WO2013191508A1 - Dispositif d'éclairage à réseaux de diodes électroluminescentes multiples et procédé pour le fabriquer - Google Patents

Dispositif d'éclairage à réseaux de diodes électroluminescentes multiples et procédé pour le fabriquer Download PDF

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Publication number
WO2013191508A1
WO2013191508A1 PCT/KR2013/005507 KR2013005507W WO2013191508A1 WO 2013191508 A1 WO2013191508 A1 WO 2013191508A1 KR 2013005507 W KR2013005507 W KR 2013005507W WO 2013191508 A1 WO2013191508 A1 WO 2013191508A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting diode
light emitting
module
housing
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2013/005507
Other languages
English (en)
Korean (ko)
Inventor
한장민
우현
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GLOBAL AND CREATIVE PARTINERSHIP CO Ltd
Original Assignee
GLOBAL AND CREATIVE PARTINERSHIP CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GLOBAL AND CREATIVE PARTINERSHIP CO Ltd filed Critical GLOBAL AND CREATIVE PARTINERSHIP CO Ltd
Publication of WO2013191508A1 publication Critical patent/WO2013191508A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023—Power supplies in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a multi-array light-emitting diode (LED) illuminator using a heat dissipation liquid having excellent heat dissipation efficiency and a manufacturing method thereof.
  • LED light-emitting diode
  • LED lighting equipment has been spotlighted as a lighting device capable of generating brightness similar to that of incandescent and fluorescent lamps with low power.
  • the heat dissipation problem in the LED lighting device not only shortens the life of the LED package itself, but also has been made to solve the heat dissipation problem because it shortens the life of the power supply module for supplying the LED and lowers the luminous efficiency.
  • the present invention provides a multi-array light emitting diode lighting device having high heat dissipation efficiency, preventing damage to the light emitting diode chip due to breakdown voltage, and lowering the manufacturing cost in a high output light emitting diode lighting device, in which heat generation is a particular problem, and manufacturing the same. It is to provide a method.
  • the base including a power terminal capable of electrical connection with an external AC power source, the base of A plurality of power sockets are formed in the circumferential surface; And a plurality of cylindrical light emitting diode modules attached to the power socket, wherein the light emitting diode module comprises: a module base part attached to the power socket; A cylindrical housing hermetically coupled to the module base portion; A light emitting diode package installed inside the housing; A power supply module for converting the external AC power to supply power to the LED package; A support structure for fixing the light emitting diode package and the power supply module; And an insulating heat dissipation filled in the housing to impregnate the light emitting diode package and the power supply module, thereby dissipating heat generated from the light emitting diode package and the power supply module. device.
  • the housing and the sealing material is made of a silicone resin
  • the insulating heat dissipating liquid may be a silicone-based insulating oil.
  • the insulating heat dissipating solution may be one of dimethyl silicone oil, methyl phenyl silicone oil, and methyl hydrogen silicone oil.
  • the light emitting diode module may further include a heat rod, part of which is impregnated in the insulating heat dissipating liquid, and part of which protrudes through the base part.
  • the base has a circular cross section, and the plurality of power sockets may be installed on the bottom of the base at a predetermined interval.
  • the housing may be made of a thermoplastic resin material.
  • the housing may include glass having a light diffusion coating on the surface thereof.
  • the support structure may be used as a power supply line for supplying the external AC power to the power supply module.
  • the irradiation light of the light emitting diode package may be installed to face outward.
  • the method of manufacturing a multi-array light emitting diode lighting device may include installing a heat rod partially impregnated in the insulating heat dissipation liquid and partially protruding from the base portion. have.
  • Figure 2 is a bottom view of a multi-array light emitting diode lighting device of one embodiment of the present invention.
  • Figure 3 is a longitudinal cross-sectional view of a multi-array light emitting diode lighting device of one embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a first embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device which is an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a second embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device which is one embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a third embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device which is one embodiment of the present invention.
  • LED lighting device may be used in various shapes and shapes, such as a bulb-type LED lighting device, a fluorescent LED lighting device, or a flat panel LED lighting device. It should be understood that it can.
  • FIG. 1 is a perspective view of a multi-array LED lighting device according to an embodiment of the present invention
  • FIG. 2 is a bottom view of the multi-array LED lighting device according to an embodiment of the present invention
  • the multi-array light emitting diode illuminator 1000 which is an embodiment of the present invention, is generally cylindrical and has a base 10 formed on the top thereof, and a circumference around the bottom of the base 10.
  • the power sockets 20 are formed at predetermined intervals.
  • the cross section of the base is circular, but the present invention is not limited thereto, and may have various shapes such as a rectangle and a polygon.
  • the base bottom surface may be formed of a curved surface in consideration of light distribution characteristics.
  • the interval may be spaced in consideration of light distribution characteristics.
  • a plurality of cylindrical LED modules 100 are attached to the power socket 20. Accordingly, the cylindrical LED module 100 irradiates light by using an external AC power received through the base 10.
  • the base 10 may be used by replacing a plurality of power terminal blocks according to the purpose of use.
  • the light emitting diode module 100 may be installed to the light emitting diode package to the outside to be irradiated toward the outside of the lighting device. Since the light emitting diode module 100 is stronger than other lighting devices, the light emitting diode module 100 may not be sufficiently irradiated with a portion directly below the lighting device 1000. In order to prepare for this, the direct type light emitting diode module 200 is installed at the center portion of the base 10, and this problem can be solved. When used in a special environment such as a factory, the light emitting diode module 100 may also be a direct type light emitting diode module.
  • the light emitting diode module 100 is attached to the circumferential surface of the base 10 having a circular cross section at predetermined intervals, and a direct type light emitting diode module 200 is attached to the center portion thereof.
  • the base 10 includes a screw portion 11 which is in direct contact with an external AC power supply, and a base case 13 for accommodating the module base portion 110 of the light emitting diode module and having a cavity therein. Can be configured.
  • the LED module 100 is attached to a power socket 20 installed in the base case 13.
  • the light emitting diode module 100 includes a module base part 110 attached to the power socket 20, a cylindrical housing 130 hermetically coupled to the module base part 110, and an interior of the housing 130.
