WO2013080441A1 - Dispositif de conversion de puissance - Google Patents

Dispositif de conversion de puissance Download PDF

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Publication number
WO2013080441A1
WO2013080441A1 PCT/JP2012/007067 JP2012007067W WO2013080441A1 WO 2013080441 A1 WO2013080441 A1 WO 2013080441A1 JP 2012007067 W JP2012007067 W JP 2012007067W WO 2013080441 A1 WO2013080441 A1 WO 2013080441A1
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WO
WIPO (PCT)
Prior art keywords
heat transfer
heat
cooling body
power conversion
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/007067
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English (en)
Japanese (ja)
Inventor
泰仁 田中
美里 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
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Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to CN201280050109.5A priority Critical patent/CN103907184B/zh
Publication of WO2013080441A1 publication Critical patent/WO2013080441A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the present invention relates to a power conversion apparatus for supporting a mounting substrate on which a circuit component including a heat generating circuit component for driving a semiconductor switching element is mounted on a semiconductor power module incorporating a semiconductor switching element for power conversion.
  • the power conversion device described in Patent Document 1 As this type of power conversion device, the power conversion device described in Patent Document 1 is known.
  • a water cooling jacket is disposed in a casing, and a semiconductor power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket to cool the power conversion apparatus.
  • a control circuit board and a drive circuit board are arranged in the casing at a predetermined distance on the side opposite to the water cooling jacket of the semiconductor power module, and heat generated by the control circuit board and the drive circuit board is radiated from the heat dissipation member. The heat is transmitted to the metal base plate supporting the control circuit board and the drive circuit board through the metal plate, and the heat transmitted to the metal base plate is transmitted to the water cooling jacket through the side wall of the housing supporting the metal base plate. I am doing so.
  • the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path. In order to solve this unsolved problem, it is also necessary to dissipate the heat generated by the substrate and mounted components by natural convection from the case and case cover, increasing the surface area of the case and case cover. For this reason, the outer shape of the housing and the housing lid is increased, and the power converter is increased in size.
  • the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and can efficiently dissipate the heat of the heat generating circuit components mounted on the substrate to the cooling body, and can be downsized. It aims at providing a simple power converter.
  • a first aspect of a power conversion device includes a semiconductor power module in which one surface is joined to a cooling body and a circuit component including a heat generating circuit component that drives the semiconductor power module. And a heat conduction path for transferring heat of the mounting substrate to the cooling body. And as for the said mounting substrate, the heat-transfer member is arrange
  • the second aspect of the power conversion device is a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, a cooling body disposed on one surface of the semiconductor power module, And a plurality of mounting boards on which circuit components including a heat generating circuit component for driving the semiconductor switching element supported on the other surface of the semiconductor power module are mounted. And at least one mounting board among the plurality of mounting boards is provided with heat transfer members individually on both front and back surfaces, and heat generation of the heat generating circuit components is conducted via both heat transfer members, and further the semiconductor power module and Heat is radiated to the cooling body through a plurality of heat conduction paths independent of the casing surrounding each mounting substrate.
  • the heat of the heat generating circuit components mounted on the mounting board can be radiated to the cooling body via the heat transfer members on both the front and back surfaces.
  • the plurality of heat conduction paths between the mounting substrate and the cooling body are formed independently of the housing surrounding the semiconductor power module and each mounting substrate, the heat conductivity of the housing should be considered.
  • a housing can be formed without any problems, and the degree of freedom in design can be improved.
  • the power transmission is provided between a mounting board on which heat transfer members are arranged on both the front and back surfaces and a mounting board facing at least one surface of the mounting board.
  • the thermal member is disposed in a solid state. According to this configuration, since the heat transfer member is interposed between the two mounting boards in a solid state, an air layer is not formed between the two mounting boards, so that the heat dissipation effect can be improved.
  • the 4th aspect of the power converter device which concerns on this invention is a surface on the opposite side to the said mounting substrate of the said both heat-transfer members in the mounting substrate in which the said heat conduction path has arrange
  • the said heat-transfer support member is comprised with the metal material with high heat conductivity.
