WO2015117814A1 - Système électronique et procédé de production d'un système électronique - Google Patents

Système électronique et procédé de production d'un système électronique Download PDF

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Publication number
WO2015117814A1
WO2015117814A1 PCT/EP2015/050952 EP2015050952W WO2015117814A1 WO 2015117814 A1 WO2015117814 A1 WO 2015117814A1 EP 2015050952 W EP2015050952 W EP 2015050952W WO 2015117814 A1 WO2015117814 A1 WO 2015117814A1
Authority
WO
WIPO (PCT)
Prior art keywords
micromechanical
thermoelectric generator
electronic system
thermal energy
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/050952
Other languages
German (de)
English (en)
Inventor
Tobias ZOLLER
Tjalf Pirk
Johannes Kenntner
Ricardo Ehrenpfordt
Frederik ANTE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to EP15701724.5A priority Critical patent/EP3103145A1/fr
Priority to CN201580007202.1A priority patent/CN105940513A/zh
Publication of WO2015117814A1 publication Critical patent/WO2015117814A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Definitions

  • the invention relates to an electronic system and a method for
  • the Internet of Things is considered one of the most important future developments in the field of information technology.
  • the Internet of Things means that not only people have access to the Internet and are connected to it, but also that devices are networked via the Internet.
  • One area of the internet of things concerns production and home automation, e.g. for temperature measurement. These sensors are already available but have very high manufacturing costs. Furthermore, efforts are being made to develop sensors that simultaneously obtain the required electrical energy from the environment. This is going through both
  • thermoelectric generators which gain energy from a temperature difference allows.
  • thermoelectric generator The recovered energy of a thermoelectric generator is directly related to an applied temperature gradient.
  • AT 0190151 B1 discloses a voltage generator with thermoelectric generators extending between a zone maintained by a waste heat source at a high temperature and a zone of lower temperature formed by a plurality of ribs arranged in a flow of cooling air to produce a temperature gradient elongated and arranged in a group having substantially parallel axes, each rib having a first longitudinal edge in direct thermal contact with the waste heat source.
  • a high temperature zone of the rib is created.
  • a second longitudinal edge opposite the first edge is at a distance from the
  • a waste heat source wherein the second edges of the ribs are uncovered free edges and the group of ribs is arranged within an air flow, so that cooling air can flow freely along the ribs, so that the ribs are cooled and a low temperature zone of the ribs in the vicinity of its second edge region and that the generators consist of several thermocouples attached to each rib, each thermocouple having a connection to the high temperature zone of the rib and a connection to the low temperature zone of the rib.
  • the present invention provides an electronic system having a micromechanical or microelectronic component, a substrate for accommodating the micromechanical or microelectronic component, at least one contact region contacting the substrate for contacting a heat source, and a first thermal energy store having the at least one contact region and the micromechanical or
  • the present invention further provides a method of manufacturing an electronic system.
  • the method comprises recording a micromechanical or microelectronic component by means of a substrate, forming at least one first thermal energy store; and thermally coupling the at least one contact region and the Micromechanical or microelectronic device by means of the first thermal energy storage.
  • the present invention also provides a sensor with a
  • thermoelectric generator a substrate for receiving the thermoelectric generator
  • thermoelectric generator a first contact region and a second contact region, which contact the substrate and are designed to contact a heat source, and at least one thermal
  • Energy storage which thermally couples the first contact region and / or the second contact region and the micromechanical or microelectronic device.
  • the present invention further provides a sensor system with the sensor according to the invention.
  • the sensor system further comprises a power circuit for switching a voltage generated by the thermoelectric generator, a microcontroller for controlling the thermoelectric generator, an energy storage for storing the of the
  • thermoelectric generator generated energy, a wireless module for wireless transmission of sensor data and an antenna.
