Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
  • H01R25/14—Rails or bus-bars constructed so that the counterparts can be connected thereto at any point along their length
  • H01R25/145—Details, e.g. end pieces or joints
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/02—Arrangements of circuit components or wiring on supporting structure
  • H05K7/12—Resilient or clamping means for holding component to structure
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
  • H01R13/42—Securing in a demountable manner
  • H01R13/428—Securing in a demountable manner by resilient locking means on the contact members; by locking means on resilient contact members
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/6608—Structural association with built-in electrical component with built-in single component
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/6608—Structural association with built-in electrical component with built-in single component
  • H01R13/6641—Structural association with built-in electrical component with built-in single component with diode
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/717—Structural association with built-in electrical component with built-in light source
  • H01R13/7175—Light emitting diodes (LEDs)

Definitions

• the present invention relates to a connection structure of electronic components capable of establishing electrical connection of the electronic components having different pitches between contacts.
• a connection structure of electronic components which obtains high reliability, by reliably establishing electrical connection of the electronic components is disclosed in PTL 1.
• a pair of bus bars 501 , 503 are assembled to a housing, and a semiconductor light emitting element (LED) 505, which is a light source, is also assembled to the housing.
• the bus bars 501, 503 in a shape of a bifurcated flat plate have a wire connecting part 507, a Zener diode connecting part 509, a resistor connecting part 511 , and an LED connecting part 5 3.
• pressure-contacting blades 515, 515 are respectively provided on the bus bars 501 , 503 which are bifurcated.
• a single pressure-contacting blade 517 is provided on one of the bus bars 501
• a single pressure-contacting blade 519 is provided on the other bus bar 503.
• a Zener diode 521 is connected to a pair of the bus bars 501 , 503 in parallel therewith, at a downstream side of a resistor 527, in such a manner that one of lead parts 523 is electrically connected to the one bus bar 501 , while the other lead part 525 is electrically connected to the other bus bar 503.
• the diode 521 protects the LED from breakdown by the large voltage.
• the diode 521 blocks electrical connection, and thus, protects the LED from the breakdown in the same manner.
• connection parts the pressure-contacting blades 515, 515, 517, 519 having different sizes according to shapes and sizes of the electronic components are required.
• the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a connection structure for an electronic component which can connect plural kinds of electronic components which are different in a pitch between contact portions, outer configuration, and size with the provision of one kind of bus bar.
• a connection structure for an electronic component having a pair of bus bars each having a terminal portion formed on one end thereof, the pair of bus bars being spaced from each other and arranged in parallel within a housing, and the each terminal portion being formed with a pair of right and left contact spring pieces each having a bulge protruded laterally outward to be opposite sides with each other at a side of leading portions which can be abutted against each other,
• the electronic component is positioned in the center between the housing inner walls at both sides thereof, by allowing the both lateral surfaces to be elastically sandwiched between the inner walls of the housing through the two inside right and left contact spring pieces, and the two outside right and left contact spring pieces.
• the two inside right and left contact spring pieces, and the two outside right and left contact spring pieces elastically support the both lateral surfaces of the electronic component with respect to the inner walls of the housing. Therefore, the dimensional change of the housing can be absorbed by the bend tolerance range of the respective first right and left contact spring pieces. Under the circumstances, the right and left contact spring pieces of the bus bars can prevent the backlash of the electronic component to obtain the appropriate contact load.
• the first electronic component is positioned in the center between the housing inner walls at both sides thereof by allowing the both lateral surfaces to be elastically sandwiched between the inner walls of the housing through the two inside first right and left contact spring pieces, and the two outside first right and left contact spring pieces. Also, the two inside first right and left contact spring pieces, and the two outside first right and left contact spring pieces elastically support the both lateral surfaces of the first electronic component with respect to the inner walls of the housing. As a result, the dimensional change of the housing can be absorbed by the bend tolerance range of the respective first right and left contact spring pieces.
• the first right and left contact spring pieces of the bus bars can prevent the backlash of the first electronic component to obtain the appropriate contact load. Also, at least any two pieces of the second right and left contact spring pieces at the second stage are connected with the pair of the contact portions disposed on one surface of the second electronic component which is disposed between the bus bars. Under the circumstances, each stage of the terminal portions between the pair of bus bars arranged in parallel can be connected with plural kinds of first and second electronic components different in the inter-contact pitch, the outer configuration, and the size.