  • the mounting substrate is made of aluminum, aluminum alloy, copper, or the like having high thermal conductivity, heat dissipation to the cooling body can be performed more efficiently.
  • the said heat-transfer member is comprised with the insulator which has thermal conductivity. According to this 5th aspect, since the heat-transfer member is comprised with the insulator, the space
  • the 7th aspect of the power converter device which concerns on this invention is comprised with the elastic body in which the said heat-transfer member has heat conductivity and has a stretching property. According to this configuration, since the heat transfer member has elasticity, the heat transfer member can be brought into contact with the periphery of a heat-generating component or the like mounted on the mounting substrate, the contact area can be increased, and the heat dissipation effect can be improved.
  • the said heat-transfer member is being fixed in the state which compressed the said elastic body with the predetermined compression rate.
  • the elastic body is fixed in a compressed state, contact with the heat-generating component mounted on the mounting board can be performed more favorably, and the heat dissipation effect can be improved.
  • the 9th aspect of the power converter device which concerns on this invention is provided with the space
  • the heat transfer members are arranged on both the front and back surfaces of the mounting board on which the circuit components including the heat generating circuit components are mounted, and both the heat transfer members are connected to the cooling body through the heat conduction path. Therefore, the heat generation on the front and back sides of the mounting substrate can be efficiently radiated to the cooling body. For this reason, the combined use with the heat dissipation action from the housing and the housing lid can be reduced, and an inexpensive power conversion device that is reduced in size by suppressing the size of the housing and the housing lid can be provided. .
  • FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
  • reference numeral 1 denotes a power converter
  • the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • a cooling water supply port 3 a and a drainage port 3 b are opened to the outside of the housing 2, and a cooling water passage 3 c is formed between the water supply port 3 a and the drainage port 3 b.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity (for example, 100 W ⁇ m ⁇ 1 ⁇ K ⁇ 1 or more).
  • the cooling body 3 has a flat bottom surface, and a concave portion 3d having a square shape when viewed from the plane is formed in the center on the top surface.
  • a rectangular protruding base 3e as viewed from above is formed, and a rectangular frame-shaped peripheral groove 3f is formed around the protruding base 3e.
  • the height of the protruding base 3e is lower than the upper surface of the cooling body 3, and is set substantially equal to the thickness of the bottom plates 39 of the heat transfer support side plates 35 and 37 described later.
  • the cooling body 3 is formed with an insertion hole 3g through which the positive and negative electrodes 4a covered with insulation of the film capacitor 4 held by the lower housing 2A are vertically inserted.
  • the power conversion apparatus 1 includes a semiconductor power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that constitutes, for example, an inverter circuit for power conversion.
  • the semiconductor power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal cooling member 13 is formed on the lower surface of the case body 12.
  • the case body 12 and the cooling member 13 are formed with insertion holes 15 through which the fixing screws 14 as the fixing members are inserted at the four corners when viewed from the plane.
  • the semiconductor power module 11 is mounted on the upper surface of the cooling body 3 by inserting the fixing screw 14 into the insertion holes 15 and screwing the tip of the male screw portion of the fixing screw into the cooling body 3.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the semiconductor power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a control circuit including a heat generation circuit component having a relatively large heat generation amount or a high heat generation density for controlling the IGBT built in the semiconductor power module 11 with a predetermined interval above the drive circuit board 21 is mounted.
  • a control circuit board 22 as a mounting board is fixed.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts a fixing screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24.
  • the joint screw 24 is fixed by being screwed to the female thread portion 24b.
  • the drive circuit board 21 is mounted with a circuit component that does not require cooling by the cooling body 3 and generates a small amount of heat
  • the control circuit board 22 has a heating circuit component that requires cooling by the cooling body.
  • the circuit component 26 to be included is mounted on both the front and back surfaces.
  • the control circuit board 22 has heat transfer members 27 and 28 arranged on the front and back sides. These heat transfer members 27 and 28 are elastic bodies having elasticity, and have the same outer dimensions as the control circuit board 22.
