WO2013175944A1 - Dispositif imageur - Google Patents

Dispositif imageur Download PDF

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Publication number
WO2013175944A1
WO2013175944A1 PCT/JP2013/062539 JP2013062539W WO2013175944A1 WO 2013175944 A1 WO2013175944 A1 WO 2013175944A1 JP 2013062539 W JP2013062539 W JP 2013062539W WO 2013175944 A1 WO2013175944 A1 WO 2013175944A1
Authority
WO
WIPO (PCT)
Prior art keywords
holder
lens frame
male screw
imaging apparatus
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/062539
Other languages
English (en)
Japanese (ja)
Inventor
井上尚之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of WO2013175944A1 publication Critical patent/WO2013175944A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies

Definitions

  • the present invention relates to an imaging apparatus, and more particularly to an imaging apparatus that is small and suitable for mass production.
  • Small and thin imaging devices are used in mobile terminals such as mobile phones and PDAs (Personal Digital Assistants).
  • a solid-state image pickup element such as a CCD type image sensor or a CMOS type image sensor is known.
  • the number of pixels of an image sensor has been increased, and higher resolution and higher performance have been achieved.
  • a metal paste for example, a solder paste
  • a solder paste is applied (potted) in advance to a predetermined position on the circuit board.
  • a camera module in which a male screw is formed on a lens holder and a female screw is formed on a lens barrel so that the relative position between the lens holder and an image sensor can be adjusted.
  • a camera module in order to prevent dust from entering the surface of the image sensor from the outside, it is usually screwed together to complete a camera module, for example, as disclosed in FIG.
  • it is designed so that a sealed space can be formed between the holder and the image sensor.
  • Patent Document 2 provides an air escape portion at a position out of phase with a notch communicating with the outside, thereby ensuring the air permeability inside and outside.
  • An imaging device that can prevent intrusion has been proposed.
  • dust is generated due to friction when the holder for holding the imaging lens is screwed into the lens frame.
  • No countermeasure has been proposed.
  • the present invention has been made in view of the problems of the related art, and provides an imaging apparatus that can prevent dust and unnecessary light from entering while ensuring air permeability inside and outside, and can suppress the generation of dust. With the goal.
  • An imaging apparatus is provided.
  • the head of the holder is in a non-contact state with the lens frame, the holder is provided with a male screw around the body portion, the lens frame is provided with a female screw that is screwed into the male screw, A part of the outer periphery is cut to form an air escape portion that communicates the inside and the outside of the lens frame, and the air escape portion is formed when the male screw and the female screw are screwed together. It is characterized by being provided radially outward from the inner peripheral ridgeline.
  • the head of the holder when the holder is screwed into the lens frame while adjusting the position of the imaging lens in the optical axis direction, the head of the holder is not in contact with the lens frame.
  • the head of the holder and the lens frame do not slide, and generation of dust due to friction can be avoided.
  • a gap occurs between the holder head and the lens frame, and dust and unnecessary light enter from the outside through the gap. It becomes easy to do.
  • a part of the outer periphery of the male screw portion is cut to form an air escape portion that communicates the inside and the outside of the lens frame, so that the inside of the sealed imaging device becomes hot.
  • the expanded air can be discharged to the outside through the air escape portion, thereby suppressing, for example, deformation or breakage of the holder or the like. If a simple air escape portion is formed, dust and unnecessary light may easily enter the imaging device.
  • the air escape portion is provided radially outward from the inner peripheral ridge line of the female screw, thereby forming a kind of labyrinth structure, and an imaging device It prevents dust and unwanted light from entering straight inside.
  • “sealing” means that air leaks from the end of the lens frame when the image sensor (or the substrate on which the image sensor is mounted) is fixed, for example, so as to close the end of the lens frame. It means no state.
  • the air escape portion includes a flat portion obtained by cutting a part of the male screw in a tangential direction, and a convex formed at the center of the flat portion. It consists of a part.
  • the holder is molded using a mold, and the convex portion has a part of the outer periphery of the male screw portion radially inward. It is characterized by a shifted shape.
