WO2014204094A1 - Boîtier d'élément optique du type to pour communication à grande vitesse - Google Patents

Boîtier d'élément optique du type to pour communication à grande vitesse Download PDF

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Publication number
WO2014204094A1
WO2014204094A1 PCT/KR2014/004199 KR2014004199W WO2014204094A1 WO 2014204094 A1 WO2014204094 A1 WO 2014204094A1 KR 2014004199 W KR2014004199 W KR 2014004199W WO 2014204094 A1 WO2014204094 A1 WO 2014204094A1
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WO
WIPO (PCT)
Prior art keywords
speed communication
stem base
electrode pins
electrode
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2014/004199
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English (en)
Korean (ko)
Inventor
김정수
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phovel Co Ltd
Original Assignee
Phovel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020130111169A external-priority patent/KR101542443B1/ko
Application filed by Phovel Co Ltd filed Critical Phovel Co Ltd
Priority to US14/899,623 priority Critical patent/US20160141830A1/en
Priority to CN201480034230.8A priority patent/CN105308806B/zh
Publication of WO2014204094A1 publication Critical patent/WO2014204094A1/fr
Anticipated expiration legal-status Critical
Priority to US15/693,686 priority patent/US20170365976A1/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Definitions

  • the present invention relates to a TO-type optical device package, and more particularly to a high-speed communication optical module for 10Gbps (Giga bit per sec) or more, and relates to a TO-type optical device package for high-speed communication capable of embedding a thermoelectric element on the top of the stem.
  • a TO-type optical device package for high-speed communication capable of embedding a thermoelectric element on the top of the stem.
  • optical communication using light as a medium for information transmission has become common in order to transmit large amounts of information and high-speed information.
  • a 10 Gbps (giga bit per sec) electric signal can be easily converted into laser light using a semiconductor laser diode chip having a length of 0.3 mm and a length of about 0.3 mm, respectively. It is easy to convert the optical signal transmitted through the electric signal.
  • the optical fiber is used as a transmission medium, it is possible to transmit hundreds of kilometers of long-distance data by superimposing several tens of Gbps ultra-high speed information with tens of Tera bps.
  • the semiconductor laser has a characteristic that the wavelength varies depending on the operating temperature. Accordingly, a package of a built-in thermoelectric device capable of maintaining a constant temperature of a laser diode chip is widely used despite a change in external environmental temperature.
  • optical module packages with built-in thermoelements are either butterfly packages or mini flat or mini deal packages. However, these butterfly and mini flat packages are very bulky and have a very high price. In contrast, low-cost optical communication modules have traditionally used TO (transister outline) packages.
  • FIG. 1 shows an outline of a conventional TO-type package.
  • the TO-type package is fixed by inserting the metal electrode pins 120 into the metal through-holes of one or a plurality of through-holes, such as iron or kovar, and fixing the metal electrode pins 120.
  • the sealing material is a package in the form of a glass material (110). This type of package is easy to manufacture and is widely used as a low cost optical communication package. This conventional TO-type package was mainly used for 2.5Gbps optical communication.
  • the signal In order to manufacture the existing TO-type package for high-speed communication of 10Gbps, the signal must be well transmitted without distortion of the electrical signal in the signal transmission line transmitting the electrical signal to and from the optical device. In order to avoid distortion of the signal in the transmission and reception of the electrical signal in this way, the transmission line must be impedance matched at each part.
  • an optical device mounted in the electrode pin 120 and the TO can package has an electrical connection through a signal transmission line made of Au wire.
  • the signal transmission line also has a structure in which impedance matching is difficult.
  • a high speed communication is performed by inserting a transmission signal relay submount 300 that is impedance matched between the optical element 200 mounted in the TO can package and the electrode pin 110.
  • 2 is a conceptual diagram showing how the electrode pin and the optical device are electrically connected in the TO can package.
  • the electrode pin 120 and the signal transmission line 900 protruding to the outside without being enclosed by the stem base 100 are difficult to achieve impedance matching, and thus a method of minimizing the length of the portion is used. Doing.
  • thermoelectric element 800 has a height of at least 1 mm so that the optical element 200 attached to the thermoelectric element 800 is at least 1 mm higher than the optical element directly attached to the stem base 100. Therefore, the height of the electrode pin 120 protruding into the air should also be increased to 1 mm or more for a package having a height of 1 mm or more for the optical module or the optical element in which the thermoelectric element 800 is attached.
