WO2015129938A1 - Sonde à ultrasons présentant de meilleures caractéristiques de dissipation de la chaleur - Google Patents
Sonde à ultrasons présentant de meilleures caractéristiques de dissipation de la chaleur Download PDFInfo
- Publication number
- WO2015129938A1 WO2015129938A1 PCT/KR2014/001650 KR2014001650W WO2015129938A1 WO 2015129938 A1 WO2015129938 A1 WO 2015129938A1 KR 2014001650 W KR2014001650 W KR 2014001650W WO 2015129938 A1 WO2015129938 A1 WO 2015129938A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing
- circuit board
- waterproof member
- probe
- outer groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/54—Control of the diagnostic device
- A61B8/546—Control of the diagnostic device involving monitoring or regulation of device temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
- G01S7/52079—Constructional features
Definitions
- the present invention relates to an ultrasonic probe provided in an ultrasonic diagnostic apparatus or the like for acquiring image information inside an object under examination using ultrasonic waves.
- the ultrasound diagnosis apparatus transmits an ultrasound signal to the internal tissue of the subject by an ultrasound probe, and then receives an ultrasound signal reflected from the tissue boundary of an object having a different acoustic impedance by the ultrasound probe, thereby receiving the ultrasound signal.
- the device obtains image information about tissues.
- the image information is output to the monitor of the ultrasound diagnosis apparatus, and the diagnoser may perform diagnosis on the subject through the image information output to the monitor.
- the ultrasonic probe may be configured by receiving a transducer and a probe circuit board in a housing.
- the transducer may include a plurality of piezoelectric elements arranged in an array and a connection circuit board electrically connected to the piezoelectric elements and drawn outward.
- the connection circuit board may be connected to the probe circuit board to electrically connect the piezoelectric elements to the probe circuit board.
- the probe circuit board may be electrically connected to the main body of the ultrasonic diagnostic apparatus by a cable.
- the cable is connected to the probe circuit board at one end of which is located inside the housing, and the other end of the cable is connected to the main body of the ultrasonic diagnostic apparatus by a cable connector.
- heat may be generated from a heat generating source such as a probe circuit board when driving the ultrasonic probe. Since such heat accumulates in the sealed space inside the housing, it may cause heat damage to the probe circuit board and the transducer, and therefore, it is necessary to smoothly discharge the heat inside the housing to the outside of the housing.
- heat dissipation means such as heatsinks are provided inside the housing. The heat sink absorbs heat inside the housing and transfers it to the cable, thereby releasing heat inside the housing to the outside of the housing.
- the heat sink is heat exchanged with the internal hot air of the housing to absorb heat with the heat sink, and then heat conduction with a cable to release heat inside the housing, the external ambient air of the housing is transferred to the internal high temperature of the housing. It may not be as effective as direct heat exchange with air to dissipate heat inside the housing.
- the ultrasonic probe has been configured to have more complex and various functions according to the technical development and application field expansion of the ultrasonic diagnostic apparatus.
- the ultrasonic probe may be configured as a smart probe including a pulse generation module and a signal processing module, etc., which are located on the main body side of the ultrasonic diagnostic apparatus, as well as a pattern circuit for signal transmission to the probe circuit board.
- the pulse generation module transmits the pulse of the electrical signal to the transducer
- the signal processing module processes the electrical signal received from the transducer.
- the ultrasonic probe may be configured as a wireless probe including a wireless communication module on the probe circuit board to enable wireless communication with the main body of the ultrasonic diagnostic apparatus without a cable.
- the ultrasound probe may be configured as a 3D probe capable of acquiring a 3D image or a 4D probe capable of acquiring a 4D image.
- the three-dimensional probe or the four-dimensional probe may be equipped with an actuator inside each housing to move the transducer in a pivotal manner.
- Such ultrasonic probes have more circuit elements mounted on the probe circuit board or actuators mounted inside the housing, thereby increasing heat generation inside the housing. Therefore, there is a need for the development of an ultrasonic probe having more effective heat dissipation characteristics.
