WO2014010334A1 - Borne à ressort - Google Patents

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Publication number
WO2014010334A1
WO2014010334A1 PCT/JP2013/065439 JP2013065439W WO2014010334A1 WO 2014010334 A1 WO2014010334 A1 WO 2014010334A1 JP 2013065439 W JP2013065439 W JP 2013065439W WO 2014010334 A1 WO2014010334 A1 WO 2014010334A1
Authority
WO
WIPO (PCT)
Prior art keywords
spring
coil spring
pedestal
spring terminal
terminal according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/065439
Other languages
English (en)
Japanese (ja)
Inventor
笠松　俊史
輝明 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Toko Meter Systems Co Ltd
Original Assignee
Toshiba Toko Meter Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Toko Meter Systems Co Ltd filed Critical Toshiba Toko Meter Systems Co Ltd
Publication of WO2014010334A1 publication Critical patent/WO2014010334A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4854—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a wire spring
    • H01R4/4863—Coil spring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs

Definitions

  • the present invention relates to a spring terminal mounted on a substrate on which an electronic component or the like is mounted.
  • the circuit board on which electronic parts are mounted is provided with a conduction part to the block side terminal.
  • a surface mount spring terminal provided with a coil spring is employed.
  • FIG. 1 is a diagram showing an example of a conventional spring terminal (Patent Document 1).
  • the spring terminal shown in FIG. 1 has a metal base 102 and a conductive coil spring 103.
  • the metal base portion 102 is provided with a top surface 106 for sucking by the suction nozzle 111 of the automatic mounting machine and a soldering surface 108 that can be soldered and that faces downward when the top surface 106 faces upward.
  • the coil spring 103 is attached in electrical conduction with the metal base 102 with the top surface 106 exposed to the inner peripheral side.
  • the top surface 106 of the protrusion 105 is exposed on the inner peripheral surface of the coil spring 103, the top surface 106 can be adsorbed to the nozzle by inserting the suction nozzle 111 through the inner periphery of the coil spring 103.
  • the coil spring 103 was compressed when the coil spring 103 was attached to the convex portion 105 of the metal base 102. For this reason, the coil spring 103 could not be suppressed stably.
  • An object of the present invention is to provide a spring terminal capable of improving the reliability of a coil spring without variation in the height of the coil spring and a load at a specified height after the coil spring is attached.
  • a spring terminal includes a conductive coil spring and a base having a nozzle suction surface for suction by a suction nozzle, and the coil spring is formed in a tapered shape. And a loosely wound portion that is loosely wound and a tightly wound portion that is tightly wound with a diameter smaller than that of the loosely wound portion, and a recess for pushing the tightly wound portion of the coil spring into the pedestal Is formed.
  • the tightly wound portion that is integrally formed with the coil spring and does not affect the spring elasticity is pressed by the cylindrical pushing jig 30, the tightly wound portion is pushed into the recess of the pedestal. Accordingly, a spring terminal that can improve the reliability of the coil spring without changing the height of the coil spring after mounting the coil spring that affects the spring elasticity is provided because the sparsely wound portion that affects the spring elasticity is not pressed. can do.
  • FIG. 1 is a view showing an example of a conventional spring terminal.
  • FIG. 2 is a schematic configuration diagram of a spring terminal according to the first embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the spring terminal shown in FIG.
  • FIG. 4 is a view showing the suction nozzle in the AA ′ sectional view of the spring terminal shown in FIG.
  • FIG. 5 is a diagram showing a detailed configuration of each part of the spring terminal according to the first embodiment of the present invention.
  • FIG. 6 is a diagram showing the configuration of the anti-displacement bonding portion of the spring terminal according to Embodiment 1 of the present invention.
  • FIG. 7 is a schematic configuration diagram of a spring terminal according to the second embodiment of the present invention.
  • FIG. 8 is a diagram showing the configuration of the solder joint portion of the spring terminal according to the second embodiment of the present invention.
  • FIG. 2 is a schematic configuration diagram of a spring terminal according to the first embodiment of the present invention.
  • 3 is a cross-sectional view taken along the line AA ′ of the spring terminal shown in FIG. 2, and also shows a cylindrical pushing jig 30.
  • FIG. 4 is a view showing the suction nozzle 40 in the AA ′ sectional view of the spring terminal shown in FIG.
  • FIG. 5 is a diagram illustrating a detailed configuration of each part of the spring terminal according to the first embodiment of the present invention.
  • the spring terminal according to the first embodiment includes the coil spring 10 and the pedestal 20, and is a component that can be reflow mounted on a board on which electronic components are mounted.
  • the reflow means that a spring terminal as a component is placed on a substrate coated with a solder paste and soldered.
  • the coil spring 10 has conductivity and is formed of a wire such as piano wire, beryllium copper, or stainless steel.
  • the coil spring 10 has a conical coil portion 11 (sparsely wound portion of the present invention) formed of a taper-like or conical spring and a loosely wound spring, and has a cylindrical shape with a smaller diameter than the conical coil portion 11 and is tightly wound. It consists of the contact
  • the pedestal 20 has conductivity and is made of a sheet metal such as brass, phosphor bronze, beryllium copper, stainless steel or the like.