  • An advantage of the present invention is to provide an electronic system with a micromechanical or microelectronic component and a thermal energy store, wherein the thermal energy store thermally couples the micromechanical or microelectronic component at least partially to a contact region.
  • the thermal coupling causes a mutual physical by buffering of thermal energy
  • thermoelectric generator when providing the micromechanical or microelectronic component in the form of a thermoelectric generator is the thermal
  • Coupling that is, the buffering of thermal energy advantageous when a voltage applied to the thermoelectric generator temperature gradient is not can be ensured continuously or, for example, when exchanging a cold and hot side of the thermoelectric generator.
  • thermoelectric generator can be made more robust to temperature changes and possible temperature peaks can be intercepted or filtered.
  • microelectronic device at least partially surrounding housing, embedded in the substrate or in a formed in the substrate
  • the first thermal energy storage can thus be arranged depending on the structural requirements or depending on the systemic requirements on an upper or lower side of the micromechanical or microelectronic device.
  • the first thermal energy store in the form of a paint, a gel, a film, a paste, a film, an adhesive, a dispension, a powder, a granule, a layer or as a composite material or a filler Screen printing, stencil printing, dispensing, laminating, spraying, spraying, transfer molding, injection molding or compression is formed.
  • the thermal energy storage is thus advantageously to structural and systemic requirements of
  • the first thermal energy storage is formed by a phase change material, wherein the phase change material in a temperature range of -40 - 150 ° C, preferably in a temperature range of 0 - 100 ° C its modulus of elasticity by receiving and delivering Energy changes.
  • the change of the Modulus of elasticity advantageously leads to a harder or softer coupling of the micromechanical or microelectronic component to the substrate or the housing of the electronic system.
  • the micromechanical or microelectronic component by an acceleration sensor, a
  • Yaw sensor, a magnetic sensor, a Hall sensor, a pressure sensor, an application-specific integrated circuit or a thermoelectric generator is formed.
  • the electronic system can thus a variety of different sensors, integrated circuits or a
  • thermoelectric generator having thermoelectric generator.
  • micromechanical or microelectronic component by the
  • thermoelectric generator is formed. It is further provided that on one side of the thermoelectric generator, a heat sink for cooling the thermoelectric generator is arranged. The side of the thermoelectric generator
  • thermoelectric generator preferably the cold side of the
  • thermoelectric generator thus can be preferably cooled by the heat sink, which causes an improved thermal gradient of the thermoelectric generator.
  • a second thermal energy storage at least in sections on a, on the substrate arranged potting compound for housing the
  • thermoelectric generator and at least partially on an upper side of the thermoelectric generator, between the upper side of the thermoelectric generator and the heat sink for cooling the
  • thermoelectric generator is arranged.
  • the provision of the second thermal energy storage enables the thermoelectric generator to be made more robust against temperature changes and possible temperature peaks to be trapped or filtered. This concerns by providing each of a thermal energy storage on the hot and cold side of the thermoelectric generator thus both the hot and the cold side of the thermoelectric generator. Temperature changes at the hot and / or cold side of the thermoelectric generator can thus be effectively intercepted, buffered or filtered.
  • Energy storage are connected to the micromechanical or microelectronic component by means of a respective thermal conductor path. Thus, heat from the contact area can be efficiently supplied to the thermal energy storage.
  • the at least one contact region forms at least a part of a housing and / or the thermal conductor path to the upper side of the micromechanical or microelectronic component forms at least a part of the housing.
  • the contact area for example, in the housing can be integrated, which allows weight savings or a more compact design.
  • the first thermal energy storage at least forms part of the micromechanical or microelectronic device at least partially surrounding housing or is inserted as a filler in at least one wall of the housing.