  • a tool for forming the helical shape is locally shifted inward in the radial direction, Since the convex portion can be formed, the mold can be easily processed.
  • the mold is processed by electric discharge machining.
  • the convex portion can be formed by locally shifting the electrode for machining and forming the spiral shape radially inward. Is easy to process.
  • the imaging device according to claim 5 is characterized in that, in the invention according to any one of claims 1 to 4, the imaging device is formed through a reflow process.
  • the reflow process is a process in which solder balls or the like between terminals are melted by passing through a high-temperature reflow bath to realize collective connection, and is described in, for example, JP-A-2002-223378.
  • an imaging apparatus that can prevent dust and unnecessary light from entering while ensuring air permeability inside and outside, and can suppress the generation of dust.
  • FIG. 7 is a view showing the holder of FIG. 5 together with the lens frame 22 when viewed in the direction of arrow VII.
  • FIG. 1 It is the figure which cut
  • FIG. 1 is a perspective view of an imaging apparatus 50 according to the present embodiment
  • FIG. 2 is a diagram of the configuration of FIG. 1 viewed from above
  • FIG. 3 is a diagram of the configuration of FIG. It is sectional drawing cut
  • an imaging device 50 includes a CMOS image sensor 51 as a solid-state imaging device having a photoelectric conversion unit 51a, and an imaging lens that causes the photoelectric conversion unit 51a of the image sensor 51 to capture a subject image.
  • a holder 21 that holds the imaging lens OU a lens frame 22 to which the holder 21 is attached, and a substrate 52 that has an external connection terminal (not shown) that holds the image sensor 51 and transmits and receives electrical signals.
  • the image sensor 51 has a photoelectric conversion unit 51a as a light receiving unit in which pixels (photoelectric conversion elements) are two-dimensionally arranged at the center of the light receiving side plane, and a signal processing circuit (not shown). It is connected to the.
  • a signal processing circuit includes a drive circuit unit that sequentially drives each pixel to obtain a signal charge, an A / D conversion unit that converts each signal charge into a digital signal, and a signal that forms an image signal output using the digital signal. It consists of a processing unit and the like.
  • a number of pads (not shown) are arranged near the outer edge of the plane on the light receiving side of the image sensor 51, and are connected to the substrate 52 via wires (not shown).
  • the image sensor 51 converts the signal charge from the photoelectric conversion unit 51a into an image signal such as a digital YUV signal, and outputs the image signal to a predetermined circuit on the substrate 52 via a wire (not shown).
  • Y is a luminance signal
  • the solid-state imaging device is not limited to the CMOS image sensor, and other devices such as a CCD may be used.
  • the substrate 52 is connected to an external circuit (for example, a control circuit included in a host device of a portable terminal mounted with an imaging device) via an external connection terminal (not shown), and a voltage for driving the image sensor 51 from the external circuit. And a clock signal can be received, and a digital YUV signal can be output to an external circuit.
  • an external circuit for example, a control circuit included in a host device of a portable terminal mounted with an imaging device
  • an external connection terminal not shown
  • a clock signal can be received, and a digital YUV signal can be output to an external circuit.
  • the hollow rectangular tube-shaped lens frame 22 has a circular hole 22b in which the head 21b of the holder 21 is accommodated in a non-contact manner with a clearance S at the top, and the lower end opens in a rectangular shape to enclose the image sensor 51.
  • the entire surface of the substrate 52 is bonded and sealed, and further has a female screw 22a at the center of the inner periphery.
  • a holder 21 is disposed inside the lens frame 22.
  • An imaging lens OU is bonded and fixed inside the holder 21, and the object side optical surface is exposed from the opening 21 e of the holder 21.
  • the imaging lens OU may be made of plastic, but is preferably made of glass having excellent heat resistance or a WLO (wafer lens having optical surfaces formed on both sides of a transparent substrate) in consideration of the reflow process.
  • the imaging lens OU may be a single lens or a plurality of lenses.
  • a sealed space is formed between the imaging element and the lens frame (by the threaded male screw 21c and female screw 22a).