  • the transmission signal relay submount 300 may include a resistor for impedance matching, and Joule heat is generated when a current flows in the signal transmission line 900 including the resistor, and the joule heat is thermoelectric. Since the element 800 is attached to the upper plate, Joule heat generated from the transmission signal relay submount 300 is transmitted to the upper plate of the thermoelectric element 800, thereby deteriorating the characteristics of the thermoelectric element 800.
  • Patent Document 1 Republic of Korea Patent Publication No. 10-2012-0129137 (2012.11.28)
  • the present invention has been proposed to solve the problems of the prior art, and an object of the present invention is to increase the speed of the transmission signal to enable transmission of 10Gbps in the TO-type optical device package for TO-type optical device package for high speed communication To provide.
  • another object of the present invention is the TO-type for ultra-high speed communication for the Joule heat generated by the impedance matching resistor included on the transmission signal line in the TO-type optical device package containing a thermoelectric element does not interfere with the characteristics of the thermoelectric element
  • An optical device package is provided.
  • the present invention proposes a method for attaching a structure in which an electrode pin of a stem exposed to air is surrounded by a metal having a circular through hole, and a submount for transmitting a signal relay surrounds the electrode pin.
  • a method of attaching to a metal having a through hole is provided.
  • the transmission signal relay submount may include a matching resistor for impedance matching.
  • an electrode pin is inserted into and fixed to a through hole formed in a stem base, and penetrates a side surface of the electrode pin protruding above the stem base.
  • a transmission signal relay submount for relaying the signal transmission between the electrode pin and the optical element is attached to the metal device.
  • the transmission signal relay submount may include an impedance matching resistor.
  • a transmission signal relay submount for relaying the signal transmission between the electrode pin and the optical element is attached to the upper portion of the thermoelectric element installed on the stem base, the metal fittings are attached to the impedance matching resistor is attached to the transmission signal relay sub It can be connected by mount and signal transmission line.
  • the metal device is preferably attached to the stem base through a solder (solder) or conductive epoxy and electrically connected.
  • the surface of the through-hole of the metal tool is coated with an insulating material
  • the metal tool is made of aluminum, it is preferable to insulate the surface of the through-hole by oxidizing the metal of the aluminum material.
  • the insulating film is removed from the surface of the metal structure of the portion where the metal mechanism and the stem base contact.
  • the TO-type optical device package according to the present invention is matched with the impedance required by the package of the electrode pin protruding from the stem base can have a high-quality transmission signal characteristics even in the high-speed operation of the optical device, the transmission signal relay submount Joule heat generated by the impedance matching resistor to be heated to the stem base does not interfere with the characteristics of the thermoelectric element has the effect of improving the characteristics of the thermoelectric element.
  • 1 is an example of a stem of a conventional TO can package
  • FIG. 2 is a conceptual view showing a state in which the electrode pin and the optical device is electrically connected in the conventional conventional TO can package
  • thermoelectric device 3 is a conceptual view showing a state in which the electrode pin and the optical device is electrically connected in the TO can package with a conventional thermoelectric device
  • Figure 4 is an example of the impedance according to the diameter of the electrode pin and the diameter of the stem through-hole in the stem produced using the dielectric constant 4 glass according to the present invention
  • FIG. 5 is a conceptual view illustrating a process of attaching a metal tool having a through hole around the electrode pin to match the impedance of the electrode pin portion protruding into the stem base and the impedance of the electrode pin portion surrounded by the through hole of the stem base according to the present invention.
  • FIG. 6 is a conceptual diagram illustrating a state in which a sub-mount for transmission signal relay including a resistor for impedance matching according to the present invention is attached to a metal apparatus;
  • thermoelectric element 7 is a conceptual diagram illustrating a state in which a resistor for impedance matching according to the present invention is attached to a metal apparatus, and a submount for transmission signal relay is disposed on the thermoelectric element;
  • FIG. 8 is a conceptual diagram showing a structure of a flexible board of a single ended drive method according to the present invention.
  • FIG. 9 is a conceptual view showing a flexible substrate structure of a differential ended drive method according to the present invention.
  • FIG. 10 is a conceptual diagram showing the arrangement of electrode pins of the stem base for the optical device for ultra-high speed communication of a single ended drive method according to the present invention