- An object of the present invention is to provide an ultrasonic probe having more effective heat dissipation characteristics.
- an ultrasonic probe includes a housing, a transducer, a probe circuit board, and a waterproof member.
- the housing has a plurality of apertures to allow air to enter and exit.
- the transducer is housed at least partially in the housing and transmits and receives ultrasonic signals.
- the probe circuit board is housed in the housing and connected to the transducer.
- the waterproof member is formed to surround the probe circuit board in the housing to block water from entering the probe circuit board.
- the internal hot air of the housing is directly heat-exchanged with the ambient air outside the housing through the through hole, thereby more effectively transferring heat inside the housing. Can be released.
- FIG. 1 is a perspective view of an ultrasonic probe according to an embodiment of the present invention.
- FIG. 2 is an exploded perspective view of the ultrasonic probe shown in FIG. 1.
- FIG. 3 is a perspective view illustrating a state in which the waterproof member and the support frame are separated from the probe circuit board in FIG. 2.
- FIG. 4 is a plan view showing a portion of the housing illustrated in FIG. 1.
- FIG. 5 is a cross-sectional view taken along the line A-A of FIG. 4.
- FIG. 6 is a plan view illustrating another example of the through hole.
- FIG. 7 is a cross-sectional view taken along the line B-B of FIG. 6.
- FIG. 1 is a perspective view of an ultrasonic probe according to an embodiment of the present invention.
- FIG. 2 is an exploded perspective view of the ultrasonic probe shown in FIG. 1.
- 3 is a perspective view illustrating a state in which the waterproof member and the support frame are separated from the probe circuit board in FIG. 2.
- FIG. 4 is a plan view showing a portion of the housing illustrated in FIG. 1.
- 5 is a cross-sectional view taken along the line A-A of FIG. 4.
- the ultrasonic probe 100 includes a housing 110, a transducer 120, a probe circuit board 130, and a waterproof member 140.
- the housing 110 accommodates and protects the probe circuit board 130 and the waterproof member 140.
- the housing 110 may be formed to have an inner space for accommodating the probe circuit board 130 and the waterproof member 140 in a state where the transducer 120 is partially inserted through an opening formed at one end.
- the housing 110 may have a grip having a constricted shape so that the diagnostic person can comfortably hold it by hand.
- the housing 110 When the ultrasonic probe 100 is connected to the main body of the ultrasonic diagnostic apparatus by a cable, the housing 110 may pass the cable through an opening formed at the opposite end.
- the housing 110 may have a structure divided into first and second housing parts 111 and 112. As the first and second housing parts 111 and 112 are coupled to or separated from each other, the transducer 120, the probe circuit board 130, and the waterproof member 140 may be easily assembled or disassembled.
- the first and second housing parts 111 and 112 may be made of a material such as plastic or rubber.
- the housing 110 has a plurality of through parts 113 to allow air to enter and exit the housing 110.
- the plurality of through parts 113 may be formed at a circumferential portion of the housing 110.
- the through parts 113 allow the internal air of the housing 110 to be discharged to the outside of the housing 110 and the external air of the housing 110 to be introduced into the housing 110.
- a heat generating source such as the probe circuit board 130 when the ultrasonic probe 100 is driven
- the internal air temperature of the housing 110 rises
- the internal hot air of the housing 110 passes through the through part 113. Through this, the heat can be directly exchanged with the ambient air outside the housing 110. Accordingly, heat inside the housing 110 may be more effectively released.
- each of the through holes 113 may include an outer groove 113a, an inner groove 113b, and a connecting hole 113c.
- the outer groove 113a is formed on the outer surface of the housing 110.
- the outer groove 113a may be formed of a circular groove or the like.
- the inner groove 113b is formed on the inner surface of the housing 110 to be eccentric with respect to the outer groove 113a. That is, the center of the inner groove 113b may be located away from the center of the outer groove 113a.
- the inner groove 113b may be formed of a circular groove or the like.
- the inner groove 113b may be smaller in diameter than the outer groove 113a.