  • heat transfer members 27 and 28 for example, a member having improved heat transfer performance while exhibiting insulation performance by interposing a metal filler inside silicon rubber as an elastic body is applied.
  • These heat transfer members 27 and 28 are compressed to about 5 to 30% in the thickness direction, for example, so that the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
  • plate-like heat transfer support plates 29 and 30 are arranged on the opposite sides of the heat transfer members 27 and 28 from the control circuit board 22.
  • These heat transfer support plates 29 and 30 are formed of a metal material such as aluminum, an aluminum alloy, or copper having high thermal conductivity (for example, 100 W ⁇ m ⁇ 1 ⁇ K ⁇ 1 or more) and rigidity.
  • the heat transfer support plates 29 and 30 are fixed to be screwed into the female screws 30a formed on the heat transfer support plate 30 from the upper surface side of the heat transfer support plate 29 through the heat transfer member 27, the control circuit board 22, and the heat transfer member 28. It is fixed by screws 31.
  • spacers 32 and 33 through which the fixing screws 31 are inserted are provided in the heat transfer members 27 and 28.
  • These spacers 32 and 33 are interval adjusting members having a heat transfer member management height H lower than the thickness T of the heat transfer members 27 and 28, and the heights of these spacers 32 and 33 are the heat transfer members 27 and 28. Is set to a height that compresses about 5 to 30% in the thickness direction.
  • the heat transfer members 27 and 28 are accurately compressed and fixed to about 5 to 30% in the thickness direction, and the heat transfer members 27 and 28 are fixed.
  • the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
  • the compression rate of the heat transfer members 27 and 28 is managed by the height H of the spacers 32 and 33, appropriate tightening is performed without causing insufficient tightening or excessive tightening.
  • the heat transfer support plates 29 and 30 are laminated on the front and back of the control circuit board 22 in a solid state with the heat transfer members 27 and 28 interposed therebetween. For this reason, the heat transfer members 27 and 28 are brought into close contact with the circuit components including the heat generating circuit components mounted on the control circuit board 22, and the heat generation of the circuit components is transmitted through the heat transfer members 27 and 28. Heat is dissipated to 29 and 30.
  • the heat transfer support plate 29 has the left end at the same position as the left end of the control circuit board 22 and the heat transfer members 27 and 28, but the right end has the control circuit.
  • a connecting portion 29 a is formed to protrude rightward from the right ends of the substrate 22 and the heat transfer members 27 and 28.
  • a connecting hole 29b is formed through the connecting portion 29a.
  • the heat transfer support plate 30 has the right end portion at the same position as the right end of the control circuit board 22 and the heat transfer members 27 and 28, but the left end portion is controlled.
  • a connecting portion 30b is formed that protrudes to the left from the left ends of the circuit board 22 and the heat transfer members 27 and 28.
  • a connecting hole 30c is formed through the connecting portion 30a.
  • a heat transfer support side plate 35 that forms a heat conduction path independent of the upper housing 2 ⁇ / b> B is fixed and connected to the connecting portion 29 a of the heat transfer support plate 29 with a fixing screw 36.
  • the fixing screw 36 is screwed into a female screw (not shown) formed on the heat transfer support side plate 35 through the connection hole 29b from above the heat transfer support plate 29.
  • a heat transfer support side plate 37 that forms a heat conduction path independent of the upper housing 2 ⁇ / b> B is fixed to and connected to the connecting portion 30 b of the heat transfer support plate 30 by a fixing screw 38.
  • the fixing screw 38 is also screwed into a female screw (not shown) formed on the heat transfer support side plate 37 from above the heat transfer support plate 30 through the connection hole 30c.
  • the heat transfer support side plate 35 is formed in an inverted L shape by a vertical plate portion 35a and a connecting plate portion 35b extending leftward from the upper end of the vertical plate portion 35a.
  • the heat transfer support side plate 35 has a curved surface (R chamfer) 35c in which the connecting portion between the vertical plate portion 35a and the connecting plate portion 35b is a part of the cylindrical surface.
  • the heat transfer support side plate 37 is also formed in an inverted L shape by a vertical plate portion 37a and a connecting plate portion 37b extending rightward from the state of the vertical plate portion 37a.