  • a light emitting diode package 140 installed in the power supply module 150 for converting the external AC power to supply power to the light emitting diode package 140, the light emitting diode package 140, and the power supply module 150.
  • the support structure 160 is fixed to the housing 130 to be filled, so as to impregnate the LED package 140 and the power supply module 150, accordingly the LED package 140 and the power supply It includes an insulating heat dissipation liquid 170 to dissipate heat generated from the module 150.
  • the configuration of the light emitting diode module will be described in more detail with reference to FIG. 3.
  • FIG. 4 is a cross-sectional view of a first embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device according to an embodiment of the present invention
  • FIG. 5 is a light emitting diode module used in a multi-array light emitting diode lighting device according to an embodiment of the present invention
  • 6 is a cross-sectional view of a third embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device which is an embodiment of the present invention.
  • the light emitting diode module 100 includes a module base 110, a housing 130, a light emitting diode package 140, a power supply module 150, a support structure 160, The heat dissipation liquid 170 and the power supply line 180 may be configured to be included.
  • the module base unit 110 is to be electrically connected to the power socket 20 installed in the base case of the base 10 and has a threaded connection unit.
  • the housing 130 has a cylindrical shape having an opening for receiving the LED package 140, the power supply module 150, the support structure 160, the power supply line 180, and the heat dissipation liquid 170.
  • Glass may be used as the housing 130, and in the case of the present invention, since the heat dissipation efficiency is excellent, a transparent polymer of thermoplastic resin, which is difficult to use at 70 degrees or more, may be used. Inexpensive and workability is enhanced.
  • the heat dissipation liquid 170 to be described later is a silicone-based oil
  • the housing 130 is also made of a silicone resin material, since the physical properties are similar, durability due to temperature changes can be excellent.
  • the surface of the housing 130 may be a light diffusion coating for light diffusion, by the light diffusion coating can be scattered to the LED light having a strong straightness can be changed to a more comfortable light to the person.
  • the light emitting diode package 140 includes an LED for converting electrical energy into light energy, and is generally attached to a PCB.
  • a general light emitting diode package 140 having one LED is used.
  • a linear light emitting diode may be used in which a plurality of LEDs are arranged vertically. In this case, the light of the linear light emitting diode may be irradiated outward.
  • the power supply module 150 is a component for changing the external AC power supplied through the base 10 to a power source (DC power source or AC power source) suitable for the light emitting diode package 140.
  • the module 150 and the light emitting diode package 140 serve as heat generating sources for generating heat.
  • the heat dissipation liquid 170 filled in the cylindrical housing 130 performs a function of absorbing and radiating heat by directly contacting the heat generated by the light emitting diode package 140 and the power supply module (water cooling).
  • the heat dissipation liquid 170 should be provided with all of heat dissipation, light transmission, electrical insulation.
  • the thermal conductivity as a heat transfer medium should be excellent, 2) the state of molecular transport to transfer the heat energy (that is, the viscosity of the liquid phase must be high in motion with temperature, and 3) the molecular structure at high temperature 4) Excellent chemical resistance, chemical resistance (non-reactive) that does not occur chemical reaction, corrosion, ion exchange, etc. with other devices, 5) Excellent light transmittance, no change in refractive index at high temperature, 6) Refractive index is freely controlled, and there should be no haze phenomenon that gel or foreign substances are generated by self-synthesis or self-crosslinking.
  • the heat dissipation liquid 170 used in the present invention is a straight-type dimethylsilicone (dimetylsilicon oil), methylphenyl silicon oil (methylphenyl silicon oil) or polymethyl hydrogen of the polydimethyl siloxane (Polydemetylsiloxane) type (polymethyl hydrogen siloxane), methyl hydrogen silicone oil and the like can be used.
  • the support structure 160 is a component attached to the module base part 110 to maintain the state in which the power supply module 150 and the light emitting diode package 140 are impregnated in the heat dissipation liquid 170.
  • the support structure 160 may function as a power supply line 180 to be described later. Alternatively, a separate power supply line 180 may be added.
  • FIG. 5 shows a second embodiment according to the present invention, and has most of the same components as in FIG. 4, except that the module base portion 110 is formed of a pin type connector 110 ′.
  • FIG. 6 shows a third embodiment according to the present invention, which is different from the first embodiment of FIG. 4 in that a heat rod 190 is further installed to increase heat dissipation efficiency, and the heat dissipation liquid 170 is leaked.
  • the sealant 120 further includes.
  • a part is impregnated in the insulating heat dissipation liquid 170, and a part of the heat absorbed by the heat dissipating liquid 170 is further installed by installing a heat rod 190 through which the module base part 110 is exposed. It is discharged to the outside faster than this, thereby lowering the temperature of the heat dissipation liquid 170 and the temperature of the housing 130 by at least 3 degrees or more.
  • the sealing member 120 for sealing the housing 130 and the module base portion 110 is further included, even if the light emitting diode module 100 is installed in the reverse direction, the module base portion 110 and the housing 130 It is possible to prevent the leakage of oil that may occur in the coupling portion of).
  • the housing 130 and the sealant 120 are made of a silicone resin, the physical properties of both are similar, so that the degree of bonding may be maintained even after a sudden temperature change.
  • the inside of the housing 130 may have an air layer of a predetermined size in consideration of the expansion of the heat radiation solution according to the temperature rise.
  • the high output light emitting diode lighting device a plurality of light emitting diode modules are separated, and each module is spaced apart, and power is supplied to the housing of the module through a heat dissipation liquid. Since heat generated from the module and the light emitting diode package is radiated, the heat dissipation efficiency is excellent, and the high output light emitting diode lighting device can be manufactured and produced at low cost.
  • the heat rod is installed in each light emitting diode module, the heat absorbed by the heat dissipation liquid is released to the outer space more quickly, so that not only can the heat dissipation efficiency be improved, but also the temperature of each light emitting diode module is lower than the burn point, There is no fear of the user getting burned.
  • the above-described multi-array light emitting diode lighting device and a method of manufacturing the same are not limited to the configuration and method of the above-described embodiments, but the embodiments may be all or all of the embodiments so that various modifications may be made. Some may be optionally combined.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
PCT/KR2013/005507 2012-06-22 2013-06-21 Dispositif d'éclairage à réseaux de diodes électroluminescentes multiples et procédé pour le fabriquer Ceased WO2013191508A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20120067290A KR101483718B1 (ko) 2012-06-22 2012-06-22 다중 배열 발광 다이오드 조명 기기 및 그 제조 방법
KR10-2012-0067290 2012-06-22

