WO2013005155A3 - Appareil pour traiter un article en forme de tranche - Google Patents

Appareil pour traiter un article en forme de tranche Download PDF

Info

Publication number
WO2013005155A3
WO2013005155A3 PCT/IB2012/053350 IB2012053350W WO2013005155A3 WO 2013005155 A3 WO2013005155 A3 WO 2013005155A3 IB 2012053350 W IB2012053350 W IB 2012053350W WO 2013005155 A3 WO2013005155 A3 WO 2013005155A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
process chamber
shaped article
closed process
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2012/053350
Other languages
English (en)
Other versions
WO2013005155A2 (fr
Inventor
Karl-Heinz Hohenwarter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Lam Research Corp
Original Assignee
Lam Research AG
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research AG, Lam Research Corp filed Critical Lam Research AG
Priority to KR1020147000452A priority Critical patent/KR102007546B1/ko
Publication of WO2013005155A2 publication Critical patent/WO2013005155A2/fr
Anticipated expiration legal-status Critical
Publication of WO2013005155A3 publication Critical patent/WO2013005155A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)

Abstract

Appareil pour traiter des articles en forme de tranches, comportant une chambre de traitement fermée, un mandrin de serrage situé à l'intérieur de la chambre de traitement fermée, et au moins un dispositif distributeur de liquide de traitement monté à l'intérieur de la chambre. La chambre de traitement fermée comporte un couvercle qui peut être ouvert pour placer un article en forme de tranche à l'intérieur de ladite chambre. Le couvercle comprend un dispositif chauffant conçu pour chauffer un article en forme de tranche placé dans la chambre de traitement fermée.
PCT/IB2012/053350 2011-07-07 2012-07-02 Appareil pour traiter un article en forme de tranche Ceased WO2013005155A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020147000452A KR102007546B1 (ko) 2011-07-07 2012-07-02 웨이퍼-형상 물품을 처리하기 위한 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/178,430 2011-07-07
US13/178,430 US20130008602A1 (en) 2011-07-07 2011-07-07 Apparatus for treating a wafer-shaped article

Publications (2)

Publication Number Publication Date
WO2013005155A2 WO2013005155A2 (fr) 2013-01-10
WO2013005155A3 true WO2013005155A3 (fr) 2015-08-06

Family

ID=47437509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2012/053350 Ceased WO2013005155A2 (fr) 2011-07-07 2012-07-02 Appareil pour traiter un article en forme de tranche

Country Status (4)

Country Link
US (1) US20130008602A1 (fr)
KR (1) KR102007546B1 (fr)
TW (1) TWI569345B (fr)
WO (1) WO2013005155A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8926788B2 (en) * 2010-10-27 2015-01-06 Lam Research Ag Closed chamber for wafer wet processing
KR101501362B1 (ko) 2012-08-09 2015-03-10 가부시키가이샤 스크린 홀딩스 기판처리장치 및 기판처리방법
KR101512560B1 (ko) 2012-08-31 2015-04-15 가부시키가이샤 스크린 홀딩스 기판처리장치
KR102091291B1 (ko) 2013-02-14 2020-03-19 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
US10132309B2 (en) * 2013-03-15 2018-11-20 Integrated Designs, L.P. Apparatus and method for the remote monitoring, viewing and control of a semiconductor process tool
US10043686B2 (en) * 2013-12-31 2018-08-07 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
DE102014105300A1 (de) * 2014-03-12 2015-09-17 Von Ardenne Gmbh Prozessieranordnung und Verfahren zum Betreiben einer Prozessieranordnung
JP6329428B2 (ja) * 2014-05-09 2018-05-23 東京エレクトロン株式会社 基板処理装置、基板処理装置の付着物除去方法、及び記憶媒体
AU2015279923B9 (en) * 2014-06-24 2018-01-25 Virsec Systems, Inc. System and methods for automated detection of input and output validation and resource management vulnerability
KR102284064B1 (ko) * 2014-09-16 2021-08-02 에이씨엠 리서치 (상하이) 인코포레이티드 자동 클리닝 기능을 갖는 코터 및 코터 자동 클리닝 방법
US20160376702A1 (en) * 2015-06-26 2016-12-29 Lam Research Ag Dual mode chamber for processing wafer-shaped articles
US10534907B2 (en) * 2016-12-15 2020-01-14 Sap Se Providing semantic connectivity between a java application server and enterprise threat detection system using a J2EE data
CN116504702B (zh) * 2023-06-26 2023-09-05 山东联高智能科技有限公司 一种半导体元件加工设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595241A (en) * 1994-10-07 1997-01-21 Sony Corporation Wafer heating chuck with dual zone backplane heating and segmented clamping member
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US6331212B1 (en) * 2000-04-17 2001-12-18 Avansys, Llc Methods and apparatus for thermally processing wafers
US6375746B1 (en) * 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks
US20020195128A1 (en) * 2001-06-22 2002-12-26 S.E.S. Company Limited Single wafer type substrate cleaning method and apparatus
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
WO2004084278A1 (fr) * 2003-03-20 2004-09-30 Sez Ag Dispositif et procede pour le traitement par voie humide d'articles discoides
US7187002B2 (en) * 2004-02-02 2007-03-06 Matsushita Electric Industrial Co., Ltd. Wafer collective reliability evaluation device and wafer collective reliability evaluation method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01134932A (ja) * 1987-11-19 1989-05-26 Oki Electric Ind Co Ltd 基板清浄化方法及び基板清浄化装置
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US6232248B1 (en) * 1998-07-03 2001-05-15 Tokyo Electron Limited Single-substrate-heat-processing method for performing reformation and crystallization
US20020096196A1 (en) * 2001-01-23 2002-07-25 Takayuki Toshima Substrate processing apparatus and substrate processing method
JP4343022B2 (ja) * 2004-05-10 2009-10-14 東京エレクトロン株式会社 基板の処理方法及び基板の処理装置
US20070289534A1 (en) * 2006-05-30 2007-12-20 Applied Materials, Inc. Process chamber for dielectric gapfill
CN101809717B (zh) * 2007-09-25 2012-10-10 朗姆研究公司 用于等离子处理设备的喷头电极总成的温度控制模块
CN101978475B (zh) * 2008-03-21 2013-09-25 应用材料公司 屏蔽性盖加热器组件
US8926788B2 (en) * 2010-10-27 2015-01-06 Lam Research Ag Closed chamber for wafer wet processing

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595241A (en) * 1994-10-07 1997-01-21 Sony Corporation Wafer heating chuck with dual zone backplane heating and segmented clamping member
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US6375746B1 (en) * 1998-07-10 2002-04-23 Novellus Systems, Inc. Wafer processing architecture including load locks
US6331212B1 (en) * 2000-04-17 2001-12-18 Avansys, Llc Methods and apparatus for thermally processing wafers
US20020195128A1 (en) * 2001-06-22 2002-12-26 S.E.S. Company Limited Single wafer type substrate cleaning method and apparatus
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
WO2004084278A1 (fr) * 2003-03-20 2004-09-30 Sez Ag Dispositif et procede pour le traitement par voie humide d'articles discoides
US7187002B2 (en) * 2004-02-02 2007-03-06 Matsushita Electric Industrial Co., Ltd. Wafer collective reliability evaluation device and wafer collective reliability evaluation method

Also Published As

Publication number Publication date
US20130008602A1 (en) 2013-01-10
WO2013005155A2 (fr) 2013-01-10
KR20140040208A (ko) 2014-04-02
TW201304041A (zh) 2013-01-16
KR102007546B1 (ko) 2019-08-05
TWI569345B (zh) 2017-02-01

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