  • the coil spring 10 and the pedestal 20 may be plated with tin.
  • the pedestal 20 has a flat portion 20a and a bent portion 20b bent at a substantially right angle with respect to the flat portion 20a.
  • a cylindrical recess 21 is formed at a substantially central portion of the flat portion 20a. The tightly wound portion 12 of the coil spring 10 is pushed into the recess 21.
  • a nozzle suction surface 23 for suction by the suction nozzle 40 is provided on the upper surface of the bottom surface of the recess 21 to mount the spring terminal on the substrate.
  • the tip of the bent portion 20b of the pedestal 20 is further bent at a substantially right angle with respect to the bent portion 20b to form a horizontal flat plate, and this horizontal flat plate has a solder joint for bonding solder to the substrate.
  • a portion 24 is provided.
  • a coil fixing for fixing the tightly wound portion 12 to the concave portion 21 of the pedestal 20 at a plurality of locations on the outer peripheral surface of the cylindrical concave portion 21 formed in the pedestal 20 and at intermediate positions in the depth direction of the concave portion 21 A claw portion 22 is formed.
  • the pedestal 20 is formed with a coil spring guiding portion 25 for guiding the coil spring 10 into the concave portion 21 of the pedestal 20.
  • the coil spring guide portion 25 has a conical taper formed at the connecting portion between the flat portion 20 a and the cylindrical recess 21.
  • an anti-displacement adhesion portion 26 is formed on the bottom surface of the bottom surface of the recess 21 of the pedestal 20.
  • the misalignment countermeasure adhesive portion 26 is bonded to an adhesive applied on the substrate, and the pedestal 20 is fixed to the substrate when the spring terminal is mounted on the substrate.
  • the non-shrinkable tightly wound portion 12 formed on the coil spring 10 is pressed by the cylindrical pressing jig 30. Then, the tightly wound portion 12 is pushed into the concave portion 21 of the base 20. Therefore, since the sparsely wound portion that affects the spring elasticity is not pressed, the height of the coil spring 10 does not vary after the coil spring 10 is attached to the base, and the load at the specified height does not vary. Further, the reliability of the coil spring 10 can be improved.
  • the coil fixing claw portion 22 for fixing the coil spring 10 to the concave portion 21 is formed on the outer peripheral surface of the concave portion 21, when the tight winding portion 12 is pushed into the concave portion 21, the winding of the tight winding portion 12 is performed.
  • the coil fixing claw portion 22 is caught between the wires, and the tightly wound portion 12 can be reliably fixed to the concave portion 21.
  • the solder can be joined to the solder joint portion 24 and the solder can be joined to the substrate by reflow.
  • the pedestal 20 is provided with a coil spring guiding portion 25 in which a conical taper is formed at a connecting portion between the flat portion 20a of the pedestal 20 and the concave portion 21 in order to guide the coil spring 10 into the concave portion 21. Since the coil spring 10 is drawn into the recess 21 with the outer diameter of the coil spring 10, the positioning can be easily performed when the coil spring 10 is assembled.
  • the spring terminal is mounted on the substrate. Later, when it is difficult to fix the spring terminal to the substrate at the time of reflow, the anti-displacement bonding portion 26 is bonded to the adhesive applied on the substrate, and the base 20 can be fixed to the substrate.
  • the spring terminal can be easily mounted on the substrate by an automatic machine, and the spring terminal can be used as a reflow reel packaging component.
  • FIG. 7 is a schematic configuration diagram of a spring terminal according to the second embodiment of the present invention.
  • FIG. 8 is a diagram illustrating the configuration of the solder joint portion of the spring terminal according to the second embodiment of the present invention.
  • the spring terminal according to the first embodiment is configured such that the pedestal 20 includes the flat portion 20a, the curved portion 20b, and the solder joint portion 24.
  • the spring terminal according to the second embodiment includes only the flat portion of the pedestal 20A. It is characterized by being configured.
  • the configuration of the flat portion shown in FIG. 7 is the same as the configuration of the flat portion 20a of the first embodiment.
  • the flat portion has a recess 21, a coil fixing claw portion 22, a nozzle suction surface 23, and a coil.
  • a spring lead-in portion 25 is formed.
  • solder joint portion 27 for joining the solder to the substrate is provided on the lower surface of the bottom surface of the recess 21 of the base 20A.
  • the curved portion 20b and the solder joint portion 24 are deleted from the pedestal 20A, and the pedestal 20A is configured only by the flat portion, so that the material cost can be reduced. . Therefore, it is possible to provide a spring terminal that can be reflow-mounted on a substrate at a low cost.
  • a solder joint portion 27 is provided on the lower surface of the bottom surface of the recess 21 of the pedestal 20A in place of the misalignment countermeasure adhesion portion 26 of the first embodiment.
  • the mounting area of the spring terminal on the substrate can be reduced.
  • this invention is not limited to the spring terminal which concerns on Example 1 and Example 2.
  • FIG. 1 the coil fixing claw portion 22 is caught between the windings of the tight winding portion 12. You may make it fix by pressing on a surface.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
PCT/JP2013/065439 2012-07-10 2013-06-04 Borne à ressort Ceased WO2014010334A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012154409A JP2014017142A (ja) 2012-07-10 2012-07-10 ばね端子
JP2012-154409 2012-07-10