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WO2013191508A1 true WO2013191508A1 (fr) 2013-12-27

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KR (1) KR101483718B1 (fr)
WO (1) WO2013191508A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170024335A (ko) 2015-08-25 2017-03-07 (주)다우씨놀 Led 조명등
KR20170024356A (ko) 2015-08-25 2017-03-07 (주)다우씨놀 Led 조명등
RU201359U1 (ru) * 2020-08-04 2020-12-11 Общество с ограниченной ответственностью «СОВРЕМЕННЫЕ СИСТЕМЫ ВЫРАЩИВАНИЯ» Излучатель с погружным светодиодным модулем

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060043589A (ko) * 2004-05-12 2006-05-15 오스람 실바니아 인코포레이티드 열적으로 효율적인 ｌｅｄ 전구
KR100982101B1 (ko) * 2006-07-17 2010-09-13 리퀴드엘이디스 라이팅 컴퍼니 리미티드 고출력 발광 다이오드 램프
KR20110095689A (ko) * 2010-02-19 2011-08-25 주식회사 엘티전자 엘이디 모듈의 탈착 및 분리 가능한 엘이디 전구
KR101131426B1 (ko) * 2011-12-02 2012-04-05 신관우 방열 효율이 우수한 발광 다이오드 조명 장치 및 이에 사용되는 방열 절연 분산액

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060043589A (ko) * 2004-05-12 2006-05-15 오스람 실바니아 인코포레이티드 열적으로 효율적인 ｌｅｄ 전구
KR100982101B1 (ko) * 2006-07-17 2010-09-13 리퀴드엘이디스 라이팅 컴퍼니 리미티드 고출력 발광 다이오드 램프
KR20110095689A (ko) * 2010-02-19 2011-08-25 주식회사 엘티전자 엘이디 모듈의 탈착 및 분리 가능한 엘이디 전구
KR101131426B1 (ko) * 2011-12-02 2012-04-05 신관우 방열 효율이 우수한 발광 다이오드 조명 장치 및 이에 사용되는 방열 절연 분산액

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KR20140000040A (ko) 2014-01-02
KR101483718B1 (ko) 2015-01-26

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