  • the heat transfer support side plate 37 has a curved surface 37c (R chamfer) in which the connecting portion between the vertical plate portion 37a and the connecting plate portion 37b is a part of the cylindrical surface.
  • the heat transfer support side plates 35 and 37 are integrated by connecting the lower end sides of the vertical plate portions 35 a and 37 a with a common bottom plate 39.
  • the bottom plate 39 is formed in a square frame shape in which a square hole 39a is formed in the center portion to insert the protruding base portion 3e of the cooling body 3 and is accommodated in the circumferential groove 3f of the cooling body 3.
  • the curved plates (R chamfers) 35d and 37d in which the lower plates of the vertical plate portions 35a and 37a of the heat transfer support side plates 35 and 37 and the bottom plate 39 are connected to each other, are part of the cylindrical surface.
  • the upper and lower ends of the vertical plate portions 35a and 37a of the heat transfer support side plates 35 and 37 are formed as cylindrical curved surfaces 35c, 35d and 37c, 37d. For this reason, when vertical vibration or roll is transmitted to the power converter 1, stress concentration generated in the connecting portions of the vertical plate portions 35a and 37a, the connecting plate portions 35b and 37b, and the bottom plate 39 can be reduced. . Therefore, the heat resistance support side plates 35 and 37 can improve the vibration resistance against vertical vibration and roll when the control circuit board 22 is supported.
  • the vertical plate portions 35a and 37a are connected to the bottom plate 39, and the vertical plate portions 35a and 37a and the connection portions of the connection plate portions 35c and 37c are formed as cylindrical curved surfaces.
  • the heat conduction path can be shortened as compared with the case where the connecting portions between the connecting portions 37a and 37a and the bottom plate portion 34 and the connecting portions between the vertical plate portions 35a and 37a and the connecting plate portions 35b and 37b have a right-angled L shape. . For this reason, the heat conduction path from the heat transfer support plates 29 and 30 to the cooling body 3 can be shortened to enable efficient heat cooling.
  • An insulating sheet 40 is attached to the lower surface of the heat transfer support plate 30 facing the drive circuit board 21 in order to shorten the insulation distance.
  • the heat transfer support side plates 35 and 37 and the bottom plate 39 have black surfaces. In order to blacken the surfaces of the heat transfer support side plates 35 and 37 and the bottom plate 39, the surface may be coated with a black resin or painted with a black paint.
  • the heat transfer support side plates 35 and 37 and the bottom plate 39 black, the heat emissivity becomes larger than the metal material color, and the amount of radiant heat transfer can be increased. For this reason, the heat dissipation to the circumference
  • a bottom plate 39 common to the heat transfer support side plates 35 and 37 is disposed in the circumferential groove 3f of the cooling body 3, and the lower surface of the cooling member 13 formed on the semiconductor power module 11 is brought into contact with the upper surface of the bottom plate 39, and The semiconductor power module 11 and the bottom plate 39 are integrally fixed to the cooling body 3 with the fixing screw 14 in a state where the cooling member 13 is in contact with the protruding base portion 3 e of the cooling body 3.
  • the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface of the semiconductor power module 11 before or after fixing to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above.
  • At least three spacers that maintain an insulation distance between the drive circuit board 21 and the insulating sheet 40 are placed on a portion of the upper surface of the drive circuit board 21 where the circuit components at the peripheral edge are not mounted. Then, the heat transfer support plate 30, the heat transfer member 28, and the control circuit board 22 in which the insulating sheet 40 is bonded to the lower surface with the joint screw 24 as a reference are laminated in this order. At this time, the spacer 33 is inserted through the insertion portion of the fixing screw 31 of the heat transfer member 28.
  • the fixing screw 25 is inserted from the upper surface of the control circuit board 22 through the insertion hole 22 a and screwed into the female screw portion 24 b formed on the upper surface of the joint screw 24, so that the control circuit board 22 is connected to the upper end of the joint screw 24. Fix it.