- the connecting through hole 113c connects the outer groove 113a with the inner groove 113b at the bottom of the outer groove 113a. Accordingly, the air inside the housing 110 may be discharged to the outside of the housing 110 through the through holes 113, and the outside air of the housing 110 may flow into the inside of the housing 110 through the through holes 113. have.
- the inner groove 113b is eccentric from the outer groove 113a, even if the diagnostic person grasps the outer surface of the housing 110 by hand, the skin of the hand is inside the housing 110 through the through holes 113. It may block the contact with, it can minimize the view of the inside of the housing 110 from the outside of the housing (110).
- the edge of the inner groove 113b is shown to coincide with the edge of the outer groove 113a, the edge of the inner groove 113b may be positioned to deviate or partially overlap the edge of the outer groove 113a. Do.
- the size and arrangement of the through-holes 113 may be variously set in a range capable of performing the above-described functions, and is not limited to the illustrated.
- the transducer 120 is at least partially housed in the housing 110.
- the transducer 120 transmits an ultrasonic signal to the internal tissue of the subject and receives the ultrasonic signal reflected from the internal tissue of the subject.
- the transducer 120 may include a plurality of piezoelectric elements arranged in an array form. Piezoelectric elements generate an ultrasonic signal by resonating when an electrical signal is applied, and generate an electrical signal by vibrating when an ultrasonic signal is received.
- Piezoelectric elements may be disposed and supported on a backing material. Matching layers may be stacked on the piezoelectric elements. An acoustic lens may be stacked on the matching layer.
- the piezoelectric elements may be connected to the connection circuit boards 121.
- the connection circuit boards 121 may be each made of a flexible substrate. One of the connection circuit boards 121 may have a pattern circuit electrically connected to the signal electrodes of the piezoelectric elements, and the other may have a pattern circuit electrically connected to the ground electrodes of the piezoelectric elements.
- the piezoelectric elements may be accommodated in the transducer case 122 and protected.
- the transducer case 122 may have a structure for accommodating not only the piezoelectric elements but also the backing material, the matching layer, and the acoustic lens in the state in which the connection circuit boards 121 are drawn out.
- the transducer case 122 may be sealed to prevent moisture or foreign matter from entering the inside.
- the transducer case 122 may be fitted to the opening of the housing 110 in a state where the connection circuit board 121 is inserted through an opening formed at one end of the housing 110.
- the transducer 120 may be of a linear array type or a convex array type.
- the probe circuit board 130 is accommodated in the housing 110.
- the probe circuit board 130 is connected to the transducer 120.
- the probe circuit board 130 may be connected to the transducer 120 by the connection circuit boards 121.
- Connectors may be formed on the probe circuit board 130 to be coupled to or separated from the connectors of the connection circuit boards 121.
- the probe circuit board 130 may have a pattern circuit for signal transmission with the transducer 120.
- the probe circuit board 130 may include not only a pattern circuit for signal transmission, but also a pulse generation module and a signal processing module which are located on the main body side of the ultrasonic diagnostic apparatus.
- the pulse generation module transmits the pulse of the electrical signal to the transducer
- the signal processing module processes the electrical signal received from the transducer.
- the probe circuit board 130 may include a wireless communication module to enable wireless communication with the main body of the ultrasonic diagnostic apparatus without a cable.
- the ultrasonic probe 100 is composed of a three-dimensional probe capable of acquiring a three-dimensional image or a four-dimensional probe capable of acquiring a four-dimensional image
- An actuator may be installed. Accordingly, the heat generating source may be increased inside the housing 110.
- the housings may be formed by the through holes 113. 110) the heat inside can be released more effectively.
- the waterproof member 140 is formed to surround the probe circuit board 130 in the housing 110 to block water from entering the probe circuit board 130. Even if moisture penetrates into the housing 110 through the through holes 113, the waterproof member 140 may block the penetrated moisture from entering the probe circuit board 130. Therefore, it is possible to prevent the probe circuit board 130 from being damaged by moisture.
- the waterproof member 140 may be made of a material such as fiber or resin having a waterproof function. The waterproof member 140 may be sealed with respect to the transducer 120 while one opening portion is accommodated in the probe circuit board 130 and the connection boards 121 through one opening.