  • FIG. 11 is a conceptual diagram showing the electrode pin arrangement of the stem base for the ultra-high speed communication optical device of the differential ended drive method according to the present invention.
  • FIG. 12 is a view illustrating an electrode pin for signal transmission using a plurality of through-hole metal structures for impedance matching of two electrode pins protruding into a package in a differential ended drive optical device according to the present invention at predetermined impedances, respectively;
  • the characteristic impedance of the electrode pin 120 surrounded by the stem base 100 and the glass 110 may include a dielectric constant of the glass 110, a diameter of the electrode pin 120, and an electrode pin. 120 can be easily adjusted by adjusting the diameter of the through-holes to pass through.
  • FIG. 4 shows characteristic impedances of the electrode pin diameters of 0.25 mm and 0.35 mm depending on the diameter of the through-holes in the stem of the stem base and the electrode pins sealed using the glass having a dielectric constant of 4;
  • the characteristic impedance matching can be achieved by setting the diameter of the electrode pin 120 and the diameter of the through hole appropriately to the characteristic impedance to be used. Therefore, by designing the appropriate electrode pin 120 and the diameter of the through hole according to the required characteristic impedance and package specification, the characteristic impedance of the electrode pin 120 surrounded by the through hole of the stem base 100 can be controlled very well. Can be.
  • the stem base 100 may be formed according to the characteristic impedance relationship according to the diameter of the electrode pin 120 and the diameter of the through hole. The through hole diameter is determined.
  • the portion of the electrode pin 120 which is not enclosed in the stem base 100 and exposed to the air is very different from the portion in which the characteristic impedance is enclosed by the stem base 100, for example, a lid of a TO can package.
  • the portion surrounded by the stem base 100 has a characteristic impedance of 25 ohms, but the electrode protrudes out of the stem base 100.
  • the pin 120 has a characteristic impedance of 166 ohms.
  • the characteristic that the impedance of the electrode pin 120 exposed to the air is different from the impedance of the portion surrounded by the through hole of the stem base 100, the electrode pin 120 of the portion protruding above the stem base 100 Impedance matching can be achieved by enclosing with another metal.
  • FIG. 5 illustrates a process of attaching a metal device having a through hole to the outside of the electrode pin exposed to the stem base.
  • the electrode pin 120 protruding above the stem base 100 and the metal appliance 400 are insulated with air, and as described above, an electrode pin having a diameter of 0.25 mm ( In order for the characteristic impedance of the portion 120 that protrudes above the stem base 100 to be 25 ohm, the diameter of the through hole of the metal fitting 400 should be 0.58 mm. Therefore, in order to match the impedance of the portion of the electrode pin 120 exposed to the stem base 100 with the impedance of the portion surrounded by the stem base 100, the electrode pin 120 exposed to the top of the stem base 100 is used. It is possible to achieve impedance matching by enclosing the metal device 400 having the through hole formed therein.
  • the metal appliance 400 and the stem base 100 should be electrically connected.
  • a solder or a conductive epoxy is used to attach the metal appliance 400 to the stem base 100. It was.
  • the material of the metal appliance 400 may be any kind of conductive metal, but is preferably made of aluminum, Au coated iron, Au coated Kovar, or the like.
  • the transmission signal relay submount 300 includes an impedance matching resistor
  • heat is generated in the resistance due to the current flowing through the signal transmission line 900. Therefore, when the impedance matching resistor is attached to the transmission signal relay submount 300, heat generated from the resistance degrades the characteristics of the thermoelectric element 800.
  • This characteristic is achieved by attaching a resistor to the transmission signal relay submount 300 attached to the upper part of the metal fixture 400 attached for impedance matching of the electrode pin 120 protruding above the stem base 100. The heat generated from the submount 300 may not be transferred to the thermoelectric device 800, thereby relaying a signal between the electrode pin 120 and the optical device 200.
  • FIG. 6 shows an example in which a transmission signal relay submount including the impedance matching resistor is attached to an upper portion of a metal apparatus. In this case, the transmission signal relay submount 300 should be attached to be spaced apart from the thermoelectric element 800 top plate.
  • the impedance matching resistor attached to the transmission signal relay submount 300 may be disposed separately from the transmission signal relay submount 300.
  • FIG. 7 shows an example in which the impedance matching resistor is attached to a metal apparatus and the transmission signal relay submount is attached to the thermoelectric top plate.
  • the heat generated from the impedance matching resistor 700 is transmitted to the metal device 400 so as not to deteriorate the thermal characteristics of the thermoelectric element, and the transmission signal relay submount 300 is connected to the electrode pin 120.
  • the transmission signal relay submount 300 is connected to the electrode pin 120.