  • the heat transfer member 27 having the spacer 32 inserted in the insertion portion of the fixing screw 31 is placed on the upper surface of the control circuit board 22, and the heat transfer support plate 29 is placed on the upper surface of the heat transfer member 27.
  • the fixing screw 31 is inserted from the upper surface of the heat transfer support plate 29, and is screwed into a female screw 30a formed on the heat transfer support plate 30 and tightened.
  • the heat transfer members 27 and 28 are compressed to a management height defined by the spacers 32 and 33. Therefore, the heat transfer members 27 and 28 are compressed by about 5 to 30%, the heat resistance of the heat transfer members 27 and 28 is reduced, and an efficient heat transfer effect can be exhibited.
  • a bus bar 50 is connected to the positive and negative DC input terminals of the semiconductor power module 11 to 11 a, and the positive and negative connection terminals of the film capacitor 4 penetrating the cooling body 3 at the other end of the bus bar 50.
  • 4a is connected with a fixing screw 51.
  • the upper housing 2B from which the lid 2b is removed is mounted on the upper surface of the cooling body 3 through a sealing material.
  • the rectangular tube 2a of the upper housing 2B is connected to a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) and an external three-phase electric motor (not shown).
  • a crimp terminal 59 fixed to the tip of the connected motor cable 58 is inserted and supported in a liquid-tight manner.
  • the crimp terminal 53 fixed to the tip of the connection cord 52 is fixed to the DC input terminal 11 a of the semiconductor power module 11.
  • a bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55.
  • a crimp terminal 59 fixed to the tip of the motor cable 58 is fixed to the other end of the bus bar 55 with a fixing screw 60 and connected.
  • the upper open end of the rectangular tube 2a is sealed with a lid 2b via a sealing material.
  • the lower housing 2A is fixed to the lower surface of the cooling body 3 via a sealing material, and the assembly of the power converter 1 is completed.
  • the DC power is supplied to the semiconductor power module 11 from an external converter (not shown) via the connection cord 52, and the power supply circuit, the control circuit, and the like mounted on the control circuit board 22 are operated.
  • a gate signal composed of, for example, a pulse width modulation signal is supplied from the control circuit to the semiconductor power module 11 via the drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the semiconductor power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the external three-phase electric motor (not shown) via the bus bar 55 and further via the motor cable 58, and this three-phase electric motor (not shown) is supplied. Drive control.
  • heat is generated in the IGBT built in the semiconductor power module 11.
  • the generated heat is cooled by the cooling water supplied to the cooling body 3 because the cooling member 13 formed in the semiconductor power module 11 is in direct contact with the protruding base 3 e of the cooling body 3.
  • circuit components 26 such as a control circuit and a power supply circuit mounted on the control circuit board 22 include heat generating circuit components, and these heat generating circuit components generate heat.
  • the heat generating circuit components are mounted on the upper and lower surfaces of the control circuit board 22.
  • Heat transfer support plates 29 and 30 are provided on the upper and lower surfaces of the control circuit board 22 via heat transfer members 27 and 28 having high heat conductivity and elasticity.
  • the heat transfer members 27 and 28 are compressed by the fixing screw 31 at a compression rate of about 5 to 30% as described above, the heat resistance is reduced and an efficient heat transfer effect can be exhibited.
  • the contact area between the heat generating circuit component and the heat transfer members 27 and 28 is increased. Therefore, heat generated by the heat generating circuit components is efficiently transferred to the heat transfer members 27 and 28. Therefore, as shown in FIG. 4, the heat transferred to the heat transfer members 27 and 28 is efficiently transferred to the heat transfer support plates 29 and 30.
  • the heat transfer support plates 29 and 30 are connected to the heat transfer support plates 29 and 30, the heat transferred to the heat transfer support plates 29 and 30 passes through the heat transfer support plates 35 and 37. It is transmitted to the common bottom plate 39. Since the bottom plate 39 is in direct contact with the circumferential groove 3 f of the cooling body 3, the transmitted heat is radiated to the cooling body 3. Further, the heat transmitted to the bottom plate 39 is transmitted from the upper surface side to the cooling member 13 of the semiconductor power module 11, and is transmitted to the projecting base 3 e of the cooling body 3 through the cooling member 13 to be radiated.
