WO2013166375A4 - Tool for use with dual-sided chemical mechanical planarization pad conditioner - Google Patents

Tool for use with dual-sided chemical mechanical planarization pad conditioner Download PDF

Info

Publication number
WO2013166375A4
WO2013166375A4 PCT/US2013/039447 US2013039447W WO2013166375A4 WO 2013166375 A4 WO2013166375 A4 WO 2013166375A4 US 2013039447 W US2013039447 W US 2013039447W WO 2013166375 A4 WO2013166375 A4 WO 2013166375A4
Authority
WO
WIPO (PCT)
Prior art keywords
holder
tool
face
dual
field strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2013/039447
Other languages
French (fr)
Other versions
WO2013166375A1 (en
Inventor
Michael Rothenberg
Taewook Hwang
Paul Cyr
Rachel Z. Pytel
Ramanujam Vedantham
Srinivasan Ramanath
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Abrasifs SA
Saint Gobain Abrasives Inc
Original Assignee
Saint Gobain Abrasifs SA
Saint Gobain Abrasives Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Abrasifs SA, Saint Gobain Abrasives Inc filed Critical Saint Gobain Abrasifs SA
Priority to CN201380030940.9A priority Critical patent/CN104471683A/en
Priority to KR1020147033029A priority patent/KR20150005661A/en
Priority to JP2015510476A priority patent/JP2015520680A/en
Publication of WO2013166375A1 publication Critical patent/WO2013166375A1/en
Publication of WO2013166375A4 publication Critical patent/WO2013166375A4/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Magnetic Heads (AREA)

Abstract

A tool includes a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner. The holder has a magnetic material, a first magnetic field strength (H1) at a first face, and a second magnetic field strength (H2) at a second face opposite the first face. The first magnetic field strength (H1) is different than the second magnetic field strength (H2).

Claims

AMENDED CLAIMS received by the International Bureau on 15 November 2013 (15.11.2013)
1. A tool comprising: a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner, the holder comprising a magnetic material, wherein the holder comprises a first magnetic field strength (HI) at a first face, a second magnetic field strength (H2) at a second face opposite the first face, and the first magnetic field strength (HI) is different than the second magnetic field strength (H2).
2. A tool comprising: a holder having a first face configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner, a second face opposite the first face, an internal cavity located inside the holder, the second face is seamless with respect to the internal cavity, and the internal cavity contains a magnetic material.
3. The tool of claim 2, wherein the internal cavity is permanently sealed with a cap that is welded to the holder adjacent the second face.
4. The tool of claim 3, wherein the second face is polished such that the cap and second face are flush and seamless.
5. The tool of claim 3 or 4, wherein the holder and cap are formed from a same material, wherein the holder and cap are formed from different materials.
6. The tool of any one of claims 2-4, wherein the second face has a selected surface roughness, wherein the second face is essentially free of macroscopic grooves and
protrusions.
7. The tool of any one of claims 2-4, wherein the second face has a surface roughness that is no greater than about 32 microinches, no greater than about 25 microinches, no greater than about 20 microinches, no greater than about 15 microinches, no greater than about 10 microinches, the surface roughness is at least about 2 microinches, at least about 4 microinches, at least about 6 microinches, at least about 8 microinches.
70
8. The tool of any one of claims 3-4, wherein the second face and the cap have surface roughnesses, there is a relative difference in surface roughness between the surface roughnesses of the second face and the cap, and the relative difference in surface roughness between the second face and the cap is no greater than about 20%, no greater than about 15%, no greater than about 10%, no greater than about 5%, no greater than about 1%, at least about 1%, at least about 2%, at least about 5%.
9. The tool of claim 1, wherein the first magnetic field strength (HI) is greater than the second magnetic field strength (H2), wherein the first magnetic field strength (HI) is less than the second magnetic field strength (H2), wherein the first magnetic field strength and the second magnetic field strength define a ratio (H1:H2) of at least about 1.1: 1, at least about 2: 1, or at least about 5: 1.
10. The tool of claims 1 or 9, wherein the holder comprises a material having an elastic modulus of at least about 2E3 MPa, wherein the holder comprises a material selected from the group of materials consisting of metals, metal alloys, polymers, ceramics, and a combination thereof.
11. The tool of any one of claims 1-4, further comprising a dual-sided CMP pad conditioner, and the holder and dual-sided CMP pad conditioner are removably coupled such that the dual-sided CMP pad conditioner has reversible orientations relative to the holder.
12. The tool of any one of claims 1-4, wherein the dual-sided CMP pad conditioner comprises a substrate having an engagement structure configured for engagement with the holder, wherein the holder comprises a recess configured for complementary engagement with the dual-sided CMP pad conditioner.
13. The tool of any one of claims 1-4, wherein the magnetic material comprises a permanent magnet, wherein the magnetic material comprises an electromagnet, wherein the magnetic material is configured for selective operation between a first state and a second state for selective coupling with and decoupling from, respectively, the dual- sided CMP pad conditioner.
71
14. The tool of any one of claims 1-4, wherein the dual-sided CMP pad conditioner comprises a substrate having an engagement structure configured for engagement with the holder, wherein the substrate comprises a substrate magnetic material that is configured for selective operation between a first state and a second state for selective coupling with and decoupling from, respectively, the holder.
15. The tool of any one of claims 1-4, wherein the magnetic material is a magnetic object that is separate from the holder.
72