- the waterproof member 140 may further have an air permeation function.
- the internal high temperature air of the waterproof member 140 passes through the waterproof member 140 having an air permeation function. It is possible to directly exchange heat with the ambient air outside the 140. Therefore, heat generated from the probe circuit board 130 may be more effectively discharged to the outside of the waterproof member 140.
- the waterproof member 140 may be made of a special fiber having a waterproof and air permeable function, such as Gore-tex fabric.
- Gore-Tex is a thin membrane with a large number of small pores formed by heating a polytetrafluoroetylene-based resin, and the Gore-Tex fabric is bonded to nylon fibers.
- Gore-Tex has more than 9 billion micropores per square inch. Thus, water molecules cannot pass through the fine pores of the Gore-Tex, while water vapor molecules can pass through the fine pores of the Gore-Tex.
- the waterproof member may be made of eVENT® fabric or the like.
- the waterproof member 140 may further have a heat dissipation function.
- the waterproof member 140 may be coated with a conductive material such as carbon nanotube, silver, copper, or the like. Accordingly, heat generated from the probe circuit board 130 may be smoothly transferred to the waterproof member 140 having a heat dissipation function and may be discharged to the outside of the waterproof member 140.
- the waterproof member 140 may further have an EMI shielding function. Accordingly, the electromagnetic wave generated from the probe circuit board 130 may be blocked from being emitted to the outside of the waterproof member 140 by the waterproof member 140 having the EMI shielding function.
- the ultrasonic probe 100 may include a support frame 150 disposed to abut against the inner surface of the waterproof member 140 to support the waterproof member 140.
- the support frame 150 may maintain the shape of the waterproof member 140 by supporting the inner surface of the waterproof member 140.
- One opening portion of the waterproof member 140 may be bonded to the support frame 150 to be sealed.
- the support frame 150 may have a rectangular parallelepiped shape having an inner space.
- the support frame 150 may be accommodated in the internal space by inserting the probe circuit board 130 and the connection circuit board 121 through one opening.
- the support frame 150 may be coupled to the transducer case 122.
- the support frame 150 has a structure in which the remaining surfaces are opened to allow the air to flow in and out smoothly between the probe circuit board 130 and the waterproof member 140.
- the support frame 150 may be made of a material such as plastic or metal.
- the inner surface of the support frame 150 may be coated with an insulating material.
- the support frame 150 may be sealed by a sealing material such as silicon at a portion coupled with the transducer 120. Therefore, the probe circuit board 130 and the connection circuit board 121 may be wrapped and sealed by the waterproof member 140 in a state accommodated in the support frame 150.
- the waterproof member 140 may be fixed to the inside of the housing 110 without the supporting frame 150.
- the waterproof member 140 may be fixed by attaching an adhesive material to the inside of the housing 110.
- each of the through holes 213 is arranged in the circumferential direction of the outer groove 213a with a plurality of inner grooves 213b eccentric with respect to the outer groove 213a, respectively. It may be formed on the inner surface of the housing 110.
- the connecting through holes 213c may connect the outer grooves 213a with the inner grooves 213b at the bottom of the outer groove 213a, respectively.
- the inner grooves 213b may have smaller diameters than the outer grooves 213a and may be arranged at regular intervals.
- the through-holes 213 may not only release air into and out of the housing 110 to release heat from the inside of the housing 110, but also the skin of the hand may be held in a state where the hand of the diagnoser holds the housing 110 by hand. 110 may be prevented from contacting the inside, it is possible to minimize the view of the inside of the housing 110 from the outside of the housing (110).
- the inner grooves 213b are shown as being partially overlapped with the outer grooves 213a, but it is also possible for each edge of the inner grooves 213b to be positioned so as to deviate from or coincide with the edge of the outer groove 213a.
- the size and arrangement of the through-holes 213 may be variously set in a range capable of performing the above-described functions, and is not limited to the illustrated.