• the first electronic component having the pair of contact portions disposed on the both lateral surfaces is brought into elastic contact with the first right and left contact spring pieces at the first stage from a direction of sandwiching the both lateral surfaces. This makes it possible to prevent the backlash of the bus bars with respect to the terminal portion, and enables stable electric continuity between the first right and left contact spring pieces of the bus bars and the contact portions of the light emitting element contact portions 23 of the first electronic component.
• At least the pair of bus bars arranged in parallel can have the same configuration, and one kind of bus bar configuration can be provided.
• each of the bus bars is bent into a U-shape so that a pair of lateral walls becomes parallel to each other, and the first and second right and left contact spring pieces are punched in each of the lateral walls.
• FIG. 2 is a perspective view of a housing that houses the bus bars illustrated in FIG. 1.
• FIG. 3A is a side view of the housing that houses the bus bars
• FIG. 3B is a cross-sectional view taken along a line A-A of FIG. 3A.
• FIG. 4A is a side view of the bus bar illustrated in FIG. 1
• FIG. 4B is a plan view thereof
• FIG. 4C is a front view thereof.
• FIG. 6A is a perspective view of a semiconductor light emitting element
• FIG. 6B is a perspective view of a zener diode.
• FIG. 7 is a diagram illustrating a process of assembling the electronic component in a connection structure for the electronic component according to the embodiment of the present invention.
• FIG. 8 is a diagram illustrating the process of assembling the electronic component in which a housing is notched in the connection structure for the electronic component.
• FIG. 10 is a plan view of the connection structure for the electronic component after a joining portion is broken.
• FIG. 11 is a diagram illustrating a process of assembling the housing in the connection structure for the electronic component.
• FIG. 12 is a diagram illustrating a process of assembling an electric wire holder in the connection structure for the electronic component.
• FIG. 13 is a perspective view of an LED unit using the connection structure for the electronic component according to the embodiment of the present invention.
• FIG. 14 is a perspective view of a main portion of a related art connection structure for an electronic component. Description of Embodiments
• FIG. 1 is a perspective view of two bus bars used in a connection structure for an electronic component according to an embodiment of the present invention.
• FIG. 2 is a perspective view of a housing that houses the bus bars illustrated in FIG. 1.
• FIG. 3A is a side view of the housing that houses the bus bars, and
• FIG. 3B is a cross-sectional view taken along a lineA-A of FIG. 3A.
• connection structure for the electronic component has two bus bars 11 having the same configuration illustrated in FIG. 1 as a main portion of the configuration.
• the two bus bars are housed in a housing 13 illustrated in FIG. 2 in use.
• Each of the two bus bars 11 is formed with two upper and lower terminal portions 15a and 15b on one end thereof. As illustrated in FIG. 2, the bus bars 11 are housed into a pair of bus bar chambers 17 of the housing 13 formed into a cuboid from a bus bar insertion opening 21 of a housing upper surface 19 so as to be spaced from each other in parallel. The bus bar chambers 17 partially communicate with each other inside of the housing 13.
• the bus bars 11 each include the two upper and lower terminal portions 15a and 15b so as to connect a semiconductor 29 and a zener diode 31 which are plural kinds (two kinds in this embodiment) of first and second electronic components.
• the connection structure for the electronic component according to the present invention is not limited to this configuration, but may be applied to a configuration having only one terminal portion 15a, or a configuration having three or more terminal portions.
• the upper (first) terminal portion 15a is formed with a pair of facing first right and left contact spring pieces 51 and 53 that can come in elastic contact with each of light emitting element contact portions 23 (refer to FIGS. 6A and 6B) which are a pair of contact portions of a semiconductor light emitting element 29.
• the lower (second) terminal portion 15b is formed with a pair of parallel second right and left contact spring pieces 59 and 61 that can come in elastic contact with each of diode contact portions (refer to FIGS.
• electric contact portions of the two adjacent inside second right and left contact spring pieces 61 and 59 among the four second right and left contact spring pieces 59, 61 , 59, and 61 at the lower stage of the two bus bars 11 arranged in parallel are connected with a pair of diode contact portions 25 disposed on one surface of the zener diode 31 which is located below the semiconductor light emitting element 29 between the two bus bars 11 (refer to FIG. 5).