  • next-generation optical communication networks such as NG-PON (Next Generation Passive Optical Network) require light emitting devices and light receiving devices capable of high-speed communication at a 10Gbps level.
  • the main contents of the present invention may be suitably applied to the ultrafast communication light emitting device including the thermoelectric device.
  • high-speed optical devices are electrically connected to a circuit board and a flexible PCB (FPCB) board.
  • the flexible board also has to be impedance matched to enable high-speed communication.
  • FIG. 8 and 9 illustrate signal line types of a flexible substrate 1000 structure that enables high-speed communication.
  • FIG. 8 illustrates a structure of a flexible substrate 1000 in which one signal line 1010 is surrounded by two ground lines 1020 inside the flexible substrate 1000, and
  • FIG. 9 illustrates two signals entering and exiting a high speed signal.
  • the structure of the flexible substrate 1100 including the lines 1110 and 1120 is shown.
  • the flexible substrate 1000 as shown in FIG. 8 is a flexible substrate structure mainly used when driving a laser diode chip in a single ended drive method in an ultrafast light emitting module, and the flexible substrate 1100 as shown in FIG. This is the structure mainly used when driving laser diode chip by differential ended drive method.
  • the TO stem ground pin connecting two ground lines 1020 of the flexible substrate 1000 may be mounted next to the signal line of the TO stem 100.
  • an element to be electrically driven is a thermistor element 820, a laser diode chip 210, and a photodiode for measuring the temperature of the thermoelectric element 800 and a thermoelectric element (not shown).
  • Chip 220 may be included. Therefore, in the case of the ultrafast communication light emitting device in which the four or more elements are built, the TO stem 100 includes a plurality of electrode pins for driving two independent electrode pins and other electrical elements in order to drive the thermoelectric elements.
  • the commercially available TO stem 100 having a diameter of 6 mm is very small in size, making electrode pin arrangement for driving all of these electrical components very difficult.
  • a special electrode pin arrangement is required in the single ended drive method and the differential ended drive method.
  • FIG. 10 shows an example of an arrangement of electrode pins of the stem base 100 in a light emitting device having a high speed laser diode chip of a single ended drive type.
  • the ground electrode pins 124 directly contacting the stem base 100 are disposed on both sides of the electrode pins 121 that transmit the high-speed signals, and the two ground lines 1020 of the flexible substrate 1000 of FIG. 8 are disposed.
  • the ground line 1020 and the stem base of the flexible substrate 1000 are connected so that the transmission signal transmitted through the signal line 1010 of the flexible substrate 1000 of FIG. 8 can be well connected to the electrode pin 121 of FIG. 10.
  • the ground electrode pin 124 of the 100 may be connected.
  • a metal tool 400 in which one through hole is kneeled may be mounted inside the TO package.
  • the electrode pins 1222 and 123 for transmitting the high speed signal allow the impedance of the electrode pins of the part sealed with glass to be a predetermined impedance.
  • a metal tool 420 having two through holes may be mounted in the TO package.
  • FIG. 12 shows a state in which the impedance of the electrode pins 122 and 123 protruding into the TO-type package is matched to a predetermined impedance by using one metal tool 420 having two through holes.
  • the number and arrangement of electrode pins in the present invention has very important technical characteristics by themselves. That is, in the case of single ended drive, only one electrode pin is used as the electrode pin for high speed communication. In this case, ground electrode is needed.
  • the three or four electrode pins 120 have a structure of sealing with one glass sealant 110, and a position opposite to three or four electrode pins 120 sealed with one glass sealant 110.
  • TO stem base structure in which the electrode pin 124 for grounding-the electrode pin 121 for high speed signal transmission-the electrode pin 124 for grounding-one or two general electrode pins 120 are arranged in a line This is a very important technical arrangement in the single ended drive system.
  • the electrode pin is composed of eight or more electrode pins including the high-speed transmission electrode pin, but three or four electrode pins 120 are sealed with one glass sealant 110. And three electrode pins 122, 123, 120, each of which is sealed with one glass sealant 110 at positions opposite to these three or four pins, are disposed and grounded on one side of the stem base 100.
  • the structure in which the electrode pins 124 are disposed also becomes a main arrangement method for arranging electrode pins of 8 or more pins considering impedance matching in a very small TO-type package.
  • the present invention is not limited to the above-described embodiments, but can be modified in various forms to perform the same to similar functions, and the present invention can be made by those skilled in the art to which the present invention pertains. Various modifications and changes may be made without departing from the spirit of the present invention and equivalents of the claims to be described below.
  • GSG Ground track on flexible board with gound-signal-ground