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Heart & Thoracic Surgery (AREA)
- Veterinary Medicine (AREA)
- Public Health (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Animal Behavior & Ethology (AREA)
- Surgery (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Medical Informatics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Computer Networks & Wireless Communication (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
La présente invention concerne une sonde à ultrasons présentant de meilleures caractéristiques de dissipation de la chaleur. La sonde à ultrasons selon l'invention comprend : un boîtier ; un transducteur ; une carte de circuit de sonde ; et un élément étanche à l'eau. Le boîtier comporte une pluralité de trous débouchants permettant à l'air d'entrer et de sortir. Au moins une partie du transducteur est reçue dans le boîtier, et le transducteur émet et reçoit un signal ultrasonore. La carte de circuit de sonde est logée dans le boîtier et est connectée au transducteur. L'élément étanche à l'eau est formé de façon à entourer la carte de circuit de sonde à l'intérieur du boîtier pour empêcher l'eau d'entrer dans la carte de circuit de sonde.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0023313 | 2014-02-27 | ||
| KR1020140023313A KR20150101699A (ko) | 2014-02-27 | 2014-02-27 | 개선된 방열 특성을 갖는 트랜스듀서 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015129938A1 true WO2015129938A1 (fr) | 2015-09-03 |
Family
ID=54009243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2014/001650 Ceased WO2015129938A1 (fr) | 2014-02-27 | 2014-02-27 | Sonde à ultrasons présentant de meilleures caractéristiques de dissipation de la chaleur |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20150101699A (fr) |
| WO (1) | WO2015129938A1 (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3520700A1 (fr) * | 2018-01-31 | 2019-08-07 | Samsung Medison Co., Ltd. | Sonde à ultrasons |
| TWI682170B (zh) * | 2018-12-04 | 2020-01-11 | 英業達股份有限公司 | 防水超音波掃描器 |
| CN111220711A (zh) * | 2018-11-26 | 2020-06-02 | 英业达科技有限公司 | 防水超音波扫描仪 |
| TWI703324B (zh) * | 2019-02-26 | 2020-09-01 | 佳世達科技股份有限公司 | 超音波掃描組合及超音波傳導模組 |
| US11033252B2 (en) * | 2016-01-28 | 2021-06-15 | Samsung Medison Co., Ltd. | Ultrasound probe and ultrasound diagnosis system including same |
| US20230107276A1 (en) * | 2014-06-10 | 2023-04-06 | Fujifilm Sonosite, Inc. | Systems and methods for cooling ultrasound transducers |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006025892A (ja) * | 2004-07-13 | 2006-02-02 | Toshiba Corp | 超音波プローブ |
| KR100749722B1 (ko) * | 2007-05-15 | 2007-08-16 | (주)아이에스피 | 고방열, 고방수성을 갖는 카세트-타입 전광판용 디스플레이모듈 |
| JP2008194278A (ja) * | 2007-02-14 | 2008-08-28 | Aloka Co Ltd | 超音波診断装置のプローブコネクタ |
| JP2008284003A (ja) * | 2007-05-15 | 2008-11-27 | Aloka Co Ltd | 超音波プローブ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100050844A (ko) * | 2008-11-06 | 2010-05-14 | 주식회사 메디슨 | 프로브 |
| KR20130104202A (ko) * | 2012-03-13 | 2013-09-25 | 삼성메디슨 주식회사 | 초음파 진단장치용 프로브 |
-
2014
- 2014-02-27 WO PCT/KR2014/001650 patent/WO2015129938A1/fr not_active Ceased
- 2014-02-27 KR KR1020140023313A patent/KR20150101699A/ko not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006025892A (ja) * | 2004-07-13 | 2006-02-02 | Toshiba Corp | 超音波プローブ |