• the bus bars 11 are partially protruded to the external of the housing 13 in a state where the bus bars 11 are mounted in the housing 13.
• a side at which parts of the bus bars 11 are protruded from the housing 13 is called “rear”, and an opposite side thereof is called “front”.
• Each rear end of the bus bars 11 is equipped with a crimping blade 35 for cutting a coating of a coated electric wire 33 to allow the electric wire 33 to electrically contact with a conductor.
• a rear abutment piece 37, a rear elastic leg 39, a front elastic leg 41 , and a front abutment edge 43 are consecutively connected in the stated order on a front portion of the crimping blade 35.
• a joining portion 45 is formed between the front abutment edge 43 and the terminal portion 15a in each of the bus bars 11.
• the joining portion 45 can be broken after the bus bar 11 has been housed into the housing 3.
• the crimping blade 35, the rear abutment piece 37, the rear elastic leg 39, the front elastic leg 41 , the front abutment edge 43, and the upper and lower terminal portions 15a, 15b are punched out integrally by a sheet-metal working, and thereafter bent into a shape illustrated in FIG. 2.
• each bus bar 1 The terminal portions 15a and 15b of each bus bar 1 are bent into a U-shape so that a pair of lateral walls 47 is arranged in parallel, and the first and second right and left contact spring pieces 51 , 53, 59, and 61 , and the right and left component seats 55 and 57 are punched in each of the lateral walls 47.
• a main body of the bus bar 11 is bent into a U-shape, and the first and second right and left contact spring pieces 51 , 53, 59, and 61 , and the right and left component seats 55 and 57 are formed in the pair of facing lateral walls 47 by punching, thereby making it possible to easily and compactly manufacture an elastic contact structure having a large number of electric contact portions.
• FIG. 5 is a cross-sectional view of each electronic component mount portion 49 (refer to FIG. 2) of the pair of bus bars 11 in a state where the first and second electronic components are mounted.
• FIG. 6A is a perspective view of the semiconductor light emitting element 29, and
• FIG. 6B is a perspective view of the zener diode 31.
• the first right and left contact spring pieces 51 and 53 arranged in the upper terminal portion 15a are formed with bulges 71 protruded horizontally outward on a side of leading portions 51a and 53a that can be abutted against each other, which are formed as flexible pieces that can be elastically deformed in the horizontal direction of the bus bars 11 with the leading portions 51a and 53a that are abutted against each other as free ends.
• the bulges 71 of the two adjacent inside first right and left contact spring pieces 51 and 53 among the first right and left contact spring pieces 51 and 53 of the pair of bus bars 11 arranged in parallel within the housing 13 come in elastic contact with the light emitting element contact portions 23 of the both lateral surfaces 77 of the semiconductor light emitting element 29 arranged between the pair of bus bars 11. Also, the bulges 71 of the two outside first right and left contact spring pieces 51 and 53 among the first right and left contact spring pieces 51 and 53 of the pair of bus bars 11 come in elastic contact with respective inner lateral walls (inner walls) 73 of the housing 3. That is, the bulges 71 of the two inside first right and left contact spring pieces 51 and 53 form electric contact portions 75.
• the second right and left contact spring pieces 59 and 61 arranged in the lower terminal portions 15b are each formed with an electric contact portion 67 having a triangular shape whose vertex is protruded downward in a leading portion thereof, which is formed as a flexible piece that can be elastically deformed in a vertical direction of the bus bars 11 with the leading portion as a free end.
• the electric contact portions 67 of those two second right and left contact spring pieces 59 and 61 face the right and left component seats 55 and 57.
• the electric contact portions 67 of the two adjacent inside second right and left contact spring pieces 61 and 59 among the second right and left contact spring pieces 59 and 61 of the pair of bus bars 11 arranged in parallel within the housing 13 come in elastic contact with the pair of diode contact portions 25 on one surface of the zener diode 31 which is arranged between the pair of bus bars 11 , and the right and left component seats 55 and 57 are abutted against the other surface of the zener diode 31.