  • the imaging device is heated at the time of reflowing in the sealed internal space A), the bonding process, etc., and the internal pressure in the sealed space increases, the lens frame is deformed or broken. Therefore, in the present embodiment, the internal space of the imaging device is communicated with the outside as described later.
  • FIG. 4 is a perspective view of the holder 21. 3 and 4, the holder 21 has a trunk portion 21a, a flange-shaped head portion 21b, and a male screw 21c formed on the outer periphery of the trunk portion 21a.
  • a part of the male screw 21c is formed at the center of a D-cut portion (flat portion) 21d (only one is shown in FIG. 4) formed so as to cut the outer periphery by two planes parallel to the axis, and the D-cut portion 21d.
  • a convex portion 21p has such a shape that the outer periphery of the male screw 21c is shifted radially inward.
  • the D cut portion 21d and the convex portion 21p constitute an air escape portion.
  • the D-cut portion 21d is formed so as to be positioned substantially the same (or slightly radially outside) as the bottom of the male screw 21c on the central parting line PL (FIG. 5) formed at the time of molding. Has been.
  • an opening 21e is formed at the center of the head 21b of the holder 21, and bottomless cutouts 21f and bottomed cutouts 21g are alternately formed at the outer periphery around the opening 21e.
  • path 21h extended in the circumferential direction and whose outer diameter is smaller than the external thread part 21c is formed.
  • the bottomed notch 21g having the same phase as the D-cut portion 21d has a relatively shallow shape and has a partition 21k at the bottom thereof, and therefore does not communicate with the passage 21h.
  • the bottomless notch 21f out of phase with the D-cut portion 21d has a relatively deep shape and communicates with the passage 21h.
  • the jig JG described later since the jig JG described later has two claw portions JGa to be engaged with the notches, two bottomless notches 21f are essentially necessary, but the degree of freedom of the engagement angle of the jig JG is sufficient. In order to ensure, it is desirable to provide four cutouts. In that case, in addition to the two bottomless cutouts 21f, a passage 21h is provided so that foreign matter does not enter even if the phase coincides with the D cut portion 21d. Two bottomed cutouts 21g that do not communicate with each other are provided. The number and interval of the cutouts are not limited to the above, and it is sufficient if the bottomless cutout 21f is out of phase with the D cut portion 21d.
  • the entire cutout portion may be a bottomed cutout 21g.
  • the bottomless notch 21f more ventilation space can be secured, and furthermore, by providing the bottomless notch 21f, a vent hole is secured, so that the entire circumference of the non-contact portion of the head 21b is secured. It is also effective when attaching an adhesive.
  • FIG. 5 is a diagram for explaining a method of forming the holder.
  • the hollow cylindrical mold M1 is for molding the head 21b of the holder 21.
  • the half-cylindrical molds M ⁇ b> 2 and M ⁇ b> 3 form the body portion 21 a of the holder 21.
  • the mold M4 forms the inner peripheral shape of the holder 21.
  • the mold M1 is provided with a protrusion M1a corresponding to the notches 21f and 21g, and a protrusion M1b that forms the opening 21e of the holder 21.
  • the mold M4 is formed with a cylindrical portion M4a that forms the inner periphery of the holder 21.
  • the molds M2 and M3 are formed with screw forming portions M2a and M3a corresponding to the male screw 21c, and inner peripheral overhanging portions M2b and M3b (see FIG. 6) corresponding to the D-cut portion 21d.
  • FIG. 6 the electric discharge machining of the screw forming portions M2a and M3a in the molds M2 and M3 will be described.
  • the electric discharge machining electrode T disposed on the inner diameter side of the cylindrical mold material M is formed by the mold. In this case, the electrode T is shifted radially inward at positions corresponding to the inner peripheral overhanging portions M2b and M3b.
  • the inner peripheral overhanging portions M2b and M3b are formed on the radially inner side. Will be.
  • the dotted lines in FIG. 6 are the shapes of the screw forming portions M2a and M3a formed when the electrode T is not shifted.
  • the inside is filled with resin and solidified to form the holder 21.
  • the molds M1 and M4 are punched out so as to be separated in the axial direction, and the molds M2 and M3 are punched out along the D-cut portion 21d in the direction orthogonal to the axial line. Accordingly, the parting line PL formed by the molds M2 and M3 crosses the center of the D cut portion 21d and gets over the convex portion 21p, and is generated in parallel to the axis.
  • the holder 21 is completed.
  • the male screw 21 c is screwed into the female screw 22 a of the lens frame 22 as shown in FIG. 3.