STATEMENT UNDER ARTICLE 19

Please substitute replacement sheets 67, 68 and 69 for original sheets 67, 68 and 69 in the application. Claims 6-8 and 11-15 were amended to comply with the third sentence of PCT Rule 6.4(a), since multiple dependent claims should not serve as the basis for any other multiple dependent claims.

We ask that you please update your records to reflect these changes.

Respectfully submitted,

November 15, 2013 /Michael E. Noe, Jr./

Michael E. Noe, Jr., Reg. No. 44,975 Attorney for Applicant(s)

ABEL LAW GROUP, LLP

8911 N. Capital of Texas Hwy

Bldg 4, Suite 4200

Austin, TX 78759

(512) 900-8500 (phone)

(512) 795-7677 (fax)

PCT/US2013/039447 2012-05-04 2013-05-03 Tool for use with dual-sided chemical mechanical planarization pad conditioner Ceased WO2013166375A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201380030940.9A CN104471683A (en) 2012-05-04 2013-05-03 Tools for Bilateral CMP Pad Regulators
KR1020147033029A KR20150005661A (en) 2012-05-04 2013-05-03 Tool for use with dual-sided chemical mechanical planarization pad conditioner
JP2015510476A JP2015520680A (en) 2012-05-04 2013-05-03 Tool used with double-sided chemical mechanical planarization pad conditioner

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261643053P 2012-05-04 2012-05-04
US61/643,053 2012-05-04

Publications (2)

Publication Number Publication Date
WO2013166375A1 WO2013166375A1 (en) 2013-11-07
WO2013166375A4 true WO2013166375A4 (en) 2014-01-09

Family

ID=49514906

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2013/039447 Ceased WO2013166375A1 (en) 2012-05-04 2013-05-03 Tool for use with dual-sided chemical mechanical planarization pad conditioner

Country Status (6)