• the semiconductor light emitting element 29 is an electronic component having the pair of light emitting element contact portions 23 disposed on the both lateral surfaces 77, and the light emitting element contact portions 23 are each formed into an L-shape continuous from each of the both lateral surfaces 77 of the semiconductor light emitting element 29 to an element lower surface 79, and fixed thereto (refer to FIG. 5).
• the light emitting element contact portions 23 fixed to the both lateral surfaces 77 are each inclined in an L-shape with respect to the both lateral surfaces 77.
• the zener diode 31 is an electronic component for surface mount having the pair of diode contact portions 25 on one surface thereof. As illustrated in FIG.
• the both lateral surfaces 77 of the semiconductor light emitting element 29 face the electric contact portions 75 of the two adjacent inside first right and left contact spring pieces 51 and 53 among the first right and left contact spring pieces 51 and 53 of the pair of bus bars 11 arranged in parallel.
• One surface of the zener diode 31 on which the diode contact portions 25 are provided faces a side of the electric contact portions 67 of the second right and left contact spring pieces 61 and 59, and the other surface (rear surface) thereof is abutted against the lower right and left component seats 55 and 57.
• an inter-contact pitch of the semiconductor light emitting element 29 is different from an inter-contact pitch of the zener diode 31, and contact location directions of the light emitting element contact portions 23 and the diode contact portions 25 are also different from each other. That is, those two electronic components are different in the inter-contact pitch and the contact structure.
• two kinds of electronic components having the different contact structure can be mounted at the same time.
• the bulges 71 (electric contact portions 75) of the two adjacent inside first right and left contact spring pieces 51 and 53 among the four first right and left contact spring pieces 51 and 53 at the upper stage of the bus bars 11 arranged in parallel come in elastic contact with the pair of light emitting element contact portions 23 disposed on both lateral surfaces of the semiconductor light emitting element 29.
• the bulges 71 of the two outside first right and left contact spring pieces 51 and 53 among the first right and left contact spring pieces 51 and 53 of the pair of bus bars 1 come in elastic contact with the respective inner lateral walls 73 of the housing 13.
• the electric contact portions 67 of the two adjacent inside second right and left contact spring pieces 61 and 59 among the four second right and left contact spring pieces 59 and 61 at the lower stage of the bus bars 1 arranged in parallel come in elastic contact with the pair of diode contact portions 25 disposed on one surface of the zener diode 31 , and are abutted against the two adjacent inside right and left component seats 55 and 57 among the four second right and left component seats 55, 57, 55, and 57 disposed below.
• the zener diode 31 can be connected with the second right and left contact spring piece 61 which is located second from the left side, and the second right and left contact spring piece 61 which is located fourth from the left side. Further, the zener diode 31 can be connected with the second right and left contact spring piece 59 which is located first from the left side, and the second right and left contact spring piece 61 which is located fourth from the left side. Thus, the zener diode 31 can be connected with the spring pieces having the different inter-contact pitches or the different contact points.
• connection structure for the electronic component having the above configuration will be described.
• FIG. 7 is a diagram illustrating a process of assembling the electronic component in the connection structure for the electronic component according to the embodiment of the present invention.
• FIG. 8 is a diagram illustrating the process of assembling the electronic component in which the housing 13 is notched likewise.
• FIG. 9 is a diagram illustrating the process of assembling resistors likewise.
• FIG. 10 is a plan view of the connection structure for the electronic component after the joining portion 45 is broken likewise.
• FIG. 11 is a diagram illustrating a process of assembling the housing likewise.
• FIG. 12 is a diagram illustrating a process of assembling an electric wire holder likewise.
• FIG. 13 is a perspective view of an LED unit 81 using the connection structure for the electronic component according to the embodiment of the present invention.
• the two bus bar chambers 17 are formed in the housing 13.
• the bus bar chambers 17 have a rear wall 83 (refer to FIG. 2) at rear ends thereof, and a pair of holding grooves 85 is formed in an inner wall surface in front of the rear wall 83 of each bus bar chamber 17.
• the bus bars 11 inserted into each of the bus bar chambers 17 sandwich the rear wall 83 between the rear abutment piece 37 and the rear elastic leg 39 so as to regulate a dropout from the housing 13.
• An LED mount opening portion 87 and a diode mount opening portion 89 are formed at two upper and lower stages in a front surface of the housing 13.