  • the holder 21 can be screwed with respect to the lens frame 22 by rotating the jig JG with the claw portion JGa fitted in the notch 21f or the notch 21g. Is incident on the image sensor for inspection through the imaging lens OU, so that the position of the imaging lens OU in the optical axis direction can be adjusted while viewing the output.
  • FIG. 7 is a cross-sectional view showing a state in which the holder 21 and the lens frame 22 are assembled at a position corresponding to FIG.
  • FIG. 8 is a view of the D-cut portion 21d as viewed in the optical axis direction, with the left half being cut at the groove bottom of the female screw 22a and the right half being cut at the groove bottom of the male screw 21c.
  • the head 21b of the holder 21 is not in the circular hole 22b of the lens frame 22. Since it is in a contact state, the head 21b and the lens frame 22 do not slide, and generation of dust due to friction can be avoided.
  • the holder 21 After the position adjustment of the imaging lens OU, the holder 21 is bonded to the lens frame 22. At this time, since the notch 21g is relatively large, it is not blocked even if the adhesive flows. Thereafter, in the reflow process, the lens frame 22 is mounted on the substrate 52 together with the image sensor 51. At this time, the air that has been heated and expanded in the space A (see FIG. 3) in the lens frame 22 has a D-cut portion 21d and a convex portion 21p, and a female screw 22a of the lens frame 22 as shown by dotted lines in FIG.
  • FIGS. 9A and 9B are diagrams illustrating a state in which the imaging device 50 is mounted on a mobile phone 100 as a mobile terminal that is a digital device.
  • FIG. 10 is a control block diagram of the mobile phone 100.
  • the imaging device 50 is disposed, for example, such that the object-side end surface of the imaging lens OU is provided on the back surface of the mobile phone 100 (the liquid crystal display unit 70 side is the front surface) and corresponds to a position below the liquid crystal display unit 70. Is done.
  • the external connection terminal (not shown) of the imaging device 50 is connected to the control unit 101 of the mobile phone 100 and outputs an image signal such as a luminance signal or a color difference signal to the control unit 101 side.
  • the cellular phone 100 controls each unit in an integrated manner, and also supports a control unit (CPU) 101 that executes a program corresponding to each process, and inputs a number and the like with keys.
  • An input unit 60 a display unit 70 for displaying captured images and videos, a wireless communication unit 80 for realizing various information communications with an external server, a system program and various processing programs for the mobile phone 100,
  • a storage unit (ROM) 91 that stores necessary data such as a terminal ID, and various processing programs and data executed by the control unit 101, processing data, imaging data by the imaging device 50, and the like are temporarily stored.
  • a temporary storage unit (RAM) 92 used as a work area for storage.
  • an image signal of a still image or a moving image is captured by the image sensor 51.
  • the image signal input from the imaging device 50 is transmitted to the control system of the mobile phone 100 and stored in the storage unit 92 or displayed on the display unit 70, and further, video information is transmitted via the wireless communication unit 80. Will be transmitted to the outside.
  • the present invention is not limited to the embodiments described in the specification, and other embodiments and modifications are included for those skilled in the art from the embodiments and technical ideas described in the present specification. it is obvious.
  • the present invention is effective not only in a reflow process but also in a high temperature environment such as an inspection process.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
PCT/JP2013/062539 2012-05-22 2013-04-30 Dispositif imageur Ceased WO2013175944A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012116144 2012-05-22
JP2012-116144 2012-05-22

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WO2013175944A1 true WO2013175944A1 (fr) 2013-11-28

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015152875A (ja) * 2014-02-19 2015-08-24 株式会社シグマ レンズ鏡筒
JP2016156864A (ja) * 2015-02-23 2016-09-01 日本電産コパル株式会社 レンズ鏡筒、撮像装置、光学機器及び電子機器
WO2024095601A1 (fr) * 2022-10-31 2024-05-10 興和株式会社 Unité de caméra

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012008268A1 (fr) * 2010-07-14 2012-01-19 コニカミノルタオプト株式会社 Dispositif d'image et procédé de production associé

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012008268A1 (fr) * 2010-07-14 2012-01-19 コニカミノルタオプト株式会社 Dispositif d'image et procédé de production associé

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015152875A (ja) * 2014-02-19 2015-08-24 株式会社シグマ レンズ鏡筒
JP2016156864A (ja) * 2015-02-23 2016-09-01 日本電産コパル株式会社 レンズ鏡筒、撮像装置、光学機器及び電子機器
WO2024095601A1 (fr) * 2022-10-31 2024-05-10 興和株式会社 Unité de caméra

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