WO2014000930A3 - Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung - Google Patents

Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung Download PDF

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Publication number
WO2014000930A3
WO2014000930A3 PCT/EP2013/059384 EP2013059384W WO2014000930A3 WO 2014000930 A3 WO2014000930 A3 WO 2014000930A3 EP 2013059384 W EP2013059384 W EP 2013059384W WO 2014000930 A3 WO2014000930 A3 WO 2014000930A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer component
external contacting
layer
producing
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2013/059384
Other languages
English (en)
French (fr)
Other versions
WO2014000930A2 (de
Inventor
Markus Weiglhofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to EP13720418.6A priority Critical patent/EP2865026A2/de
Priority to JP2015518913A priority patent/JP6064044B2/ja
Priority to US14/405,127 priority patent/US20150146342A1/en
Publication of WO2014000930A2 publication Critical patent/WO2014000930A2/de
Publication of WO2014000930A3 publication Critical patent/WO2014000930A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Thermistors And Varistors (AREA)
  • Contacts (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Ceramic Capacitors (AREA)
  • Laminated Bodies (AREA)

Abstract

Es wird ein Vielschichtbauelement angegeben, aufweisend einen Grundkörper (1) der einen Stapel aus dielektrischen Schichten und internen Elektrodenschichten(3a, 3b) aufweist, und aufweisend eine Außenkontaktierung (4a, 4b) zur elektrischen Kontaktierung der Elektrodenschichten (3a, 3b) wobei die Außenkontaktierung (4a, 4b) eine erste Schicht (6) und eine zweite Schicht (7) aufweist und wobei die erste Schicht (6) und die zweite Schicht (7) eingebrannt sind.
PCT/EP2013/059384 2012-06-25 2013-05-06 Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung Ceased WO2014000930A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP13720418.6A EP2865026A2 (de) 2012-06-25 2013-05-06 Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung
JP2015518913A JP6064044B2 (ja) 2012-06-25 2013-05-06 外部接続部を有する多層デバイス、および外部接続部を有する多層デバイスの製造方法
US14/405,127 US20150146342A1 (en) 2012-06-25 2013-05-06 Multi-Layer Component Having an External Contact and Method for Producing a Multi-Layer Component Having an External Contact

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012105517.3A DE102012105517B4 (de) 2012-06-25 2012-06-25 Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung
DE102012105517.3 2012-06-25

Publications (2)

Publication Number Publication Date
WO2014000930A2 WO2014000930A2 (de) 2014-01-03
WO2014000930A3 true WO2014000930A3 (de) 2014-03-06

Family

ID=48289209

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/059384 Ceased WO2014000930A2 (de) 2012-06-25 2013-05-06 Vielschichtbauelement mit einer aussenkontaktierung und verfahren zur herstellung eines vielschichtbauelements mit einer aussenkontaktierung

Country Status (5)

Country Link
US (1) US20150146342A1 (de)
EP (1) EP2865026A2 (de)
JP (1) JP6064044B2 (de)
DE (1) DE102012105517B4 (de)
WO (1) WO2014000930A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6726508B2 (ja) * 2016-04-07 2020-07-22 日本特殊陶業株式会社 圧電アクチュエータ
DE102018123594B4 (de) * 2018-09-25 2022-06-09 Tdk Electronics Ag Verfahren zur Herstellung eines keramischen Bauelements

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1156498A2 (de) * 2000-04-25 2001-11-21 TDK Corporation Vielschicht- Keramikbauteil und Herstellungsverfahren
DE102007049576A1 (de) * 2006-12-06 2008-06-12 Tdk Corp. Piezoelektrisches Mehrschichtelement
US20080305944A1 (en) * 2007-04-09 2008-12-11 Yaiyo Yuden Co., Ltd. Dielectric ceramics and manufacturing method thereof, as well as multilayer ceramic capacitor
EP2410540A1 (de) * 2010-07-21 2012-01-25 Murata Manufacturing Co. Ltd. Keramisches Elektronikbauteil

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19945934C1 (de) * 1999-09-24 2001-03-22 Epcos Ag Verfahren zur Herstellung einer Außenkontaktierung eines elektrokeramischen Bauelementes, insbesondere eines Piezoaktors
JP4158338B2 (ja) 2000-06-06 2008-10-01 株式会社デンソー インジェクタ用圧電体素子
JP2002050803A (ja) * 2000-07-31 2002-02-15 Tokin Ceramics Corp 積層型圧電セラミックス
JP4506084B2 (ja) * 2002-04-16 2010-07-21 株式会社村田製作所 非還元性誘電体セラミックおよびその製造方法ならびに積層セラミックコンデンサ
DE10234787C1 (de) * 2002-06-07 2003-10-30 Pi Ceramic Gmbh Keramische Tec Verfahren zur Herstellung eines monolithischen Vielschichtaktors, monolithischer Vielschichtaktor aus einem piezokeramischen oder elektrostriktiven Material
JP4593911B2 (ja) * 2003-12-18 2010-12-08 京セラ株式会社 積層型圧電素子及び噴射装置
DE10345500B4 (de) * 2003-09-30 2015-02-12 Epcos Ag Keramisches Vielschicht-Bauelement
JP2006303045A (ja) 2005-04-18 2006-11-02 Denso Corp 積層型圧電体素子
JP4720425B2 (ja) * 2005-10-18 2011-07-13 株式会社村田製作所 電子部品
CN101405882B (zh) * 2006-03-31 2011-06-15 株式会社村田制作所 压电致动器
JP5282634B2 (ja) * 2008-06-25 2013-09-04 株式会社村田製作所 積層セラミック電子部品およびその製造方法
WO2010057939A1 (de) * 2008-11-20 2010-05-27 Ceramtec Ag Vielschichtaktor mit aussenelektroden als metallische, poröse, dehnbare leitschicht
DE102009013125A1 (de) 2009-03-13 2010-09-23 Epcos Ag Piezoaktor in Vielschichtbauweise und Verfahren zum Befestigen einer Außenelektrode bei einem Piezoaktor
JP2011176187A (ja) * 2010-02-25 2011-09-08 Kyocera Corp 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム
KR101153573B1 (ko) * 2010-11-25 2012-06-11 삼성전기주식회사 이중 전극 구조를 갖는 적층형 세라믹 캐패시터

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1156498A2 (de) * 2000-04-25 2001-11-21 TDK Corporation Vielschicht- Keramikbauteil und Herstellungsverfahren
DE102007049576A1 (de) * 2006-12-06 2008-06-12 Tdk Corp. Piezoelektrisches Mehrschichtelement
US20080305944A1 (en) * 2007-04-09 2008-12-11 Yaiyo Yuden Co., Ltd. Dielectric ceramics and manufacturing method thereof, as well as multilayer ceramic capacitor
EP2410540A1 (de) * 2010-07-21 2012-01-25 Murata Manufacturing Co. Ltd. Keramisches Elektronikbauteil

Also Published As

Publication number Publication date
EP2865026A2 (de) 2015-04-29
JP6064044B2 (ja) 2017-01-18
WO2014000930A2 (de) 2014-01-03
US20150146342A1 (en) 2015-05-28
JP2015529967A (ja) 2015-10-08
DE102012105517A1 (de) 2014-01-02
DE102012105517B4 (de) 2020-06-18

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