| JP2008194278A (ja) * | 2007-02-14 | 2008-08-28 | Aloka Co Ltd | 超音波診断装置のプローブコネクタ |
| KR100749722B1 (ko) * | 2007-05-15 | 2007-08-16 | (주)아이에스피 | 고방열, 고방수성을 갖는 카세트-타입 전광판용 디스플레이모듈 |
| JP2008284003A (ja) * | 2007-05-15 | 2008-11-27 | Aloka Co Ltd | 超音波プローブ |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230107276A1 (en) * | 2014-06-10 | 2023-04-06 | Fujifilm Sonosite, Inc. | Systems and methods for cooling ultrasound transducers |
| US12521097B2 (en) * | 2014-06-10 | 2026-01-13 | Fujifilm Sonosite, Inc. | Systems and methods for air cooled ultrasound transducers via cavity on the probe |
| US11033252B2 (en) * | 2016-01-28 | 2021-06-15 | Samsung Medison Co., Ltd. | Ultrasound probe and ultrasound diagnosis system including same |
| EP3520700A1 (fr) * | 2018-01-31 | 2019-08-07 | Samsung Medison Co., Ltd. | Sonde à ultrasons |
| KR20190092701A (ko) * | 2018-01-31 | 2019-08-08 | 삼성메디슨 주식회사 | 초음파 프로브 |
| US11311272B2 (en) | 2018-01-31 | 2022-04-26 | Samsung Medison Co., Ltd. | Ultrasonic probe |
| KR102607018B1 (ko) | 2018-01-31 | 2023-11-29 | 삼성메디슨 주식회사 | 초음파 프로브 |
| CN111220711A (zh) * | 2018-11-26 | 2020-06-02 | 英业达科技有限公司 | 防水超音波扫描仪 |
| TWI682170B (zh) * | 2018-12-04 | 2020-01-11 | 英業達股份有限公司 | 防水超音波掃描器 |
| TWI703324B (zh) * | 2019-02-26 | 2020-09-01 | 佳世達科技股份有限公司 | 超音波掃描組合及超音波傳導模組 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150101699A (ko) | 2015-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20240168277A1 (en) | Photoelectric composite module, camera head, and endoscopic device | |
| CN112514546B (zh) | 包含屏蔽构件的电子设备 | |
| KR20150101699A (ko) | 개선된 방열 특성을 갖는 트랜스듀서 | |
| WO2010011034A1 (fr) | Sonde ultrasonique avec dissipateur thermique | |
| CN102639048B (zh) | 电子内窥镜 | |
| US20190098189A1 (en) | Image pickup apparatus | |
| US20200029794A1 (en) | Optical connector and medical equipment | |
| CN102395226B (zh) | 一种有源天线系统、基站和通信系统 | |
| CN105451664B (zh) | 超声波内窥镜顶端部 | |
| JP2009082503A (ja) | 撮像装置及びその撮像装置を備えた内視鏡 | |
| WO2013145894A1 (fr) | Structure de connexion de câble, sonde ultrasonore, et système d'endoscope ultrasonore | |
| US11090031B2 (en) | Systems, methods, and apparatuses for thermal management of ultrasound transducers | |
| WO2014080312A1 (fr) | Sondes ultrasonores sans cadre à dissipation thermique | |
| WO2013100242A1 (fr) | Transducteur d'onde ultrasonore ayant un logement à passage de signal intégré | |
| US20150250378A1 (en) | Wire connection device, camera head and endoscopic device | |
| JPH1094540A (ja) | 超音波プローブ | |
| WO2015194733A1 (fr) | Bloc de dissipation d'onde ultrasonore et sonde ultrasonore le comprenant | |
| WO2015147355A1 (fr) | Structure à rayonnement de chaleur d'un transducteur ultrasonore | |
| US20160270220A1 (en) | Electronic apparatus | |
| JP4870591B2 (ja) | 超音波診断装置のプローブコネクタ | |
| WO2019212068A1 (fr) | Ensemble sonde ultrasonore utilisant un fpcb | |
| WO2015182843A1 (fr) | Appareil d'antenne à trois dimensions | |
| WO2016117721A1 (fr) | Transducteur à ultrasons comportant une couche absorbant les sons pour améliorer la dissipation de chaleur | |
| KR102943285B1 (ko) | 디지털 영상 전송 장치 | |
| WO2022173150A1 (fr) | Sonde à ultrasons |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14883887 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 14883887 Country of ref document: EP Kind code of ref document: A1 |