WO2015019596A1 - Composition pour former un film de sous-couche de dépôt autocatalytique - Google Patents

Composition pour former un film de sous-couche de dépôt autocatalytique Download PDF

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Publication number
WO2015019596A1
WO2015019596A1 PCT/JP2014/004068 JP2014004068W WO2015019596A1 WO 2015019596 A1 WO2015019596 A1 WO 2015019596A1 JP 2014004068 W JP2014004068 W JP 2014004068W WO 2015019596 A1 WO2015019596 A1 WO 2015019596A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroless plating
group
base film
composition
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2014/004068
Other languages
English (en)
Japanese (ja)
Inventor
師健 中村
真吾 小野寺
直子 荒井
文起 深津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Original Assignee
Idemitsu Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co Ltd filed Critical Idemitsu Kosan Co Ltd
Priority to JP2015530700A priority Critical patent/JP6437438B2/ja
Publication of WO2015019596A1 publication Critical patent/WO2015019596A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper

Definitions

  • An object of the present invention is to provide a composition for forming an electroless plating base film having excellent molding processability and plating precipitation.
  • composition for forming electroless plating base film By mixing each component of the composition for forming an electroless plating base film of the present invention, a composition for forming an electroless plating base film can be obtained.
  • urethane resins include MAU series such as MAU1008, MAU4308HV, MAU5022, and MAU9022 (manufactured by Dainichi Seika Kogyo Co., Ltd.), ASPU series such as ASPU360, ASPU112, ASPU116, and ASPU121 (manufactured by DIC Corporation), Hydran AP. -20, AP-30F, AP-40F, WLS-213, etc. Hydran series (DIC), Ucourt UX-150, UX-200, UX-310, UWS-145, etc.
  • MAU series such as MAU1008, MAU4308HV, MAU5022, and MAU9022
  • ASPU series such as ASPU360, ASPU112, ASPU116, and ASPU121 (manufactured by DIC Corporation)
  • the glass transition temperature of the epoxy resin is preferably 60 ° C. to 110 ° C., more preferably 70 ° C. to 105 ° C., and further preferably 75 ° C. to 100 ° C.
  • the glass transition temperature of the epoxy resin is within the above range, thereby improving the heat resistance and thermal shock resistance of the base film. Can be made.
  • the base film is a substrate without impairing moldability.
  • excellent adhesion to the substrate film and the plating film is shown. This is because, by adding an epoxy resin having the above glass transition temperature to a conductive polymer such as a polyaniline composite, the coating strength and adhesion strength are increased flexibly, so that a heat resistance test and heat after printing, molding and plating are performed. It is thought that resistance to impact tests is improved.
  • the content of the polyvinyl acetal resin is preferably 0.1 parts by weight to 10 parts by weight, more preferably 0.3 parts by weight to the total of 100 parts by weight of the conductive polymer, urethane resin and epoxy resin in the composition.
  • the amount is 3 parts by weight, more preferably 0.5 to 1.5 parts by weight.
  • n is an integer of 0 to 7, preferably 0 to 3, more preferably 1.
  • R is an alkyl group having 1 to 20 carbon atoms, an alkenyl group, an alkylthio group, a cycloalkyl group having 3 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkylaryl group, or an arylalkyl group.
  • Specific examples of the phenolic compound represented by the formula (B) include hydroxynaphthalene.
  • the acidic substance is preferably a compound different from the proton donor of the polyaniline complex
  • the salt of the acidic substance is preferably a compound different from the proton donor of the polyaniline complex.
  • both the acidic substance and the salt of the acidic substance are included as the heat stabilizer, preferably at least one of the acidic substance and the salt of the acidic substance is a compound different from the proton donor.
  • composition of the present invention may further contain additives such as other resins, inorganic materials, curing agents, plasticizers, and organic conductive materials.
  • additives such as other resins, inorganic materials, curing agents, plasticizers, and organic conductive materials.
  • other resins include a binder substrate, a plasticizer, and a matrix substrate.
  • Comparative Example 3 As shown in Table 1, except that 4 g of HP4710 was used instead of HP7200HH, a plating underlayer forming composition was prepared and a plated laminate was manufactured and evaluated in the same manner as in Example 1. The results are shown in Table 2.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)