  • Embodiments of the invention mediate. They illustrate
  • Fig. 1 is a sectional view of an electronic system according to a first
  • Fig. 2 is a sectional view of the electronic system according to a second
  • Fig. 3 is a sectional view of the electronic system according to a third
  • Fig. 4 is a sectional view of the electronic system according to a fourth
  • Fig. 5 is a sectional view of the electronic system according to a fifth
  • Fig. 6 is a sectional view of the electronic system according to a
  • Fig. 7 is a sectional view of the electronic system according to a seventh
  • FIG. 8 is a sectional view of the electronic system according to an eighth embodiment of the invention.
  • Fig. 1 shows a sectional view of an electronic system according to a first embodiment of the invention.
  • the electronic system 1 has a micromechanical component 10,
  • a sensor in particular preferably one
  • the micromechanical component 10 has an upper side 10a and a lower side 10b.
  • a yaw rate sensor a magnetic sensor, a Hall sensor, a pressure sensor, a microelectronic device, such as e.g. a
  • the micromechanical component 10 is arranged on a substrate 12, wherein a thermal energy store 16 is formed between the micromechanical component 10 and the substrate 12.
  • the thermal energy store 16 is formed by a phase change material, wherein the phase change material in a temperature range of -40 - 150 ° C, preferably in a temperature range of 0 - 100 ° C, modifies its modulus of elasticity by absorbing and releasing energy.
  • phase change material is formed in the present embodiment in the form of a paint.
  • the phase change material may also be in the form of an adhesive, a gel, a film, a paste, a film, a dispersion, a granulate, a powder or a layer
  • Phase change material is applied to the substrate 12 by a primer.
  • the phase change material can also be applied by an adhesive or by pressing.
  • first contact region 14 and a second contact region 15 are provided, which are arranged on an underside of the substrate 12.
  • the first contact region 14 and the second contact region 15 are connected to the thermal energy store 16 by means of thermal conductor paths (not shown in FIG. 1).
  • the thermal conductor paths are formed by copper inserts in the present exemplary embodiment.
  • the thermal conductor paths may also be provided as metallic vias, metallic interconnects, thermally highly conductive polymers, or as thermally poorly conductive polymers with thermally conductive spacers.
  • the electronic system 1 further comprises a housing 18, which is designed such that it is placed on the substrate 12 and the micromechanical component 10 as well as the thermal
  • the housing 18 has a width that is identical to the width of the substrate 12.
  • the substrate 12 is preferably formed by a printed circuit board.
  • the substrate 12 may be formed of another suitable material such as ceramic, silicon, copper or polyimide.
  • phase change material is arranged between the contact regions 14, 15 and the micromechanical component in order to thermally and / or mechanically couple the system to one another.
  • thermal energy can be buffered by the coupling and, on the other hand, thermal peaks can be intercepted and smoothed by the system.
  • the phase change material preferably serves for the stress decoupling of the
  • micromechanical device 10 from the substrate 12 of the electronic
  • phase change material In a temperature range of preferably 20-80 ° C, the phase change material is designed to change its modulus of elasticity or its mechanical properties by absorbing and releasing energy. As a result of this change, the coupling of the micromechanical component 10 to the substrate 12 and / or contact region 14, 15 can be set harder or softer.
  • Fig. 2 shows a sectional view of an electronic system according to a second embodiment of the invention.
  • thermo energy storage 16 which in the form of
  • Phase change material is formed between the top 10 a of the micromechanical device 10 and an inner side 18 a of the housing 18 is arranged.
  • the thermal conductor paths (not shown in FIG. 2) connect the first and second contact regions 14, 15 to the micromechanical component 10 as in the embodiment described with reference to FIG. 1.
  • the thermal energy store 16 thermally and / or couples the micromechanical component 10
  • FIG. 3 shows a sectional view of an electronic system according to a third.
  • thermo energy storage 16 in the form of
  • the micromechanical component 10 is arranged on the substrate 12 as in the embodiment described with reference to FIG. 1.
  • the upper surface of the substrate 12 has a beam-like structure.
  • the underside may also have a beam-like structure.
