sandia Corporation Method of monolithic module assembly
JP4441938B2 (ja) * 1998-12-28 2010-03-31 ソニー株式会社 集積型薄膜素子およびその製造方法
US20070137692A1 (en) * 2005-12-16 2007-06-21 Bp Corporation North America Inc. Back-Contact Photovoltaic Cells
NL2001727C2 (nl) * 2008-06-26 2009-12-29 Eurotron B V Werkwijze voor het vervaardigen van een zonnepaneel, alsmede halffabrikaat daarvoor.
NL2001958C (en) * 2008-09-05 2010-03-15 Stichting Energie Method of monolithic photo-voltaic module assembly.
US20110083716A1 (en) * 2009-07-22 2011-04-14 Applied Materials, Inc. Monolithic module assembly using back contact solar cells and metal ribbon
US8119901B2 (en) * 2009-11-03 2012-02-21 Lg Electronics Inc. Solar cell module having a conductive pattern part

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Also Published As

Publication number Publication date
DE102011077469A1 (de) 2012-12-20
WO2012171680A3 (fr) 2013-05-02

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