  • the heat transfer members 27 and 28 are arranged on both the front and back surfaces of the control circuit board 22, and the heat transfer members 27 and 28 are transferred to the opposite side of the control circuit board 22. Since the support plates 29 and 30 are arranged, the heat generated by the heat generating circuit components mounted on the control circuit board 22 is not directly passed through the control circuit board 22 having a large thermal resistance, but directly through the heat transfer members 27 and 28. Thus, heat is transferred to the heat transfer support plates 29 and 30, so that efficient heat dissipation can be performed.
  • the heat transmitted to the heat transfer members 27 and 28 is transferred to the heat transfer support plates 29 and 30 and further transferred to the heat transfer support side plates 35 and 37.
  • the heat transfer support side plates 35 and 37 are provided along the long side of the semiconductor power module 11. For this reason, a wide heat transfer area can be taken, and a wide heat dissipation path can be secured.
  • the bent portions of the heat transfer support side plates 35 and 37 are cylindrical curved portions 35c, 35d and 37c, 37d, the heat transfer support side plates 35 and 37 are transferred to the cooling body 3 as compared with the case where the bent portions are L-shaped. The thermal distance can be shortened. For this reason, the heat dissipation efficiency can be further improved.
  • the heat transport amount Q can be expressed by the following equation (1).
  • Q ⁇ ⁇ (A / L) ⁇ T (1)
  • T is the temperature difference [° C.] substrate temperature T 1 -cooling body temperature T 2
  • A is the minimum heat transfer cross section [m 2 ]
  • L is the heat transfer length [m ].
  • the heat transfer support side plates 35 and 37 are integrated with a common bottom plate 39, there is no joint between the components between the heat transfer support side plates 35 and 37 and the bottom plate 39, thereby suppressing thermal resistance. it can.
  • the housing 2 is not included in the heat dissipation path from the control circuit board 22 on which the heat generating circuit components are mounted to the cooling body 3, it is not necessary to use a metal such as aluminum having high thermal conductivity for the housing 2. Since it can be made of a synthetic resin material, the weight can be reduced.
  • the heat dissipation path can be formed by the power converter 1 alone without the heat dissipation path depending on the housing 2, the semiconductor power module 11, the drive circuit board 21, and the control circuit board 22 are configured.
  • the power conversion device 1 can be applied to various types of housings 2 and cooling bodies 3.
  • the rigidity of the control circuit board 22 can be increased. For this reason, even when the power converter 1 is applied as a motor drive circuit for driving a vehicle driving motor, when the vertical vibration or roll shown in FIG. Since the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37 are integrated, the rigidity can be increased. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations and rolls.
  • the heat transfer members 27 and 28 are made of an insulator having heat transfer properties, insulation between the control circuit board 22 and the heat transfer support plates 29 and 30 can be performed. It can be shortened and the whole can be miniaturized.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 27 and 28 may be provided only at locations where the heat generating circuit components exist. Further, by disposing the heat generating circuit components near the heat transfer support side plates 35 and 37 in the control circuit board 22, the distance of the heat radiation path to the cooling body 3 may be shortened. In this case, since the distance of the heat radiation path to the cooling body 3 of the heat generating circuit component is shortened, efficient heat radiation can be performed.
  • a circuit board is further mounted above the heat transfer support plate in the first embodiment described above. That is, in the second embodiment, as shown in FIGS. 6 and 7, for example, a power circuit component is provided on the upper surface side of the heat transfer support plate 29 on the upper surface side in the first embodiment via the heat transfer member 41.
  • the power supply circuit board 42 mounted with is mounted.
  • Other configurations have the same configurations as those in FIGS. 2 and 3 in the first embodiment described above, and corresponding parts to FIGS. 2 and 3 are denoted by the same reference numerals, and detailed description thereof is omitted. .
  • the fixing screw 31 of the first embodiment is omitted, and instead, a fixing screw 43 for fixing the control circuit board 22 and the heat transfer support plate 30 is provided.