• the semiconductor light emitting element 29 is inserted into the LED mount opening portion 87 with the light emitting element contact portions 23 fixed to the both lateral surfaces 77.
• the zener diode 31 is inserted into the diode mount opening portion 89 with the diode contact portions 25 disposed on an upper side.
• the light emitting element contact portions 23 and the diode contact portions 25 are connected to the electric contact portions 75 of the first right and left contact spring pieces 51 and 53, and the electric contact portions 67 of the second right and left contact spring pieces 61 and 59, respectively.
• the two inside first right and left contact spring pieces 53 and 51 are subject to a reaction force in a direction of bringing the first right and left contact spring pieces 53 and 51 close to each other from the inner lateral walls 73 of the housing 3.
• the semiconductor light emitting element 29 is positioned in the center between the inner lateral walls 73 of the housing 3 at both sides thereof by allowing the both lateral surfaces 77 to be elastically sandwiched between the inner lateral walls 73 of the housing 13 through the two inside first right and left contact spring pieces 53, 51 , and the two outside first right and left contact spring pieces 51 , 53.
• the two inside first right and left contact spring pieces 53, 51 , and the two outside first right and left contact spring pieces 51 , 53 elastically support the both lateral surfaces 77 of the semiconductor light emitting element 29 with respect to the inner lateral walls 73 of the housing 13. Therefore, a dimensional change of the housing 3 can be absorbed by a bend tolerance range of the respective first right and left contact spring pieces 51 and 53. Under the circumstances, the first right and left contact spring pieces 51 and 53 of the bus bars 11 can prevent the backlash of the semiconductor light emitting element 29 to obtain an appropriate contact load.
• the semiconductor light emitting element 29 having the pair of light emitting element contact portions 23 disposed on the both lateral surfaces 77 is brought into elastic contact with the pair of first right and left contact spring pieces 51 and 53 from a direction of sandwiching the both lateral surfaces 77 to enable stable electric continuity with the terminal portions 15a of the bus bars 11.
• resistor mount opening portions 93 are formed in a bottom surface 91 of the housing 3, and resistors 95 are inserted into the respective resistor mount opening portions 93.
• the resistor 95 is sandwiched between the front abutment edge 43 (refer to FIG. 4) and the front elastic leg 41 in each of the bus bars 11 , and an electric contact portion of the front elastic leg 41 is connected to a pair of resistor contact portions 97 of the resistor 95.
• the LED unit 81 needs to be a circuit having the semiconductor light emitting element 29, the zener diode 31 , and a circuit providing each of the resistors 95 between a positive electrode and a negative electrode.
• the joining portion 45 is formed between the front abutment edge 43 and the terminal portion 15a in each of the bus bars 11. As illustrated in FIG. 10, the joining portion 45 is cut whereby, in each of the bus bars 11 , the other resistor contact portion 97 of the resistor 95 having one resistor contact portion 97 brought in contact with the crimping blade 35 comes in contact with the front elastic leg 41. This leads to a circuit in which each of the resistors 95 is disposed in series between the crimping blade 35 and the terminal portion 15a.
• the housing 13 in which the semiconductor light emitting element 29 and the zener diode 31 are mounted is mounted in a lens cover 99.
• a housing insertion opening 101 is formed in a rear end surface of the lens cover 99.
• the crimping blades 35 are protruded from the housing 13 inserted into the lens cover 99, backward within the lens cover 99.
• an electric wire holder 103 is inserted into the lens cover 99 in which the housing 13 is mounted, from the housing insertion opening 101.
• U-shaped electric wire holding grooves 105 are formed in three-side outer surfaces of the electric wire holder 103 at two portions.
• Coated electric wires 33 are each bent in a U-shape and fitted into the respective electric wire holding grooves 105.
• Horizontal crimping blade entrance slits 107 are formed across the respective electric wire holding grooves 105 in a front surface of the electric wire holder 103.
• Locking claws 111 protruded from the lateral surfaces of the electric wire holder 103 inserted into the lens cover 99 is locked with locking holes 109 formed in lateral portions of the lens cover 99 to regulate disengagement of the housing 3 and the electric wire holder 03 per se from the lens cover 99.
• the housing 13 and the electric wire holder 103 are mounted in the lens cover 99 to configure the LED unit 81 illustrated in FIG. 13.