Publications (1)

Publication Number Publication Date
WO2014010334A1 true WO2014010334A1 (fr) 2014-01-16

Family

ID=49915807

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/065439 Ceased WO2014010334A1 (fr) 2012-07-10 2013-06-04 Borne à ressort

Country Status (2)

Country Link
JP (1) JP2014017142A (fr)
WO (1) WO2014010334A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107666041A (zh) * 2016-07-28 2018-02-06 舍弗勒技术股份两合公司 接触板和接触插接系统
EP3378110A4 (fr) * 2015-11-17 2019-06-19 AMPD Electrosprings Limited Ressort hélicoïdal

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101793717B1 (ko) * 2015-08-07 2017-11-03 조인셋 주식회사 전기접속단자

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170617A (ja) * 2000-12-04 2002-06-14 Yokowo Co Ltd コイルばねコネクタ
JP2003217726A (ja) * 2002-01-24 2003-07-31 Yokowo Co Ltd コネクタ
JP2003346937A (ja) * 2002-05-24 2003-12-05 Gp Daikyo Corp 端子接続構造
JP2009038005A (ja) * 2007-07-06 2009-02-19 Kitagawa Ind Co Ltd 表面実装コンタクト
JP2010157386A (ja) * 2008-12-26 2010-07-15 Yamaichi Electronics Co Ltd 半導体装置用電気接続装置及びそれに使用されるコンタクト

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5664495A (en) * 1979-10-31 1981-06-01 Tdk Electronics Co Ltd Method of soldering electronic part
US4458293A (en) * 1981-11-05 1984-07-03 Cherry Electrical Products Corporation Capacitive keyboard
JPS59196518A (ja) * 1983-04-06 1984-11-07 チエリ−・エレクトリカル・プロダクツ・コ−ポレ−シヨン キ−ボ−ドスイツチ
US20050023119A1 (en) * 2003-07-29 2005-02-03 Lu Yao Tsun Restorable conductive elastic connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170617A (ja) * 2000-12-04 2002-06-14 Yokowo Co Ltd コイルばねコネクタ
JP2003217726A (ja) * 2002-01-24 2003-07-31 Yokowo Co Ltd コネクタ
JP2003346937A (ja) * 2002-05-24 2003-12-05 Gp Daikyo Corp 端子接続構造
JP2009038005A (ja) * 2007-07-06 2009-02-19 Kitagawa Ind Co Ltd 表面実装コンタクト
JP2010157386A (ja) * 2008-12-26 2010-07-15 Yamaichi Electronics Co Ltd 半導体装置用電気接続装置及びそれに使用されるコンタクト

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3378110A4 (fr) * 2015-11-17 2019-06-19 AMPD Electrosprings Limited Ressort hélicoïdal
CN107666041A (zh) * 2016-07-28 2018-02-06 舍弗勒技术股份两合公司 接触板和接触插接系统
CN107666041B (zh) * 2016-07-28 2021-10-19 舍弗勒技术股份两合公司 接触板和接触插接系统

Also Published As

Publication number Publication date
JP2014017142A (ja) 2014-01-30

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