  • the power supply circuit board 42 is fixed to the heat transfer support plate 29 via the heat transfer member 41 by the fixing screw 44 in the same manner as the control circuit board 22 described above.
  • a spacer 45 is disposed in the insertion portion of the fixing screw 44 of the heat transfer member 41. The height of the spacer 45 is such that the compression rate of the heat transfer member 41 is 5 to 30%. It is set to become.
  • the female screw portion 24 b at the upper end of the joint screw 24 is connected to the lower end of the joint screw 46 that is the same as the joint screw 24.
  • the control circuit board 22 is fixed on the joint screw 24 by screwing the formed male screw portion 46a.
  • the power supply circuit board 42 is fixed by screwing the fixing screw 47 into the female screw portion 46 b formed at the upper end of the joint screw 46.
  • the compression rate of the heat transfer member 27 interposed between the control circuit board 22 and the heat transfer support plate 29 is defined by the height of the joint screw 46. That is, the space between the heat transfer support plate 29 and the power supply circuit board 42 is fixed so that the spacer 45 is screwed into the female screw portion 29c formed on the heat transfer support plate 29 through the spacer 45 from above the power supply circuit board 42. And a screw 44.
  • the height H2 between the upper surface and the lower surface of the joint screw 46 is about 5 to 30% of the height of the spacer 45, the thickness of the heat transfer support plate 29 and the heat transfer member 27 as shown in FIG. It is set to the height obtained by adding the height when compressed.
  • the mounting height position of the control circuit board 22 is defined by screwing the male screw portion 46 a formed on the lower surface of the joint screw 46 with the female screw portion 24 b formed on the upper end of the joint screw 24.
  • the heat transfer support plate 29 and the power supply circuit board 42 integrated with the fixing screw 44 are disposed on the upper surface of the heat transfer member 27 through the insertion holes 27a formed in the heat transfer member 27.
  • the heat transfer member 27 can be compressed and fixed at a compression rate of about 5 to 30% by fixing the power supply circuit board 42 to the upper surface of the joint screw 46 with the fixing screw 47.
  • the heat generation of the heat generating circuit components mounted on the control circuit board 22 is performed by the heat transfer members 27 and 28 arranged on the front and back surfaces, as in the first embodiment. Heat is transferred to the heat transfer support plates 29 and 30, transferred to the heat transfer support side plates 35 and 37, and radiated to the cooling body 3. At the same time, the heat generating circuit components mounted on the power supply circuit board 42 also transfer heat to the heat transfer support plate 29 via the heat transfer member 41 and further transfer heat to the heat transfer support side plate 35 to dissipate heat to the cooling body 3. it can.
  • the cooling member 61 formed in the semiconductor power module 11 includes cooling fins 61 that directly contact the cooling water flowing through the cooling body 3. You may make it set it as the structure provided. In this case, an immersion part 62 for immersing the cooling fin 61 in the cooling water passage is formed in the central part of the cooling body 3.
  • a sealing member 66 such as an O-ring is disposed between the peripheral wall 63 surrounding the immersion part 62 and the cooling member 13. According to this configuration, the cooling fins 61 are formed on the cooling member 13 of the semiconductor power module 11, and the cooling fins 61 are immersed in the cooling water in the cooling water at the immersion part 62, so that the semiconductor power module 11 is more efficiently used. Can be cooled.
  • the present invention is not limited to the above configuration, and the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37 may be configured integrally. In this case, since no seam is formed between the heat transfer support plates 29 and 30 and the heat transfer support side plates 35 and 37, more efficient heat dissipation can be achieved by reducing the thermal resistance. it can.
  • the case where the heat transfer members 27 and 28 inserted between the control circuit board 22 and the heat transfer support plates 29 and 30 have elasticity has been described.
  • the heat-transfer member which does not have elasticity such as an insulating-coated metal plate, can also be applied.
  • the heat transfer support side plates 35 and 37 are disposed separately from the upper housing 2B surrounding the semiconductor power module 11, the cooling body 3, the drive circuit board 21, and the control circuit board 22.