  • the substrate 12 has two levels in the present embodiment. One of the two levels is mechanically flexible.
  • the substrate is made according to the present embodiment
  • the substrate can also be formed, for example, from FR4, BT or PTFE.
  • the upper side of the substrate 12, which has a beam-like structure, is formed in the present embodiment of a thermosetting material.
  • the thermal energy storage is introduced between the thermoset layer and the mechanically flexible plane.
  • the mechanically flexible plane is formed in the present embodiment of polyimide.
  • the mechanically flexible plane can also be formed from another suitable material.
  • FIG. 4 shows a sectional view of an electronic system according to a fourth embodiment of the invention.
  • the electronic system 1 is formed in the present embodiment by a sensor.
  • the micromechanical component 10 is formed by a thermoelectric generator, the thermoelectric generator having an upper side 10a and a lower side 10b, which correspond to a cold and a hot side.
  • the underside 10 b of the thermoelectric generator is connected by means of wire bonds 26 to conductor tracks of the substrate 12.
  • the thermal energy storage 16 in the form of the phase change material is embedded in the substrate as in the embodiment described with reference to FIG. 3.
  • the contact region 14 is arranged on an underside of the substrate 12 and connected to the thermal
  • Thermal energy storage 16 thermally connected by metallic inserts.
  • the thermal energy store 16 is further thermally connected to the underside 10b of the thermoelectric generator by means of a thermal conductor path 24 in the form of metallic inserts.
  • a second contact region for providing a thermal gradient at the upper side 10a of the thermoelectric generator is not shown in FIG. 4.
  • FIG. 5 shows a sectional view of an electronic system according to a fifth embodiment of the invention.
  • a potting compound 25 is additionally formed on the substrate 12.
  • Potting compound is used to house the thermoelectric generator and encloses the thermoelectric generator except for an upper surface of the upper surface 10 a of the thermoelectric generator, on which a
  • Heatsink 20 is arranged for cooling the thermoelectric generator. By providing the heat sink 20, a temperature gradient applied to the thermoelectric generator can be improved.
  • the heat sink 20 also has the function of a cover of the sensor to protect possible components from the external conditions.
  • another micromechanical or microelectronic component 10 may also be provided.
  • Fig. 6 shows a sectional view of an electronic system according to a sixth embodiment of the invention.
  • thermo energy storage 16 in the form of
  • thermoelectric generator 10 itself also has a recess in which the thermoelectric generator 10, in particular the bottom 10b of the thermoelectric generator 10 is received.
  • the present embodiment of the sensor is opposite to those described above
  • Embodiments a lower height and can thus be used advantageously where a low height of the sensor is required.
  • Fig. 7 shows a sectional view of an electronic system according to a seventh embodiment of the invention.
  • a second thermal energy storage 22 is provided.
  • the second thermal energy storage 22 is disposed on an upper side of the potting compound 25, wherein the second thermal energy storage 22 between a top 10a of the
  • thermoelectric generator 10 and a lower side of the heat sink 20 is arranged.
  • the second thermal energy store 22 is thus configured to thermally and / or mechanically couple the upper side 10a of the thermoelectric generator 10 with the heat sink 20 and to make the thermoelectric generator more robust to temperature changes and to buffer or buffer possible temperature peaks.
  • Fig. 8 shows a sectional view of an electronic system according to an eighth embodiment of the invention.
  • a geometry of a packaging of the sensor is designed in such a way that it is arranged on the substrate 12
  • Potting compound 25 for housing the thermoelectric generator on the one hand thinner and on the other with a uniform height is formed.
  • the sensor 1 can thus be designed in accordance with structural requirements.
  • FIG. 9 shows a flow chart of a method of manufacturing an electronic system according to the first to eighth embodiments of the invention.
  • the method of manufacturing the electronic system includes a
  • the contact regions 14, 15, the first and / or second thermal energy store 16, 22 as well as the micromechanical or microelectronic component 10 may be arranged at another suitable position in the electronic system or have varying material properties.

