WO2012173654A3 - Ensemble circuit flexible et procédé associé - Google Patents

Ensemble circuit flexible et procédé associé Download PDF

Info

Publication number
WO2012173654A3
WO2012173654A3 PCT/US2012/000259 US2012000259W WO2012173654A3 WO 2012173654 A3 WO2012173654 A3 WO 2012173654A3 US 2012000259 W US2012000259 W US 2012000259W WO 2012173654 A3 WO2012173654 A3 WO 2012173654A3
Authority
WO
WIPO (PCT)
Prior art keywords
flexible circuit
circuit assembly
embedded device
plane
proximity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2012/000259
Other languages
English (en)
Other versions
WO2012173654A2 (fr
Inventor
James Jen-Ho Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Power Gold LLC
Original Assignee
Power Gold LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/506,110 external-priority patent/US8879276B2/en
Application filed by Power Gold LLC filed Critical Power Gold LLC
Priority to JP2014515804A priority Critical patent/JP5823033B2/ja
Publication of WO2012173654A2 publication Critical patent/WO2012173654A2/fr
Publication of WO2012173654A3 publication Critical patent/WO2012173654A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Led Device Packages (AREA)

Abstract

Un dispositif noyé (105) est assemblé à l'intérieur d'un ensemble circuit flexible (30), le dispositif noyé étant situé intentionnellement à la partie moyenne à proximité du plan central (115) de l'ensemble circuit flexible pour rendre minimaux les effets de contrainte sur le dispositif noyé. L'ouverture (18), pour le dispositif noyé, est agrandie dans une couche intermédiaire (10) pour augmenter la flexibilité de l'ensemble circuit flexible.
PCT/US2012/000259 2011-06-15 2012-05-30 Ensemble circuit flexible et procédé associé Ceased WO2012173654A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014515804A JP5823033B2 (ja) 2011-06-15 2012-05-30 フレキシブル回路アセンブリおよびその方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14974711A 2011-06-15 2011-06-15
US61497,47 2011-06-15
US13/506,110 2012-03-27
US13/506,110 US8879276B2 (en) 2011-06-15 2012-03-27 Flexible circuit assembly and method thereof

Publications (2)

Publication Number Publication Date
WO2012173654A2 WO2012173654A2 (fr) 2012-12-20
WO2012173654A3 true WO2012173654A3 (fr) 2013-02-21

Family

ID=47357656

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/000259 Ceased WO2012173654A2 (fr) 2011-06-15 2012-05-30 Ensemble circuit flexible et procédé associé

Country Status (1)

Country Link
WO (1) WO2012173654A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9668352B2 (en) 2013-03-15 2017-05-30 Sumitomo Electric Printed Circuits, Inc. Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly
US8998454B2 (en) 2013-03-15 2015-04-07 Sumitomo Electric Printed Circuits, Inc. Flexible electronic assembly and method of manufacturing the same
CN119943774B (zh) * 2025-01-06 2025-11-07 华天科技(南京)有限公司 一种预埋器件散热基板叠层贴装结构及其制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444228A (en) * 1992-05-27 1995-08-22 Seb S.A. Flat, flexible heating element with integrated connector
DE4412278A1 (de) * 1994-04-09 1995-10-12 Bosch Gmbh Robert Starre und flexible Bereiche aufweisende Leiterplatte
US20070108521A1 (en) * 2003-07-04 2007-05-17 Ronald Dekker Flexible semiconductor device and identification label
US20070124916A1 (en) * 2000-05-19 2007-06-07 Harding Philip A Method of making slotted core inductors and transformers
US20100072577A1 (en) * 2004-06-04 2010-03-25 The Board Of Trustees Of The University Of Illinois Methods and Devices for Fabricating and Assembling Printable Semiconductor Elements
US20100091501A1 (en) * 2008-10-15 2010-04-15 Young Optics Inc. Light emitting diode apparatus and optical engine using the same
US20100096166A1 (en) * 2008-10-17 2010-04-22 Occam Portfolio Llc Flexible Circuit Assemblies without Solder and Methods for their Manufacture
US20110117703A1 (en) * 2008-12-12 2011-05-19 Helmut Eckhardt Fabrication of electronic devices including flexible electrical circuits

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5444228A (en) * 1992-05-27 1995-08-22 Seb S.A. Flat, flexible heating element with integrated connector
DE4412278A1 (de) * 1994-04-09 1995-10-12 Bosch Gmbh Robert Starre und flexible Bereiche aufweisende Leiterplatte
US20070124916A1 (en) * 2000-05-19 2007-06-07 Harding Philip A Method of making slotted core inductors and transformers
US20070108521A1 (en) * 2003-07-04 2007-05-17 Ronald Dekker Flexible semiconductor device and identification label
US20100072577A1 (en) * 2004-06-04 2010-03-25 The Board Of Trustees Of The University Of Illinois Methods and Devices for Fabricating and Assembling Printable Semiconductor Elements
US20100091501A1 (en) * 2008-10-15 2010-04-15 Young Optics Inc. Light emitting diode apparatus and optical engine using the same
US20100096166A1 (en) * 2008-10-17 2010-04-22 Occam Portfolio Llc Flexible Circuit Assemblies without Solder and Methods for their Manufacture
US20110117703A1 (en) * 2008-12-12 2011-05-19 Helmut Eckhardt Fabrication of electronic devices including flexible electrical circuits

Also Published As

Publication number Publication date
WO2012173654A2 (fr) 2012-12-20

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