Country Link
US (1) US20130316630A1 (en)
JP (1) JP2015520680A (en)
KR (1) KR20150005661A (en)
CN (1) CN104471683A (en)
TW (1) TW201350267A (en)
WO (1) WO2013166375A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101413030B1 (en) 2009-03-24 2014-07-02 생-고벵 아브라시프 Abrasive tool for use as a chemical mechanical planarization pad conditioner
SG176629A1 (en) 2009-06-02 2012-01-30 Saint Gobain Abrasives Inc Corrosion-resistant cmp conditioning tools and methods for making and using same
EP2474025A2 (en) 2009-09-01 2012-07-11 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
CN104736299A (en) * 2012-08-02 2015-06-24 3M创新有限公司 Abrasive articles with precisely shaped features and method of making thereof
JP6254383B2 (en) * 2013-08-29 2017-12-27 株式会社荏原製作所 Dressing apparatus, chemical mechanical polishing apparatus including the dressing apparatus, and dresser disk used therefor
US20150158143A1 (en) * 2013-12-10 2015-06-11 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemically mechanically polishing
KR101571953B1 (en) * 2014-01-02 2015-11-25 주식회사 엘지실트론 Wafer lapping apparatus
TWI551400B (en) * 2014-10-23 2016-10-01 中國砂輪企業股份有限公司 Grinding tool and method of manufacturing the same
JP2018501119A (en) * 2014-12-22 2018-01-18 スリーエム イノベイティブ プロパティズ カンパニー Abrasive article having a removable abrasive member and method for separating and replacing a removable abrasive member
WO2018169536A1 (en) * 2017-03-16 2018-09-20 Intel Corporation Conditioning disks for chemical mechanical polishing
US12020946B2 (en) * 2018-07-31 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ld. Chemical mechanical polishing apparatus
KR102718281B1 (en) * 2018-11-19 2024-10-15 삼성전자주식회사 Polishing slurry and method of manufacturing semiconductor device
CN110052962A (en) * 2019-04-25 2019-07-26 西安奕斯伟硅片技术有限公司 A kind of polishing pad trimmer, processing unit (plant) and method
TWI706831B (en) * 2020-02-10 2020-10-11 富仕多科技有限公司 Base seat used in polishing pad conditioning apparatus
CN113524058B (en) * 2021-07-12 2022-05-03 华侨大学 Single-layer diamond abrasive particle ordered arrangement brazing method for template-free furnace brazing

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4222204A (en) * 1979-06-18 1980-09-16 Benner Robert L Holder for an abrasive plate
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5667433A (en) * 1995-06-07 1997-09-16 Lsi Logic Corporation Keyed end effector for CMP pad conditioner
GB9700527D0 (en) * 1997-01-11 1997-02-26 Ecc Int Ltd Processing of ceramic materials
US6033293A (en) * 1997-10-08 2000-03-07 Lucent Technologies Inc. Apparatus for performing chemical-mechanical polishing
US6402603B1 (en) * 1998-12-15 2002-06-11 Diamond Machining Technology, Inc. Two-sided abrasive tool
US6059638A (en) * 1999-01-25 2000-05-09 Lucent Technologies Inc. Magnetic force carrier and ring for a polishing apparatus
JP3772946B2 (en) * 1999-03-11 2006-05-10 株式会社荏原製作所 Dressing apparatus and polishing apparatus provided with the dressing apparatus
US6244941B1 (en) * 1999-03-30 2001-06-12 Speedfam - Ipec Corporation Method and apparatus for pad removal and replacement
JP4163359B2 (en) * 2000-01-24 2008-10-08 不二越機械工業株式会社 Polishing surface plate
US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
JP2002200553A (en) * 2000-11-06 2002-07-16 Nikon Engineering Co Ltd Polishing equipment
US6835118B2 (en) * 2001-12-14 2004-12-28 Oriol, Inc. Rigid plate assembly with polishing pad and method of using
US7004817B2 (en) * 2002-08-23 2006-02-28 Micron Technology, Inc. Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
KR200298920Y1 (en) * 2002-09-17 2003-01-03 아남반도체 주식회사 Conditioner end effecter of a chemical-mechanical polisher
KR100506934B1 (en) * 2003-01-10 2005-08-05 삼성전자주식회사 Polishing apparatus and the polishing method using the same
KR20080033368A (en) * 2005-07-09 2008-04-16 티비더블유 인더스트리즈, 인코포레이티드 Improved end effector arm placement for chemical mechanical planarization conditioning
KR101413030B1 (en) * 2009-03-24 2014-07-02 생-고벵 아브라시프 Abrasive tool for use as a chemical mechanical planarization pad conditioner
JP2011011303A (en) * 2009-07-03 2011-01-20 Mitsubishi Materials Corp Cmp pad conditioner
SG176629A1 (en) * 2009-06-02 2012-01-30 Saint Gobain Abrasives Inc Corrosion-resistant cmp conditioning tools and methods for making and using same

Also Published As

Publication number Publication date
KR20150005661A (en) 2015-01-14
WO2013166375A1 (en) 2013-11-07
JP2015520680A (en) 2015-07-23
US20130316630A1 (en) 2013-11-28
TW201350267A (en) 2013-12-16
CN104471683A (en) 2015-03-25

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