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  • Micromachines (AREA)

Abstract

L'invention concerne un système électronique comprenant un composant micromécanique ou microélectronique (10), un substrat (12) servant à loger le composant micromécanique ou microélectronique (10), au moins une zone de contact (14) en contact avec le substrat (12) et servant à la mise en contact avec une source de chaleur, et un premier accumulateur d'énergie thermique (16), lequel couple thermiquement la ou les zones de contact (14) et le composant micromécanique ou microélectronique (10). L'invention concerne en outre un procédé de production d'un système électronique, un capteur ainsi qu'un système de détection.
PCT/EP2015/050952 2014-02-05 2015-01-20 Système électronique et procédé de production d'un système électronique Ceased WO2015117814A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP15701724.5A EP3103145A1 (fr) 2014-02-05 2015-01-20 Système électronique et procédé de production d'un système électronique
CN201580007202.1A CN105940513A (zh) 2014-02-05 2015-01-20 电子系统和用于制造电子系统的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014202008.5A DE102014202008A1 (de) 2014-02-05 2014-02-05 Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems
DE102014202008.5 2014-02-05

Publications (1)

Publication Number Publication Date
WO2015117814A1 true WO2015117814A1 (fr) 2015-08-13

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PCT/EP2015/050952 Ceased WO2015117814A1 (fr) 2014-02-05 2015-01-20 Système électronique et procédé de production d'un système électronique

Country Status (4)

Country Link
EP (1) EP3103145A1 (fr)
CN (1) CN105940513A (fr)
DE (1) DE102014202008A1 (fr)
WO (1) WO2015117814A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017068476A1 (fr) * 2015-10-21 2017-04-27 Soreq Nuclear Research Center Systèmes de refroidissement ultra compacts basés sur des accumulateurs de chaleur à matériau à changement de phase
WO2018060233A1 (fr) * 2016-09-27 2018-04-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Support de composant doté d'un dispositif thermoélectrique entièrement encapsulé
CN106404821B (zh) * 2016-10-31 2023-05-23 华南理工大学 一种材料相变行为表征用电-热耦合处理系统
DE102017206744B9 (de) * 2017-04-21 2023-01-12 Infineon Technologies Ag Mems package mit hoher wärmekapazität und verfahren zum herstellen selbiger

Citations (5)

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Publication number Priority date Publication date Assignee Title
EP1001470A1 (fr) * 1998-11-13 2000-05-17 Seiko Instruments Inc. Dispositif électronique à générateur thermoélectrique
DE10324156A1 (de) * 2003-05-22 2004-12-16 Siemens Ag Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät
DE10347518A1 (de) * 2003-10-13 2005-05-25 Siemens Ag Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher
EP2475019A2 (fr) * 2010-12-15 2012-07-11 The Boeing Company Production d'électricité utilisant un générateur thermoélectrique et matériau de changement de phase
US20130098417A1 (en) * 2010-06-23 2013-04-25 Jerome Gavillet Thermogenerator comprising phase-change materials

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AT190151B (de) 1955-10-25 1957-06-11 Landis & Gyr Ag Rücklaufhemmung mit Signalgabe für elektrische Meßinstrumente, insbesondere Elektrizitätszähler

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1001470A1 (fr) * 1998-11-13 2000-05-17 Seiko Instruments Inc. Dispositif électronique à générateur thermoélectrique
DE10324156A1 (de) * 2003-05-22 2004-12-16 Siemens Ag Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät
DE10347518A1 (de) * 2003-10-13 2005-05-25 Siemens Ag Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher
US20130098417A1 (en) * 2010-06-23 2013-04-25 Jerome Gavillet Thermogenerator comprising phase-change materials
EP2475019A2 (fr) * 2010-12-15 2012-07-11 The Boeing Company Production d'électricité utilisant un générateur thermoélectrique et matériau de changement de phase

Non-Patent Citations (1)

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Title
JOACHIM NURNUS: "Thermoelectric thin film power generators: self-sustaining power supply for smart systems", PROCEEDINGS OF SPIE, vol. 7362, 18 May 2009 (2009-05-18), pages 736205 - 736205-6, XP055177770, ISSN: 0277-786X, DOI: 10.1117/12.821606 *

Also Published As

Publication number Publication date
EP3103145A1 (fr) 2016-12-14
DE102014202008A1 (de) 2015-08-06
CN105940513A (zh) 2016-09-14

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