Abstract

L'invention concerne une composition pour former un film de sous-couche de dépôt autocatalytique, qui comprend un polymère électriquement conducteur, une résine uréthane et une résine époxy, la quantité de résine époxy étant de 0,2 à 30 % en poids par rapport à la quantité totale du polymère électriquement conducteur, de la résine uréthane et de la résine époxy.
PCT/JP2014/004068 2013-08-06 2014-08-04 Composition pour former un film de sous-couche de dépôt autocatalytique Ceased WO2015019596A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015530700A JP6437438B2 (ja) 2013-08-06 2014-08-04 無電解めっき下地膜形成用組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013163360 2013-08-06
JP2013-163360 2013-08-06

Publications (1)

Publication Number Publication Date
WO2015019596A1 true WO2015019596A1 (fr) 2015-02-12

Family

ID=52460952

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/004068 Ceased WO2015019596A1 (fr) 2013-08-06 2014-08-04 Composition pour former un film de sous-couche de dépôt autocatalytique

Country Status (3)

Country Link
JP (1) JP6437438B2 (fr)
TW (1) TWI678432B (fr)
WO (1) WO2015019596A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018080320A (ja) * 2016-08-30 2018-05-24 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 静電気放散性組成物及び方法
EP3296845A4 (fr) * 2015-05-11 2018-07-25 FUJIFILM Corporation Procédé de fabrication d'un stratifié conducteur, stratifié conducteur, substrat doté d'une couche précurseur à couche plaquée, substrat doté d'une couche plaquée et capteur tactile
CN110914471A (zh) * 2017-07-11 2020-03-24 出光兴产株式会社 无电镀基底膜形成用组合物
JPWO2020195905A1 (fr) * 2019-03-27 2020-10-01
JPWO2020196112A1 (fr) * 2019-03-27 2020-10-01

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260897A (ja) * 2007-04-13 2008-10-30 Yokohama Rubber Co Ltd:The 導電性組成物、導電性材料の製造方法および帯電防止材
WO2013031846A1 (fr) * 2011-08-31 2013-03-07 ナガセケムテックス株式会社 Procédé de production d'un article plaqué et article plaqué

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5051328B1 (ja) * 2012-01-27 2012-10-17 大日本印刷株式会社 光学積層体、偏光板及び画像表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260897A (ja) * 2007-04-13 2008-10-30 Yokohama Rubber Co Ltd:The 導電性組成物、導電性材料の製造方法および帯電防止材
WO2013031846A1 (fr) * 2011-08-31 2013-03-07 ナガセケムテックス株式会社 Procédé de production d'un article plaqué et article plaqué

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3296845A4 (fr) * 2015-05-11 2018-07-25 FUJIFILM Corporation Procédé de fabrication d'un stratifié conducteur, stratifié conducteur, substrat doté d'une couche précurseur à couche plaquée, substrat doté d'une couche plaquée et capteur tactile
JP2018080320A (ja) * 2016-08-30 2018-05-24 ザ・ボーイング・カンパニーＴｈｅ Ｂｏｅｉｎｇ Ｃｏｍｐａｎｙ 静電気放散性組成物及び方法
CN110914471A (zh) * 2017-07-11 2020-03-24 出光兴产株式会社 无电镀基底膜形成用组合物
US11421115B2 (en) 2017-07-11 2022-08-23 Idemitsu Kosan Co., Ltd. Composition for electroless plating underlying membrane
JPWO2020195905A1 (fr) * 2019-03-27 2020-10-01
WO2020195905A1 (fr) * 2019-03-27 2020-10-01 出光興産株式会社 Composition de solution contenant un polymère conducteur
JPWO2020196112A1 (fr) * 2019-03-27 2020-10-01
WO2020196112A1 (fr) * 2019-03-27 2020-10-01 出光興産株式会社 Film de base de dépôt autocatalytique
CN113573899A (zh) * 2019-03-27 2021-10-29 出光兴产株式会社 包含导电性高分子的溶液组合物
CN113661270A (zh) * 2019-03-27 2021-11-16 出光兴产株式会社 化学镀基底膜
EP3950332A4 (fr) * 2019-03-27 2022-12-21 Idemitsu Kosan Co., Ltd. Composition de solution contenant un polymère conducteur
JP7438192B2 (ja) 2019-03-27 2024-02-26 出光興産株式会社 防錆剤の製造方法

Also Published As

Publication number Publication date
TW201510274A (zh) 2015-03-16
JPWO2015019596A1 (ja) 2017-03-02
TWI678432B (zh) 2019-12-01
JP6437438B2 (ja) 2018-12-12

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