  • the present invention is not limited to the above configuration.
  • the heat transfer support side plates 35 and 37 are omitted and the heat transfer support plate 29 is omitted.
  • And 30 may be directly supported by the upper casing 2B.
  • the drive circuit board 21 can be omitted.
  • the film capacitor 4 is applied as a smoothing capacitor.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor is applied. Also good.
  • the present invention is not limited to this, and the present invention is also applied to a rail vehicle traveling on a rail.
  • the invention can be applied and can be applied to any electric drive vehicle.
  • the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • a heat transfer member is arranged on both front and back surfaces of a mounting board on which circuit components including a heat generating circuit part are mounted, and both the heat transfer members have a semiconductor switching element built in a case body and a mounting board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dc-Dc Converters (AREA)

Abstract

La présente invention a trait à un dispositif de conversion de puissance qui est en mesure d'être miniaturisé et de rayonner de façon efficace, dans un corps de refroidissement, la chaleur provenant d'un composant de circuit thermogène qui est monté sur un substrat. Ce dispositif de conversion de puissance (1) est équipé d'un bloc de puissance à semi-conducteur (11) dont une surface est collée au corps de refroidissement (3), d'un substrat de montage (22) sur lequel les composants de circuit sont montés qui incluent un composant de circuit thermogène qui entraîne le bloc de puissance à semi-conducteur (11), et de trajectoires de transmission de chaleur (35, 37) qui transfèrent la chaleur depuis le substrat de montage jusque dans le corps de refroidissement (3). Des éléments de transmission de chaleur (27, 28) sont disposés à la fois sur les surfaces avant et arrière du substrat de montage (22).
PCT/JP2012/007067 2011-11-30 2012-11-05 Dispositif de conversion de puissance Ceased WO2013080441A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280050109.5A CN103907184B (zh) 2011-11-30 2012-11-05 电力转换装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011263012 2011-11-30
JP2011-263012 2011-11-30

Publications (1)

Publication Number Publication Date
WO2013080441A1 true WO2013080441A1 (fr) 2013-06-06

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PCT/JP2012/007067 Ceased WO2013080441A1 (fr) 2011-11-30 2012-11-05 Dispositif de conversion de puissance

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JP (1) JPWO2013080441A1 (fr)
CN (1) CN103907184B (fr)
WO (1) WO2013080441A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021002627A (ja) * 2019-06-24 2021-01-07 キヤノン株式会社 電子モジュール及び機器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6880851B2 (ja) * 2017-03-13 2021-06-02 オムロン株式会社 電力変換装置および電源装置
US20210185817A1 (en) * 2018-08-20 2021-06-17 Mitsubishi Electric Corporation Circuit device and power conversion apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001211663A (ja) * 2000-01-28 2001-08-03 Sanden Corp モータ駆動用インバータ装置
JP2002110869A (ja) * 2000-09-26 2002-04-12 Toshiba Corp 半導体装置
JP2008125240A (ja) * 2006-11-13 2008-05-29 Hitachi Ltd 電力変換装置
JP2010035347A (ja) * 2008-07-29 2010-02-12 Hitachi Ltd 電力変換装置および電動車両

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3642548B2 (ja) * 1997-10-27 2005-04-27 株式会社東芝 電力変換装置
JP4580997B2 (ja) * 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 電力変換装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001211663A (ja) * 2000-01-28 2001-08-03 Sanden Corp モータ駆動用インバータ装置
JP2002110869A (ja) * 2000-09-26 2002-04-12 Toshiba Corp 半導体装置
JP2008125240A (ja) * 2006-11-13 2008-05-29 Hitachi Ltd 電力変換装置
JP2010035347A (ja) * 2008-07-29 2010-02-12 Hitachi Ltd 電力変換装置および電動車両

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021002627A (ja) * 2019-06-24 2021-01-07 キヤノン株式会社 電子モジュール及び機器
JP7406314B2 (ja) 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器

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CN103907184A (zh) 2014-07-02
JPWO2013080441A1 (ja) 2015-04-27
CN103907184B (zh) 2016-08-31

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