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

La présente invention concerne un boîtier d'élément optique du type TO destiné à une communication à grande vitesse qui est utilisé pour un module optique en vue d'une communication à grande vitesse d'au moins 10 gigabits par seconde (Gbps) et permet que des éléments thermoélectriques soient incorporés dans une partie supérieure d'une partie supérieure d'une tige. Le boîtier d'élément optique du type TO destiné à une communication à grande vitesse, selon la présente invention, peut transmettre des signaux de haute qualité dans un fonctionnement à grande vitesse de l'élément optique en insérant et en fixant une broche d'électrode (120) dans un trou traversant formé sur une base de tige (100), entourant une surface latérale de la broche d'électrode (120) faisant saillie vers une partie supérieure de la base de tige (100), à l'aide d'un instrument métallique (400) comportant un trou traversant de sorte à permettre que l'impédance d'une partie broche d'électrode (120) entourée par la base de tige (100) corresponde à l'impédance d'une partie broche d'électrode (120) faisant saillie vers la partie supérieure de la base de tige (100).
PCT/KR2014/004199 2013-06-19 2014-05-12 Boîtier d'élément optique du type to pour communication à grande vitesse Ceased WO2014204094A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/899,623 US20160141830A1 (en) 2013-06-19 2014-05-12 To-type optical element package for high-speed communication
CN201480034230.8A CN105308806B (zh) 2013-06-19 2014-05-12 高速通信用to型光元件封装
US15/693,686 US20170365976A1 (en) 2013-06-19 2017-09-01 To-type optical element package for high-speed communication

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2013-0070578 2013-06-19
KR20130070578 2013-06-19
KR1020130111169A KR101542443B1 (ko) 2013-06-19 2013-09-16 고속 통신용 to형 광소자 패키지
KR10-2013-0111169 2013-09-16

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US14/899,623 A-371-Of-International US20160141830A1 (en) 2013-06-19 2014-05-12 To-type optical element package for high-speed communication
US15/693,686 Continuation US20170365976A1 (en) 2013-06-19 2017-09-01 To-type optical element package for high-speed communication

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WO2014204094A1 true WO2014204094A1 (fr) 2014-12-24

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10811582B2 (en) 2015-06-18 2020-10-20 Osram Oled Gmbh Arrangement
CN114641128A (zh) * 2022-03-11 2022-06-17 武汉光迅科技股份有限公司 一种高频管座和柔性电路板的封装组件和方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040042922A (ko) * 2002-11-14 2004-05-22 주식회사 래피더스 10기가비피에스급 광모듈용 티오-캔 패키지
US20050201433A1 (en) * 2002-01-18 2005-09-15 Riaziat Majid L. High-speed TO-can optoelectronic packages
US20060176918A1 (en) * 2005-02-04 2006-08-10 Mitsubishi Denki Kabushiki Kaisha Optical module
KR100871011B1 (ko) * 2008-01-23 2008-11-27 김정수 파장 잠금 기능을 갖는 티오형 레이저 다이오드 패키지 및 그 패키지에 구비된 경사필터의 제작 방법
KR20110008891A (ko) * 2009-07-21 2011-01-27 주식회사 오이솔루션 ＳｉＯＢ를 이용한 ＴＯ ＣＡＮ 평행광 패키지

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050201433A1 (en) * 2002-01-18 2005-09-15 Riaziat Majid L. High-speed TO-can optoelectronic packages
KR20040042922A (ko) * 2002-11-14 2004-05-22 주식회사 래피더스 10기가비피에스급 광모듈용 티오-캔 패키지
US20060176918A1 (en) * 2005-02-04 2006-08-10 Mitsubishi Denki Kabushiki Kaisha Optical module
KR100871011B1 (ko) * 2008-01-23 2008-11-27 김정수 파장 잠금 기능을 갖는 티오형 레이저 다이오드 패키지 및 그 패키지에 구비된 경사필터의 제작 방법
KR20110008891A (ko) * 2009-07-21 2011-01-27 주식회사 오이솔루션 ＳｉＯＢ를 이용한 ＴＯ ＣＡＮ 평행광 패키지

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10811582B2 (en) 2015-06-18 2020-10-20 Osram Oled Gmbh Arrangement
CN114641128A (zh) * 2022-03-11 2022-06-17 武汉光迅科技股份有限公司 一种高频管座和柔性电路板的封装组件和方法

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