• the bulges 71 of the two outside first right and left contact spring pieces 51 and 53 among the four first right and left contact spring pieces 51 , 53, 51 , and 53 at the upper stage of the bus bars 11 arranged in parallel come in elastic contact with the respective inner lateral walls 73 of the housing 13.
• the semiconductor light emitting element 29 is positioned in the center between the inner lateral walls 73 of the housing 13 at both sides thereof by allowing the both lateral surfaces 77 to be elastically sandwiched between the inner lateral walls 73 of the housing 13 through the two inside first right and left contact spring pieces 53, 51 , and the two outside first right and left contact spring pieces 51 , 53.
• the two inside first right and left contact spring pieces 53, 51 , and the two outside first right and left contact spring pieces 51 , 53 elastically support the both lateral surfaces 77 of the semiconductor light emitting element 29 with respect to the inner lateral walls 73 of the housing 13. Therefore, the dimensional change of the housing 13 can be absorbed by the bend tolerance range of the respective first right and left contact spring pieces 51 and 53. Under the circumstances, the first right and left contact spring pieces 51 and 53 of the bus bars 11 can prevent the backlash of the semiconductor light emitting element 29 to obtain the appropriate contact load.
• the semiconductor light emitting element 29 having the pair of light emitting element contact portions 23 disposed on the both lateral surfaces 77 is brought into elastic contact with the pair of first right and left contact spring pieces 51 and 53 from a direction of sandwiching the both lateral surfaces 77. This makes it possible to prevent the backlash of the bus bars 11 with respect to the terminal portion 15a, and enables stable electric continuity between the first right and left contact spring pieces 51 and 53 of the bus bars 11 and the light emitting element contact portions 23 of the semiconductor light emitting element 29.
• the two bus bars 11 having two pairs of parallel first right and left contact spring pieces 51 and 53, and the second right and left contact spring pieces 59 and 61 formed therein are spaced from each other in parallel.
• the upper terminal portion 5a can be connected with the semiconductor light emitting element 29 different in size and contact location direction from the zener diode 31.
• zener diodes 31 at the lower terminal portions 15b can be also connected with four kinds of zener diodes 31 different in the inter-contact pitch and the contact position.
• housings 13 different in the interval between the pair of bus bar chambers 17 are prepared, and the pair of bus bars 11 is arranged in parallel at the different interval within the housing 13, to thereby enable plural kinds of semiconductor light emitting elements different in the inter-contact pitch and the size to be connected with the housings 13.
• connection structure for the electronic component of this embodiment the kind of bus bars 11 is limited to one, and the semiconductor light emitting element 29 and the zener diode 31 , which are different in the pitch between the contact portions, the outer configuration, and the size can be connected to the connection structure. Even if the connection structure are connected to the light emitting element contact portions 23 on the lateral surface sides of the semiconductor light emitting element 29, an influence of the dimension tolerance and the contraction of the housing 13 can be ignored, and the stable connection can be conducted.
• connection structure for the electronic component according to the present invention is not limited to the above-mentioned embodiment, but can be appropriately deformed and improved.
• material, configuration, dimension, the number, and installation location of the respective constituent elements in the above-mentioned embodiment are arbitrarily, and not limited if the present invention can be achieved.
• the present invention is useful for providing a connection structure for an electronic component which can connect plural kinds of electronic components which are different in a pitch between contact portions, outer configuration, and size with the provision of one kind of bus bar.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Details Of Connecting Devices For Male And Female Coupling (AREA)
• Connecting Device With Holders (AREA)
• Led Device Packages (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)

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• 2012
  • 2012-03-05 JP JP2012048336A patent/JP2013182878A/ja active Pending
• 2013
  • 2013-02-28 CN CN201380012930.2A patent/CN104584703A/zh active Pending
  • 2013-02-28 KR KR1020147024923A patent/KR20140128410A/ko not_active Withdrawn
  • 2013-02-28 WO PCT/JP2013/056214 patent/WO2013133348A2/fr not_active Ceased
  • 2013-02-28 DE DE112013001296.0T patent/DE112013001296T5/de not_active Withdrawn
• 2014
  • 2014-08-25 US US14/467,463 patent/US20140363993A1/en not_active Abandoned

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